¼¼°èÀÇ GaN »ê¾÷¿ë µð¹ÙÀ̽º ½ÃÀå
GaN Industrial Devices
»óǰÄÚµå : 1797306
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¹ßÇàÀÏ : 2025³â 08¿ù
ÆäÀÌÁö Á¤º¸ : ¿µ¹® 282 Pages
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¼¼°èÀÇ GaN »ê¾÷¿ë µð¹ÙÀ̽º ½ÃÀåÀº 2030³â±îÁö 34¾ï ´Þ·¯¿¡ ´ÞÇÒ Àü¸Á

2024³â¿¡ 18¾ï ´Þ·¯·Î ÃßÁ¤µÇ´Â ¼¼°èÀÇ GaN »ê¾÷¿ë µð¹ÙÀ̽º ½ÃÀåÀº ºÐ¼® ±â°£ÀÎ 2024-2030³â¿¡ CAGR 11.4%·Î ¼ºÀåÇϸç, 2030³â¿¡´Â 34¾ï ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù. ÀÌ ¸®Æ÷Æ®¿¡¼­ ºÐ¼®ÇÑ ºÎ¹®ÀÇ ÇϳªÀÎ ¿ÉÅäÀÏ·ºÆ®·Î´Ð½º GaN µð¹ÙÀ̽º´Â CAGR 9.5%¸¦ ±â·ÏÇϸç, ºÐ¼® ±â°£ Á¾·á½Ã¿¡´Â 17¾ï ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù. ÆÄ¿ö GaN µð¹ÙÀ̽º ºÐ¾ßÀÇ ¼ºÀå·üÀº ºÐ¼® ±â°£¿¡ CAGR 14.1%·Î ÃßÁ¤µË´Ï´Ù.

¹Ì±¹ ½ÃÀåÀº 4¾ï 7,840¸¸ ´Þ·¯, Áß±¹Àº CAGR 15.1%·Î ¼ºÀå ¿¹Ãø

¹Ì±¹ÀÇ GaN »ê¾÷¿ë µð¹ÙÀ̽º ½ÃÀåÀº 2024³â¿¡ 4¾ï 7,840¸¸ ´Þ·¯·Î ÃßÁ¤µË´Ï´Ù. ¼¼°è 2À§ÀÇ °æÁ¦´ë±¹ÀÎ Áß±¹Àº ºÐ¼® ±â°£2024-2030³â CAGR 15.1%·Î ÃßÀÌÇϸç, 2030³â¿¡´Â 6¾ï 8,630¸¸ ´Þ·¯ÀÇ ½ÃÀå ±Ô¸ð¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù. ±âŸ ÁÖ¸ñÇÒ ¸¸ÇÑ Áö¿ªº° ½ÃÀåÀ¸·Î´Â ÀϺ»°ú ij³ª´Ù°¡ ÀÖÀ¸¸ç, ºÐ¼® ±â°£ Áß CAGRÀº °¢°¢ 8.5%¿Í 10.0%·Î ¿¹ÃøµË´Ï´Ù. À¯·´¿¡¼­´Â µ¶ÀÏÀÌ CAGR ¾à 9.0%·Î ¼ºÀåÇÒ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù.

