세계의 반도체 제조 장비 시장 : 시장 점유율과 순위, 전체 매출 및 수요 예측(2025-2031년)
Semiconductor Manufacturing Equipment - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031
상품코드:1693165
리서치사:QYResearch
발행일:2025년 04월
페이지 정보:영문
라이선스 & 가격 (부가세 별도)
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한글목차
세계 반도체 제조 장비 시장 규모는 2024년 1,209억 3,000만 달러에 달했습니다.
이 시장은 2031년 1,874억 달러에 달할 것으로 예상되며, 2025-2031년 6.59%의 CAGR을 기록할 것으로 전망됩니다.
북미 반도체 제조 장비 시장 규모는 2024년 132억 달러에 달했습니다. 이 시장은 2031년에는 208억 9,000만 달러에 달할 것으로 예상되며, 2025-2031년 CAGR은 6.75%에 달할 것으로 예상됩니다.
유럽 반도체 제조 장비 시장 규모는 2024년 74억 8,000만 달러에 달했습니다. 이 시장은 2031년에는 114억 달러에 달할 것으로 예상되며, 2025-2031년 CAGR은 5.99%에 달할 것으로 예상됩니다.
일본의 반도체 제조 장비 시장 규모는 2024년 91억 4,000만 달러에 달했습니다. 이 시장은 2031년에는 134억 달러에 달할 것으로 예상되며, 2025-2031년 CAGR은 5.16%에 달할 것으로 예상됩니다.
한국의 반도체 제조 장비 시장 규모는 2024년 222억 5,000만 달러로 집계되었습니다. 이 시장은 2031년에는 311억 9,000만 달러에 달할 것으로 예상되며, 2025-2031년 CAGR은 5.91%에 달할 것으로 예상됩니다.
중국 반도체 제조 장비 시장 규모는 2024년 424억 4,400만 달러에 달했습니다. 이 시장은 2031년에는 714억 6,000만 달러에 달할 것으로 예상되며, 2025-2031년 CAGR은 7.47%에 달할 것으로 예상됩니다.
중국 대만 반도체 제조 장비 시장 규모는 2024년 232억 9,000만 달러로 집계되었습니다. 이 시장은 2031년에는 326억 2,000만 달러에 달할 것으로 예상되며, 2025-2031년 CAGR은 5.42%에 달할 것으로 예상됩니다.
동남아시아의 반도체 제조 장비 시장은 2024년 25억 8,000만 달러 규모였습니다. 이 시장은 2031년에는 54억 5,000만 달러에 달할 것으로 예상되며, 2025-2031년 연평균 11.79%의 CAGR을 기록할 것으로 예상됩니다.
세계 웨이퍼 팹 장비 세계 시장은 2024년에 1,062억 9,000만 달러 규모였습니다. 이 시장은 2031년에는 1,637억 9,000만 달러에 달할 것으로 예상되며, 2025-2031년 연평균 6.63%의 CAGR을 기록할 것으로 예상됩니다.
세계 반도체 후공정 테스트 장비 세계 시장은 2024년 82억 3,000만 달러 규모였습니다. 이 시장은 2031년에는 130억 5,000만 달러에 달할 것으로 예상되며, 2025-2031년 연평균 6.23%의 CAGR을 기록할 것으로 예상됩니다.
세계 반도체 후공정 조립 및 패키징 장비 세계 시장은 2024년 64억 달러 규모였습니다. 이 시장은 2031년에는 105억 8,000만 달러에 달할 것으로 예상되며, 2025-2031년 연평균 6.48%의 CAGR을 기록할 것으로 예상됩니다.
세계 시장의 주요 기업으로는 ASML, corporation, Advantest, SCREEN, NAURA, ASM International, Hitachi High-Tech Corporation, DISCO Corporation, Teradyne, Canon, Lasertec, Kokusai Electric, EV Group(EVG), SEMES 등이 있습니다. Lasertec, Kokusai Electric, EV Group(EVG), SEMES 등이 있으며, 2024년에는 세계 상위 10개 기업이 세계 시장의 76.3%를 차지할 것으로 예상됩니다.
반도체 에칭 장비의 주요 진입 기업으로는 Lam Research, TEL, Applied Materials, Hitachi High-Tech, Oxford Instruments, SPTS Technologies, Plasma-Therm, GigaLane, SAMCO, AMEC, NAURA 등이 있습니다. SAMCO, AMEC, NAURA 등이 있습니다.
