Wafer Level Packaging Market Report by Packaging Technology, End Use Industry, and Region 2024-2032
세계 웨이퍼 레벨 패키징 시장 규모는 2023년 57억 달러에 달했습니다. 향후 IMARC Group은 2032년까지 시장 규모가 225억 달러에 달해 2024-2032년 사이 16.1%의 연평균 성장률(CAGR)을 기록할 것으로 예측했습니다.
웨이퍼 레벨 패키징(WLP)은 전자 연결 및 집적 회로(IC)의 보호 층을 추가하는 데 사용되는 패키징 솔루션을 말합니다. 마이크, 압력 센서, 가속도계, 자이로스코프, 커패시터, 저항기, 트랜지스터 등의 장치에 사용됩니다. 일반적으로 사용되는 WLP의 집적화 유형에는 팬아웃(FO), 팬인(FI), 플립칩, 3D FOWLP 등이 있습니다. 이러한 솔루션은 웨이퍼를 개별 다이로 다이싱하고 패키징하는 대신 웨이퍼 레벨에서 디바이스를 패키징하는 데 사용됩니다. 이를 통해 웨이퍼 칩 크기 축소, 제조 공정 간소화, 칩 기능 향상 등 다양한 이점을 얻을 수 있습니다. 또한, 초박형 웨이퍼는 방열 및 성능 향상, 폼팩터 축소, 전력 소비를 최소화할 수 있습니다.
전 세계 전자 산업의 괄목할만한 성장은 시장 성장에 밝은 전망을 가져다주는 중요한 요인 중 하나입니다. 또한, 소형화 및 고속화되는 소비자 전자기기에 대한 요구가 증가하고 있는 것도 시장 성장의 원동력이 되고 있습니다. 이에 따라 기계적 보호, 구조적 지원 및 장치 배터리 수명 연장을 위한 비용 효율적인 고성능 패키징 솔루션에 대한 수요도 전반적으로 증가하고 있습니다. 또한, 커넥티드 디바이스와 사물인터넷(IoT)의 통합 등 다양한 기술 발전도 성장을 촉진하는 요인으로 작용하고 있습니다. 예를 들어, WLP는 자율주행 자동차의 레이더 시스템 제조에 널리 사용되고 있습니다. 또한, 의료 분야에서는 다양한 웨어러블 기기 제조에 사용되고 있습니다. 기타 요인으로는 마이크로 전자 장치의 회로 미세화 발전과 광범위한 연구 개발(R&D) 활동이 시장을 더욱 견인할 것으로 예상됩니다.
본 보고서에서 다루는 주요 질문들
- 웨이퍼 레벨 패키징 세계 시장 규모는?
- 2024-2032년 웨이퍼 레벨 패키징 세계 시장의 예상 성장률은?
- 세계 웨이퍼 레벨 패키징 시장을 주도하는 주요 요인은 무엇인가?
- COVID-19가 세계 웨이퍼 레벨 패키징 시장에 미치는 영향은?
- 패키징 기술별 웨이퍼 레벨 패키징 세계 시장 현황은?
- 웨이퍼 레벨 패키징 세계 시장 최종 사용 산업별 분류는?
- 세계 웨이퍼 레벨 패키징 시장의 주요 지역은?
- 세계 웨이퍼 레벨 패키징 시장에 진출한 주요 업체는?
목차
제1장 서문
제2장 조사 범위와 조사 방법
- 조사 목적
- 이해관계자
- 데이터 소스
- 시장 추정
- 조사 방법
제3장 주요 요약
제4장 소개
제5장 웨이퍼 레벨 패키징 세계 시장
- 시장 개요
- 시장 실적
- COVID-19의 영향
- 시장 예측
제6장 시장 내역 : 패키징 기술별
- 3D TSV WLP
- 2.5D TSV WLP
- WLCSP
- 나노 WLP
- 기타
제7장 시장 내역 : 최종 이용 산업별
- 항공우주 및 방위
- 가전제품
- IT·통신
- 의료
- 자동차
- 기타
제8장 시장 내역 : 지역별
- 북미
- 아시아태평양
- 유럽
- 독일
- 프랑스
- 영국
- 이탈리아
- 스페인
- 러시아
- 기타
- 라틴아메리카
- 중동 및 아프리카
제9장 SWOT 분석
제10장 밸류체인 분석
제11장 Porter's Five Forces 분석
- 개요
- 구매자의 교섭력
- 공급 기업의 교섭력
- 경쟁 정도
- 신규 참여업체의 위협
- 대체품의 위협
제12장 가격 분석
제13장 경쟁 상황
- 시장 구조
- 주요 기업
- 주요 기업 개요
- Amkor Technology Inc.
- China Wafer Level CSP Co. Ltd.
- Chipbond Technology Corporation
- Deca Technologies Inc.(Infineon Technologies AG)
- Fujitsu Limited
- IQE PLC
- JCET Group Co. Ltd.
- Siliconware Precision Industries Co. Ltd.(Advanced Semiconductor Engineering Inc.)
- Tokyo Electron Ltd.