¼¼°èÀÇ GaN »ê¾÷¿ë µð¹ÙÀ̽º ½ÃÀå - ÁÖ¿ä µ¿Çâ°ú ÃËÁø¿äÀÎ Á¤¸®

GaN µð¹ÙÀ̽º°¡ »ê¾÷¿ë Àü·Â ½Ã½ºÅÛÀ» º¯È­½ÃŰ´Â ÀÌÀ¯

ÁúÈ­°¥·ý(GaN) ¼ÒÀÚ´Â ±âÁ¸ ½Ç¸®ÄÜ ±â¹Ý ÆÄ¿ö ÀÏ·ºÆ®·Î´Ð½º¿¡ ºñÇØ ½ºÀ§Äª ¼Óµµ, ¿­È¿À², ÄÄÆÑÆ®ÇÑ ¼³°è°¡ ¿ì¼öÇÏ¿© »ê¾÷ ¿ëµµ Àü¹Ý¿¡ °ÉÃÄ ¼ºÀå¼¼¸¦ º¸À̰í ÀÖ½À´Ï´Ù. GaN Æ®·£Áö½ºÅÍ¿Í ´ÙÀÌ¿Àµå´Â »ê¾÷¿ë ÄÁ¹öÅÍ, ¸ðÅÍ ±¸µ¿ ÀåÄ¡, Àü·Â ÀιöÅÍ, ¹«¼± Àü·Â Àü¼Û ½Ã½ºÅÛ µî¿¡ ³Î¸® »ç¿ëµË´Ï´Ù. ³·Àº Àü·Â ¼Õ½Ç·Î ´õ ³ôÀº Àü¾Ð°ú Á֯ļö¿¡¼­ ÀÛµ¿ÇÒ ¼ö ÀÖ´Â ´É·ÂÀº ¿¡³ÊÁö Áý¾àÀûÀÌ°í °ø°£ Á¦¾àÀÌ ¸¹Àº ȯ°æ¿¡ ÀÌ»óÀûÀÔ´Ï´Ù.

»ê¾÷ ½Ã½ºÅÛ, ƯÈ÷ ·Îº¿ °øÇÐ, °øÀå ÀÚµ¿È­, ÁßÀåºñ, »ê¾÷ Á¶¸í µîÀÇ ºÐ¾ß¿¡¼­ ´õ ³ôÀº È¿À²°ú Àü·Â ¹Ðµµ°¡ Á¡Á¡ ´õ ¿ä±¸µÇ°í ÀÖ½À´Ï´Ù. GaN ±â¹Ý ºÎǰÀº °í¼Ó ½ºÀ§ÄªÀ» Áö¿øÇϰí, ¼öµ¿ ºÎǰ Å©±â¸¦ ÁÙÀ̰í, ¿­ °ü¸®¸¦ °£¼ÒÈ­Çϱâ À§ÇØ GaN ±â¹Ý ºÎǰÀÌ Ã¤ÅõǾú½À´Ï´Ù. »ê¾÷ ºÎ¹® Àü¹Ý¿¡ °ÉÃÄ Àü±âÈ­°¡ ÁøÇàµÊ¿¡ µû¶ó GaN µð¹ÙÀ̽º´Â ¼³Ä¡ ¸éÀû °¨¼Ò, ¿¡³ÊÁö Àý¾à, ½Ã½ºÅÛ ½Å·Ú¼º Çâ»óÀ» ´Þ¼ºÇÏ´Â µ¥ ÇʼöÀûÀÎ ¿ä¼Ò·Î ÀÚ¸® Àâ°í ÀÖ½À´Ï´Ù.

±â±âÀÇ ´É·ÂÀ» Çâ»ó½ÃŰ´Â ±â¼ú Çõ½ÅÀ̶õ?

GaN-on-silicon ±âÆÇÀÌ Áö¹èÀûÀÎ Ç÷§ÆûÀ¸·Î, ±âÁ¸ÀÇ ½Ç¸®ÄÜ Á¦Á¶ °øÁ¤À» »ç¿ëÇÏ¿© GaN ±â¼úÀ» È®ÀåÇÒ ¼ö ÀÖ´Â ºñ¿ë È¿À²ÀûÀÎ °æ·Î¸¦ Á¦°øÇÕ´Ï´Ù. ¿¡ÇÇÅÃ¼È ¼ºÀå°ú Æ÷Àå ±â¼úÀÇ °­È­·Î ÀÎÇØ ¼ÒÀÚÀÇ Àϰü¼º, ¿­ÀüµµÀ², Ç¥ÁØ Á¦¾î ȸ·Î¿ÍÀÇ ÅëÇÕÀÌ Çâ»óµÇ°í ÀÖ½À´Ï´Ù. Ç¥¸é ÆÐ½Ãº£À̼ǰú °ß°íÇÑ °ÔÀÌÆ® º¸È£ ±¸Á¶µµ »ê¾÷Àû ³»±¸¼º ±âÁØÀ» ÃæÁ·½Ã۱â À§ÇØ °³¼±µÇ¾ú½À´Ï´Ù.

