한글목차

세계의 SiC 연마 소모품 시장은 2024년에는 1억 3,400만 달러 규모로 추정되며, 2031년에는 4억 7,200만 달러로 재조정되어 예측 기간인 2025-2031년 CAGR은 19.6%를 보일 것으로 예측됩니다.

실리콘 카바이드(SiC)는 더 높은 온도, 전력 레벨, 전압에서 작동 가능한 와이드 밴드갭 반도체입니다. 이를 통해 전력 장치, LED 조명, 통신의 에너지 효율을 향상시킬 수 있습니다. SiC는 독특한 특성으로 인해 하이브리드 전기자동차, 파워일렉트로닉스 스위치, LED 조명 기술 등 다양한 용도로 선택되고 있는 소재입니다.

본 보고서는 SiC CMP 슬러리와 SiC CMP 패드를 포함한 SiC 연마 소모품에 대해 조사하였습니다.

SiC 연마 소모품의 세계적인 주요 기업으로는 DuPont, Entegris, Fujimi Corporation, Saint-Gobain, Fujibo, Shanghai Xinanna 등이 있습니다. 2024년에는 세계 주요 4개 기업이 매출액 기준 약 82%의 점유율을 차지했습니다.

SiC CMP 슬러리의 주요 업체로는 Entegris, Fujimi Corporation, Saint-Gobain, Shanghai Xinanna 등이 있습니다. 2024년에는 세계 3대 기업이 매출액 기준 약 82.4%의 점유율을 차지했습니다.

SiC CMP 패드의 주요 업체로는 DuPont, Entegris, and Fujibo 등이 있습니다. DuPont은 세계 SiC CMP 패드 시장을 독점하고 있으며, 75% 이상의 점유율을 차지하고 있습니다.

슬러리와 패드를 포함한 실리콘 카바이드(SiC) 화학기계 연마(CMP) 소모품 시장은 SiC 웨이퍼 산업 자체의 급속한 성장을 반영하여 매우 중요한 단계에 있습니다. 현재 시장은 매우 집중되어 있으며, 소수의 주요 업체들이 공급망을 지배하고 있습니다. 엔테그리스와 후지미코퍼레이션은 SiC CMP 슬러리의 선두주자로 자리매김하고 있으며, 재료 과학에 대한 깊은 전문 지식을 활용하여 SiC 연마의 까다로운 요구 사항을 충족하는 독자적인 배합을 개발하고 있습니다. 마찬가지로 DuPont과 후지방은 SiC CMP 패드 시장에서 압도적인 위치를 차지하고 있습니다. 이러한 제한된 수공급업체는 높은 품질과 성능을 보장하는 한편, 향후 생산 능력 확장의 병목현상이 될 수 있습니다. 현재 시장 활동의 대부분은 파워일렉트로닉스의 업계 표준이 되어 자동차 및 에너지 분야에 필수적인 6인치 SiC 웨이퍼에 집중되어 있습니다. 그러나 8인치 웨이퍼에 대한 수요도 이제 막 시작되었지만 성장하고 있으며, 이는 규모의 경제를 약속하는 것으로 웨이퍼 및 ST마이크로일렉트로닉스와 같은 대형 SiC 제조업체들에게 중요한 초점이 되고 있습니다. 이러한 소모품의 성능은 최종 디바이스의 수율과 품질에 직접적인 영향을 미치기 때문에 그 개발은 SiC 생태계 전체에 중요한 과제가 되고 있습니다.

SiC CMP 소모품 시장에는 몇 가지 강력한 추세가 있습니다. 우선, 전기자동차(EV)에 SiC의 채용이 가속화되고 있습니다. SiC 파워 디바이스는 기존 실리콘 기반 솔루션에 비해 효율, 전력 밀도, 열전도율이 우수하여 EV의 인버터, 차량용 충전기, DC-DC 컨버터에 매우 중요한 역할을 합니다. EV 생산이 전 세계적으로 확대됨에 따라 SiC 웨이퍼, 나아가 이를 연마하기 위한 소모품에 대한 수요도 확대되고 있습니다. 둘째, 재생에너지의 세계 추진이 중요한 원동력이 되고 있습니다. SiC 부품은 태양광 인버터 및 풍력 터빈 시스템에 필수적이며, 에너지 변환 효율을 극대화하는 데 기여하고 있습니다. 세 번째 요인은 6인치 웨이퍼에서 8인치 웨이퍼로의 전환입니다. 이러한 전환은 반도체 산업이 다이당 비용 절감을 지속적으로 추구하고 있기 때문입니다. 대형 SiC 제조업체들이 8인치 생산 라인에 대규모 투자를 진행함에 따라, 대형 웨이퍼에 최적화된 고성능 CMP 슬러리 및 패드에 대한 수요가 급증할 것으로 예측됩니다. 이러한 전환에 따라 소모품 제조업체는 대형 기판의 연마 균일성 및 결함에 대한 새로운 기술 과제를 해결하기 위해 대규모 R&D 투자가 필요합니다.

