Global Semiconductor Wafer Polishing and Grinding Equipment Market 2025-2035
상품코드:1681031
리서치사:Orion Market Research
발행일:2025년 02월
페이지 정보:영문 145 Pages
라이선스 & 가격 (부가세 별도)
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한글목차
반도체 웨이퍼 연마 및 연삭 장비 시장 규모는 예측 기간(2025-2035년) 동안 10.2%의 연평균 복합 성장률(CAGR)로 확대될 것으로 예상됩니다. 가전, 통신, 자동차 등 산업 분야 증가, 더 작고 강하며 에너지 소비가 적은 반도체 생산 증가 등의 중요한 요인이 초박형, 무결점 웨이퍼를 요구하고 있습니다. 또한, 5G 통신의 확대와 보급, 고성능 반도체와 3D-IC, 시스템 인 패키지 SiP와 같은 신흥 첨단 패키지 구조로 인한 사물인터넷(IoT)의 확대와 보급 등도 산업 성장에 기여하고 있습니다.
반도체 웨이퍼 연마 및 연삭 장비 시장의 트렌드 중 하나는 첨단 CMP(화학적 기계적 평탄화) 장비에 대한 수요 증가입니다. 반도체 디바이스는 점점 더 복잡해지고 있으며, 제조업체들은 웨이퍼 표면의 요구되는 균일성을 달성하기 위해 고정밀하고 효율적인 연마 솔루션을 요구하고 있으며, CMP 장비는 첨단 노드 기술의 까다로운 요구사항을 충족시키기 위해 진화하고 있습니다. 칩을 생산할 수 있습니다. 또한, 3D NAND 및 FinFET 아키텍처 기술의 채택이 증가함에 따라 이러한 복잡한 설계에 대응하기 위해 보다 특수한 CMP의 개발이 필요하게 되었습니다. 각 업체들은 연구개발 프로그램에 많은 투자를 지속하고 있으며, 장비의 성능을 최적화하고 생산 수율을 향상시켜 불량률을 낮추는데 주력하고 있습니다. 이는 AI, 5G, 자율주행차 등 고성능 칩을 용도에 투입해야 할 필요성에 기인합니다.
반도체 산업은 대량 생산과 보다 엄격한 공정 관리에 대응해야 했고, 자동화는 이러한 측면에서 효율성과 일관성을 실현할 수 있는 수단이었습니다. 최신 연마 및 연삭 공구는 생산성 향상을 위해 실시간 모니터링, 예지보전, 머신러닝 알고리즘 등의 기능을 갖추고 있습니다. 이러한 개발을 통해 제조업체는 다운타임을 방지하고, 운영 비용을 절감하며, 웨이퍼 품질을 향상시킬 수 있습니다. 실제로 스마트 제조는 상호 연결된 시스템과 데이터 분석을 핵심 구성 요소로 하는 더 큰 인더스트리 4.0의 움직임의 일부입니다. 이러한 현상은 특히 대량 생산 환경에서는 약간의 공정 최적화만으로도 상당한 비용 절감과 성능 향상으로 이어질 수 있는 대량 생산 환경에서 특히 중요합니다.
세계의 반도체 웨이퍼 연마 및 연삭 장비 시장에 대해 조사했으며, 시장 개요, 유형별/최종사용자별/지역별 동향, 시장 진출 기업 프로파일 등의 정보를 전해드립니다.
목차
제1장 보고서 요약
제2장 시장 개요와 인사이트
제3장 시장 결정 요인
시장 성장 촉진요인
시장 문제점과 과제
시장 기회
제4장 경쟁 구도
경쟁 대시보드 - 반도체 웨이퍼 연마 및 연삭 장비 시장 제조업체별 매출과 점유율
반도체 웨이퍼 연마 및 연삭 장비 제품 비교 분석
주요 시장 진출기업 순위 매트릭스
주요 기업 분석
Applied Materials, Inc.
Tokyo Seimitsu Co., Ltd.
JTEKT CORP.
Komatsu NTC Ltd.
Okamoto Machine Tool Works, Ltd
시장 진출기업의 주요 성공 전략
인수합병(M&A)
제품 발매
파트너십 및 협업
제5장 세계의 반도체 웨이퍼 연마 및 연삭 장비 시장 판매 분석(100만 달러), 유형별
반도체 웨이퍼 연마 장비
반도체 웨이퍼 연삭 장비
제6장 세계의 반도체 웨이퍼 연마 및 연삭 장비 시장 판매 분석(100만 달러), 최종사용자별
주조
메모리 제조업체
IDM
기타(테스트 및 포장 서비스 제공업체)
제7장 지역 분석
북미
유럽
아시아태평양
기타 지역
제8장 기업 개요
Alpsitec SAS
Applied Materials, Inc.