µðÀÚÀÎ ÅëÇÕÀº ¶Ç ´Ù¸¥ ÁßÁ¡ ºÐ¾ßÀÔ´Ï´Ù. GaN µð¹ÙÀ̽º´Â °ÔÀÌÆ® µå¶óÀ̹ö¿Í º¸È£ ȸ·Î¸¦ ÅëÇÕÇÑ ÇÏÇÁ ºê¸®Áö ¶Ç´Â Ç® ºê¸®Áö ±¸¼ºÀ¸·Î Á¦°øµÇ°í ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ÅëÇÕ Àü·Â ¸ðµâÀº ±âÆÇ ¼³°è¸¦ °£¼ÒÈ­Çϰí ÀüÀڱ⠰£¼·À» ÁÙÀÔ´Ï´Ù. PQFN°ú °°Àº ¼ÒÇü Ç¥¸é ½ÇÀå Æ÷Àå Æ÷¸ËÀº Á¦ÇÑµÈ »ê¾÷¿ë ÀÎŬ·ÎÀú¿¡¼­ ´õ ³ôÀº Àü·Â ¹Ðµµ¸¦ °¡´ÉÇÏ°Ô ÇÕ´Ï´Ù. ¶ÇÇÑ GaN ºÎǰÀº ÀÚµ¿Â÷ ¹× ¿¡³ÊÁö ½Ã½ºÅÛ¿¡¼­ ¿Âµµ ¹× Áøµ¿¿¡ ´ëÇÑ ³»¼º µî °¡È¤ÇÑ ÀÛµ¿ Á¶°Ç¿¡ ¸Â°Ô Á¶Á¤µË´Ï´Ù.

»ê¾÷¿ë ÀÌ¿ë »ç·Ê¿Í Àü·Â ½Ã½ºÅÛ ¼³°è´Â ¾î¶»°Ô ÁøÈ­Çϰí Àִ°¡?

GaN µð¹ÙÀ̽º´Â ¸ðÅÍ Á¦¾î ÀåÄ¡, ¿ª·ü °³¼±(PFC) ȸ·Î, ÀÚµ¿È­ ¹× ·Îº¿ ½Ã½ºÅÛ¿ë DC-DC ÄÁ¹öÅÍ µî ´Ù¾çÇÑ »ê¾÷ ¿ëµµ¿¡ Àû¿ëµÇ°í ÀÖ½À´Ï´Ù. °íÁÖÆÄ ÀÛµ¿Àº ÀÚ±â ȸ·ÎÀÇ °¨¼Ò¿Í ¼ÒÇü ³Ã°¢ ½Ã½ºÅÛÀ» °¡´ÉÇÏ°Ô Çϸç, À̴ ƯÈ÷ À̵¿½Ä ¹× ¸ðµâ½Ä »ê¾÷ Àåºñ¿¡ À¯¿ëÇÕ´Ï´Ù. Àç»ý¿¡³ÊÁö ºÐ¾ß¿¡¼­ GaN ÀιöÅÍ´Â º¸´Ù ÄÄÆÑÆ®Çϰí È¿À²ÀûÀΠž籤¹ßÀü ÃÖÀûÈ­ ÀåÄ¡¿Í ¿¡³ÊÁö ÀúÀå ÀÎÅÍÆäÀ̽º¸¦ °¡´ÉÇÏ°Ô Çϰí ÀÖ½À´Ï´Ù.

Àü±âÀÚµ¿Â÷(EV) ÃæÀü ÀÎÇÁ¶óµµ GaNÀÇ ºü¸¥ ½ºÀ§Äª°ú ¼ÒÇüÈ­ÀÇ ÇýÅÃÀ» ´©¸®°í ÀÖ½À´Ï´Ù. ÃæÀü¼Ò, Â÷·®¿ë ÃæÀü±â, ¾ç¹æÇâ ÄÁ¹öÅÍ´Â GaN ½ºÀ§Ä¡¸¦ »ç¿ëÇÏ¿© È¿À² ¸ñÇ¥¸¦ ÃæÁ·Çϵµ·Ï Àç¼³°èµÇ¾ú½À´Ï´Ù. »ê¾÷¿ë ¹«Á¤Àü Àü¿øÀåÄ¡(UPS) ½Ã½ºÅÛ ¹× Åë½Å¿ë Àü¿ø ¸ðµâÀº GaNÀ» äÅÃÇÏ¿© ´õ ³ôÀº ºÎÇÏ ÀÀ´ä ¼Óµµ¿Í ¿ì¼öÇÑ ¿­ ¼º´ÉÀ» ´Þ¼ºÇϰí ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ¿ëµµ¿¡¼­´Â È®Àå °¡´ÉÇÏ°í °íÈ¿À²ÀÇ Àü·Â º¯È¯ÀÌ ÇÊ¿äÇϸç, GaN ¼ÒÀç°¡ ÀûÇÕÇÕ´Ï´Ù.