견고한 촉진요인에도 불구하고,SiC CMP 소모품 산업은 큰 문제에 직면하고 있습니다. 주요 장애물은 SiC의 매우 높은 경도와 화학적 불활성으로 인해 연마가 본질적으로 어렵고 시간이 많이 걸리는 과정입니다. 따라서 효과적이고 비용 효율적인 연마 슬러리와 내구성이 뛰어난 패드를 사용해야 합니다. 표면 결함을 최소화하면서 더 높은 재료 제거율(MRR)을 달성할 수 있는 새로운 배합을 개발하는 것은 여전히 큰 기술적 장애물이 되고 있습니다. 두 번째 큰 문제는 원료, 특히 슬러리에 사용되는 특수 연마제 및 화학물질의 비용이 비싸고 공급량이 제한적이라는 점입니다. 시장의 집중적인 특성도 주요 공급업체가 생산 문제에 직면할 경우 잠재적인 공급망 취약성을 초래할 수 있어 우려의 대상이 될 수 있습니다. 또한, 서로 다른 SiC 디바이스 제조업체 간에 표준화된 연마 공정이 없기 때문에 복잡성이 증가하고 있습니다. 각 제조업체는 고유 한 레시피를 가지고 있기 때문에 소모품 공급업체는 다양한 제품을 개발하거나 개별 고객과 긴밀히 협력하여 맞춤형 솔루션을 개발해야합니다. 이러한 단편화는 전체 산업의 성숙을 지연시키고 보편적이고 수율이 높은 연마 공정의 개발을 방해할 수 있습니다.

이 보고서는 SiC 연마 소모품 세계 시장을 종합적으로 소개하며, 지역별, 국가별, 유형별, 웨이퍼 크기별 분석과 함께 총매출액, 주요 기업 점유율 및 순위에 초점을 맞추었습니다.

SiC 연마 소모품 시장 규모와 추정 및 예측에 대해 2024년을 기준 연도로 하여 2020년부터 2031년까지의 과거 데이터와 예측 데이터를 매출액(백만 달러)으로 조사하여 분석했습니다. 정량적 분석과 정성적 분석을 통해 독자들이 비즈니스/성장 전략을 수립하고, 시장 경쟁 구도를 평가하고, 현재 시장에서의 위치를 분석하며, SiC 연마 소모품에 대한 정보에 입각한 비즈니스 의사결정을 내릴 수 있도록 돕습니다.

목차

제1장 시장 개요

• SiC 연마 소모품 제품 서론
• SiC 연마 소모품 세계 시장 규모 예측(2020-2031년)
• SiC 연마 소모품 시장 동향과 촉진요인
• 전제조건과 제약
• 조사 목적
• 조사 대상 연도

제2장 기업별 경쟁 분석

• 세계의 SiC 연마 소모품 기업 수익 순위(2024년)
• 세계의 SiC 연마 소모품 기업별 매출(2020-2025년)
• 주요 제조업체의 SiC 연마 소모품 제조거점 분포 및 본사
• 주요 제조업체의 SiC 연마 소모품 제품 제공
• 주요 제조업체의 SiC 연마 소모품 양산 개시시기
• SiC 연마 소모품 시장 경쟁 분석
• 인수합병(M&A) 및 확대

