한글목차

세계의 인터포저 시장 규모는 2024년에 4억 5,600만 달러로 추정되며, 2025-2031년의 예측 기간에 CAGR 16.4%로 성장하며, 2031년까지 13억 3,200만 달러로 확대할 것으로 예측되고 있습니다.

인터포저(중간층이라고도 함)는 전자 시스템에서 서로 다른 두 인터페이스 또는 기술 간의 연결성 및 신호 변환을 제공하는 물리적 구성 요소입니다.

인터포저 시장은 반도체 산업에서 틈새 시장으로, 고성능 전자 장치를 위한 첨단 포장 솔루션에서 중요한 역할을 담당하고 있습니다. 칩 패키지 내의 서로 다른 구성 요소 간의 가교 역할을 하며, 특히 이기종 통합에서 연결성을 촉진하고 성능을 최적화하는 역할을 합니다. 이를 통해 CPU, GPU, 메모리 등 서로 다른 반도체 부품 간의 효율적인 연동을 가능하게 합니다.

시장 동향 : 칩의 소형화 추세와 더 작은 크기에서의 기능 및 성능 향상에 대한 요구가 이종 집적 기술의 발전을 촉진합니다. 인터포저는 시스템 레벨 포장, 특히 2.5D 및 3D IC 용도에서 시스템 레벨 포장에서 점점 더 중요해질 것입니다. 사물인터넷(IoT), 자율주행차 등의 동향은 더 높은 대역폭의 데이터 처리 및 통신을 필요로 하며, 이에 따라 고성능 전자 시스템에 대한 수요가 증가합니다. 이 또한 인터포저 시장의 성장을 가속하는 요인이 될 것입니다. 그러나 인터포저 기술의 발전은 재료로 인한 성능 및 비용 장벽을 해결하는 데에도 의존하고 있습니다. 현재 관련 연구에서는 비용 절감을 위해 유리와 같은 신소재에 대한 연구가 진행되고 있습니다.

이 보고서는 세계의 인터포저 시장에 대한 종합적인 분석을 제공하는 것을 목표로 합니다. 총매출액, 주요 기업의 시장 점유율과 순위에 초점을 맞추고, 지역별, 국가별, 유형별, 용도별 인터포저 분석을 포함합니다.

인터포저 시장 규모, 추정치 및 예측은 매출액으로 제시되며, 2024년을 기준 연도로, 2020-2031년 기간의 과거 데이터와 예측 데이터를 포함합니다. 정량적 분석과 정성적 분석을 통해 독자들이 비즈니스/성장 전략을 수립하고, 시장 경쟁 구도를 평가하고, 현재 시장에서의 위치를 분석하고, 인터포저에 대한 정보에 입각한 비즈니스 의사결정을 내릴 수 있도록 돕습니다.

시장 세분화

기업별

• Murata
• Tezzaron
• Xilinx
• AGC Electronics
• TSMC
• UMC
• Plan Optik AG
• Amkor
• IMT
• ALLVIA, Inc

유형별 부문

• 2D인터포저
• 2.5D 인터포저
• 3D 인터포저

용도별 부문

• CIS
• CPU 또는 GPU
• MEMS 3D 캡핑 인터포저
• RF 디바이스
• 로직 SoC
• ASIC 또는 FPGA
• 고출력 LED

지역별

• 북미
  • 미국
  • 캐나다
• 아시아태평양
  • 중국
  • 일본
  • 한국
  • 동남아시아
  • 인도
  • 호주
  • 기타 아시아태평양
• 유럽
  • 독일
  • 프랑스
  • 영국
  • 이탈리아
  • 네덜란드
  • 북유럽 국가
  • 기타 유럽
• 라틴아메리카
  • 멕시코
  • 브라질
  • 기타 라틴아메리카
• 중동 및 아프리카
  • 튀르키예
  • 사우디아라비아
  • 아랍에미리트
  • 기타 중동 및 아프리카

영문목차

The global market for Interposer was estimated to be worth US$ 456 million in 2024 and is forecast to a readjusted size of US$ 1332 million by 2031 with a CAGR of 16.4% during the forecast period 2025-2031.

An interposer, also known as an intermediate layer, is a physical component used in electronic systems to provide connectivity or signal conversion between two different interfaces or technologies.

