세계의 반도체 조립 및 포장 장비 시장 : 규모, 점유율, 동향, 산업 분석 보고서 - 제품별, 패키징 유형별, 최종 용도별, 지역별 시장 예측(2025-2034년)

Semiconductor Assembly and Packaging Equipment Market Size, Share, Trends, Industry Analysis Report By Product (Dicing Equipment, Bonding Equipment), By Packaging Type, By End Use, By Region - Market Forecast, 2025-2034

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한글목차

Polaris Market Research의 최신 조사에 따르면 반도체 조립 및 포장 장비 시장 규모는 2034년까지 84억 8,000만 달러에 이를 전망입니다. 이 설문조사 보고서는 현재 시장 역학을 자세히 파악하고 향후 시장 성장에 대한 분석을 제공합니다.

반도체 조립 및 포장 장비는 반도체 제조의 최종 단계에서 사용되는 정밀 기계로 개별 칩을 연결, 보호하고 전자 시스템에 통합할 준비를 합니다. 이 시장을 견인하고 있는 것은 칩의 성능, 전력 효율, 소형화를 높이는 것을 목적으로 한 연질 패키징 기술의 급속한 진화입니다. 2.5D/3D 통합 및 SiP와 같은 기술의 채용은 최종 용도가 보다 작은 폼팩터로 보다 고기능을 요구함에 따라 가속화되고 있으며, 디바이스 제조업체는 이러한 복잡한 포장 요건을 충족하기 위해 기술 혁신 및 능력 확장을 진행하고 있습니다.

조립 및 포장 공정의 자동화와 디지털화의 진전은 반도체 조립 및 포장 장비 수요를 더욱 밀어올립니다. 반도체 제조가 복잡해지고 규모가 계속 커지고 있는 가운데, 기업은 정확한 정렬, 실시간 모니터링 및 데이터 구동 최적화를 지원하는 지능형 고처리량 장치에 투자하고 있습니다. 이 변화는 생산 효율성 및 수율을 향상시키는 동시에 업계의 스마트 제조 환경으로의 전환과도 일치합니다. 그 결과, 경쟁력을 유지하고 급속하게 진화하는 신기술 수요에 대응하는 것을 목표로 하는 기업에 있어서, 자동화는 핵심 전략이 되고 있습니다.

반도체 조립 및 포장 장비 시장 보고서 하이라이트

포장 유형별로, 본딩 장치는 반도체 디바이스의 미세화와 성능의 선진 패키징에 큰 역할을 하기 때문에 2024년에 최대의 수익 점유율을 차지했습니다.

최종 용도별로는 패브리스 반도체 기업의 대두 및 후공정의 아웃소싱으로의 시프트에 추진되어 OSAT 부문이 가장 급성장할 것으로 예측됩니다.

북미의 반도체 조립 및 포장 장비 시장은 기술 혁신과 하이테크 제조 능력에 대한 주력에 힘입어 대폭적인 성장이 전망되고 있습니다.

아시아태평양은 견고한 반도체 에코시스템 및 차세대 패키징 인프라에 중점을 두어 2024년 세계 시장을 선도하고 있습니다.

반도체 조립 및 포장 장비 시장에서 세계 주요 기업으로는 Applied Materials, ASM Pacific Technology, Besi, Disco Corporation, Kulicke & Soffa Industries, Inc.(K&S), Nikon Corporation, Plasma-Therm, Rudolph Technologies, Inc., SCREEN Semiconductor Solutions Co. Ltd., SUSS MicroTec SE 등이 포함됩니다.