제3장 유형별 세분화

• 유형별 서론
  • SiC CMP 패드
  • SiC CMP 슬러리
• 세계의 SiC 연마 소모품 유형별 판매액

제4장 웨이퍼 사이즈별 부문

• 웨이퍼 사이즈별 서론
  • 8인치 SiC 웨이퍼
  • 6인치 SiC 웨이퍼
  • 4인치 SiC 웨이퍼
• 웨이퍼 사이즈별 SiC 연마 소모품 세계 판매 금액
  • 웨이퍼 사이즈별 SiC 연마 소모품 세계 판매액(2020년 vs. 2024년 vs. 2031년)
  • 웨이퍼 사이즈별 SiC 연마 소모품 세계 판매액(2020년-2031년)
  • 웨이퍼 사이즈별 SiC 연마 소모품 세계 판매액(%)(2020-2031년)

제5장 지역별 세분화

• SiC 연마 소모품 지역별 세계 판매액
• 북미
• 유럽
• 아시아태평양
• 남미
• 중동 및 아프리카

제6장 주요 국가/지역별 부문

• 주요 국가, 지역별 SiC 연마 소모품 판매액 성장 동향, 2020년 vs. 2024년 vs. 2031년
• 주요 국가, 지역별 SiC 연마 소모품 판매액,2020-2031년
• 미국
• 유럽
• 중국
• 일본
• 한국
• 동남아시아
• 인도

제7장 기업 개요

• DuPont
• Fujibo Group
• Entegris(CMC Materials)
• Saint-Gobain
• Fujimi Corporation
• Shanghai Xinanna Electronic Technology
• Vibrantz(Ferro)
• Beijing Hangtian Saide
• Beijing Grish Hitech
• Tianjin Helen
• CHUANYAN
• Engis Corporation

제8장 산업 체인 분석

제9장 조사 결과와 결론

제10장 부록

영문목차

The global market for SiC Polishing Consumables was estimated to be worth US$ 134 million in 2024 and is forecast to a readjusted size of US$ 472 million by 2031 with a CAGR of 19.6% during the forecast period 2025-2031.

Silicon Carbide (SiC) is a wide band gap semiconductor that can operate at higher temperature, power level, and voltage. This enables improved energy efficiency in power devices, LED lighting, and telecommunications. Because of its unique properties, SiC is the material of choice for diverse applications such as Hybrid Electric vehicles, power electronic switches, and LED lighting technology.

This report studies the SiC Polishing Consumables, include the SiC CMP Slurry and SiC CMP Pad.

The global key players of SiC polishing consumables include DuPont, Entegris, Fujimi Corporation, Saint-Gobain, Fujibo and Shanghai Xinanna, etc. In 2024, the global top four players occupied for a share approximately 82% in terms of revenue.

The key players of SiC CMP slurry include Entegris, Fujimi Corporation, Saint-Gobain, and Shanghai Xinanna, etc. In 2024, the global top three players occupied for a share approximately 82.4% in terms of revenue.

The key players of SiC CMP pads include DuPont, Entegris, and Fujibo, etc. DuPont is domaing the global SiC CMP pads market, holds a share over 75%.

The market for silicon carbide (SiC) chemical mechanical polishing (CMP) consumables, including slurries and pads, is at a pivotal stage, reflecting the rapid growth of the SiC wafer industry itself. Currently, the market is highly concentrated, with a small number of key players dominating the supply chain. Entegris and Fujimi Corporation are the established leaders in SiC CMP slurries, leveraging their deep expertise in materials science to develop proprietary formulations that meet the stringent demands of SiC polishing. Similarly, DuPont and Fujibo hold a commanding position in the SiC CMP pads market. This limited number of suppliers, while ensuring high quality and performance, also presents a potential bottleneck for future capacity expansion. Most of the market activity today is focused on 6-inch SiC wafers, which have become the industry standard for power electronics and are critical for the automotive and energy sectors. However, there is a nascent but growing demand for 8-inch wafers, which promises economies of scale and is a key focus for leading SiC manufacturers like Wolfspeed and STMicroelectronics. The performance of these consumables directly impacts the final device yield and quality, making their development a critical path item for the entire SiC ecosystem.