The interposer market is a niche segment within the semiconductor industry and plays a critical role in advanced packaging solutions for high-performance electronic devices. It serves as a bridge between different components within a chip package, facilitating connectivity and optimizing performance, particularly in heterogeneous integration, enabling efficient collaboration between different semiconductor components such as CPUs, GPUs, and memory.

Market Trends: The trend toward smaller chips and the demand for increased functionality and performance in smaller sizes will drive the development of heterogeneous integration. Interposers will become increasingly important for system-level packaging, particularly in 2.5D and 3D IC applications. Trends such as the Internet of Things (IoT) and autonomous vehicles will require higher-bandwidth data processing and communication, thereby increasing the demand for high-performance electronic systems, which will also drive the growth of the interposer market. However, the development of interposer technology also depends on addressing performance and cost barriers caused by its materials. Currently, related research is exploring new materials such as glass to reduce costs.

This report aims to provide a comprehensive presentation of the global market for Interposer, focusing on the total sales revenue, key companies market share and ranking, together with an analysis of Interposer by region & country, by Type, and by Application.

The Interposer market size, estimations, and forecasts are provided in terms of sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Interposer.

Market Segmentation

By Company

• Murata
• Tezzaron
• Xilinx
• AGC Electronics
• TSMC
• UMC
• Plan Optik AG
• Amkor
• IMT
• ALLVIA, Inc

Segment by Type

• 2D Interposer
• 2.5D Interposer
• 3D Interposer

Segment by Application

• CIS
• CPU or GPU
• MEMS 3D Capping Interposer
• RF Devices
• Logic SoC
• ASIC or FPGA
• High Power LED

By Region

• North America
  • United States
  • Canada
• Asia-Pacific
  • China
  • Japan
  • South Korea
  • Southeast Asia
  • India
  • Australia
  • Rest of Asia-Pacific
• Europe
  • Germany
  • France
  • U.K.
  • Italy
  • Netherlands
  • Nordic Countries
  • Rest of Europe
• Latin America
  • Mexico
  • Brazil
  • Rest of Latin America
• Middle East & Africa
  • Turkey
  • Saudi Arabia
  • UAE
  • Rest of MEA

Chapter Outline

Chapter 1: Introduces the report scope of the report, global total market size. This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 2: Detailed analysis of Interposer company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 5: Revenue of Interposer in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.

Chapter 6: Revenue of Interposer in country level. It provides sigmate data by Type, and by Application for each country/region.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Conclusion.

Table of Contents

1 Market Overview

• 1.1 Interposer Product Introduction
• 1.2 Global Interposer Market Size Forecast (2020-2031)
• 1.3 Interposer Market Trends & Drivers
  • 1.3.1 Interposer Industry Trends
  • 1.3.2 Interposer Market Drivers & Opportunity
  • 1.3.3 Interposer Market Challenges
  • 1.3.4 Interposer Market Restraints
• 1.4 Assumptions and Limitations
• 1.5 Study Objectives
• 1.6 Years Considered

2 Competitive Analysis by Company

• 2.1 Global Interposer Players Revenue Ranking (2024)
• 2.2 Global Interposer Revenue by Company (2020-2025)
• 2.3 Key Companies Interposer Manufacturing Base Distribution and Headquarters
• 2.4 Key Companies Interposer Product Offered
• 2.5 Key Companies Time to Begin Mass Production of Interposer
• 2.6 Interposer Market Competitive Analysis
  • 2.6.1 Interposer Market Concentration Rate (2020-2025)
  • 2.6.2 Global 5 and 10 Largest Companies by Interposer Revenue in 2024
  • 2.6.3 Global Top Companies by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Interposer as of 2024)
• 2.7 Mergers & Acquisitions, Expansion

3 Segmentation by Type

• 3.1 Introduction by Type
  • 3.1.1 2D Interposer
  • 3.1.2 2.5D Interposer
  • 3.1.3 3D Interposer
• 3.2 Global Interposer Sales Value by Type
  • 3.2.1 Global Interposer Sales Value by Type (2020 VS 2024 VS 2031)
  • 3.2.2 Global Interposer Sales Value, by Type (2020-2031)
  • 3.2.3 Global Interposer Sales Value, by Type (%) (2020-2031)