- Toshiba Corporation
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The global wafer level packaging market size reached US$ 5.7 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 22.5 Billion by 2032, exhibiting a growth rate (CAGR) of 16.1% during 2024-2032.
The wafer-level packaging (WLP) refers to a packaging solution used for adding a protective layer of electronic connections and integrated circuits (ICs). It is used for devices, such as microphones, pressure sensors, accelerometers, gyroscopes, capacitors, resistors and transistors. Some of the commonly used WLP integration types include fan-out (FO), fan-in (FI), flip-chip, 3D FOWLP. These solutions are used at the wafer-level of the device, instead of dicing the wafer into the individual die and packaging them. This offers various benefits, such as a reduction in the size of the wafer chips, streamlining of the manufacturing processes and improvements in chip functionalities. The ultrathin wafers also provide improved heat dissipation and performance, form factor reduction and minimal power consumption.
Significant growth in the electronics industry across the globe represents one of the key factors creating a positive outlook on the market growth. Furthermore, the increasing requirement for more compact and faster consumer electronics is also driving the market growth. This has also enhanced the overall demand for cost-effective and high-performance packaging solutions for enhanced mechanical protection, structural support and extended battery life of the devices. Additionally, various technological advancements, such as the integration of connected devices with the Internet of Things (IoT), are acting as other growth-inducing factors. For instance, WLP is widely used for the manufacturing of radar systems in self-driving automobiles. It is also used in the healthcare sector for the production of various wearable devices. Other factors, including increasing circuit miniaturization in microelectronic devices, along with extensive research and development (R&D) activities, are anticipated to drive the market further.
Key Market Segmentation:
IMARC Group provides an analysis of the key trends in each sub-segment of the global wafer level packaging market report, along with forecasts at the global, regional and country level from 2024-2032. Our report has categorized the market based on packaging technology and end use industry.
Breakup by Packaging Technology:
3D TSV WLP
2.5D TSV WLP
WLCSP
Nano WLP
Others
Breakup by End Use Industry:
Aerospace and Defense
Consumer Electronics
IT & Telecommunication
Healthcare
Automotive
Others
Breakup by Region:
North America
United States
Canada
Asia-Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
Competitive Landscape:
The competitive landscape of the industry has also been examined along with the profiles of the key players being Amkor Technology Inc., China Wafer Level CSP Co. Ltd., Chipbond Technology Corporation, Deca Technologies Inc. (Infineon Technologies AG), Fujitsu Limited, IQE PLC, JCET Group Co. Ltd., Siliconware Precision Industries Co. Ltd. (Advanced Semiconductor Engineering Inc.), Tokyo Electron Ltd. and Toshiba Corporation.
Key Questions Answered in This Report
- 1. How big is the global wafer level packaging market?
- 2. What is the expected growth rate of the global wafer level packaging market during 2024-2032?
- 3. What are the key factors driving the global wafer level packaging market?
- 4. What has been the impact of COVID-19 on the global wafer level packaging market?
- 5. What is the breakup of the global wafer level packaging market based on the packaging technology?
- 6. What is the breakup of the global wafer level packaging market based on the end use industry?
- 7. What are the key regions in the global wafer level packaging market?
- 8. Who are the key players/companies in the global wafer level packaging market?
Table of Contents
1 Preface
2 Scope and Methodology
- 2.1 Objectives of the Study
- 2.2 Stakeholders
- 2.3 Data Sources
- 2.3.1 Primary Sources
- 2.3.2 Secondary Sources
- 2.4 Market Estimation
- 2.4.1 Bottom-Up Approach
- 2.4.2 Top-Down Approach
- 2.5 Forecasting Methodology