Several powerful trends are acting as tailwinds for the SiC CMP consumables market. First and foremost is the accelerated adoption of SiC in electric vehicles (EVs). SiC power devices are crucial for EV inverters, on-board chargers, and DC-DC converters due to their superior efficiency, power density, and thermal conductivity compared to traditional silicon-based solutions. As EV production scales up globally, so does the demand for SiC wafers and, by extension, the consumables used to polish them. Second, the global push for renewable energy is a significant driver. SiC components are essential for solar inverters and wind turbine systems, where they help maximize energy conversion efficiency. The third factor is the transition from 6-inch to 8-inch wafers. This shift is driven by the semiconductor industry's constant quest for lower costs per die. As major SiC manufacturers invest heavily in 8-inch fabrication lines, the demand for high-performance CMP slurries and pads specifically optimized for these larger wafers will surge. This transition will require significant R&D investment from consumables suppliers to address new technical challenges related to polishing uniformity and defectivity on larger substrates.

Despite the robust growth drivers, the SiC CMP consumables industry faces significant challenges. The primary obstacle is the extreme hardness and chemical inertness of SiC, which makes polishing an inherently difficult and slow process. This necessitates the use of abrasive slurries and durable pads that are both effective and cost-effective. Developing new formulations that can achieve higher material removal rates (MRR) while minimizing surface defects remains a major technical hurdle. A second major challenge is the high cost and limited supply of raw materials, particularly the specialized abrasives and chemicals used in slurries. The concentrated nature of the market could also be a point of concern, as it could lead to potential supply chain vulnerabilities if a key supplier faces production issues. Furthermore, the lack of a standardized polishing process across different SiC device manufacturers adds complexity. Each manufacturer has its own proprietary recipes, requiring consumables suppliers to develop a wide range of products or work closely with individual customers on tailored solutions. This fragmentation can slow down the overall maturation of the industry and hinder the development of universal, high-yield polishing processes.

This report aims to provide a comprehensive presentation of the global market for SiC Polishing Consumables, focusing on the total sales revenue, key companies market share and ranking, together with an analysis of SiC Polishing Consumables by region & country, by Type, and by Wafer Size.

The SiC Polishing Consumables market size, estimations, and forecasts are provided in terms of sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding SiC Polishing Consumables.

Market Segmentation

By Company

• DuPont
• Fujibo Group
• Entegris (CMC Materials)
• Saint-Gobain
• Fujimi Corporation
• Shanghai Xinanna Electronic Technology
• Vibrantz (Ferro)
• Beijing Hangtian Saide
• Beijing Grish Hitech
• Tianjin Helen
• CHUANYAN
• Engis Corporation

Segment by Type

• SiC CMP Pads
• SiC CMP Slurry

Segment by Wafer Size

• 8 Inch SiC Wafer
• 6 Inch SiC Wafer
• 4 Inch SiC Wafer

By Region

• North America
  • United States
  • Canada
• Asia-Pacific
  • China
  • Japan
  • South Korea
  • Southeast Asia
  • India
  • Australia
  • Rest of Asia-Pacific
• Europe
  • Germany
  • France
  • U.K.
  • Italy
  • Netherlands
  • Nordic Countries
  • Rest of Europe
• Latin America
  • Mexico
  • Brazil
  • Rest of Latin America
• Middle East & Africa
  • Turkey
  • Saudi Arabia
  • UAE
  • Rest of MEA

Chapter Outline

Chapter 1: Introduces the report scope of the report, global total market size. This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 2: Detailed analysis of SiC Polishing Consumables company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 4: Provides the analysis of various market segments by Wafer Size, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 5: Revenue of SiC Polishing Consumables in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.

Chapter 6: Revenue of SiC Polishing Consumables in country level. It provides sigmate data by Type, and by Wafer Size for each country/region.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Conclusion.

Table of Contents

1 Market Overview

• 1.1 SiC Polishing Consumables Product Introduction
• 1.2 Global SiC Polishing Consumables Market Size Forecast (2020-2031)
• 1.3 SiC Polishing Consumables Market Trends & Drivers
  • 1.3.1 SiC Polishing Consumables Industry Trends
  • 1.3.2 SiC Polishing Consumables Market Drivers & Opportunity
  • 1.3.3 SiC Polishing Consumables Market Challenges
  • 1.3.4 SiC Polishing Consumables Market Restraints
• 1.4 Assumptions and Limitations
• 1.5 Study Objectives
• 1.6 Years Considered