4 Segmentation by Application

• 4.1 Introduction by Application
  • 4.1.1 CIS
  • 4.1.2 CPU or GPU
  • 4.1.3 MEMS 3D Capping Interposer
  • 4.1.4 RF Devices
  • 4.1.5 Logic SoC
  • 4.1.6 ASIC or FPGA
  • 4.1.7 High Power LED
• 4.2 Global Interposer Sales Value by Application
  • 4.2.1 Global Interposer Sales Value by Application (2020 VS 2024 VS 2031)
  • 4.2.2 Global Interposer Sales Value, by Application (2020-2031)
  • 4.2.3 Global Interposer Sales Value, by Application (%) (2020-2031)

5 Segmentation by Region

• 5.1 Global Interposer Sales Value by Region
  • 5.1.1 Global Interposer Sales Value by Region: 2020 VS 2024 VS 2031
  • 5.1.2 Global Interposer Sales Value by Region (2020-2025)
  • 5.1.3 Global Interposer Sales Value by Region (2026-2031)
  • 5.1.4 Global Interposer Sales Value by Region (%), (2020-2031)
• 5.2 North America
  • 5.2.1 North America Interposer Sales Value, 2020-2031
  • 5.2.2 North America Interposer Sales Value by Country (%), 2024 VS 2031
• 5.3 Europe
  • 5.3.1 Europe Interposer Sales Value, 2020-2031
  • 5.3.2 Europe Interposer Sales Value by Country (%), 2024 VS 2031
• 5.4 Asia Pacific
  • 5.4.1 Asia Pacific Interposer Sales Value, 2020-2031
  • 5.4.2 Asia Pacific Interposer Sales Value by Region (%), 2024 VS 2031
• 5.5 South America
  • 5.5.1 South America Interposer Sales Value, 2020-2031
  • 5.5.2 South America Interposer Sales Value by Country (%), 2024 VS 2031
• 5.6 Middle East & Africa
  • 5.6.1 Middle East & Africa Interposer Sales Value, 2020-2031
  • 5.6.2 Middle East & Africa Interposer Sales Value by Country (%), 2024 VS 2031

6 Segmentation by Key Countries/Regions

• 6.1 Key Countries/Regions Interposer Sales Value Growth Trends, 2020 VS 2024 VS 2031
• 6.2 Key Countries/Regions Interposer Sales Value, 2020-2031
• 6.3 United States
  • 6.3.1 United States Interposer Sales Value, 2020-2031
  • 6.3.2 United States Interposer Sales Value by Type (%), 2024 VS 2031
  • 6.3.3 United States Interposer Sales Value by Application, 2024 VS 2031
• 6.4 Europe
  • 6.4.1 Europe Interposer Sales Value, 2020-2031
  • 6.4.2 Europe Interposer Sales Value by Type (%), 2024 VS 2031
  • 6.4.3 Europe Interposer Sales Value by Application, 2024 VS 2031
• 6.5 China
  • 6.5.1 China Interposer Sales Value, 2020-2031
  • 6.5.2 China Interposer Sales Value by Type (%), 2024 VS 2031
  • 6.5.3 China Interposer Sales Value by Application, 2024 VS 2031
• 6.6 Japan
  • 6.6.1 Japan Interposer Sales Value, 2020-2031
  • 6.6.2 Japan Interposer Sales Value by Type (%), 2024 VS 2031
  • 6.6.3 Japan Interposer Sales Value by Application, 2024 VS 2031
• 6.7 South Korea
  • 6.7.1 South Korea Interposer Sales Value, 2020-2031
  • 6.7.2 South Korea Interposer Sales Value by Type (%), 2024 VS 2031
  • 6.7.3 South Korea Interposer Sales Value by Application, 2024 VS 2031
• 6.8 Southeast Asia
  • 6.8.1 Southeast Asia Interposer Sales Value, 2020-2031
  • 6.8.2 Southeast Asia Interposer Sales Value by Type (%), 2024 VS 2031
  • 6.8.3 Southeast Asia Interposer Sales Value by Application, 2024 VS 2031
• 6.9 India
  • 6.9.1 India Interposer Sales Value, 2020-2031
  • 6.9.2 India Interposer Sales Value by Type (%), 2024 VS 2031
  • 6.9.3 India Interposer Sales Value by Application, 2024 VS 2031