목차

제1장 서론

제2장 주요 요약

제3장 조사 방법

제4장 세계의 반도체 조립 및 포장 장비 시장 인사이트

• 시장 현황
• 반도체 조립 및 포장 장비 시장 역학
  • 성장 촉진요인 및 기회
    • 선진성 및 자동화에 대한 투자 증가
    • AI, IoT, 5G 대응 디바이스의 도입 증가
  • 성장 억제요인 및 과제
    • 고액의 자본 투자 및 기술적인 복잡성
  • 여론 및 프라이버시에 관한 판례
• PESTEL 분석
• 반도체 조립 및 포장 장비 시장 동향
• 밸류체인 분석

제5장 세계의 반도체 조립 및 포장 장비 시장 : 제품별

• 주요 조사 결과
• 서문
• 다이싱 장치
• 본딩 장치
• 패키징 장치
• 기타

제6장 세계의 반도체 조립 및 포장 장비 시장 : 패키징 유형별

• 주요 조사 결과
• 서문
• 플립칩 패키징 장치
• WLP 장치
• FO 패키징 장치
• SiP 장치
• 3D/2.5D 패키징 장치
• 기타

제7장 세계의 반도체 조립 및 포장 장비 시장 : 최종 용도별

• 주요 조사 결과
• 서문
• IDM
• OSAT

제8장 세계의 반도체 조립 및 포장 장비 시장 : 지역별

• 주요 조사 결과
• 서문
  • 반도체 조립 및 포장 장비 시장 분석 : 지역별(2020-2034년)
• 북미
  • 북미 : 제품별(2020-2034년)
  • 북미 : 패키징 유형별(2020-2034년)
  • 북미 : 최종 용도별(2020-2034년)
  • 미국
  • 캐나다
• 유럽
  • 유럽 : 제품별(2020-2034년)
  • 유럽 : 패키징 유형별(2020-2034년)
  • 유럽 : 최종 용도별(2020-2034년)
  • 영국
  • 프랑스
  • 독일
  • 이탈리아
  • 스페인
  • 네덜란드
  • 러시아
  • 기타 유럽
• 아시아태평양
  • 아시아태평양 : 제품별(2020-2034년)
  • 아시아태평양 : 패키징 유형별(2020-2034년)
  • 아시아태평양 : 최종 용도별(2020-2034년)
  • 중국
  • 인도
  • 말레이시아
  • 일본
  • 인도네시아
  • 한국
  • 호주
  • 기타 아시아태평양
• 중동 및 아프리카
  • 중동 및 아프리카 : 제품별(2020-2034년)
  • 중동 및 아프리카 : 패키징 유형별(2020-2034년)
  • 중동 및 아프리카 : 최종 용도별(2020-2034년)
  • 사우디아라비아
  • 아랍에미리트(UAE)
  • 이스라엘
  • 남아프리카
  • 기타 중동 및 아프리카
• 라틴아메리카
  • 라틴아메리카 : 제품별(2020-2034년)
  • 라틴아메리카 : 패키징 유형별(2020-2034년)
  • 라틴아메리카 : 최종 용도별(2020-2034년)
  • 멕시코
  • 브라질
  • 아르헨티나
  • 기타 라틴아메리카

제9장 경쟁 구도

• 확대 및 인수 분석
  • 확대
  • 인수
• 제휴, 협업, 합의 및 공개

제10장 기업 프로파일

• Applied Materials
• ASM Pacific Technology
• Besi
• Disco Corporation
• Kulicke & Soffa Industries, Inc.(K&S)
• Nikon Corporation
• Plasma-Therm
• Rudolph Technologies, Inc.
• SCREEN Semiconductor Solutions Co., Ltd.
• SUSS MicroTec SE

AJY

영문 목차

영문목차

The semiconductor Assembly and Packaging Equipment market size is expected to reach USD 8.48 billion by 2034, according to a new study by Polaris Market Research. The report "Semiconductor Assembly and Packaging Equipment Market Share, Size, Trends, Industry Analysis Report By Product (Dicing Equipment, Bonding Equipment), By Packaging Type, By End Use, By Region; Market Forecast, 2025-2034" gives a detailed insight into current market dynamics and provides analysis on future market growth.