3 Executive Summary
4 Introduction
- 4.1 Overview
- 4.2 Key Industry Trends
5 Global Wafer Level Packaging Market
- 5.1 Market Overview
- 5.2 Market Performance
- 5.3 Impact of COVID-19
- 5.4 Market Forecast
6 Market Breakup by Packaging Technology
- 6.1 3D TSV WLP
- 6.1.1 Market Trends
- 6.1.2 Market Forecast
- 6.2 2.5D TSV WLP
- 6.2.1 Market Trends
- 6.2.2 Market Forecast
- 6.3 WLCSP
- 6.3.1 Market Trends
- 6.3.2 Market Forecast
- 6.4 Nano WLP
- 6.4.1 Market Trends
- 6.4.2 Market Forecast
- 6.5 Others
- 6.5.1 Market Trends
- 6.5.2 Market Forecast
7 Market Breakup by End Use Industry
- 7.1 Aerospace and Defense
- 7.1.1 Market Trends
- 7.1.2 Market Forecast
- 7.2 Consumer Electronics
- 7.2.1 Market Trends
- 7.2.2 Market Forecast
- 7.3 IT & Telecommunication
- 7.3.1 Market Trends
- 7.3.2 Market Forecast
- 7.4 Healthcare
- 7.4.1 Market Trends
- 7.4.2 Market Forecast
- 7.5 Automotive
- 7.5.1 Market Trends
- 7.5.2 Market Forecast
- 7.6 Others
- 7.6.1 Market Trends
- 7.6.2 Market Forecast
8 Market Breakup by Region
- 8.1 North America
- 8.1.1 United States
- 8.1.1.1 Market Trends
- 8.1.1.2 Market Forecast
- 8.1.2 Canada
- 8.1.2.1 Market Trends
- 8.1.2.2 Market Forecast
- 8.2 Asia-Pacific
- 8.2.1 China
- 8.2.1.1 Market Trends
- 8.2.1.2 Market Forecast
- 8.2.2 Japan
- 8.2.2.1 Market Trends
- 8.2.2.2 Market Forecast
- 8.2.3 India
- 8.2.3.1 Market Trends
- 8.2.3.2 Market Forecast
- 8.2.4 South Korea
- 8.2.4.1 Market Trends
- 8.2.4.2 Market Forecast
- 8.2.5 Australia
- 8.2.5.1 Market Trends
- 8.2.5.2 Market Forecast
- 8.2.6 Indonesia
- 8.2.6.1 Market Trends
- 8.2.6.2 Market Forecast
- 8.2.7 Others
- 8.2.7.1 Market Trends
- 8.2.7.2 Market Forecast
- 8.3 Europe
- 8.3.1 Germany
- 8.3.1.1 Market Trends
- 8.3.1.2 Market Forecast
- 8.3.2 France
- 8.3.2.1 Market Trends
- 8.3.2.2 Market Forecast
- 8.3.3 United Kingdom
- 8.3.3.1 Market Trends
- 8.3.3.2 Market Forecast
- 8.3.4 Italy
- 8.3.4.1 Market Trends
- 8.3.4.2 Market Forecast
- 8.3.5 Spain
- 8.3.5.1 Market Trends
- 8.3.5.2 Market Forecast
- 8.3.6 Russia
- 8.3.6.1 Market Trends
- 8.3.6.2 Market Forecast
- 8.3.7 Others
- 8.3.7.1 Market Trends
- 8.3.7.2 Market Forecast
- 8.4 Latin America
- 8.4.1 Brazil
- 8.4.1.1 Market Trends
- 8.4.1.2 Market Forecast
- 8.4.2 Mexico
- 8.4.2.1 Market Trends
- 8.4.2.2 Market Forecast
- 8.4.3 Others
- 8.4.3.1 Market Trends
- 8.4.3.2 Market Forecast
- 8.5 Middle East and Africa
- 8.5.1 Market Trends
- 8.5.2 Market Breakup by Country
- 8.5.3 Market Forecast
9 SWOT Analysis
- 9.1 Overview
- 9.2 Strengths
- 9.3 Weaknesses
- 9.4 Opportunities
- 9.5 Threats
10 Value Chain Analysis
11 Porters Five Forces Analysis
- 11.1 Overview
- 11.2 Bargaining Power of Buyers
- 11.3 Bargaining Power of Suppliers
- 11.4 Degree of Competition
- 11.5 Threat of New Entrants
- 11.6 Threat of Substitutes
12 Price Analysis
13 Competitive Landscape
- 13.1 Market Structure
- 13.2 Key Players
- 13.3 Profiles of Key Players
- 13.3.1 Amkor Technology Inc.
- 13.3.1.1 Company Overview
- 13.3.1.2 Product Portfolio
- 13.3.1.3 Financials
- 13.3.1.4 SWOT Analysis
- 13.3.2 China Wafer Level CSP Co. Ltd.
- 13.3.2.1 Company Overview
- 13.3.2.2 Product Portfolio
- 13.3.2.3 SWOT Analysis
- 13.3.3 Chipbond Technology Corporation
- 13.3.3.1 Company Overview
- 13.3.3.2 Product Portfolio
- 13.3.3.3 SWOT Analysis
- 13.3.4 Deca Technologies Inc. (Infineon Technologies AG)
- 13.3.4.1 Company Overview
- 13.3.4.2 Product Portfolio
- 13.3.5 Fujitsu Limited
- 13.3.5.1 Company Overview
- 13.3.5.2 Product Portfolio
- 13.3.5.3 Financials
- 13.3.5.4 SWOT Analysis
- 13.3.6 IQE PLC
- 13.3.6.1 Company Overview
- 13.3.6.2 Product Portfolio
- 13.3.6.3 SWOT Analysis
- 13.3.7 JCET Group Co. Ltd.
- 13.3.7.1 Company Overview
- 13.3.7.2 Product Portfolio
- 13.3.7.3 SWOT Analysis
- 13.3.8 Siliconware Precision Industries Co. Ltd. (Advanced Semiconductor Engineering Inc.)
- 13.3.8.1 Company Overview
- 13.3.8.2 Product Portfolio
- 13.3.8.3 Financials
- 13.3.9 Tokyo Electron Ltd.
- 13.3.9.1 Company Overview
- 13.3.9.2 Product Portfolio
- 13.3.9.3 Financials
- 13.3.9.4 SWOT Analysis
- 13.3.10 Toshiba Corporation
- 13.3.10.1 Company Overview
- 13.3.10.2 Product Portfolio
- 13.3.10.3 Financials
- 13.3.10.4 SWOT Analysis
