Semiconductor Wafer Polishing and Grinding Equipment Market Report by Type (Semiconductor Wafer Polishing Equipment, Semiconductor Wafer Grinding Equipment), End User (Foundries, Memory Manufacturers, IDMs, and Others), and Region 2024-2032
세계의 반도체 웨이퍼 연마 및 연삭 장비 시장 규모는 2023년 4억 3,120만 달러에 달했습니다. IMARC Group은 향후 시장이 2032년까지 6억 4,780만에 이를 전망이며, 2024년부터 2032년까지 성장률(CAGR)은 4.5%가 될 것으로 예측했습니다.
연마 및 연삭 장비는 일반적으로 반도체 웨이퍼 제조에 사용되는 고도로 필수적인 부품을 말합니다. 이러한 장비에는 증착, 리소그래피, 이온 주입, 에칭, 세척 등이 포함되며, 금속 조직 검사 장치, 디스크 마감 장치, 랩 보드의 도움으로 수행되는 표준 방법이 있습니다. 반도체 웨이퍼 연마 및 연삭 장비는 평활하고 손상되지 않은 표면을 확보하면서 멤브레인에서 불필요한 물질을 제거하고 제품을 얇게하고 정제하는 데 도움이 됩니다. 이러한 특성으로부터 집적 회로를 구성하는 파운드리나 메모리 제조업체에 널리 이용되고 있습니다.
반도체 웨이퍼 연마 및 연삭 장비 시장 동향 :
전자 산업의 급속한 확대에 따라 스마트폰, 노트북, 데스크톱 PC 등 다양한 소비자용 전자제품의 제조에 사용되는 미소전기기계시스템(MEMS), 마이크로칩, 집적회로에 대한 수요가 높아지고 있습니다. 그 결과, 웨이퍼의 박형화와 데미지 경감을 위해, 첨단 반도체 웨이퍼 연마 및 연삭 장비의 보급이 촉진되어 이것이 현재 시장 성장을 견인하는 주된 요인의 하나가 되고 있습니다. 이에 따라 생산 공정에서 웨이퍼 표면 형상을 유지하기 위한 금속-산화막-반도체(MOS) 및 화학-기계-연마(CMP) 솔루션의 채용 등 대폭적인 기술 진보가 다른 성장 촉진요인으로서 작용하고 있습니다. 또한 사물인터넷(IoT)과 인공지능(AI)을 포함한 무선 기술의 대규모 통합이 시장을 지원하고 스마트 디바이스 제조에 도움이 됩니다. 또한, 시스템 온칩(SoC) 주사위를 제조하기 위해 웨이퍼 제조 공장에서 연마 및 연삭 장비가 널리 이용되고 있는 것도 시장의 성장에 기여하고 있습니다. 기타 요인으로는 웨이퍼의 박형화에 의한 전자 디바이스의 소형화 요구 증가, 연구개발(R&D) 활동에 대한 지속적인 투자, 고성능 웨이퍼 연마 및 연삭 장비 도입을 위한 주요 기업 간의 전략적 제휴 등이 있어 시장에 밝은 전망을 가져오고 있습니다.
목차
제1장 서문
제2장 조사 범위 및 조사 방법
- 조사의 목적
- 이해관계자
- 데이터 소스
- 시장 추정
- 조사 방법
제3장 주요 요약
제4장 서문
제5장 세계의 반도체 웨이퍼 연마 및 연삭 장비 시장
- 시장 개요
- 시장 실적
- COVID-19의 영향
- 시장 예측
제6장 시장 내역 : 유형별
- 반도체 웨이퍼 연마 장비
- 반도체 웨이퍼 연삭 장비
제7장 시장 내역 : 최종 사용자별
제8장 시장 내역 : 지역별
- 북미
- 아시아태평양
- 유럽
- 독일
- 프랑스
- 영국
- 이탈리아
- 스페인
- 러시아
- 기타
- 라틴아메리카
- 중동 및 아프리카
제9장 SWOT 분석
제10장 밸류체인 분석
제11장 Porter's Five Forces 분석
- 개요
- 구매자의 협상력
- 공급기업의 협상력
- 경쟁도
- 신규 참가업체의 위협
- 대체품의 위협
제12장 가격 분석
제13장 경쟁 구도
- 시장 구조
- 주요 기업
- 주요 기업 프로파일
- Accretech(Europe) GmbH(Tokyo Seimitsu Co. Ltd.)
- Amtech Systems Inc.
- Axus Technology
- BBS Kinmei Co Ltd
- Disco Corporation
- Dynavest Pte Ltd
- Ebara Corporation
- Gigamat Technologies Inc.
- Lapmaster Wolters GmbH(Lapmaster International LLC)
- Logitech Ltd.
- Okamoto Machine Tool Works Ltd
- Revasum Inc.
AJY
The global semiconductor wafer polishing and grinding equipment market size reached US$ 431.2 Million in 2023. Looking forward, IMARC Group expects the market to reach US$ 647.8 Million by 2032, exhibiting a growth rate (CAGR) of 4.5% during 2024-2032.
