[시장보고서]플립칩 시장 예측 : 산업 규모, 점유율, 동향, 기회, 웨이퍼 범핑 공정별, 패키징 기술별, 제품별, 최종 사용자별, 지역별, 경쟁 구도(2021-2031년)

플립칩 시장 예측 : 산업 규모, 점유율, 동향, 기회, 웨이퍼 범핑 공정별, 패키징 기술별, 제품별, 최종 사용자별, 지역별, 경쟁 구도(2021-2031년)

Flip Chip Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Wafer Bumping Process, By Packaging Technology (BGA and CSP), By Product, By End User, By Region & Competition, 2021-2031F

상품코드 : 1901613

리서치사 : TechSci Research

발행일 : 2026년 01월

페이지 정보 : 영문 181 Pages

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한글목차

샘플 요청 목록에 추가

세계 플립칩 시장은 2025년 363억 8,000만 달러, 2031년까지 529억 3,000만 달러에 달하고, CAGR 6.45%로 성장할 것으로 예측됩니다.

플립칩 기술(일명: 제어 붕괴 칩 접속)이란, 칩의 유효면에 형성된 솔더 범프를 이용하여 반도체 디바이스를 외부 회로에 접속하는 방법입니다.

시장 개요
예측 기간	2027-2031년
시장 규모 : 2025년	363억 8,000만 달러
시장 규모 : 2031년	529억 3,000만 달러
CAGR : 2026-2031년	6.45%
가장 빠르게 성장하는 부문	구리 기둥
가장 큰 시장	아시아태평양

주요 시장 성장 촉진요인

고성능 컴퓨팅(HPC) 및 인공지능(AI)의 급증은 세계의 플립칩 시장에서 주요한 촉진요인이 되고 있습니다. 이러한 용도는 전례없는 상호 연결 밀도와 전기 효율을 요구하기 때문입니다. AI 알고리즘의 방대한 계산 부하에 대응하기 위해 제조업체는 기존의 와이어 본딩에 비해 우수한 열 관리와 낮은 인덕턴스를 제공하는 구리 필러 범프 등의 플립 칩 상호 연결을 점점 활용하고 있습니다.

주요 시장 과제

세계의 플립칩 시장은 언더필링 공정과 관련된 높은 제조 비용과 기술적 복잡성과 관련하여 큰 문제에 직면하고 있습니다. 이 특정 제조 공정은 칩과 기판 사이의 열팽창 불일치를 완화하는 데 필수적이지만 작동에 큰 어려움을 초래합니다.

주요 시장 동향

반도체 제조업체는 모놀리식 시스템 온칩(SoC) 설계에서 모듈형 칩렛 아키텍처로 전환하고 있습니다. 이것은 단일 패키지 내에서 여러 개의 소형 다이를 상호 연결하기 위해 고급 플립 칩 패키징에 크게 의존합니다. 이 아키텍처의 전환은 첨단 노드에서 대형 다이 제조와 관련된 급등하는 비용과 수율 문제를 해결하고 로직과 메모리와 같은 다른 기능을 확장 가능한 시스템에 통합 할 수있게합니다.

시장 규모 및 예측
- 금액별
시장 점유율 및 예측
- 웨이퍼 범핑 공정별(구리 필러, 주석-납 공정 솔더, 무연 솔더, 금 스터드 범핑)
- 패키징 기술별(BGA(2.1D/2.5D/3D) 및 CSP)
- 제품별(메모리, LED, CMOS 이미지 센서, SoC, GPU, CPU)
- 최종 사용자별(군 및 방위, 의료 및 건강, 산업 분야, 자동차, 소비자 전자 기기, 통신)
- 지역별
- 기업별(2025)
시장 맵

