반도체 조립 및 패키징 장비 시장 규모, 점유율, 동향 분석 보고서 : 제품 유형별, 포장 유형별, 최종 용도별, 지역별, 부문별 예측(2025-2033년)
Semiconductor Assembly And Packaging Equipment Market Size, Share & Trends Analysis Report By Product (Dicing Equipment, Bonding Equipment), By Packaging Type, By End-use, By Region, And Segment Forecasts, 2025 - 2033
상품코드
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1790117
리서치사
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Grand View Research
발행일
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2025년 07월
페이지 정보
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영문 100 Pages
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반도체 조립 및 패키징 장비 시장 요약
반도체 조립 및 패키징 장비 세계 시장 규모는 2024년 44억 2,100만 달러로 추정되며, 2025-2033년 8.4% 성장하여 2030년에는 92억 900만 달러에 달할 것으로 예측됩니다. 이러한 성장의 원동력은 소형, 고성능 전자기기에 대한 수요 증가입니다.
가전제품과 모바일 기기의 소형화 및 고성능화에 따라 성능, 효율성, 소형화 요건을 충족하기 위한 첨단 패키징 기술에 대한 요구가 지속적으로 증가하고 있습니다. 시장 성장의 중요한 촉진요인은 팹리스 반도체 기업의 아웃소싱 증가 추세입니다. 이러한 변화로 인해 OSAT(반도체 조립 및 테스트 아웃소싱) 업체들이 제공하는 조립 및 패키징 서비스에 대한 수요가 증가하고 있습니다. 이에 따라, OSAT 제공업체들은 진화하는 고객 요구에 대응하기 위해 첨단 조립 및 패키징 장비에 적극적으로 투자하고 있습니다.
또한, 미국, 중국, 유럽 등의 지역에서는 정부의 이니셔티브와 반도체 부양책으로 인해 칩 생산 및 패키징 인프라에 대한 설비투자가 더욱 가속화되고 있습니다. 이러한 요인들이 복합적으로 작용하여 반도체 조립 및 패키징 장비 산업의 강력한 성장 궤도에 힘을 실어주고 있습니다.
목차 제1장 조사 방법과 범위
제2장 주요 요약
제3장 세계의 반도체 조립 및 패키징 장비 시장 변수, 동향, 범위
시장 집중과 성장 전망 매핑
업계 밸류체인 분석
원재료 및 부품 전망
제조업체 전망
유통 전망
최종사용자 전망
규제 프레임워크
기술 개요
시장 역학
시장 성장 촉진요인 분석
시장 성장 억제요인 분석
시장이 해결해야 할 과제 분석
시장 기회 분석
경제 메가 트렌드 분석
업계 분석 툴
Porter의 Five Forces 분석
거시환경 분석
제4장 세계의 반도체 조립 및 패키징 장비 시장 : 최종 용도별 추정 및 동향 분석
최종 용도별 변동 분석과 시장 점유율, 2024년과 2033년
최종 용도별, 2021년부터 2033년
IDM(통합 디바이스 제조업체)
OSAT(아웃소싱 반도체 조립·테스트)
제5장 세계의 반도체 조립 및 패키징 장비 시장 : 포장 유형별 추정 및 동향 분석
포장 유형별 변동 분석과 시장 점유율, 2024년과 2033년
포장 유형별, 2021-2033년
플립칩 패키징 장비
웨이퍼 레벨 포장(WLP) 장비
팬 아웃 패키징 장비
System-in-Package(SiP) 장비
3D/2.5D 패키징 장비
기타
제6장 세계의 반도체 조립 및 패키징 장비 시장 : 제품별 추정 및 동향 분석
제품별 변동 분석과 시장 점유율, 2024년과 2033년
제품별, 2021-2033년
다이싱 장비
본딩 장비
패키징 장비
기타
제7장 세계의 반도체 조립 및 패키징 장비 시장 : 지역별 추정 및 동향 분석
지역별 변동 분석과 시장 점유율, 2024년과 2033년
북미
패키징 유형별, 2021년-2033년
최종 용도별, 2021년-2033년
제품별, 2021년-2033년
미국
캐나다
멕시코
유럽
패키징 유형별, 2021년-2033년
최종 용도별, 2021년-2033년
제품별, 2021년-2033년
독일
프랑스
영국
이탈리아
스페인
네덜란드
아시아태평양
패키징 유형별, 2021년-2033년
최종 용도별, 2021년-2033년
제품별, 2021년-2033년
중국
인도
일본
대만
한국
라틴아메리카
패키징 유형별, 2021년-2033년
최종 용도별, 2021년-2033년
제품별, 2021년-2033년
브라질
중동 및 아프리카