2 Competitive Analysis by Company

• 2.1 Global SiC Polishing Consumables Players Revenue Ranking (2024)
• 2.2 Global SiC Polishing Consumables Revenue by Company (2020-2025)
• 2.3 Key Companies SiC Polishing Consumables Manufacturing Base Distribution and Headquarters
• 2.4 Key Companies SiC Polishing Consumables Product Offered
• 2.5 Key Companies Time to Begin Mass Production of SiC Polishing Consumables
• 2.6 SiC Polishing Consumables Market Competitive Analysis
  • 2.6.1 SiC Polishing Consumables Market Concentration Rate (2020-2025)
  • 2.6.2 Global 5 and 10 Largest Companies by SiC Polishing Consumables Revenue in 2024
  • 2.6.3 Global Top Companies by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in SiC Polishing Consumables as of 2024)
• 2.7 Mergers & Acquisitions, Expansion

3 Segmentation by Type

• 3.1 Introduction by Type
  • 3.1.1 SiC CMP Pads
  • 3.1.2 SiC CMP Slurry
• 3.2 Global SiC Polishing Consumables Sales Value by Type
  • 3.2.1 Global SiC Polishing Consumables Sales Value by Type (2020 VS 2024 VS 2031)
  • 3.2.2 Global SiC Polishing Consumables Sales Value, by Type (2020-2031)
  • 3.2.3 Global SiC Polishing Consumables Sales Value, by Type (%) (2020-2031)

4 Segmentation by Wafer Size

• 4.1 Introduction by Wafer Size
  • 4.1.1 8 Inch SiC Wafer
  • 4.1.2 6 Inch SiC Wafer
  • 4.1.3 4 Inch SiC Wafer
• 4.2 Global SiC Polishing Consumables Sales Value by Wafer Size
  • 4.2.1 Global SiC Polishing Consumables Sales Value by Wafer Size (2020 VS 2024 VS 2031)
  • 4.2.2 Global SiC Polishing Consumables Sales Value, by Wafer Size (2020-2031)
  • 4.2.3 Global SiC Polishing Consumables Sales Value, by Wafer Size (%) (2020-2031)

5 Segmentation by Region

• 5.1 Global SiC Polishing Consumables Sales Value by Region
  • 5.1.1 Global SiC Polishing Consumables Sales Value by Region: 2020 VS 2024 VS 2031
  • 5.1.2 Global SiC Polishing Consumables Sales Value by Region (2020-2025)
  • 5.1.3 Global SiC Polishing Consumables Sales Value by Region (2026-2031)
  • 5.1.4 Global SiC Polishing Consumables Sales Value by Region (%), (2020-2031)
• 5.2 North America
  • 5.2.1 North America SiC Polishing Consumables Sales Value, 2020-2031
  • 5.2.2 North America SiC Polishing Consumables Sales Value by Country (%), 2024 VS 2031
• 5.3 Europe
  • 5.3.1 Europe SiC Polishing Consumables Sales Value, 2020-2031
  • 5.3.2 Europe SiC Polishing Consumables Sales Value by Country (%), 2024 VS 2031
• 5.4 Asia Pacific
  • 5.4.1 Asia Pacific SiC Polishing Consumables Sales Value, 2020-2031
  • 5.4.2 Asia Pacific SiC Polishing Consumables Sales Value by Region (%), 2024 VS 2031
• 5.5 South America
  • 5.5.1 South America SiC Polishing Consumables Sales Value, 2020-2031
  • 5.5.2 South America SiC Polishing Consumables Sales Value by Country (%), 2024 VS 2031
• 5.6 Middle East & Africa
  • 5.6.1 Middle East & Africa SiC Polishing Consumables Sales Value, 2020-2031
  • 5.6.2 Middle East & Africa SiC Polishing Consumables Sales Value by Country (%), 2024 VS 2031