제6장 북미의 플립칩 시장 전망

시장 규모 및 예측
시장 점유율 및 예측
북미 : 국가별 분석
- 미국
- 캐나다
- 멕시코

제7장 유럽의 플립칩 시장 전망

시장 규모 및 예측
시장 점유율 및 예측
유럽 : 국가별 분석
- 독일
- 프랑스
- 영국
- 이탈리아
- 스페인

제8장 아시아태평양의 플립칩 시장 전망

시장 규모 및 예측
시장 점유율 및 예측
아시아태평양 : 국가별 분석
- 중국
- 인도
- 일본
- 한국
- 호주

제9장 중동 및 아프리카의 플립칩 시장 전망

시장 규모 및 예측
시장 점유율 및 예측
중동 및 아프리카 : 국가별 분석
- 사우디아라비아
- 아랍에미리트(UAE)
- 남아프리카

제10장 남미의 플립칩 시장 전망

시장 규모 및 예측
시장 점유율 및 예측
남미 : 국가별 분석
- 브라질
- 콜롬비아
- 아르헨티나

제11장 시장 역학

성장 촉진요인
과제

제12장 시장 동향과 발전

합병 및 인수
제품 출시
최근 동향

제13장 세계의 플립칩 시장 : SWOT 분석

제14장 Porter's Five Forces 분석

업계 내 경쟁
신규 진입의 가능성
공급자의 힘
고객의 힘
대체품의 위협

제15장 경쟁 구도

Intel Corporation
Taiwan Semiconductor Manufacturing Company Limited
Samsung Electronics Co., Ltd.
Advanced Micro Devices, Inc.
Amkor Technology, Inc.
ASE Group
Texas Instruments Incorporated
GlobalFoundries Inc.
Powertech Technology Inc.
Siliconware Precision Industries Co., Ltd.

제16장 전략적 제안

제17장 기업 소개와 면책사항

SHW

영문 목차

영문목차

The Global Flip Chip Market will grow from USD 36.38 Billion in 2025 to USD 52.93 Billion by 2031 at a 6.45% CAGR. Flip chip technology, also known as Controlled Collapse Chip Connection, is a method for interconnecting semiconductor devices to external circuitry using solder bumps deposited onto the active face of the chip.

Market Overview
Forecast Period	2027-2031
Market Size 2025	USD 36.38 Billion
Market Size 2031	USD 52.93 Billion
CAGR 2026-2031	6.45%
Fastest Growing Segment	Copper pillar
Largest Market	Asia Pacific

Key Market Drivers

The surge in High-Performance Computing (HPC) and Artificial Intelligence constitutes a primary catalyst for the Global Flip Chip Market, as these applications demand unprecedented interconnect density and electrical efficiency. To accommodate the massive computational loads of AI algorithms, manufacturers are increasingly utilizing flip chip interconnects, such as copper pillar bumps, which offer superior thermal management and lower inductance compared to traditional wire bonding. This transition is essential for enabling the dense integration required by modern Graphics Processing Units (GPUs) and AI accelerators found in data centers.

Key Market Challenges

The Global Flip Chip Market faces a substantial challenge regarding the high manufacturing costs and technical complexities associated with the underfilling process. This specific production step is essential for mitigating thermal expansion mismatches between the chip and the substrate but introduces significant operational difficulties. The intricate nature of underfilling requires precise control and specialized materials, which directly increases the overall unit cost.

Key Market Trends

Semiconductor manufacturers are increasingly moving away from monolithic System-on-Chip (SoC) designs toward modular chiplet architectures, relying heavily on advanced flip chip packaging to interconnect multiple smaller dies within a single package. This architectural shift addresses the skyrocketing costs and yield challenges associated with manufacturing large dies at advanced nodes, allowing for the integration of disparate functions like logic and memory into scalable systems.

Key Market Players

Intel Corporation
Taiwan Semiconductor Manufacturing Company Limited
Samsung Electronics Co., Ltd.
Advanced Micro Devices, Inc.
Amkor Technology, Inc.
ASE Group
Texas Instruments Incorporated
GlobalFoundries Inc.
Powertech Technology Inc.
Siliconware Precision Industries Co., Ltd.

Report Scope:

In this report, the Global Flip Chip Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Flip Chip Market, By Wafer Bumping Process:

Copper Pillar
Tin-Lead Eutectic Solder
Lead-Free Solder
Gold Stud Bumping

Flip Chip Market, By Packaging Technology:

BGA (2.1D/2.5D/3D) and CSP

Flip Chip Market, By Product:

Memory
Light Emitting Diode
CMOS Image Sensor
SoC
GPU
CPU

Flip Chip Market, By End User:

Military and Defense
Medical and Healthcare
Industrial Sector
Automotive
Consumer Electronics
Telecommunications

Flip Chip Market, By Region:

North America
United States
Canada
Mexico
Europe
France
United Kingdom
Italy
Germany
Spain
Asia Pacific
China
India
Japan
Australia
South Korea
South America
Brazil
Argentina
Colombia
Middle East & Africa
South Africa
Saudi Arabia
UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Flip Chip Market.