Axus Technology
Buehler Ltd.
Daitron Co., Ltd.
DISCO Corp.
Engis Corp.
Grintimate Precision Industry Co., Ltd.
Henan Chengyi Equipment Science and Technology Co., Ltd.
Semiconductor Wafer Polishing and Grinding Equipment Market Size, Share & Trends Analysis Report by Type (Semiconductor Wafer Polishing Equipment and Semiconductor Wafer Grinding Equipment), and End-User (Foundries, Memory Manufacturers, Integrated Device Manufacturers (IDMs), and Others) Forecast Period (2025-2035)
Industry Overview
The semiconductor wafer polishing and grinding equipment market is anticipated to grow at a CAGR of 10.2% during the forecast period (2025-2035). Pivotal factors such as rising industrial sectors for consumer electronics, telecom, and auto, and increasing production of more compact stronger, and less energy-consuming semiconductors demand ultra-thin and faultless wafers. Further, the expansion and deployment of 5G communications and expansion and proliferation of the Internet of Things (IoT) with greater performing semiconductors and emerging advanced package structures such as 3D-ICs, and system-in-package SiP, among others also contribute to industry growth.
Market Dynamics
Growing Adoption of Advanced CMP Equipment
One of the trends in the market for semiconductor wafer polishing and grinding equipment is increased demand for advanced chemical mechanical planarization (CMP) equipment. The complexity of the semiconductor device increases, and manufacturers are looking for highly precise and efficient polishing solutions to achieve the required uniformity of the wafer surface. CMP equipment is evolving to meet the stringent requirements of advanced node technologies, thereby enabling the production of smaller, faster, and more energy-efficient chips. In addition, growth in the adoption of 3D NAND and FinFET architecture technologies has fuelled the necessity of developing a range of more specific CMPs suited to meet such complex designs. Companies continue investing heavily in R&D programs, focusing on optimizing equipment performance and lowering defect rates with high production yield improvements. It is a function of the necessity of pushing more performing chips into applications, such as AI, 5G, or autonomous vehicle applications.
Increasing Automation and Smart Manufacturing
The semiconductor industry had to deal with high production volumes and stricter process control, automation has been the efficiency and consistency enabler in this regard. The modern polishing and grinding tools are advanced with such features as real-time monitoring, predictive maintenance, and machine learning algorithms to enhance productivity. These developments enable the manufacturer to avoid downtime, cut operational costs, and increase wafer quality. Smart manufacturing is, in fact, a part of the larger Industry 4.0 movement, with interconnected systems and data analytics as its core constituents. This phenomenon is especially critical in high-volume production environments wherein even minor process optimizations can lead to significant cost savings and performance improvement.
Market Segmentation
Based on the type, the market is segmented into semiconductor wafer polishing equipment and semiconductor wafer grinding equipment.
Based on the end-user, the market is segmented into foundries, memory manufacturers, integrated device manufacturers (IDMs), and others (testing and packaging service providers).
Semiconductor Wafer Polishing Equipment Segment to Lead the Market with the Largest Share
There is an increase in the demand for electronic devices, and customers look for performance electronic devices, precise wafer processing has been very crucial in this. Polishing semiconductor wafer processing equipment plays a critical role in wafers, in achieving a flat surface. Furthermore, the growing adoption of advanced materials and miniature-sized chips is driving the need for high-level polishing solutions. Companies are responding with innovations in equipment efficiency to meet the industry's demands.
Foundries: A Key Segment in Market Growth
The demand from foundries is rising sharply, and the growth in the semiconductor wafer polishing and grinding equipment market is mainly led by this. Foundries are manufacturing entities catering to the needs of several IC designers. Advanced nodes and technologies adopted by these foundries require precise and efficient wafer processing solutions. In particular, the demand for high-quality consumer electronics, automotive chips, and IoT devices is still growing at a higher rate.