7 Company Profiles

• 7.1 Murata
  • 7.1.1 Murata Profile
  • 7.1.2 Murata Main Business
  • 7.1.3 Murata Interposer Products, Services and Solutions
  • 7.1.4 Murata Interposer Revenue (US$ Million) & (2020-2025)
  • 7.1.5 Murata Recent Developments
• 7.2 Tezzaron
  • 7.2.1 Tezzaron Profile
  • 7.2.2 Tezzaron Main Business
  • 7.2.3 Tezzaron Interposer Products, Services and Solutions
  • 7.2.4 Tezzaron Interposer Revenue (US$ Million) & (2020-2025)
  • 7.2.5 Tezzaron Recent Developments
• 7.3 Xilinx
  • 7.3.1 Xilinx Profile
  • 7.3.2 Xilinx Main Business
  • 7.3.3 Xilinx Interposer Products, Services and Solutions
  • 7.3.4 Xilinx Interposer Revenue (US$ Million) & (2020-2025)
  • 7.3.5 Xilinx Recent Developments
• 7.4 AGC Electronics
  • 7.4.1 AGC Electronics Profile
  • 7.4.2 AGC Electronics Main Business
  • 7.4.3 AGC Electronics Interposer Products, Services and Solutions
  • 7.4.4 AGC Electronics Interposer Revenue (US$ Million) & (2020-2025)
  • 7.4.5 AGC Electronics Recent Developments
• 7.5 TSMC
  • 7.5.1 TSMC Profile
  • 7.5.2 TSMC Main Business
  • 7.5.3 TSMC Interposer Products, Services and Solutions
  • 7.5.4 TSMC Interposer Revenue (US$ Million) & (2020-2025)
  • 7.5.5 TSMC Recent Developments
• 7.6 UMC
  • 7.6.1 UMC Profile
  • 7.6.2 UMC Main Business
  • 7.6.3 UMC Interposer Products, Services and Solutions
  • 7.6.4 UMC Interposer Revenue (US$ Million) & (2020-2025)
  • 7.6.5 UMC Recent Developments
• 7.7 Plan Optik AG
  • 7.7.1 Plan Optik AG Profile
  • 7.7.2 Plan Optik AG Main Business
  • 7.7.3 Plan Optik AG Interposer Products, Services and Solutions
  • 7.7.4 Plan Optik AG Interposer Revenue (US$ Million) & (2020-2025)
  • 7.7.5 Plan Optik AG Recent Developments
• 7.8 Amkor
  • 7.8.1 Amkor Profile
  • 7.8.2 Amkor Main Business
  • 7.8.3 Amkor Interposer Products, Services and Solutions
  • 7.8.4 Amkor Interposer Revenue (US$ Million) & (2020-2025)
  • 7.8.5 Amkor Recent Developments
• 7.9 IMT
  • 7.9.1 IMT Profile
  • 7.9.2 IMT Main Business
  • 7.9.3 IMT Interposer Products, Services and Solutions
  • 7.9.4 IMT Interposer Revenue (US$ Million) & (2020-2025)
  • 7.9.5 IMT Recent Developments
• 7.10 ALLVIA, Inc
  • 7.10.1 ALLVIA, Inc Profile
  • 7.10.2 ALLVIA, Inc Main Business
  • 7.10.3 ALLVIA, Inc Interposer Products, Services and Solutions
  • 7.10.4 ALLVIA, Inc Interposer Revenue (US$ Million) & (2020-2025)
  • 7.10.5 ALLVIA, Inc Recent Developments

8 Industry Chain Analysis

• 8.1 Interposer Industrial Chain
• 8.2 Interposer Upstream Analysis
  • 8.2.1 Key Raw Materials
  • 8.2.2 Raw Materials Key Suppliers
  • 8.2.3 Manufacturing Cost Structure
• 8.3 Midstream Analysis
• 8.4 Downstream Analysis (Customers Analysis)
• 8.5 Sales Model and Sales Channels
  • 8.5.1 Interposer Sales Model
  • 8.5.2 Sales Channel
  • 8.5.3 Interposer Distributors

9 Research Findings and Conclusion

10 Appendix

• 10.1 Research Methodology
  • 10.1.1 Methodology/Research Approach
    • 10.1.1.1 Research Programs/Design
    • 10.1.1.2 Market Size Estimation
    • 10.1.1.3 Market Breakdown and Data Triangulation
  • 10.1.2 Data Source
    • 10.1.2.1 Secondary Sources
    • 10.1.2.2 Primary Sources
• 10.2 Author Details
• 10.3 Disclaimer