패키징 유형별, 2021년-2033년
최종 용도별, 2021년-2033년
제품별, 2021년-2033년
이스라엘
남아프리카공화국
제8장 세계의 반도체 조립 및 패키징 장비 시장-경쟁 구도
주요 시장 진출기업의 최근 동향과 영향 분석
기업 분류
기업 대시보드 분석
벤더 구도
주요 원재료/부품 공급업체 리스트
주요 제조업체 리스트
주요 유통업체 리스트
기업의 시장 점유율 분석, 2024년
기업 포지셔닝 분석, 2024년
기업 히트맵 분석, 2024년
전략 매핑
기업 개요
Applied Materials
ASM Pacific Technology
Veeco Instruments Inc.
Besi
Disco Corporation
Kulicke &Soffa Industries, Inc.(K&S)
Lam Research Corporation
Nikon Corporation
Plasma-Therm
Rudolph Technologies, Inc.
SCREEN Semiconductor Solutions Co., Ltd.
SUSS MicroTec SE
Teradyne, Inc.
Tokyo Electron Limited(TEL)
Ultratech, Inc.
LSH
영문 목차
Semiconductor Assembly & Packaging Equipment Market Summary
The global semiconductor assembly and packaging equipment market size was estimated at USD 4,421.0 million in 2024 and is projected to reach USD 9,209.0 million by 2030, growing at a CAGR of 8.4% from 2025 to 2033. This growth is driven by rising demand for compact, high-performance electronic devices.
As consumer electronics and mobile devices become smaller yet more powerful, the need for advanced packaging technologies continues to grow to meet performance, efficiency, and miniaturization requirements. A significant driver of market growth is the increasing trend of outsourcing by fabless semiconductor companies. This shift has resulted in rising demand for assembly and packaging services provided by OSAT (Outsourced Semiconductor Assembly and Test) companies. In response, OSAT providers are heavily investing in advanced assembly and packaging equipment to meet evolving customer needs.
In addition, government initiatives and semiconductor stimulus programs in regions such as the U.S., China, and Europe are further accelerating capital investments in chip production and packaging infrastructure. Collectively, these factors are propelling the robust growth trajectory of the semiconductor assembly and packaging equipment industry.
Global Semiconductor Assembly & Packaging Equipment Market Report Segmentation
This report forecasts revenue growth at global, regional, and country levels and provides an analysis of the latest industry trends in each of the sub-segments from 2021 to 2033. For this study, Grand View Research has segmented the global semiconductor assembly and packaging equipment market report based on packaging type,end-use, product and region.