리소그래피 장비 시장은 ASML이 독점하고 있습니다. 그 외에는 Nikon, Canon, SMEE 등이 있습니다.
반도체 측정 및 검사 장비의 주요 기업은 KLA Corporation, Applied Materials, Hitachi High-Technologies, ASML, Onto Innovation, Lasertec, SCREEN Semiconductor, ZEISS, Camtek, Nova 등입니다. Solutions, ZEISS, Camtek, Nova 등이 있습니다.
PVD 시장은 Applied Materials, ULVAC, Evatec 등이 독점하고 있습니다.
CVD 시장은 Applied Materials, Lam Research, TEL, ASM International 등이 독점하고 있습니다. 그 외에는 Wonik IPS, Eugene Technology, TES, SPTS Technologies(KLA), Veeco, CVD Equipment, Shengyang Piotech, NAURA 등이 있습니다.
세정장비 시장은 SCREEN Semiconductor Solutions, TEL, Lam Research, SEMES, ACM Research, ZEUS Co. PSK, KCTECH, Takada 등이 독점하고 있습니다.
CMP 장비의 주요 진출 기업으로는 Applied Materials, Ebara Corporation, KCTech, ACCRETECH, Hwatsing Technology 등이 있습니다.
이 코터 & 신흥국 시장은 TEL과 SCREEN Semiconductor Solutions가 독점하고 있습니다. 그 외 SEMES, SUSS MicroTec, KINGSEMI, TAZMO 등이 있습니다.
Applied Materials, Inc.와 Axcelis Technologies Inc.는 이온 주입 장비의 주요 진입자이며, Axcelis와 Applied Materials는 전체 범위의 임플란트 제품을 갖춘 유일한 이온 주입 장비 제조업체입니다. 다른 이온 주입 장치 제조업체로는 일본의 Sumitomo Heavy Industries Ion Technology Co., Ltd, Nissin Ion Equipment Co., Ltd, 중국 대만의 Advanced Ion Beam Technology, Inc. 중국 CETC Electronics Equipment Group Co. 등이 있습니다.
반도체 테스트 장비의 주요 기업은 Advantest, Teradyne, Cohu, Hangzhou Changchuan Technology, Beijing Huafeng Test &Control Technology, Chroma ATE, YC Corporation 등입니다.
웨이퍼 다이서 및 그라인더의 주요 업체로는 디스코, 도쿄정밀 등이 있습니다.
반도체 테스트 장비의 주요 제조업체는 Advantest,Teradyne,Cohu,Hangzhou Changchuan Technology,Beijing Huafeng Test &Control Technology,Chroma ATE,YC Corporation 등입니다.
이 보고서는 세계 반도체 제조 장비 시장을 종합적으로 분석하여 지역별, 국가별, 유형별, 웨이퍼 크기별 반도체 제조 장비 분석과 함께 총 판매량, 판매 수익, 가격, 주요 기업의 시장 점유율 및 순위에 초점을 맞추고 있습니다. 또한, 2024년을 기준 연도로 하여 2020년부터 2031년까지의 실적 및 예측 데이터와 함께 판매량(대수)과 판매 수익(백만 달러)을 제공합니다. 정량적 및 정성적 분석을 통해 독자들이 비즈니스/성장 전략을 수립하고, 시장 경쟁 상황을 평가하고, 현재 시장에서의 위치를 분석하여 반도체 제조 장비에 대한 정보에 입각한 비즈니스 의사결정을 내릴 수 있도록 돕습니다.