GaN »ê¾÷¿ë ÀåÄ¡ ½ÃÀåÀÇ ¼ºÀåÀº ¸î °¡Áö ¿äÀο¡ ÀÇÇØ ÁÖµµµË´Ï´Ù.

GaN »ê¾÷¿ë µð¹ÙÀ̽º ½ÃÀåÀÇ ¼ºÀåÀº ³ôÀº ¿¡³ÊÁö È¿À²¿¡ ´ëÇÑ ¼ö¿ä, »ê¾÷¿ë Àü·Â ½Ã½ºÅÛÀÇ ¼ÒÇüÈ­, °íÁÖÆÄ ½ºÀ§Äª ¾ÆÅ°ÅØÃ³ÀÇ Ã¤Åà µî ¿©·¯ ¿äÀο¡ ÀÇÇØ ÁÖµµµÇ°í ÀÖ½À´Ï´Ù. »ê¾÷ ÀÚµ¿È­, ·Îº¿, ¿¡³ÊÁö °ü¸® ½Ã½ºÅÛ¿¡¼­ Àü±âÈ­ Áõ°¡´Â GaN ±â¹Ý Àü·Â ÀåÄ¡ÀÇ ÅëÇÕÀ» Áö¿øÇÕ´Ï´Ù. GaN-on-silicon »ý»ê, Æ÷Àå, ÅëÇÕ ¸ðµâ ¼³°èÀÇ °³¼±À¸·Î ºñ¿ëÀ» Àý°¨Çϰí äÅÃÀ» ÃËÁøÇÒ ¼ö ÀÖ½À´Ï´Ù. EV ÃæÀü, ž籤 ÀιöÅÍ, °øÀå¿ë Àü¿øÀåÄ¡ÀÇ ¿ëµµ È®´ë°¡ ¼ö¿ä¸¦ ´õ¿í Áõ°¡½Ãų °ÍÀÔ´Ï´Ù. »ê¾÷°èÀÇ ¼³°è ¿ä±¸»çÇ×ÀÌ ´õ ³ôÀº Àü·Â ¹Ðµµ, ¿­ Á¦¾î, µðÁöÅÐ ÅëÇÕÀ» ÇâÇØ ÁøÈ­Çϰí ÀÖ´Â °¡¿îµ¥, GaN µð¹ÙÀ̽º´Â ¿©·¯ ¿ëµµ¿¡¼­ ½ÃÀå ¼ºÀåÀ» °¡¼ÓÇÒ ¼ö ÀÖ´Â ¼º´É»óÀÇ ÀÌÁ¡À» Á¦°øÇÕ´Ï´Ù.

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Global GaN Industrial Devices Market to Reach US$3.4 Billion by 2030

The global market for GaN Industrial Devices estimated at US$1.8 Billion in the year 2024, is expected to reach US$3.4 Billion by 2030, growing at a CAGR of 11.4% over the analysis period 2024-2030. Optoelectronics GaN Devices, one of the segments analyzed in the report, is expected to record a 9.5% CAGR and reach US$1.7 Billion by the end of the analysis period. Growth in the Power GaN Devices segment is estimated at 14.1% CAGR over the analysis period.

The U.S. Market is Estimated at US$478.4 Million While China is Forecast to Grow at 15.1% CAGR

The GaN Industrial Devices market in the U.S. is estimated at US$478.4 Million in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$686.3 Million by the year 2030 trailing a CAGR of 15.1% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 8.5% and 10.0% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 9.0% CAGR.