Packaging Type Outlook (Revenue, USD Million, 2021 - 2033)
Flip Chip Packaging Equipment
Wafer Level Packaging (WLP) Equipment
Fan-Out Packaging Equipment
System-in-Package (SiP) Equipment
3D/2.5D Packaging Equipment
Others
End-use Outlook (Revenue, USD Million, 2021 - 2033)
IDMs (Integrated Device Manufacturers)
OSAT (Outsourced Semiconductor Assembly and Test)
Product Outlook (Revenue, USD Million, 2021 - 2033)
Dicing Equipment
Scriber
Dicer
Wafer Mounting Equipment
Bonding Equipment
Die Bonder
Wire Bonder
Others
Packaging Equipment
Molding Equipment
Solder Plating Equipment
Deflasher
Others
Others
Regional Outlook (Revenue, USD Million, 2021 - 2033)
North America
Mexico
Europe
Germany
France
Italy
Spain
UK
Netherlands
Asia Pacific
China
India
Japan
South Korea
Taiwan
Latin America
Middle East and Africa
Table of Contents Chapter 1. Methodology and Scope
1.1. Market Segmentation & Scope
1.2. Market Definition
1.3. Information Procurement
1.3.1. Purchased Database
1.3.2. GVR's Internal Database
1.3.3. Secondary Sources & Third-Party Perspectives
1.3.4. Primary Research
1.4. Information Analysis
1.4.1. Data Analysis Models
1.5. Market Formulation & Data Visualization
1.6. Data Validation & Publishing
Chapter 2. Executive Summary
2.1. Market Snapshot
2.2. Segment Snapshot
2.3. Competitive Landscape Snapshot
Chapter 3. Global Semiconductor Assembly and Packaging Equipment Market Variables, Trends & Scope
3.1. Market Concentration & Growth Prospect Mapping
3.2. Industry Value Chain Analysis
3.2.1. Raw Material/Component Outlook
3.2.2. Manufacturer Outlook
3.2.3. Distribution Outlook
3.2.4. End User Outlook
3.3. Regulatory Framework
3.4. Technology Overview
3.5. Market Dynamics
3.5.1. Market Driver Analysis
3.5.2. Market Restraint Analysis
3.5.3. Market Challenges Analysis
3.5.4. Market Opportunity Analysis
3.6. Economic Mega-Trend Analysis
3.7. Industry Analysis Tools
3.7.1. Porter's Five Forces Analysis
3.7.2. Macro-environmental Analysis
Chapter 4. Global Semiconductor Assembly and Packaging Equipment Market: End Use Estimates & Trend Analysis
4.1. End Use Movement Analysis & Market Share, 2024 & 2033
4.2. Global Semiconductor Assembly and Packaging Equipment Market Estimates & Forecast, By End Use, 2021 to 2033 (USD Million)
4.3. IDMs (Integrated Device Manufacturers)
4.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
4.4. OSAT (Outsourced Semiconductor Assembly and Test)
4.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
Chapter 5. Global Semiconductor Assembly and Packaging Equipment Market: Packaging Type Estimates & Trend Analysis
5.1. Packaging Type Movement Analysis & Market Share, 2024 & 2033
5.2. Global Semiconductor Assembly and Packaging Equipment Market Estimates & Forecast, By Packaging Type, 2021 to 2033 (USD Million)
5.3. Flip Chip Packaging Equipment
5.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
5.4. Wafer Level Packaging (WLP) Equipment
5.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
5.5. Fan-Out Packaging Equipment
5.5.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
5.6. System-in-Package (SiP) Equipment
5.6.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
5.7. 3D/2.5D Packaging Equipment
5.7.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
5.8. Others
5.8.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
Chapter 6. Global Semiconductor Assembly and Packaging Equipment Market: Product Estimates & Trend Analysis
6.1. Product Movement Analysis & Market Share, 2024 & 2033
6.2. Global Semiconductor Assembly and Packaging Equipment Market Estimates & Forecast, By Product, 2021 to 2033 (USD Million)
6.3. Dicing Equipment
6.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
6.3.2. Scriber
6.3.2.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
6.3.3. Dicer
6.3.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
6.3.4. Wafer Mounting Equipment
6.3.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
6.4. Bonding Equipment
6.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
6.4.2. Die Bonder
6.4.2.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
6.4.3. Wire Bonder
6.4.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
6.4.4. Others
6.4.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
6.5. Packaging Equipment
6.5.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
6.5.2. Molding Equipment
6.5.2.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
6.5.3. Solder Plating Equipment
6.5.3.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
6.5.4. Deflasher
6.5.4.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
6.5.5. Others
6.5.5.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
6.6. Others
6.6.1. Market Revenue Estimates and Forecasts, 2021 - 2033 (USD Million)
Chapter 7. Global Semiconductor Assembly and Packaging Equipment Market: Regional Estimates & Trend Analysis