목차
제1장 시장 개요
반도체 제조 장비 제품 소개
세계의 반도체 제조 장비 시장 규모 예측
반도체 제조 장비 시장 동향과 촉진요인
세계의 반도체 시장
가정과 제한
가정과 제한
가정과 제한
조사 목적
대상 연도
제2장 기업에 의한 경쟁 분석
제3장 유형별 세분화
유형별 소개
세계의 반도체 제조 장비 판매액, 유형별
세계의 반도체 제조 장비 판매량, 유형별
세계의 반도체 제조 장비 평균 가격, 유형별(2020-2031년)
제4장 장비 유형별 세분화
장비 유형별 소개
세계의 반도체 제조 장비 판매액, 장비 유형별
세계의 반도체 제조 장비 판매량, 장비 유형별
세계의 반도체 제조 장비 평균 가격, 장비 유형별(2020-2031년)
제5장 웨이퍼 사이즈별 세분화
웨이퍼 사이즈별 소개
세계의 반도체 제조 장비 판매액, 웨이퍼 사이즈별
세계의 반도체 제조 장비 판매량, 웨이퍼 사이즈별
세계의 반도체 제조 장비 평균 가격, 웨이퍼 사이즈별(2020-2031년)
제6장 지역별 세분화
세계의 반도체 제조 장비 판매액, 지역별
세계의 반도체 제조 장비 판매량, 지역별
세계의 반도체 제조 장비 평균 가격, 지역별(2020-2031년)
북미
유럽
아시아태평양
남미
중동 및 아프리카
제7장 주요 국가·지역별 세분화
주요 국가·지역별 반도체 제조 장비 판매액 성장 동향, 2020년 대 2024년 대 2031년
주요 국가·지역별 반도체 제조 장비 판매액·판매대수
미국
유럽
중국
일본
한국
동남아시아
중국 대만
제8장 기업 개요
Applied Materials, Inc.(AMAT)
ASML
TEL(Tokyo Electron Ltd.)
Lam Research
SCREEN Semiconductor Solutions Co., Ltd.
KLA Corporation
NAURA
Advantest
ASM International
Hitachi High-Tech Corporation
Teradyne
Lasertec
DISCO Corporation
Canon
Nikon Precision Inc
SEMES
Ebara Technologies, Inc.(ETI)
Axcelis Technologies Inc
AMEC(Advanced Micro-Fabrication Equipment Inc. China)
Kokusai Electric
Beijing E-Town Semiconductor Technology
Onto Innovation
Aixtron
NuFlare Technology, Inc.
ACM Research
Veeco
Wonik IPS
Piotech, Inc
Hwatsing Technology
SUSS Group
ULVAC
Kingsemi
Eugene Technology
PSK Group
Jusung Engineering
Oxford Instruments
Skyverse Technology
PNC Technology Group
TES CO., LTD
Samco Inc.
제9장 산업 체인 분석
제10장 조사 결과와 결론
제11장 부록
ksm
영문 목차
영문목차
The global semiconductor manufacturing equipment market was valued at US$ 120.93 billion in 2024 and is expected to reach US$ 187.4 billion by 2031, growing at a CAGR of 6.59% during 2025-2031.
The North America semiconductor manufacturing equipment market was valued at US$ 13.2 billion in 2024 and is expected to reach US$ 20.89 billion by 2031, growing at a CAGR of 6.75% during 2025-2031.
The Europe semiconductor manufacturing equipment market was valued at US$ 7.48 billion in 2024 and is expected to reach US$ 11.4 billion by 2031, growing at a CAGR of 5.99% during 2025-2031.
The Japan semiconductor manufacturing equipment market was valued at US$ 9.14 billion in 2024 and is expected to reach US$ 13.4 billion by 2031, growing at a CAGR of 5.16% during 2025-2031.
The South Korea semiconductor manufacturing equipment market was valued at US$ 22.25 billion in 2024 and is expected to reach US$ 31.19 billion by 2031, growing at a CAGR of 5.91% during 2025-2031.
The China semiconductor manufacturing equipment market was valued at US$ 42.44 billion in 2024 and is expected to reach US$ 71.46 billion by 2031, growing at a CAGR of 7.47% during 2025-2031.
The China Taiwan semiconductor manufacturing equipment market was valued at US$ 23.29 billion in 2024 and is expected to reach US$ 32.62 billion by 2031, growing at a CAGR of 5.42% during 2025-2031.
The Southeast Asia semiconductor manufacturing equipment market was valued at US$ 2.58 billion in 2024 and is expected to reach US$ 5.45 billion by 2031, growing at a CAGR of 11.79% during 2025-2031.
The global wafer fab equipment market was valued at US$ 106.29 billion in 2024 and is expected to reach US$ 163.79 billion by 2031, growing at a CAGR of 6.63% during 2025-2031.