Polishing and grinding equipment refer to advanced, indispensable components generally used while fabricating semiconductor wafers. They involve deposition, lithography, Ion implant, etching, and cleaning as some of the standard methods performed with the assistance of metallographic tools, disc finishing, and lapping machines. Semiconductor wafer polishing and grinding equipment aid in removing unwarranted material from a film and thinning and refining the product while ensuring a smooth and damage-free surface. On account of these properties, they are extensively utilized by foundries and memory manufacturers for composing integrated circuits.
Semiconductor Wafer Polishing and Grinding Equipment Market Trends:
With the rapid expansion in the electronics industry, there has been increasing demand for microelectromechanical systems (MEMS), microchips and integrated circuits for manufacturing various consumer electronic goods, including smartphones, laptops and desktops. This, in turn, has facilitated the widespread adoption of advanced semiconductor wafer grinding and polishing machinery for thinning and mitigating damage from wafers, which represents one of the prime factors currently driving the market growth. In line with this, significant technological advancements, such as the employment of metal-oxide-semiconductor (MOS) and chemical-mechanical-polishing (CMP) solutions to maintain the wafer surface profile during production processes, are acting as other growth-inducing factors. The market is also being supported by the large-scale integration of wireless technologies, including the Internet of Things (IoT) and artificial intelligence (AI), that help manufacturers engineer smart devices. Additionally, the extensive utilization of polishing and grinding equipment in wafer fabrication plants to manufacture a system on a chip (SoC) dice is contributing to the market growth. Other factors, such as the rising need for miniaturized electronic devices with thinner wafers, continuous investments in research and development (R&D) activities, and strategic collaborations amongst key players to introduce high-performance wafer polishing and grinding tools are creating a positive outlook for the market.
Key Market Segmentation:
IMARC Group provides an analysis of the key trends in each sub-segment of the global semiconductor wafer polishing and grinding equipment market report, along with forecasts at the global, regional and country level from 2024-2032. Our report has categorized the market based on type and end user.
Breakup by Type:
Semiconductor Wafer Polishing Equipment
Semiconductor Wafer Grinding Equipment
Breakup by End User:
Foundries
Memory Manufacturers
IDMs
Others
Breakup by Region:
North America
United States
Canada
Asia-Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
Competitive Landscape:
The competitive landscape of the industry has also been examined along with the profiles of the key players being Accretech (Europe) Gmbh (Tokyo Seimitsu Co. Ltd.), Amtech Systems Inc., Axus Technology, BBS Kinmei Co Ltd, Disco Corporation, Dynavest Pte Ltd, Ebara Corporation, Gigamat Technologies Inc., Lapmaster Wolters GmbH (Lapmaster International LLC), Logitech Ltd., Okamoto Machine Tool Works Ltd and Revasum Inc.
Key Questions Answered in This Report:
- How has the global semiconductor wafer polishing and grinding equipment market performed so far and how will it perform in the coming years?
- What has been the impact of COVID-19 on the global semiconductor wafer polishing and grinding equipment market?
- What are the key regional markets?
- What is the breakup of the market based on the type?
- What is the breakup of the market based on the end user?
- What are the various stages in the value chain of the industry?
- What are the key driving factors and challenges in the industry?
- What is the structure of the global semiconductor wafer polishing and grinding equipment market and who are the key players?
- What is the degree of competition in the industry?
Table of Contents
1 Preface
2 Scope and Methodology