Available Customizations:

Global Flip Chip Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

1. Product Overview

1.1. Market Definition
1.2. Scope of the Market
- 1.2.1. Markets Covered
- 1.2.2. Years Considered for Study
- 1.2.3. Key Market Segmentations

2. Research Methodology

2.1. Objective of the Study
2.2. Baseline Methodology
2.3. Key Industry Partners
2.4. Major Association and Secondary Sources
2.5. Forecasting Methodology
2.6. Data Triangulation & Validation
2.7. Assumptions and Limitations

3. Executive Summary

3.1. Overview of the Market
3.2. Overview of Key Market Segmentations
3.3. Overview of Key Market Players
3.4. Overview of Key Regions/Countries
3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global Flip Chip Market Outlook

5.1. Market Size & Forecast
- 5.1.1. By Value
5.2. Market Share & Forecast
- 5.2.1. By Wafer Bumping Process (Copper Pillar, Tin-Lead Eutectic Solder, Lead-Free Solder, Gold Stud Bumping)
- 5.2.2. By Packaging Technology (BGA (2.1D/2.5D/3D) and CSP)
- 5.2.3. By Product (Memory, Light Emitting Diode, CMOS Image Sensor, SoC, GPU, CPU)
- 5.2.4. By End User (Military and Defense, Medical and Healthcare, Industrial Sector, Automotive, Consumer Electronics, Telecommunications)
- 5.2.5. By Region
- 5.2.6. By Company (2025)
5.3. Market Map

6. North America Flip Chip Market Outlook

6.1. Market Size & Forecast
- 6.1.1. By Value
6.2. Market Share & Forecast
- 6.2.1. By Wafer Bumping Process
- 6.2.2. By Packaging Technology
- 6.2.3. By Product
- 6.2.4. By End User
- 6.2.5. By Country
6.3. North America: Country Analysis
- 6.3.1. United States Flip Chip Market Outlook
  - 6.3.1.1. Market Size & Forecast
    - 6.3.1.1.1. By Value
  - 6.3.1.2. Market Share & Forecast
    - 6.3.1.2.1. By Wafer Bumping Process
    - 6.3.1.2.2. By Packaging Technology
    - 6.3.1.2.3. By Product
    - 6.3.1.2.4. By End User
- 6.3.2. Canada Flip Chip Market Outlook
  - 6.3.2.1. Market Size & Forecast
    - 6.3.2.1.1. By Value
  - 6.3.2.2. Market Share & Forecast
    - 6.3.2.2.1. By Wafer Bumping Process
    - 6.3.2.2.2. By Packaging Technology
    - 6.3.2.2.3. By Product
    - 6.3.2.2.4. By End User
- 6.3.3. Mexico Flip Chip Market Outlook
  - 6.3.3.1. Market Size & Forecast
    - 6.3.3.1.1. By Value
  - 6.3.3.2. Market Share & Forecast
    - 6.3.3.2.1. By Wafer Bumping Process
    - 6.3.3.2.2. By Packaging Technology
    - 6.3.3.2.3. By Product
    - 6.3.3.2.4. By End User