Regional Outlook
The global semiconductor wafer polishing and grinding equipment market is further divided by geography, including Asia-Pacific (India, China, Japan, South Korea, Australia and New Zealand, ASEAN Countries, and the Rest of Asia-Pacific), North America (the US and Canada), Europe (the UK, Germany, France, Italy, Spain, Russia, and the Rest of Europe), and the Rest of the World (the Middle East & Africa, and Latin America)
Growing Semiconductor Wafer and Substrate Manufacturing in North America
The North American semiconductor wafer polishing and grinding equipment market are experiencing significant growth, primarily owing to integrated device manufacturers. The manufacturers are increasing amounts of investment in various advanced technologies to boost their production facilities and cater to the growing demand for high-performance semiconductors. This growth is a result of the high and rapid growth experienced in the automotive, consumer electronics, and telecommunication sectors. This sector mainly thrives on proper and efficient semiconductor production. For instance, Intel Corp. is continuously developing advanced polishing and grinding technologies, which the corporation uses in enhancing its wafer fabrication process. Such investment results in an efficient production level, thus answering the rising demand for changing technology standards.
Asia-Pacific Region Dominates the Market with Major Share
Several factors are contributing to the Asia-Pacific semiconductor wafer polishing and grinding equipment market. The need for advanced semiconductor manufacturing processes is driven by the increasing demand for advanced consumer electronics & industrial devices. The growing adoption of automation in wafer processing is also fueling market growth. Governments across the region are also pouring money into semiconductor research and development. Technologies such as 5G and IoT are creating huge opportunities for semiconductor manufacturers. The demand for precision equipment is further driven by technological advancements and innovation in the region.
Market Players Outlook
The major companies operating in the global semiconductor wafer polishing and grinding equipment market include Applied Materials, Inc., JTEKT CORP., Tokyo Seimitsu Co., Ltd., Okamoto Machine Tool Works, Ltd., DISCO Corp., Engis Corp., and Komatsu NTC Ltd., among others. Market players are leveraging partnerships, collaborations, mergers and acquisition strategies for business expansion and innovative product development to maintain their market positioning.
Recent Development
In November 2024, NexGen Wafer Systems introduced SERENO, the company's new multi-chamber platform that it has specifically developed for Wet Etch and Clean applications. The SERENO offers high performance in combination with the highest level of flexibility with onboard chemical supply supporting multiple process chemicals with integrated mixing, blending, and comprehensive analytics for maximum adaptability across a wide range of applications.
The Report Covers:
Market value data analysis of 2024 and forecast to 2035.
Annualized market revenues ($ million) for each market segment.
Country-wise analysis of major geographical regions.
Key companies operating in the global semiconductor wafer polishing and grinding equipment market. Based on the availability of data, information related to new products, and relevant news is also available in the report.
Analysis of business strategies by identifying the key market segments positioned for strong growth in the future.
Analysis of market-entry and market expansion strategies.
Competitive strategies by identifying 'who-stands-where' in the market.
Table of Contents
1. Report Summary
Current Industry Analysis and Growth Potential Outlook
Global Semiconductor Wafer Polishing and Grinding Equipment Market Sales Analysis - Type| End-User ($ Million)
Semiconductor Wafer Polishing and Grinding Equipment Market Sales Performance of Top Countries
1.1. Research Methodology
Primary Research Approach
Secondary Research Approach
1.2. Market Snapshot
2. Market Overview and Insights
2.1. Scope of the Study
2.2. Analyst Insight & Current Market Trends
2.2.1. Key Semiconductor Wafer Polishing and Grinding Equipment Industry Trends
2.2.2. Market Recommendations
2.3. Porter's Five Forces Analysis for the Semiconductor Wafer Polishing and Grinding Equipment Market
2.3.1. Competitive Rivalry
2.3.2. Threat of New Entrants
2.3.3. Bargaining Power of Suppliers
2.3.4. Bargaining Power of Buyers
2.3.5. Threat of Substitutes
3. Market Determinants
3.1. Market Drivers
3.1.1. Drivers For Global Semiconductor Wafer Polishing and Grinding Equipment Market: Impact Analysis
3.2. Market Pain Points and Challenges
3.2.1. Restraints For Global Semiconductor Wafer Polishing and Grinding Equipment Market: Impact Analysis
3.3. Market Opportunities
4. Competitive Landscape
4.1. Competitive Dashboard - Semiconductor Wafer Polishing and Grinding Equipment Market Revenue and Share by Manufacturers