The global semiconductor back-end test equipment market was valued at US$ 8.23 billion in 2024 and is expected to reach US$ 13.05 billion by 2031, growing at a CAGR of 6.23% during 2025-2031.
The global semiconductor back-end assembly & packaging equipment market was valued at US$ 6.40 billion in 2024 and is expected to reach US$ 10.58 billion by 2031, growing at a CAGR of 6.48% during 2025-2031.
In global market, the key players are ASML, Applied Materials, Inc. (AMAT), TEL (Tokyo Electron Ltd.), Lam Research, KLA Corporation, Advantest, SCREEN, NAURA, ASM International, Hitachi High-Tech Corporation, DISCO Corporation, Teradyne, Canon, Lasertec, Kokusai Electric, EV Group (EVG), and SEMES, etc. In 2024, the global top ten players hold 76.3 percent of global market.
The key players of semiconductor etch equipment include Lam Research, TEL, Applied Materials, Hitachi High-Tech, Oxford Instruments, SPTS Technologies, Plasma-Therm, GigaLane, SAMCO, AMEC, and NAURA, etc.
The Lithography Machine market is dominated by ASML. Other players include Nikon, Canon, and SMEE.
The key players of Semiconductor Metrology and Inspection Equipment include KLA Corporation, Applied Materials, Hitachi High-Technologies, ASML, Onto Innovation, Lasertec, SCREEN Semiconductor Solutions, ZEISS, Camtek and Nova, etc.
The PVD market is dominated by Applied Materials, ULVAC, and Evatec, etc.
CVD market is dominated by Applied Materials, Lam Research, TEL, and ASM International, etc. other players include Wonik IPS, Eugene Technology, Eugene Technology, TES, SPTS Technologies (KLA), Veeco, CVD Equipment, Shengyang Piotech, and NAURA.
The cleaning equipment market is dominated by SCREEN Semiconductor Solutions, TEL, Lam Research, SEMES, ACM Research, ZEUS Co., Ltd., Shibaura Mechatronics, NAURA, DAIKIN FINETECH, LTD., PSK, KCTECH, and Takada, etc.
The key players of CMP equipment include Applied Materials, Ebara Corporation, KCTech, ACCRETECH, and Hwatsing Technology, etc.
This Coater & Developer market is dominated by TEL and SCREEN Semiconductor Solutions. Other players are SEMES, SUSS MicroTec, KINGSEMI, and TAZMO, etc.
In the market for ion implantation systems, key players are Applied Materials, Inc and Axcelis Technologies Inc. Axcelis and Applied Materials are the only ion implant system manufacturers with a full range of implant products. Other implantation equipment manufacturers include Sumitomo Heavy Industries Ion Technology Co. Ltd. and Nissin Ion Equipment Co., Ltd in Japan, Advanced Ion Beam Technology, Inc. in China Taiwan, as well as CETC Electronics Equipment Group Co., Ltd. in China.
The key players of Semiconductor Test Equipment inlcude Advantest, Teradyne, Cohu, Hangzhou Changchuan Technology, Beijing Huafeng Test & Control Technology, Chroma ATE, and YC Corporation, etc.
The key players of Wafer Dicer and Grinder are Disco and TOKYO SEIMITSU, etc.
The key players of Semiconductor Test Equipment inlcude Advantest, Teradyne, Cohu, Hangzhou Changchuan Technology, Beijing Huafeng Test & Control Technology, Chroma ATE, and YC Corporation, etc.
This report aims to provide a comprehensive presentation of the global market for Semiconductor Manufacturing Equipment, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Semiconductor Manufacturing Equipment by region & country, by Type, and by Wafer Size.
The Semiconductor Manufacturing Equipment market size, estimations, and forecasts are provided in terms of sales volume (Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Manufacturing Equipment.
Market Segmentation
By Company
ASML
Applied Materials, Inc. (AMAT)
TEL (Tokyo Electron Ltd.)
Lam Research
KLA Corporation
Advantest
SCREEN
NAURA
ASM International
Hitachi High-Tech Corporation
DISCO Corporation
Teradyne
Canon
Lasertec
Kokusai Electric
EV Group (EVG)
SEMES
Ebara Technologies, Inc. (ETI)
AMEC
ASMPT Limited
Tokyo Seimitsu (Accretech)
IMS Nanofabrication
Axcelis Technologies Inc
ACM Research
Besi
NuFlare Technology, Inc.