Semiconductor assembly and packaging equipment refers to precision machinery used in the final stages of semiconductor manufacturing, where individual chips are connected, protected, and prepared for integration into electronic systems. This market is driven by the rapid evolution of flexible packaging techniques that aim to enhance chip performance, power efficiency, and miniaturization. The adoption of technologies such as 2.5D/3D integration and system-in-package is accelerating as end-use applications demand greater functionality in smaller form factors, driving equipment manufacturers to innovate and expand their capabilities to meet these complex packaging requirements.

The increasing automation and digitalization of assembly and packaging processes further drive demand for semiconductor assembly and packaging equipment. Companies are investing in intelligent, high-throughput equipment that supports precise alignment, real-time monitoring, and data-driven optimization as semiconductor manufacturing continues to grow in complexity and scale. This shift enhances production efficiency and yield while also aligning with the industry's transition toward smart manufacturing environments. As a result, automation is becoming a core strategy for players aiming to maintain competitiveness and meet the rapidly evolving demands of emerging technologies.

Semiconductor Assembly and Packaging Equipment Market Report Highlights

In terms of packaging type, the bonding equipment segment held the largest revenue share in 2024, as it plays a major role in advancing semiconductor device miniaturization and performance.

Based on end use, the OSAT segment is projected to grow the fastest, fueled by the rise of fabless semiconductor companies and the shift toward outsourcing back-end processes.

The North America semiconductor assembly and packaging equipment market is set for significant growth, supported by its focus on innovation and high-tech manufacturing capabilities.

Asia Pacific led the global market in 2024, owing to its robust semiconductor ecosystem and heavy investments in next-gen packaging infrastructure.

A few global key players in the semiconductor assembly and packaging equipment market include Applied Materials; ASM Pacific Technology; Besi; Disco Corporation; Kulicke & Soffa Industries, Inc. (K&S); Nikon Corporation; Plasma-Therm; Rudolph Technologies, Inc.; SCREEN Semiconductor Solutions Co., Ltd.; and SUSS MicroTec SE.

Polaris Market Research has segmented the semiconductor assembly and packaging equipment market report on the basis of product, packaging type, end use, and region:

By Product Outlook (Revenue, USD Billion, 2020-2034)

Dicing Equipment

Scriber

Dicer

Wafer Mounting Equipment

Bonding Equipment

Die Bonder

Wire Bonder

Others

Packaging Equipment

Molding Equipment

Solder Plating Equipment

Deflasher

Others

Others

By Packaging Type Outlook (Revenue, USD Billion, 2020-2034)

Flip Chip Packaging Equipment

Wafer Level Packaging (WLP) Equipment

Fan-Out Packaging Equipment

System-in-Package (SiP) Equipment

3D/2.5D Packaging Equipment

Others

By End Use Outlook (Revenue, USD Billion, 2020-2034)

IDMs (Integrated Device Manufacturers)

OSAT (Outsourced Semiconductor Assembly and Test)

By Regional Outlook (Revenue, USD Billion, 2020-2034)

North America

U.S.

Canada

Europe

Germany

UK

France

Italy

Spain

Russia

Netherlands

Rest of Europe

Asia Pacific

China

India

Japan

South Korea

Indonesia

Malaysia

Vietnam

Australia

Rest of Asia Pacific

Latin America

Argentina

Brazil

Mexico

Rest of Latin America

Middle East & Africa

UAE

Saudi Arabia

Israel

South Africa

Rest of Middle East & Africa

Table of Contents

1. Introduction

• 1.1. Report Description
  • 1.1.1. Objectives of the Study
  • 1.1.2. Market Scope
  • 1.1.3. Assumptions
• 1.2. Stakeholders

2. Executive Summary

• 2.1. Market Highlights

3. Research Methodology

• 3.1. Overview
  • 3.1.1. Data Mining
• 3.2. Data Sources
  • 3.2.1. Primary Sources
  • 3.2.2. Secondary Sources