7. Europe Flip Chip Market Outlook

7.1. Market Size & Forecast
- 7.1.1. By Value
7.2. Market Share & Forecast
- 7.2.1. By Wafer Bumping Process
- 7.2.2. By Packaging Technology
- 7.2.3. By Product
- 7.2.4. By End User
- 7.2.5. By Country
7.3. Europe: Country Analysis
- 7.3.1. Germany Flip Chip Market Outlook
  - 7.3.1.1. Market Size & Forecast
    - 7.3.1.1.1. By Value
  - 7.3.1.2. Market Share & Forecast
    - 7.3.1.2.1. By Wafer Bumping Process
    - 7.3.1.2.2. By Packaging Technology
    - 7.3.1.2.3. By Product
    - 7.3.1.2.4. By End User
- 7.3.2. France Flip Chip Market Outlook
  - 7.3.2.1. Market Size & Forecast
    - 7.3.2.1.1. By Value
  - 7.3.2.2. Market Share & Forecast
    - 7.3.2.2.1. By Wafer Bumping Process
    - 7.3.2.2.2. By Packaging Technology
    - 7.3.2.2.3. By Product
    - 7.3.2.2.4. By End User
- 7.3.3. United Kingdom Flip Chip Market Outlook
  - 7.3.3.1. Market Size & Forecast
    - 7.3.3.1.1. By Value
  - 7.3.3.2. Market Share & Forecast
    - 7.3.3.2.1. By Wafer Bumping Process
    - 7.3.3.2.2. By Packaging Technology
    - 7.3.3.2.3. By Product
    - 7.3.3.2.4. By End User
- 7.3.4. Italy Flip Chip Market Outlook
  - 7.3.4.1. Market Size & Forecast
    - 7.3.4.1.1. By Value
  - 7.3.4.2. Market Share & Forecast
    - 7.3.4.2.1. By Wafer Bumping Process
    - 7.3.4.2.2. By Packaging Technology
    - 7.3.4.2.3. By Product
    - 7.3.4.2.4. By End User
- 7.3.5. Spain Flip Chip Market Outlook
  - 7.3.5.1. Market Size & Forecast
    - 7.3.5.1.1. By Value
  - 7.3.5.2. Market Share & Forecast
    - 7.3.5.2.1. By Wafer Bumping Process
    - 7.3.5.2.2. By Packaging Technology
    - 7.3.5.2.3. By Product
    - 7.3.5.2.4. By End User

8. Asia Pacific Flip Chip Market Outlook

8.1. Market Size & Forecast
- 8.1.1. By Value
8.2. Market Share & Forecast
- 8.2.1. By Wafer Bumping Process
- 8.2.2. By Packaging Technology
- 8.2.3. By Product
- 8.2.4. By End User
- 8.2.5. By Country
8.3. Asia Pacific: Country Analysis
- 8.3.1. China Flip Chip Market Outlook
  - 8.3.1.1. Market Size & Forecast
    - 8.3.1.1.1. By Value
  - 8.3.1.2. Market Share & Forecast
    - 8.3.1.2.1. By Wafer Bumping Process
    - 8.3.1.2.2. By Packaging Technology
    - 8.3.1.2.3. By Product
    - 8.3.1.2.4. By End User
- 8.3.2. India Flip Chip Market Outlook
  - 8.3.2.1. Market Size & Forecast
    - 8.3.2.1.1. By Value
  - 8.3.2.2. Market Share & Forecast
    - 8.3.2.2.1. By Wafer Bumping Process
    - 8.3.2.2.2. By Packaging Technology
    - 8.3.2.2.3. By Product
    - 8.3.2.2.4. By End User
- 8.3.3. Japan Flip Chip Market Outlook
  - 8.3.3.1. Market Size & Forecast
    - 8.3.3.1.1. By Value
  - 8.3.3.2. Market Share & Forecast
    - 8.3.3.2.1. By Wafer Bumping Process
    - 8.3.3.2.2. By Packaging Technology
    - 8.3.3.2.3. By Product
    - 8.3.3.2.4. By End User
- 8.3.4. South Korea Flip Chip Market Outlook
  - 8.3.4.1. Market Size & Forecast
    - 8.3.4.1.1. By Value
  - 8.3.4.2. Market Share & Forecast
    - 8.3.4.2.1. By Wafer Bumping Process
    - 8.3.4.2.2. By Packaging Technology
    - 8.3.4.2.3. By Product
    - 8.3.4.2.4. By End User
- 8.3.5. Australia Flip Chip Market Outlook
  - 8.3.5.1. Market Size & Forecast
    - 8.3.5.1.1. By Value
  - 8.3.5.2. Market Share & Forecast
    - 8.3.5.2.1. By Wafer Bumping Process
    - 8.3.5.2.2. By Packaging Technology
    - 8.3.5.2.3. By Product
    - 8.3.5.2.4. By End User