Aixtron
Piotech, Inc
Kulicke & Soffa
Veeco
Onto Innovation
Nikon Precision Inc
Hangzhou Changchuan Technology
SMEE
Beijing E-Town Semiconductor Technology
Hwatsing Technology
Shibaura Mechatronics
Camtek
Wonik IPS
SUSS Group
Cohu
ULVAC
Jusung Engineering
ZEUS
TOWA Corporation
Eugene Technology
KINGSEMI Co., Ltd
Skyverse Technology
Oxford Instruments
PSK Group
Chroma ATE
KCTech
TES CO., LTD
PNC Technology Group
Beijing Huafeng Test & Control Technology
YC Corporation
Wuhan Jingce Electronic Group
Samco Inc.
Segment by Type
Wafer Fab Equipment
Back-end Test Equipment
Back-end Assembly & Packaging Equipment
Segment by Wafer Size
300mm Wafer Size
200mm Wafer Size
Others
By Region
North America
United States
Canada
Mexico
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
Others
Europe
Germany
UK
France
Italy
Netherlands
Austria & Sweden
Nordic Countries
Others
South America
Brazil
Others
Middle East & Africa
Israel
Others
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Semiconductor Manufacturing Equipment manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Equipment Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Wafer Size, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales, revenue of Semiconductor Manufacturing Equipment in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 7: Sales, revenue of Semiconductor Manufacturing Equipment in country level. It provides sigmate data by Type, and by Wafer Size for each country/region.
Chapter 8: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 9: Analysis of industrial chain, including the upstream and downstream of the industry.
2.9.2 Global 5 and 10 Largest Manufacturers by Semiconductor Manufacturing Equipment Revenue in 2024
2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Semiconductor Manufacturing Equipment as of 2024)
2.10 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 Wafer Fab Equipment
3.1.2 Back-end Test Equipment
3.1.3 Back-end Assembly & Packaging Equipment
3.2 Global Semiconductor Manufacturing Equipment Sales Value by Type
3.2.1 Global Semiconductor Manufacturing Equipment Sales Value by Type (2020 VS 2024 VS 2031)
3.2.2 Global Semiconductor Manufacturing Equipment Sales Value, by Type (2020-2031)
3.2.3 Global Semiconductor Manufacturing Equipment Sales Value, by Type (%) (2020-2031)
3.3 Global Semiconductor Manufacturing Equipment Sales Volume by Type
3.3.1 Global Semiconductor Manufacturing Equipment Sales Volume by Type (2020 VS 2024 VS 2031)
3.3.2 Global Semiconductor Manufacturing Equipment Sales Volume, by Type (2020-2031)
3.3.3 Global Semiconductor Manufacturing Equipment Sales Volume, by Type (%) (2020-2031)
3.4 Global Semiconductor Manufacturing Equipment Average Price by Type (2020-2031)
4 Segmentation by Equipment Type
4.1 Introduction by Equipment Type
4.1.1 Semiconductor Etch Equipment
4.1.2 Semiconductor Lithography Equipment
4.1.3 Semiconductor Metrology and Inspection Equipment
4.1.4 Semiconductor Deposition Equipment
4.1.5 Semiconductor Cleaning Equipment
4.1.6 Semiconductor Track/(Coater & Developer)
4.1.7 Semiconductor CMP Equipment
4.1.8 Semiconductor Heat Treatment Equipment
4.1.9 Semiconductor Ion Implant
4.1.10 Semiconductor Test Equipment
4.1.11 Test Handler
4.1.12 Wafer Dicer and Grinder
4.2 Global Semiconductor Manufacturing Equipment Sales Value by Equipment Type
4.2.1 Global Semiconductor Manufacturing Equipment Sales Value by Equipment Type (2020 VS 2024 VS 2031)
4.2.2 Global Semiconductor Manufacturing Equipment Sales Value, by Equipment Type (2020-2031)
4.2.3 Global Semiconductor Manufacturing Equipment Sales Value, by Equipment Type (%) (2020-2031)