6 Segmentation by Key Countries/Regions

• 6.1 Key Countries/Regions SiC Polishing Consumables Sales Value Growth Trends, 2020 VS 2024 VS 2031
• 6.2 Key Countries/Regions SiC Polishing Consumables Sales Value, 2020-2031
• 6.3 United States
  • 6.3.1 United States SiC Polishing Consumables Sales Value, 2020-2031
  • 6.3.2 United States SiC Polishing Consumables Sales Value by Type (%), 2024 VS 2031
  • 6.3.3 United States SiC Polishing Consumables Sales Value by Wafer Size, 2024 VS 2031
• 6.4 Europe
  • 6.4.1 Europe SiC Polishing Consumables Sales Value, 2020-2031
  • 6.4.2 Europe SiC Polishing Consumables Sales Value by Type (%), 2024 VS 2031
  • 6.4.3 Europe SiC Polishing Consumables Sales Value by Wafer Size, 2024 VS 2031
• 6.5 China
  • 6.5.1 China SiC Polishing Consumables Sales Value, 2020-2031
  • 6.5.2 China SiC Polishing Consumables Sales Value by Type (%), 2024 VS 2031
  • 6.5.3 China SiC Polishing Consumables Sales Value by Wafer Size, 2024 VS 2031
• 6.6 Japan
  • 6.6.1 Japan SiC Polishing Consumables Sales Value, 2020-2031
  • 6.6.2 Japan SiC Polishing Consumables Sales Value by Type (%), 2024 VS 2031
  • 6.6.3 Japan SiC Polishing Consumables Sales Value by Wafer Size, 2024 VS 2031
• 6.7 South Korea
  • 6.7.1 South Korea SiC Polishing Consumables Sales Value, 2020-2031
  • 6.7.2 South Korea SiC Polishing Consumables Sales Value by Type (%), 2024 VS 2031
  • 6.7.3 South Korea SiC Polishing Consumables Sales Value by Wafer Size, 2024 VS 2031
• 6.8 Southeast Asia
  • 6.8.1 Southeast Asia SiC Polishing Consumables Sales Value, 2020-2031
  • 6.8.2 Southeast Asia SiC Polishing Consumables Sales Value by Type (%), 2024 VS 2031
  • 6.8.3 Southeast Asia SiC Polishing Consumables Sales Value by Wafer Size, 2024 VS 2031
• 6.9 India
  • 6.9.1 India SiC Polishing Consumables Sales Value, 2020-2031
  • 6.9.2 India SiC Polishing Consumables Sales Value by Type (%), 2024 VS 2031
  • 6.9.3 India SiC Polishing Consumables Sales Value by Wafer Size, 2024 VS 2031