- 2.1 Objectives of the Study
- 2.2 Stakeholders
- 2.3 Data Sources
- 2.3.1 Primary Sources
- 2.3.2 Secondary Sources
- 2.4 Market Estimation
- 2.4.1 Bottom-Up Approach
- 2.4.2 Top-Down Approach
- 2.5 Forecasting Methodology
3 Executive Summary
4 Introduction
- 4.1 Overview
- 4.2 Key Industry Trends
5 Global Semiconductor Wafer Polishing and Grinding Equipment Market
- 5.1 Market Overview
- 5.2 Market Performance
- 5.3 Impact of COVID-19
- 5.4 Market Forecast
6 Market Breakup by Type
- 6.1 Semiconductor Wafer Polishing Equipment
- 6.1.1 Market Trends
- 6.1.2 Market Forecast
- 6.2 Semiconductor Wafer Grinding Equipment
- 6.2.1 Market Trends
- 6.2.2 Market Forecast
7 Market Breakup by End User
- 7.1 Foundries
- 7.1.1 Market Trends
- 7.1.2 Market Forecast
- 7.2 Memory Manufacturers
- 7.2.1 Market Trends
- 7.2.2 Market Forecast
- 7.3 IDMs
- 7.3.1 Market Trends
- 7.3.2 Market Forecast
- 7.4 Others
- 7.4.1 Market Trends
- 7.4.2 Market Forecast
8 Market Breakup by Region
- 8.1 North America
- 8.1.1 United States
- 8.1.1.1 Market Trends
- 8.1.1.2 Market Forecast
- 8.1.2 Canada
- 8.1.2.1 Market Trends
- 8.1.2.2 Market Forecast
- 8.2 Asia-Pacific
- 8.2.1 China
- 8.2.1.1 Market Trends
- 8.2.1.2 Market Forecast
- 8.2.2 Japan
- 8.2.2.1 Market Trends
- 8.2.2.2 Market Forecast
- 8.2.3 India
- 8.2.3.1 Market Trends
- 8.2.3.2 Market Forecast
- 8.2.4 South Korea
- 8.2.4.1 Market Trends
- 8.2.4.2 Market Forecast
- 8.2.5 Australia
- 8.2.5.1 Market Trends
- 8.2.5.2 Market Forecast
- 8.2.6 Indonesia
- 8.2.6.1 Market Trends
- 8.2.6.2 Market Forecast
- 8.2.7 Others
- 8.2.7.1 Market Trends
- 8.2.7.2 Market Forecast
- 8.3 Europe
- 8.3.1 Germany
- 8.3.1.1 Market Trends
- 8.3.1.2 Market Forecast
- 8.3.2 France
- 8.3.2.1 Market Trends
- 8.3.2.2 Market Forecast
- 8.3.3 United Kingdom
- 8.3.3.1 Market Trends
- 8.3.3.2 Market Forecast
- 8.3.4 Italy
- 8.3.4.1 Market Trends
- 8.3.4.2 Market Forecast
- 8.3.5 Spain
- 8.3.5.1 Market Trends
- 8.3.5.2 Market Forecast
- 8.3.6 Russia
- 8.3.6.1 Market Trends
- 8.3.6.2 Market Forecast
- 8.3.7 Others
- 8.3.7.1 Market Trends
- 8.3.7.2 Market Forecast
- 8.4 Latin America
- 8.4.1 Brazil
- 8.4.1.1 Market Trends
- 8.4.1.2 Market Forecast
- 8.4.2 Mexico
- 8.4.2.1 Market Trends
- 8.4.2.2 Market Forecast
- 8.4.3 Others
- 8.4.3.1 Market Trends
- 8.4.3.2 Market Forecast
- 8.5 Middle East and Africa
- 8.5.1 Market Trends
- 8.5.2 Market Breakup by Country
- 8.5.3 Market Forecast
9 SWOT Analysis
- 9.1 Overview
- 9.2 Strengths
- 9.3 Weaknesses
- 9.4 Opportunities
- 9.5 Threats
10 Value Chain Analysis
11 Porters Five Forces Analysis
- 11.1 Overview
- 11.2 Bargaining Power of Buyers
- 11.3 Bargaining Power of Suppliers
- 11.4 Degree of Competition
- 11.5 Threat of New Entrants
- 11.6 Threat of Substitutes
12 Price Analysis
13 Competitive Landscape
- 13.1 Market Structure
- 13.2 Key Players
- 13.3 Profiles of Key Players
- 13.3.1 Accretech (Europe) Gmbh (Tokyo Seimitsu Co. Ltd.)
- 13.3.1.1 Company Overview
- 13.3.1.2 Product Portfolio
- 13.3.2 Amtech Systems Inc.
- 13.3.2.1 Company Overview
- 13.3.2.2 Product Portfolio
- 13.3.2.3 Financials
- 13.3.3 Axus Technology
- 13.3.3.1 Company Overview
- 13.3.3.2 Product Portfolio
- 13.3.4 BBS Kinmei Co Ltd
- 13.3.4.1 Company Overview
- 13.3.4.2 Product Portfolio
- 13.3.5 Disco Corporation
- 13.3.5.1 Company Overview
- 13.3.5.2 Product Portfolio
- 13.3.5.3 Financials
- 13.3.6 Dynavest Pte Ltd
- 13.3.6.1 Company Overview
- 13.3.6.2 Product Portfolio
- 13.3.7 Ebara Corporation
- 13.3.7.1 Company Overview
- 13.3.7.2 Product Portfolio
- 13.3.7.3 Financials
- 13.3.7.4 SWOT Analysis
- 13.3.8 Gigamat Technologies Inc.
- 13.3.8.1 Company Overview
- 13.3.8.2 Product Portfolio
- 13.3.9 Lapmaster Wolters GmbH (Lapmaster International LLC)
- 13.3.9.1 Company Overview
- 13.3.9.2 Product Portfolio
- 13.3.10 Logitech Ltd.
- 13.3.10.1 Company Overview
- 13.3.10.2 Product Portfolio
- 13.3.11 Okamoto Machine Tool Works Ltd
- 13.3.11.1 Company Overview
- 13.3.11.2 Product Portfolio
- 13.3.11.3 Financials
- 13.3.12 Revasum Inc.
- 13.3.12.1 Company Overview
- 13.3.12.2 Product Portfolio
- 13.3.12.3 Financials