4. Global Semiconductor Assembly and Packaging Equipment Market Insights

• 4.1. Semiconductor Assembly and Packaging Equipment Market - Market Snapshot
• 4.2. Semiconductor Assembly and Packaging Equipment Market Dynamics
  • 4.2.1. Drivers and Opportunities
    • 4.2.1.1. Increasing Investment in Advancement and Automation
    • 4.2.1.2. Rising Adoption of AI, IoT, and 5G-Enabled Devices
  • 4.2.2. Restraints and Challenges
    • 4.2.2.1. High Capital Investment and Technological Complexity
  • 4.2.3. Public opinion and privacy legal precedents
• 4.3. Porter's Five Forces Analysis
  • 4.3.1. Bargaining Power of Suppliers (Moderate)
  • 4.3.2. Threats of New Entrants: (Low)
  • 4.3.3. Bargaining Power of Buyers (Moderate)
  • 4.3.4. Threat of Substitute (Moderate)
  • 4.3.5. Rivalry among existing firms (High)
• 4.4. PESTEL Analysis
• 4.5. Semiconductor Assembly and Packaging Equipment Market Trends
• 4.6. Value Chain Analysis

5. Global Semiconductor Assembly and Packaging Equipment Market, By Product

• 5.1. Key Findings
• 5.2. Introduction
  • 5.2.1. Global Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
• 5.3. Dicing Equipment
  • 5.3.1. Global Semiconductor Assembly and Packaging Equipment Market, by Dicing Equipment, by Region, 2020-2034 (USD Billion)
  • 5.3.2. Scriber
    • 5.3.2.1. Global Semiconductor Assembly and Packaging Equipment Market, by Scriber, by Region, 2020-2034 (USD Billion)
  • 5.3.3. Dicer
    • 5.3.3.1. Global Semiconductor Assembly and Packaging Equipment Market, by Dicer, by Region, 2020-2034 (USD Billion)
  • 5.3.4. Wafer Mounting Equipment
    • 5.3.4.1. Global Semiconductor Assembly and Packaging Equipment Market, by Wafer Mounting Equipment, by Region, 2020-2034 (USD Billion)
• 5.4. Bonding Equipment
  • 5.4.1. Global Semiconductor Assembly and Packaging Equipment Market, by Bonding Equipment, by Region, 2020-2034 (USD Billion)
  • 5.4.2. Die Bonder
    • 5.4.2.1. Global Semiconductor Assembly and Packaging Equipment Market, by Die Bonder, by Region, 2020-2034 (USD Billion)
  • 5.4.3. Wire Bonder
    • 5.4.3.1. Global Semiconductor Assembly and Packaging Equipment Market, by Wire Bonder, by Region, 2020-2034 (USD Billion)
  • 5.4.4. Others
    • 5.4.4.1. Global Semiconductor Assembly and Packaging Equipment Market, by Others, by Region, 2020-2034 (USD Billion)
• 5.5. Packaging Equipment
  • 5.5.1. Global Semiconductor Assembly and Packaging Equipment Market, by Packaging Equipment, by Region, 2020-2034 (USD Billion)
  • 5.5.2. Molding Equipment
    • 5.5.2.1. Global Semiconductor Assembly and Packaging Equipment Market, by Molding Equipment, by Region, 2020-2034 (USD Billion)
  • 5.5.3. Solder Plating Equipment
    • 5.5.3.1. Global Semiconductor Assembly and Packaging Equipment Market, by Solder Plating Equipment, by Region, 2020-2034 (USD Billion)
  • 5.5.4. Deflasher
    • 5.5.4.1. Global Semiconductor Assembly and Packaging Equipment Market, by Deflasher, by Region, 2020-2034 (USD Billion)
  • 5.5.5. Others
    • 5.5.5.1. Global Semiconductor Assembly and Packaging Equipment Market, by Others, by Region, 2020-2034 (USD Billion)
• 5.6. Others
  • 5.6.1. Global Semiconductor Assembly and Packaging Equipment Market, by Others, by Region, 2020-2034 (USD Billion)