4.3 Global Semiconductor Manufacturing Equipment Sales Volume by Equipment Type
4.3.1 Global Semiconductor Manufacturing Equipment Sales Volume by Equipment Type (2020 VS 2024 VS 2031)
4.3.2 Global Semiconductor Manufacturing Equipment Sales Volume, by Equipment Type (2020-2031)
4.3.3 Global Semiconductor Manufacturing Equipment Sales Volume, by Equipment Type (%) (2020-2031)
4.4 Global Semiconductor Manufacturing Equipment Average Price by Equipment Type (2020-2031)
5 Segmentation by Wafer Size
5.1 Introduction by Wafer Size
5.1.1 300mm Wafer Size Equipment
5.1.2 200mm Wafer Size Equipment
5.1.3 Others
5.2 Global Semiconductor Manufacturing Equipment Sales Value by Wafer Size
5.2.1 Global Semiconductor Manufacturing Equipment Sales Value by Wafer Size (2020 VS 2024 VS 2031)
5.2.2 Global Semiconductor Manufacturing Equipment Sales Value, by Wafer Size (2020-2031)
5.2.3 Global Semiconductor Manufacturing Equipment Sales Value, by Wafer Size (%) (2020-2031)
5.3 Global Semiconductor Manufacturing Equipment Sales Volume by Wafer Size
5.3.1 Global Semiconductor Manufacturing Equipment Sales Volume by Wafer Size (2020 VS 2024 VS 2031)
5.3.2 Global Semiconductor Manufacturing Equipment Sales Volume, by Wafer Size (2020-2031)
5.3.3 Global Semiconductor Manufacturing Equipment Sales Volume, by Wafer Size (%) (2020-2031)
5.4 Global Semiconductor Manufacturing Equipment Average Price by Wafer Size (2020-2031)
6 Segmentation by Region
6.1 Global Semiconductor Manufacturing Equipment Sales Value by Region
6.1.1 Global Semiconductor Manufacturing Equipment Sales Value by Region: 2020 VS 2024 VS 2031
6.1.2 Global Semiconductor Manufacturing Equipment Sales Value by Region (2020-2025)
6.1.3 Global Semiconductor Manufacturing Equipment Sales Value by Region (2026-2031)
6.1.4 Global Semiconductor Manufacturing Equipment Sales Value by Region (%), (2020-2031)
6.2 Global Semiconductor Manufacturing Equipment Sales Volume by Region
6.2.1 Global Semiconductor Manufacturing Equipment Sales Volume by Region: 2020 VS 2024 VS 2031
6.2.2 Global Semiconductor Manufacturing Equipment Sales Volume by Region (2020-2025)
6.2.3 Global Semiconductor Manufacturing Equipment Sales Volume by Region (2026-2031)
6.2.4 Global Semiconductor Manufacturing Equipment Sales Volume by Region (%), (2020-2031)
6.3 Global Semiconductor Manufacturing Equipment Average Price by Region (2020-2031)
6.4 North America
6.4.1 North America Semiconductor Manufacturing Equipment Sales Value, 2020-2031
6.4.2 North America Semiconductor Manufacturing Equipment Sales Value by Country (%), 2024 VS 2031
6.5 Europe
6.5.1 Europe Semiconductor Manufacturing Equipment Sales Value, 2020-2031
6.5.2 Europe Semiconductor Manufacturing Equipment Sales Value by Country (%), 2024 VS 2031
6.6 Asia Pacific
6.6.1 Asia Pacific Semiconductor Manufacturing Equipment Sales Value, 2020-2031
6.6.2 Asia Pacific Semiconductor Manufacturing Equipment Sales Value by Region (%), 2024 VS 2031
6.7 South America
6.7.1 South America Semiconductor Manufacturing Equipment Sales Value, 2020-2031
6.7.2 South America Semiconductor Manufacturing Equipment Sales Value by Country (%), 2024 VS 2031
6.8 Middle East & Africa
6.8.1 Middle East & Africa Semiconductor Manufacturing Equipment Sales Value, 2020-2031
6.8.2 Middle East & Africa Semiconductor Manufacturing Equipment Sales Value by Country (%), 2024 VS 2031
7 Segmentation by Key Countries/Regions
7.1 Key Countries/Regions Semiconductor Manufacturing Equipment Sales Value Growth Trends, 2020 VS 2024 VS 2031
7.2 Key Countries/Regions Semiconductor Manufacturing Equipment Sales Value and Sales Volume