9. Middle East & Africa Flip Chip Market Outlook

9.1. Market Size & Forecast
- 9.1.1. By Value
9.2. Market Share & Forecast
- 9.2.1. By Wafer Bumping Process
- 9.2.2. By Packaging Technology
- 9.2.3. By Product
- 9.2.4. By End User
- 9.2.5. By Country
9.3. Middle East & Africa: Country Analysis
- 9.3.1. Saudi Arabia Flip Chip Market Outlook
  - 9.3.1.1. Market Size & Forecast
    - 9.3.1.1.1. By Value
  - 9.3.1.2. Market Share & Forecast
    - 9.3.1.2.1. By Wafer Bumping Process
    - 9.3.1.2.2. By Packaging Technology
    - 9.3.1.2.3. By Product
    - 9.3.1.2.4. By End User
- 9.3.2. UAE Flip Chip Market Outlook
  - 9.3.2.1. Market Size & Forecast
    - 9.3.2.1.1. By Value
  - 9.3.2.2. Market Share & Forecast
    - 9.3.2.2.1. By Wafer Bumping Process
    - 9.3.2.2.2. By Packaging Technology
    - 9.3.2.2.3. By Product
    - 9.3.2.2.4. By End User
- 9.3.3. South Africa Flip Chip Market Outlook
  - 9.3.3.1. Market Size & Forecast
    - 9.3.3.1.1. By Value
  - 9.3.3.2. Market Share & Forecast
    - 9.3.3.2.1. By Wafer Bumping Process
    - 9.3.3.2.2. By Packaging Technology
    - 9.3.3.2.3. By Product
    - 9.3.3.2.4. By End User

10. South America Flip Chip Market Outlook

10.1. Market Size & Forecast
- 10.1.1. By Value
10.2. Market Share & Forecast
- 10.2.1. By Wafer Bumping Process
- 10.2.2. By Packaging Technology
- 10.2.3. By Product
- 10.2.4. By End User
- 10.2.5. By Country
10.3. South America: Country Analysis
- 10.3.1. Brazil Flip Chip Market Outlook
  - 10.3.1.1. Market Size & Forecast
    - 10.3.1.1.1. By Value
  - 10.3.1.2. Market Share & Forecast
    - 10.3.1.2.1. By Wafer Bumping Process
    - 10.3.1.2.2. By Packaging Technology
    - 10.3.1.2.3. By Product
    - 10.3.1.2.4. By End User
- 10.3.2. Colombia Flip Chip Market Outlook
  - 10.3.2.1. Market Size & Forecast
    - 10.3.2.1.1. By Value
  - 10.3.2.2. Market Share & Forecast
    - 10.3.2.2.1. By Wafer Bumping Process
    - 10.3.2.2.2. By Packaging Technology
    - 10.3.2.2.3. By Product
    - 10.3.2.2.4. By End User
- 10.3.3. Argentina Flip Chip Market Outlook
  - 10.3.3.1. Market Size & Forecast
    - 10.3.3.1.1. By Value
  - 10.3.3.2. Market Share & Forecast
    - 10.3.3.2.1. By Wafer Bumping Process
    - 10.3.3.2.2. By Packaging Technology
    - 10.3.3.2.3. By Product
    - 10.3.3.2.4. By End User

11. Market Dynamics

11.1. Drivers
11.2. Challenges

12. Market Trends & Developments

12.1. Merger & Acquisition (If Any)
12.2. Product Launches (If Any)
12.3. Recent Developments

13. Global Flip Chip Market: SWOT Analysis

14. Porter's Five Forces Analysis

14.1. Competition in the Industry
14.2. Potential of New Entrants
14.3. Power of Suppliers
14.4. Power of Customers
14.5. Threat of Substitute Products

15. Competitive Landscape

15.1. Intel Corporation
- 15.1.1. Business Overview
- 15.1.2. Products & Services
- 15.1.3. Recent Developments
- 15.1.4. Key Personnel
- 15.1.5. SWOT Analysis
15.2. Taiwan Semiconductor Manufacturing Company Limited
15.3. Samsung Electronics Co., Ltd.
15.4. Advanced Micro Devices, Inc.
15.5. Amkor Technology, Inc.
15.6. ASE Group
15.7. Texas Instruments Incorporated
15.8. GlobalFoundries Inc.
15.9. Powertech Technology Inc.
15.10. Siliconware Precision Industries Co., Ltd.