6. Global Semiconductor Assembly and Packaging Equipment Market, by Packaging Type

• 6.1. Key Findings
• 6.2. Introduction
  • 6.2.1. Global Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
• 6.3. Flip Chip Packaging Equipment
  • 6.3.1. Global Semiconductor Assembly and Packaging Equipment Market, by Flip Chip Packaging Equipment, by Region, 2020-2034 (USD Billion)
• 6.4. Wafer Level Packaging (WLP) Equipment
  • 6.4.1. Global Semiconductor Assembly and Packaging Equipment Market, by Wafer Level Packaging (WLP) Equipment, by Region, 2020-2034 (USD Billion)
• 6.5. Fan-Out Packaging Equipment
  • 6.5.1. Global Semiconductor Assembly and Packaging Equipment Market, by Fan-Out Packaging Equipment, by Region, 2020-2034 (USD Billion)
• 6.6. System-in-Package (SiP) Equipment
  • 6.6.1. Global Semiconductor Assembly and Packaging Equipment Market, by System-in-Package (SiP) Equipment, by Region, 2020-2034 (USD Billion)
• 6.7. 3D/2.5D Packaging Equipment
  • 6.7.1. Global Semiconductor Assembly and Packaging Equipment Market, by 3D/2.5D Packaging Equipment, by Region, 2020-2034 (USD Billion)
• 6.8. Others
  • 6.8.1. Global Semiconductor Assembly and Packaging Equipment Market, by Others, by Region, 2020-2034 (USD Billion)

7. Global Semiconductor Assembly and Packaging Equipment Market, by End Use

• 7.1. Key Findings
• 7.2. Introduction
  • 7.2.1. Global Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
• 7.3. IDMs (Integrated Device Manufacturers)
  • 7.3.1. Global Semiconductor Assembly and Packaging Equipment Market, by IDMs (Integrated Device Manufacturers), by Region, 2020-2034 (USD Billion)
• 7.4. OSAT (Outsourced Semiconductor Assembly and Test)
  • 7.4.1. Global Semiconductor Assembly and Packaging Equipment Market, by OSAT (Outsourced Semiconductor Assembly and Test), by Region, 2020-2034 (USD Billion)