7.1. Regional Movement Analysis & Market Share, 2024 & 2033
7.2. North America
7.2.1. Market Estimates & Forecast, 2021 - 2033 (USD Million)
7.2.2. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
7.2.3. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
7.2.4. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
7.2.5. U.S.
7.2.5.1. Key country dynamics
7.2.5.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
7.2.5.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
7.2.5.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
7.2.5.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
7.2.6. Canada
7.2.6.1. Key country dynamics
7.2.6.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
7.2.6.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
7.2.6.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
7.2.6.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
7.2.7. Mexico
7.2.7.1. Key country dynamics
7.2.7.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
7.2.7.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
7.2.7.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
7.2.7.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
7.3. Europe
7.3.1. Market Estimates & Forecast, 2021 - 2033 (USD Million)
7.3.2. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
7.3.3. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
7.3.4. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
7.3.5. Germany
7.3.5.1. Key country dynamics
7.3.5.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
7.3.5.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
7.3.5.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
7.3.5.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
7.3.6. France
7.3.6.1. Key country dynamics
7.3.6.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
7.3.6.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
7.3.6.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
7.3.6.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
7.3.7. UK
7.3.7.1. Key country dynamics
7.3.7.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
7.3.7.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
7.3.7.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
7.3.7.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
7.3.8. Italy
7.3.8.1. Key country dynamics
7.3.8.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
7.3.8.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
7.3.8.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
7.3.8.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
7.3.9. Spain
7.3.9.1. Key country dynamics
7.3.9.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
7.3.9.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
7.3.9.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
7.3.9.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
7.3.10. Netherlands
7.3.10.1. Key country dynamics
7.3.10.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
7.3.10.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
7.3.10.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
7.3.10.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
7.4. Asia Pacific
7.4.1. Market Estimates & Forecast, 2021 - 2033 (USD Million)
7.4.2. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
7.4.3. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
7.4.4. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
7.4.5. China
7.4.5.1. Key country dynamics
7.4.5.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
7.4.5.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
7.4.5.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
7.4.5.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
7.4.6. India
7.4.6.1. Key country dynamics
7.4.6.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
7.4.6.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
7.4.6.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
7.4.6.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
7.4.7. Japan
7.4.7.1. Key country dynamics
7.4.7.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
7.4.7.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
7.4.7.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
7.4.7.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
7.4.8. Taiwan
7.4.8.1. Key country dynamics
7.4.8.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
7.4.8.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
7.4.8.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
7.4.8.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
7.4.9. South Korea
7.4.9.1. Key country dynamics