7 Company Profiles

• 7.1 DuPont
  • 7.1.1 DuPont Profile
  • 7.1.2 DuPont Main Business
  • 7.1.3 DuPont SiC Polishing Consumables Products, Services and Solutions
  • 7.1.4 DuPont SiC Polishing Consumables Revenue (US$ Million) & (2020-2025)
  • 7.1.5 DuPont Recent Developments
• 7.2 Fujibo Group
  • 7.2.1 Fujibo Group Profile
  • 7.2.2 Fujibo Group Main Business
  • 7.2.3 Fujibo Group SiC Polishing Consumables Products, Services and Solutions
  • 7.2.4 Fujibo Group SiC Polishing Consumables Revenue (US$ Million) & (2020-2025)
  • 7.2.5 Fujibo Group Recent Developments
• 7.3 Entegris (CMC Materials)
  • 7.3.1 Entegris (CMC Materials) Profile
  • 7.3.2 Entegris (CMC Materials) Main Business
  • 7.3.3 Entegris (CMC Materials) SiC Polishing Consumables Products, Services and Solutions
  • 7.3.4 Entegris (CMC Materials) SiC Polishing Consumables Revenue (US$ Million) & (2020-2025)
  • 7.3.5 Entegris (CMC Materials) Recent Developments
• 7.4 Saint-Gobain
  • 7.4.1 Saint-Gobain Profile
  • 7.4.2 Saint-Gobain Main Business
  • 7.4.3 Saint-Gobain SiC Polishing Consumables Products, Services and Solutions
  • 7.4.4 Saint-Gobain SiC Polishing Consumables Revenue (US$ Million) & (2020-2025)
  • 7.4.5 Saint-Gobain Recent Developments
• 7.5 Fujimi Corporation
  • 7.5.1 Fujimi Corporation Profile
  • 7.5.2 Fujimi Corporation Main Business
  • 7.5.3 Fujimi Corporation SiC Polishing Consumables Products, Services and Solutions
  • 7.5.4 Fujimi Corporation SiC Polishing Consumables Revenue (US$ Million) & (2020-2025)
  • 7.5.5 Fujimi Corporation Recent Developments
• 7.6 Shanghai Xinanna Electronic Technology
  • 7.6.1 Shanghai Xinanna Electronic Technology Profile
  • 7.6.2 Shanghai Xinanna Electronic Technology Main Business
  • 7.6.3 Shanghai Xinanna Electronic Technology SiC Polishing Consumables Products, Services and Solutions
  • 7.6.4 Shanghai Xinanna Electronic Technology SiC Polishing Consumables Revenue (US$ Million) & (2020-2025)
  • 7.6.5 Shanghai Xinanna Electronic Technology Recent Developments
• 7.7 Vibrantz (Ferro)
  • 7.7.1 Vibrantz (Ferro) Profile
  • 7.7.2 Vibrantz (Ferro) Main Business
  • 7.7.3 Vibrantz (Ferro) SiC Polishing Consumables Products, Services and Solutions
  • 7.7.4 Vibrantz (Ferro) SiC Polishing Consumables Revenue (US$ Million) & (2020-2025)
  • 7.7.5 Vibrantz (Ferro) Recent Developments
• 7.8 Beijing Hangtian Saide
  • 7.8.1 Beijing Hangtian Saide Profile
  • 7.8.2 Beijing Hangtian Saide Main Business
  • 7.8.3 Beijing Hangtian Saide SiC Polishing Consumables Products, Services and Solutions
  • 7.8.4 Beijing Hangtian Saide SiC Polishing Consumables Revenue (US$ Million) & (2020-2025)
  • 7.8.5 Beijing Hangtian Saide Recent Developments
• 7.9 Beijing Grish Hitech
  • 7.9.1 Beijing Grish Hitech Profile
  • 7.9.2 Beijing Grish Hitech Main Business
  • 7.9.3 Beijing Grish Hitech SiC Polishing Consumables Products, Services and Solutions
  • 7.9.4 Beijing Grish Hitech SiC Polishing Consumables Revenue (US$ Million) & (2020-2025)
  • 7.9.5 Beijing Grish Hitech Recent Developments
• 7.10 Tianjin Helen
  • 7.10.1 Tianjin Helen Profile
  • 7.10.2 Tianjin Helen Main Business
  • 7.10.3 Tianjin Helen SiC Polishing Consumables Products, Services and Solutions
  • 7.10.4 Tianjin Helen SiC Polishing Consumables Revenue (US$ Million) & (2020-2025)
  • 7.10.5 Tianjin Helen Recent Developments
• 7.11 CHUANYAN
  • 7.11.1 CHUANYAN Profile
  • 7.11.2 CHUANYAN Main Business
  • 7.11.3 CHUANYAN SiC Polishing Consumables Products, Services and Solutions
  • 7.11.4 CHUANYAN SiC Polishing Consumables Revenue (US$ Million) & (2020-2025)
  • 7.11.5 CHUANYAN Recent Developments
• 7.12 Engis Corporation
  • 7.12.1 Engis Corporation Profile
  • 7.12.2 Engis Corporation Main Business
  • 7.12.3 Engis Corporation SiC Polishing Consumables Products, Services and Solutions
  • 7.12.4 Engis Corporation SiC Polishing Consumables Revenue (US$ Million) & (2020-2025)
  • 7.12.5 Engis Corporation Recent Developments

8 Industry Chain Analysis

• 8.1 SiC Polishing Consumables Industrial Chain
• 8.2 SiC Polishing Consumables Upstream Analysis
  • 8.2.1 Key Raw Materials
  • 8.2.2 Raw Materials Key Suppliers
  • 8.2.3 Manufacturing Cost Structure
• 8.3 Midstream Analysis
• 8.4 Downstream Analysis (Customers Analysis)
• 8.5 Sales Model and Sales Channels
  • 8.5.1 SiC Polishing Consumables Sales Model
  • 8.5.2 Sales Channel
  • 8.5.3 SiC Polishing Consumables Distributors

9 Research Findings and Conclusion

10 Appendix

• 10.1 Research Methodology
  • 10.1.1 Methodology/Research Approach
    • 10.1.1.1 Research Programs/Design
    • 10.1.1.2 Market Size Estimation
    • 10.1.1.3 Market Breakdown and Data Triangulation
  • 10.1.2 Data Source
    • 10.1.2.1 Secondary Sources
    • 10.1.2.2 Primary Sources
• 10.2 Author Details
• 10.3 Disclaimer