8. Global Semiconductor Assembly and Packaging Equipment Market, by Geography

• 8.1. Key Findings
• 8.2. Introduction
  • 8.2.1. Semiconductor Assembly and Packaging Equipment Market Assessment, By Geography, 2020-2034 (USD Billion)
• 8.3. Semiconductor Assembly and Packaging Equipment Market - North America
  • 8.3.1. North America: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • 8.3.2. North America: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • 8.3.3. North America: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • 8.3.4. Semiconductor Assembly and Packaging Equipment Market - US
    • 8.3.4.1. US: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
    • 8.3.4.2. US: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
    • 8.3.4.3. US: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • 8.3.5. Semiconductor Assembly and Packaging Equipment Market - Canada
    • 8.3.5.1. Canada: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
    • 8.3.5.2. Canada: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
    • 8.3.5.3. Canada: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
• 8.4. Semiconductor Assembly and Packaging Equipment Market - Europe
  • 8.4.1. Europe: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • 8.4.2. Europe: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • 8.4.3. Europe: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • 8.4.4. Semiconductor Assembly and Packaging Equipment Market - UK
    • 8.4.4.1. UK: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
    • 8.4.4.2. UK: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
    • 8.4.4.3. UK: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • 8.4.5. Semiconductor Assembly and Packaging Equipment Market - France
    • 8.4.5.1. France: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
    • 8.4.5.2. France: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
    • 8.4.5.3. France: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • 8.4.6. Semiconductor Assembly and Packaging Equipment Market - Germany
    • 8.4.6.1. Germany: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
    • 8.4.6.2. Germany: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
    • 8.4.6.3. Germany: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • 8.4.7. Semiconductor Assembly and Packaging Equipment Market - Italy
    • 8.4.7.1. Italy: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
    • 8.4.7.2. Italy: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
    • 8.4.7.3. Italy: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • 8.4.8. Semiconductor Assembly and Packaging Equipment Market - Spain
    • 8.4.8.1. Spain: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
    • 8.4.8.2. Spain: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
    • 8.4.8.3. Spain: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • 8.4.9. Semiconductor Assembly and Packaging Equipment Market - Netherlands
    • 8.4.9.1. Netherlands: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
    • 8.4.9.2. Netherlands: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
    • 8.4.9.3. Netherlands: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • 8.4.10. Semiconductor Assembly and Packaging Equipment Market - Russia
    • 8.4.10.1. Russia: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
    • 8.4.10.2. Russia: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
    • 8.4.10.3. Russia: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • 8.4.11. Semiconductor Assembly and Packaging Equipment Market - Rest of Europe
    • 8.4.11.1. Rest of Europe: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
    • 8.4.11.2. Rest of Europe: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
    • 8.4.11.3. Rest of Europe: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
• 8.5. Semiconductor Assembly and Packaging Equipment Market - Asia Pacific
  • 8.5.1. Asia Pacific: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • 8.5.2. Asia Pacific: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • 8.5.3. Asia Pacific: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • 8.5.4. Semiconductor Assembly and Packaging Equipment Market - China
    • 8.5.4.1. China: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
    • 8.5.4.2. China: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
    • 8.5.4.3. China: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • 8.5.5. Semiconductor Assembly and Packaging Equipment Market - India
    • 8.5.5.1. India: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
    • 8.5.5.2. India: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
    • 8.5.5.3. India: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • 8.5.6. Semiconductor Assembly and Packaging Equipment Market - Malaysia
    • 8.5.6.1. Malaysia: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
    • 8.5.6.2. Malaysia: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
    • 8.5.6.3. Malaysia: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • 8.5.7. Semiconductor Assembly and Packaging Equipment Market - Japan
    • 8.5.7.1. Japan: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
    • 8.5.7.2. Japan: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
    • 8.5.7.3. Japan: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • 8.5.8. Semiconductor Assembly and Packaging Equipment Market - Indonesia
    • 8.5.8.1. Indonesia: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
    • 8.5.8.2. Indonesia: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
    • 8.5.8.3. Indonesia: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • 8.5.9. Semiconductor Assembly and Packaging Equipment Market - South Korea
    • 8.5.9.1. South Korea: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
    • 8.5.9.2. South Korea: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
    • 8.5.9.3. South Korea: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • 8.5.10. Semiconductor Assembly and Packaging Equipment Market - Australia
    • 8.5.10.1. Australia: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
    • 8.5.10.2. Australia: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
    • 8.5.10.3. Australia: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • 8.5.11. Semiconductor Assembly and Packaging Equipment Market - Rest of Asia Pacific
    • 8.5.11.1. Rest of Asia Pacific: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
    • 8.5.11.2. Rest of Asia Pacific: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
    • 8.5.11.3. Rest of Asia Pacific: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
• 8.6. Semiconductor Assembly and Packaging Equipment Market - Middle East & Africa
  • 8.6.1. Middle East & Africa: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • 8.6.2. Middle East & Africa: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • 8.6.3. Middle East & Africa: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • 8.6.4. Semiconductor Assembly and Packaging Equipment Market - Saudi Arabia
    • 8.6.4.1. Saudi Arabia: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
    • 8.6.4.2. Saudi Arabia: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
    • 8.6.4.3. Saudi Arabia: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • 8.6.5. Semiconductor Assembly and Packaging Equipment Market - UAE
    • 8.6.5.1. UAE: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
    • 8.6.5.2. UAE: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
    • 8.6.5.3. UAE: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • 8.6.6. Semiconductor Assembly and Packaging Equipment Market - Israel
    • 8.6.6.1. Israel: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
    • 8.6.6.2. Israel: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
    • 8.6.6.3. Israel: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • 8.6.7. Semiconductor Assembly and Packaging Equipment Market - South Africa
    • 8.6.7.1. South Africa: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
    • 8.6.7.2. South Africa: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
    • 8.6.7.3. South Africa: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • 8.6.8. Semiconductor Assembly and Packaging Equipment Market - Rest of Middle East & Africa
    • 8.6.8.1. Rest of Middle East & Africa: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
    • 8.6.8.2. Rest of Middle East & Africa: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
    • 8.6.8.3. Rest of Middle East & Africa: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
• 8.7. Semiconductor Assembly and Packaging Equipment Market - Latin America
  • 8.7.1. Latin America: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
  • 8.7.2. Latin America: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
  • 8.7.3. Latin America: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • 8.7.4. Semiconductor Assembly and Packaging Equipment Market - Mexico
    • 8.7.4.1. Mexico: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
    • 8.7.4.2. Mexico: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
    • 8.7.4.3. Mexico: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • 8.7.5. Semiconductor Assembly and Packaging Equipment Market - Brazil
    • 8.7.5.1. Brazil: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
    • 8.7.5.2. Brazil: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
    • 8.7.5.3. Brazil: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • 8.7.6. Semiconductor Assembly and Packaging Equipment Market - Argentina
    • 8.7.6.1. Argentina: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
    • 8.7.6.2. Argentina: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
    • 8.7.6.3. Argentina: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)
  • 8.7.7. Semiconductor Assembly and Packaging Equipment Market - Rest of Latin America
    • 8.7.7.1. Rest of Latin America: Semiconductor Assembly and Packaging Equipment Market, By Product, 2020-2034 (USD Billion)
    • 8.7.7.2. Rest of Latin America: Semiconductor Assembly and Packaging Equipment Market, by Packaging Type, 2020-2034 (USD Billion)
    • 8.7.7.3. Rest of Latin America: Semiconductor Assembly and Packaging Equipment Market, by End Use, 2020-2034 (USD Billion)