7.4.9.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
7.4.9.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
7.4.9.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
7.4.9.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
7.5. Latin America
7.5.1. Market Estimates & Forecast, 2021 - 2033 (USD Million)
7.5.2. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
7.5.3. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
7.5.4. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
7.5.5. Brazil
7.5.5.1. Key country dynamics
7.5.5.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
7.5.5.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
7.5.5.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
7.5.5.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
7.6. Middle East & Africa
7.6.1. Market Estimates & Forecast, 2021 - 2033 (USD Million)
7.6.2. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
7.6.3. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
7.6.4. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
7.6.5. Israel
7.6.5.1. Key country dynamics
7.6.5.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
7.6.5.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
7.6.5.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
7.6.5.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
7.6.6. South Africa
7.6.6.1. Key country dynamics
7.6.6.2. Market Estimates & Forecast, 2021 - 2033 (USD Million)
7.6.6.3. Market estimates & forecast, by packaging type, 2021 - 2033 (USD Million)
7.6.6.4. Market estimates & forecast, by end use, 2021 - 2033 (USD Million)
7.6.6.5. Market estimates & forecast, by product, 2021 - 2033 (USD Million)
Chapter 8. Global Semiconductor Assembly and Packaging Equipment Market - Competitive Landscape
8.1. Recent Developments & Impact Analysis, By Key Market Participants
8.2. Company Categorization
8.3. Company Dashboard Analysis
8.4. Vendor Landscape
8.4.1. List of Key Raw Material/Component Providers
8.4.2. List of Key Manufacturers
8.4.3. List of Key Distributors
8.5. Company Market Share Analysis, 2024
8.6. Company Positioning Analysis, 2024
8.7. Company Heat Map Analysis, 2024
8.8. Strategy Mapping
8.9. Company Profiles
8.9.1. Applied Materials
8.9.1.1. Participant's overview
8.9.1.2. Financial performance
8.9.1.3. Product benchmarking
8.9.1.4. Recent developments
8.9.2. ASM Pacific Technology
8.9.2.1. Participant's overview
8.9.2.2. Financial performance
8.9.2.3. Product benchmarking
8.9.2.4. Recent developments
8.9.3. Veeco Instruments Inc.
8.9.3.1. Participant's overview
8.9.3.2. Financial performance
8.9.3.3. Product benchmarking
8.9.3.4. Recent developments
8.9.4. Besi
8.9.4.1. Participant's overview
8.9.4.2. Financial performance
8.9.4.3. Product benchmarking
8.9.4.4. Recent developments
8.9.5. Disco Corporation
8.9.5.1. Participant's overview
8.9.5.2. Financial performance
8.9.5.3. Product benchmarking
8.9.5.4. Recent developments
8.9.6. Kulicke & Soffa Industries, Inc. (K&S)
8.9.6.1. Participant's overview
8.9.6.2. Financial performance
8.9.6.3. Product benchmarking
8.9.6.4. Recent developments
8.9.7. Lam Research Corporation
8.9.7.1. Participant's overview
8.9.7.2. Financial performance
8.9.7.3. Product benchmarking
8.9.7.4. Recent developments
8.9.8. Nikon Corporation
8.9.8.1. Participant's overview
8.9.8.2. Financial performance
8.9.8.3. Product benchmarking
8.9.8.4. Recent developments
8.9.9. Plasma-Therm
8.9.9.1. Participant's overview
8.9.9.2. Financial performance
8.9.9.3. Product benchmarking
8.9.9.4. Recent developments
8.9.10. Rudolph Technologies, Inc.
8.9.10.1. Participant's overview
8.9.10.2. Financial performance
8.9.10.3. Product benchmarking
8.9.10.4. Recent developments
8.9.11. SCREEN Semiconductor Solutions Co., Ltd.
8.9.11.1. Participant's overview
8.9.11.2. Financial performance
8.9.11.3. Product benchmarking
8.9.11.4. Recent developments
8.9.12. SUSS MicroTec SE
8.9.12.1. Participant's overview
8.9.12.2. Financial performance
8.9.12.3. Product benchmarking
8.9.12.4. Recent developments
8.9.13. Teradyne, Inc.
8.9.13.1. Participant's overview
8.9.13.2. Financial performance
8.9.13.3. Product benchmarking
8.9.13.4. Recent developments
8.9.14. Tokyo Electron Limited (TEL)
8.9.14.1. Participant's overview
8.9.14.2. Financial performance
8.9.14.3. Product benchmarking
8.9.14.4. Recent developments
8.9.15. Ultratech, Inc.
8.9.15.1. Participant's overview
8.9.15.2. Financial performance
8.9.15.3. Product benchmarking
8.9.15.4. Recent developments
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