Global GaN Industrial Devices Market - Key Trends & Drivers Summarized

Why Are GaN Devices Transforming Industrial Power Systems?

Gallium nitride (GaN) devices are gaining momentum across industrial applications due to their superior switching speed, thermal efficiency, and compact design compared to traditional silicon-based power electronics. GaN transistors and diodes are widely used in industrial converters, motor drives, power inverters, and wireless power transfer systems. Their ability to operate at higher voltages and frequencies with lower power loss makes them ideal for energy-intensive and space-constrained environments.

Industrial systems increasingly demand higher efficiency and power density, especially in segments such as robotics, factory automation, heavy machinery, and industrial lighting. GaN-based components are being adopted to support high-speed switching, reduce passive component size, and enable simplified thermal management. As electrification advances across industrial sectors, GaN devices are becoming critical to achieving reduced footprint, improved energy savings, and increased system reliability.

What Technological Innovations Are Advancing Device Capabilities?

GaN-on-silicon substrates are the dominant platform, offering a cost-effective path to scale GaN technology using established silicon manufacturing processes. Enhancements in epitaxial growth and packaging technologies are improving device consistency, thermal conductivity, and integration with standard control circuits. Surface passivation and robust gate protection structures are also being refined to meet industrial durability standards.

Design integration is another focus area. GaN devices are increasingly available in half-bridge or full-bridge configurations with embedded gate drivers and protection circuitry. These integrated power modules simplify board design and reduce electromagnetic interference. Compact surface-mount packaging formats such as PQFN are enabling higher power density in confined industrial enclosures. GaN components are also being tailored for harsh operating conditions, including temperature and vibration resilience in automotive and energy systems.

How Are Industrial Use Cases and Power System Designs Evolving?

GaN devices are being deployed across a broad spectrum of industrial applications, including motor control units, power factor correction (PFC) circuits, and DC-DC converters for automation and robotics systems. High-frequency operation allows for reduced magnetics and compact cooling systems, which is especially beneficial in mobile or modular industrial equipment. In renewable energy, GaN inverters are enabling more compact and efficient solar power optimizers and energy storage interfaces.

Electric vehicle (EV) charging infrastructure also benefits from GaN’s fast switching and compact size. Charging stations, onboard chargers, and bidirectional converters are being redesigned to meet efficiency targets using GaN switches. Industrial uninterruptible power supply (UPS) systems and telecommunications power modules are adopting GaN to achieve higher load response rates and better thermal performance. These applications require scalable, high-efficiency power conversion that GaN materials are well-suited to deliver.

Growth in the GaN Industrial Devices Market Is Driven by Several Factors…

Growth in the GaN industrial devices market is driven by several factors including demand for higher energy efficiency, miniaturization of industrial power systems, and adoption of high-frequency switching architectures. Increasing electrification in industrial automation, robotics, and energy management systems supports integration of GaN-based power devices. Improvements in GaN-on-silicon production, packaging, and integrated module design reduce costs and facilitate adoption. Expanding use in EV charging, solar inverters, and factory power supply units further boosts demand. As industrial design requirements evolve toward greater power density, thermal control, and digital integration, GaN devices offer performance advantages that continue to drive market growth across multiple application domains.

SCOPE OF STUDY:

The report analyzes the GaN Industrial Devices market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Type (Optoelectronics GaN Devices, Power GaN Devices, RF GaN Devices); Application (RF Power Amplifier Application, Microwave & Millimeter Wave Circuits Application, Radar Sensing Equipment Application, Tactical Radios Application, Communications Satellite Equipment Application, Other Applications); End-Use, Aerospace & Defense End-Use, Automotive End-Use, IT & Telecommunications End-Use, Other End-Uses)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.

Select Competitors (Total 36 Featured) -

AI INTEGRATIONS

We're transforming market and competitive intelligence with validated expert content and AI tools.

Instead of following the general norm of querying LLMs and Industry-specific SLMs, we built repositories of content curated from domain experts worldwide including video transcripts, blogs, search engines research, and massive amounts of enterprise, product/service, and market data.

TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by increasing the Cost of Goods Sold (COGS), reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

III. MARKET ANALYSIS

IV. COMPETITION

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