9. Competitive Landscape

• 9.1. Expansion and Acquisition Analysis
  • 9.1.1. Expansion
  • 9.1.2. Acquisitions
• 9.2. Partnerships/Collaborations/Agreements/Exhibitions

10. Company Profiles

• 10.1. Applied Materials
  • 10.1.1. Company Overview
  • 10.1.2. Financial Performance
  • 10.1.3. Product Benchmarking
  • 10.1.4. Recent Development
• 10.2. ASM Pacific Technology
  • 10.2.1. Company Overview
  • 10.2.2. Financial Performance
  • 10.2.3. Product Benchmarking
  • 10.2.4. Recent Development
• 10.3. Besi
  • 10.3.1. Company Overview
  • 10.3.2. Financial Performance
  • 10.3.3. Product Benchmarking
  • 10.3.4. Recent Development
• 10.4. Disco Corporation
  • 10.4.1. Company Overview
  • 10.4.2. Financial Performance
  • 10.4.3. Product Benchmarking
  • 10.4.4. Recent Development
• 10.5. Kulicke & Soffa Industries, Inc. (K&S)
  • 10.5.1. Company Overview
  • 10.5.2. Financial Performance
  • 10.5.3. Product Benchmarking
  • 10.5.4. Recent Development
• 10.6. Nikon Corporation
  • 10.6.1. Company Overview
  • 10.6.2. Financial Performance
  • 10.6.3. Product Benchmarking
  • 10.6.4. Recent Development
• 10.7. Plasma-Therm
  • 10.7.1. Company Overview
  • 10.7.2. Financial Performance
  • 10.7.3. Product Benchmarking
  • 10.7.4. Recent Development
• 10.8. Rudolph Technologies, Inc.
  • 10.8.1. Company Overview
  • 10.8.2. Financial Performance
  • 10.8.3. Product Benchmarking
  • 10.8.4. Recent Development
• 10.9. SCREEN Semiconductor Solutions Co., Ltd.
  • 10.9.1. Company Overview
  • 10.9.2. Financial Performance
  • 10.9.3. Product Benchmarking
  • 10.9.4. Recent Development
• 10.10. SUSS MicroTec SE
  • 10.10.1. Company Overview
  • 10.10.2. Financial Performance
  • 10.10.3. Product Benchmarking
  • 10.10.4. Recent Development

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