Semiconductor Wafer Polishing and Grinding Equipment Product Comparison Analysis
Top Market Player Ranking Matrix
4.2. Key Company Analysis
4.2.1. Applied Materials, Inc.
4.2.1.1. Overview
4.2.1.2. Product Portfolio
4.2.1.3. Financial Analysis (Subject to Data Availability)
4.2.1.4. SWOT Analysis
4.2.1.5. Business Strategy
4.2.2. Tokyo Seimitsu Co., Ltd.
4.2.2.1. Overview
4.2.2.2. Product Portfolio
4.2.2.3. Financial Analysis (Subject to Data Availability)
4.2.2.4. SWOT Analysis
4.2.2.5. Business Strategy
4.2.3. JTEKT CORP.
4.2.3.1. Overview
4.2.3.2. Product Portfolio
4.2.3.3. Financial Analysis (Subject to Data Availability)
4.2.3.4. SWOT Analysis
4.2.3.5. Business Strategy
4.2.4. Komatsu NTC Ltd.
4.2.4.1. Overview
4.2.4.2. Product Portfolio
4.2.4.3. Financial Analysis (Subject to Data Availability)
4.2.4.4. SWOT Analysis
4.2.4.5. Business Strategy
4.2.5. Okamoto Machine Tool Works, Ltd
4.2.5.1. Overview
4.2.5.2. Product Portfolio
4.2.5.3. Financial Analysis (Subject to Data Availability)
4.2.5.4. SWOT Analysis
4.2.5.5. Business Strategy
4.3. Top Winning Strategies by Market Players
4.3.1. Merger and Acquisition
4.3.2. Product Launch
4.3.3. Partnership And Collaboration
5. Global Semiconductor Wafer Polishing and Grinding Equipment Market Sales Analysis by Type ($ Million)
5.1. Semiconductor Wafer Polishing Equipment
5.2. Semiconductor Wafer Grinding Equipment
6. Global Semiconductor Wafer Polishing and Grinding Equipment Market Sales Analysis by End-User ($ Million)
6.1. Foundries
6.2. Memory Manufacturer
6.3. IDMs
6.4. Others (Testing and Packaging Service Providers)
7. Regional Analysis
7.1. North American Semiconductor Wafer Polishing and Grinding Equipment Market Sales Analysis - Type| End-User | Country ($ Million)
Macroeconomic Factors for North America
7.1.1. United States
7.1.2. Canada
7.2. European Semiconductor Wafer Polishing and Grinding Equipment Market Sales Analysis - Type| End-User | Country ($ Million)
Macroeconomic Factors for Europe
7.2.1. UK
7.2.2. Germany
7.2.3. Italy
7.2.4. Spain
7.2.5. France
7.2.6. Russia
7.2.7. Rest of Europe
7.3. Asia-Pacific Semiconductor Wafer Polishing and Grinding Equipment Market Sales Analysis - Type| End-User | Country ($ Million)
Macroeconomic Factors for Asia-Pacific
7.3.1. China
7.3.2. Japan
7.3.3. South Korea
7.3.4. India
7.3.5. Australia & New Zealand
7.3.6. ASEAN Countries (Thailand, Indonesia, Vietnam, Singapore, And Other)
7.3.7. Rest of Asia-Pacific
7.4. Rest of the World Semiconductor Wafer Polishing and Grinding Equipment Market Sales Analysis - Type| End-User | Country ($ Million)
Macroeconomic Factors for the Rest of the World
7.4.1. Latin America
7.4.2. Middle East and Africa
8. Company Profiles
8.1. Alpsitec SAS
8.1.1. Quick Facts
8.1.2. Company Overview
8.1.3. Product Portfolio
8.1.4. Business Strategies
8.2. Applied Materials, Inc.
8.2.1. Quick Facts
8.2.2. Company Overview
8.2.3. Product Portfolio
8.2.4. Business Strategies
8.3. Axus Technology
8.3.1. Quick Facts
8.3.2. Company Overview
8.3.3. Product Portfolio
8.3.4. Business Strategies
8.4. Buehler Ltd.
8.4.1. Quick Facts
8.4.2. Company Overview
8.4.3. Product Portfolio
8.4.4. Business Strategies
8.5. Daitron Co., Ltd.
8.5.1. Quick Facts
8.5.2. Company Overview
8.5.3. Product Portfolio
8.5.4. Business Strategies
8.6. DISCO Corp.
8.6.1. Quick Facts
8.6.2. Company Overview
8.6.3. Product Portfolio
8.6.4. Business Strategies
8.7. Engis Corp.
8.7.1. Quick Facts
8.7.2. Company Overview
8.7.3. Product Portfolio
8.7.4. Business Strategies
8.8. Grintimate Precision Industry Co., Ltd.
8.8.1. Quick Facts
8.8.2. Company Overview
8.8.3. Product Portfolio
8.8.4. Business Strategies
8.9. Henan Chengyi Equipment Science and Technology Co., Ltd.
