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Outsourced Semiconductor Assembly And Test Services (OSAT) Market - Forecasts from 2025 to 2030
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OSAT ½ÃÀåÀº 2025³â 462¾ï 1,737¸¸ 6,000´Þ·¯¿¡¼­ 2030³â¿¡´Â 799¾ï 1,385¸¸ 9,000´Þ·¯¿¡ ´ÞÇϸç, CAGR 11.57%·Î ¼ºÀåÇÒ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù.

¹ÝµµÃ¼ Á¶¸³ ¹× Å×½ºÆ® À§Å¹ ¼­ºñ½º(OSAT)´Â ¹ÝµµÃ¼ ºñÁî´Ï½º¿¡ Àü¹®ÀûÀÎ Á¦Á¶ ¹× Å×½ºÆ® ¼­ºñ½º¸¦ Á¦°øÇÏ´Â ¾÷°è ¿ë¾îÀÔ´Ï´Ù. ¹ÝµµÃ¼ Á¦Á¶¾÷üµéÀº ÁýÀûȸ·Î(IC) ¹× ±âŸ µð¹ÙÀ̽ºÀÇ Á¶¸³, ÆÐŰ¡, Å×½ºÆ®¸¦ À§ÇØ OSAT ¾÷ü¸¦ °í¿ëÇϰí ÀÖ½À´Ï´Ù. ´Ù¾çÇÑ ºÐ¾ß¿¡¼­ ÷´Ü ÀüÀÚÁ¦Ç°¿¡ ´ëÇÑ ¼ö¿ä°¡ Áõ°¡ÇÔ¿¡ µû¶ó OSAT ½ÃÀåÀ» ÁÖµµÇϰí ÀÖÀ¸¸ç, OSAT °ø±Þ¾÷ü´Â ºñ¿ë Àý°¨°ú ³³±â ´ÜÃàÀ» À§ÇØ ¹ÝµµÃ¼ »ç¾÷ÀÚ¸¦ À§ÇØ Á¶¸³ ¹× Å×½ºÆ®¸¦ ¼öÇàÇÕ´Ï´Ù. ¶ÇÇÑ SoC ¼³°è ¹× ÆÐŰ¡ ¹æ¹ýÀÇ °³¼±°ú °°Àº º¹ÀâÇÑ ¹ÝµµÃ¼ ºÎǰÀ¸·Î ÀÎÇØ ÀÌ·¯ÇÑ Àü¹® ¼­ºñ½º¿¡ ´ëÇÑ ¿ä±¸°¡ Áõ°¡Çϰí ÀÖ½À´Ï´Ù.

OSAT´Â IDM(Integrated Device Manufacturer) ¹× ÆÕ¸®½º ±â¾÷À» À§ÇØ ¹ÝµµÃ¼ ÆÐŰ¡, Á¶¸³, Å×½ºÆ®¸¦ ¾Æ¿ô¼Ò½ÌÇÏ´Â Á¦3ÀÚ ±â°üÀ» ¸»Çϸç, OSAT´Â ¿øÇÏ´Â ¼º´É, ½Å·Ú¼º, ǰÁúÀÇ Ä¨À» º¸ÀåÇϱâ À§ÇØ Áß¿äÇÑ ÈİøÁ¤ °øÁ¤À» ¼öÇàÇÕ´Ï´Ù. °í±Þ ÆÐŰ¡(¿¹: 2.5D/3D IC, ÆÒ¾Æ¿ô)¿¡ ´ëÇÑ ¿ä±¸°¡ Áõ°¡ÇÔ¿¡ µû¶ó OSAT´Â AI, 5G, Â÷·®¿ë ÀüÀÚÁ¦Ç° ½ÃÀåÀÇ ºñ¿ëÀý°¨ ½ºÄÉÀϸµÀ» ÃËÁøÇÕ´Ï´Ù.

½ÃÀå µ¿Çâ :

ÀÌ ¸®Æ÷Æ®¿¡¼­ ´Ù·ç°í ÀÖ´Â ÁÖ¿ä ±â¾÷¿¡´Â ASE Group, Amkor Technology Inc., Powertech Technology Inc., ChipMOS Technologies Inc., King Yuan Electronics Co.Ltd., Jiangsu Changjiang Electronics Technology Co.Ltd., UTAC Holdings Ltd., Lingsen Precision Industries Ltd., Tongfu Microelectronics Co. µîÀÌ ÀÖ½À´Ï´Ù.

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Á¦6Àå OSAT ½ÃÀå : ÆÐŰ¡ À¯Çüº°

Á¦7Àå OSAT ½ÃÀå : µð¹ÙÀ̽º À¯Çüº°

Á¦8Àå OSAT ½ÃÀå : ¾ÖÇø®ÄÉÀ̼Ǻ°

Á¦9Àå OSAT ½ÃÀå : Áö¿ªº°

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The OSAT Market, valued at US$ 79,913.859 million in 2030 from US$ 46,217.376 million in 2025, is projected to grow at a CAGR of 11.57%.

Outsourced semiconductor assembly and test services (OSAT) is the industry term for providing specialist manufacturing and testing services to semiconductor businesses. To assemble, package, and test integrated circuits (ICs) and other devices, semiconductor manufacturers employ OSAT companies. The rising demand for cutting-edge electronic gadgets across various sectors is driving the OSAT market. OSAT suppliers conduct assembly and testing for semiconductor businesses to save money and expedite delivery. Furthermore, the need for these specialized services is driven by complex semiconductor components such as SoC designs and improved packaging methods.

OSAT refers to a third-party semiconductor package, assembly, and test outsourcing for IDMs (Integrated Device Manufacturers) and fabless companies. OSATs carry out important post-fabrication processes to guarantee chips of desired performance, reliability, and quality. With the growing need for advanced packaging (e.g., 2.5D/3D IC, fan-out), OSATs facilitate cost-saving scaling for AI, 5G, and automotive electronics markets.

Market Trends:

Some of the major players covered in this report include ASE Group, Amkor Technology Inc., Powertech Technology Inc., ChipMOS Technologies Inc., King Yuan Electronics Co. Ltd, Jiangsu Changjiang Electronics Technology Co. Ltd, UTAC Holdings Ltd, Lingsen Precision Industries Ltd, and Tongfu Microelectronics Co., among others.

Key Benefits of this Report:

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

OSAT Market Segmentation:

By Service Type

By Packaging Type

By Device Type

By Application

By Region

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

3. BUSINESS LANDSCAPE

4. TECHNOLOGICAL OUTLOOK

5. OSAT MARKET BY SERVICE TYPE

6. OSAT MARKET BY PACKAGING TYPE

7. OSAT MARKET BY DEVICE TYPE

8. OSAT MARKET BY APPLICATION

9. OSAT MARKET BY GEOGRAPHY

10. COMPETITIVE ENVIRONMENT AND ANALYSIS

11. COMPANY PROFILES

12. APPENDIX

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