한글목차

세계의 FC BGA 시장 규모는 2024년에 53억 5,500만 달러로 추정되며, 2025-2031년의 예측 기간에 CAGR 9.8%로 성장하며, 2031년까지 100억 300만 달러로 확대할 것으로 예측되고 있습니다.

이 보고서는 FC BGA의 국경 간 산업 발자국, 자본 배분 패턴, 지역 경제의 상호 의존성, 공급망 재구축, 최근 관세 조정 및 국제적인 전략적 대응 조치에 대한 종합적인 평가를 제공합니다.

플립칩 볼 그리드 어레이(FC BGA)는 중저가 고성능 반도체 패키징 솔루션으로, 다이와 기판의 상호 연결에 제어 붕괴 칩 연결 기술(플립칩이라고도 함)을 채택하고 있습니다. FC BGA는 더 높은 신호 밀도와 기능을 더 작은 다이 및 패키지 실적로 구현할 수 있는 설계 유연성을 제공합니다. FC BGA 패키징은 비용보다 성능이 중요시되는 상황에서 매력적인 선택이 될 수 있습니다. 플립칩 BGA 패키지는 표준 프린트 기판을 사용하여 장착이 가능하며, 기존의 표준 수리 방법으로 교체가 가능합니다.

ABF(아지노모토 빌드업 필름) 기판은 표면이 레이저 가공 및 직접 구리 도금에 적합하므로 이러한 미세 부품의 형성을 가능하게 하는 '빌드업 기판'이라고 불리는 다층 마이크로 회로로 구성되어 있습니다. 대부분의 현대 칩 제조업체는 CPU와 GPU의 소형 부품 설계에 ABF를 채택하고 있습니다.

FC BGA 기판의 세계적인 주요 제조업체로는 Unimicron, Ibiden, AT&S, Nan Ya PCB, Shinko Electric Industries 등이 있습니다. 상위 5개사의 점유율은 약 74%를 차지하고 있습니다. 대만은 FC BGA 기판의 세계 최대 시장으로 약 30%의 점유율을 차지하고 있습니다. 그 다음으로 중국 본토와 한국이 각각 약 17%의 점유율을 차지하고 있습니다. 제품 유형별로는 4-8층 ABF 기판이 가장 큰 부문으로 약 69%의 점유율을 차지하고 있습니다. 용도별로는 PC가 가장 큰 분야로 약 40%의 점유율을 차지하고 있습니다.

이 보고서는 세계의 FC BGA 시장에 대해 총판매량, 판매 매출, 가격, 주요 기업의 시장 점유율 및 순위에 초점을 맞추고 지역/국가별, 유형별, 용도별 분석을 종합적으로 제시하는 것을 목적으로 합니다.

이 보고서는 FC BGA 시장 규모, 추정치, 예측치를 판매량(천 평방미터) 및 매출액(백만 달러)으로 제시하고, 2024년을 기준 연도로, 2020-2031년 과거 데이터와 예측 데이터를 포함합니다. 정량적 분석과 정성적 분석을 통해 독자들이 비즈니스/성장 전략 수립, 시장 경쟁 평가, 현재 시장에서의 포지셔닝 분석, FC BGA에 대한 정보에 입각한 비즈니스 의사결정을 내릴 수 있도록 돕습니다.

시장 세분화

기업별

• Unimicron
• Ibiden
• Nan Ya PCB
• Shinko Electric Industries
• Kinsus Interconnect
• AT&S
• Semco
• Kyocera
• TOPPAN
• Zhen Ding Technology
• Daeduck Electronics
• Shenzhen Fastprint Circuit Tech
• Zhuhai Access Semiconductor
• LG InnoTek
• Shennan Circuit
• Korea Circuit
• FICT LIMITED
• AKM Meadville

유형별 부문

• 4-8층 FCBGA 기판
• 8-16층 FCBGA 기판
• 기타

용도별 부문

• PC
• 서버 및 데이터센터
• HPC/AI 칩
• 통신
• 기타

지역별

• 북미
  • 미국
  • 캐나다
• 아시아태평양
  • 중국
  • 일본
  • 한국
  • 동남아시아
  • 인도
  • 호주
  • 기타 아시아태평양
• 유럽
  • 독일
  • 프랑스
  • 영국
  • 이탈리아
  • 네덜란드
  • 북유럽 국가
  • 기타 유럽
• 라틴아메리카
  • 멕시코
  • 브라질
  • 기타 라틴아메리카
• 중동 및 아프리카
  • 튀르키예
  • 사우디아라비아
  • 아랍에미리트
  • 기타 중동 및 아프리카

영문목차

The global market for FC BGA was estimated to be worth US$ 5355 million in 2024 and is forecast to a readjusted size of US$ 10003 million by 2031 with a CAGR of 9.8% during the forecast period 2025-2031.

This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on FC BGA cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.

Flip Chip Ball Grid Array is a mid-cost, high-performance, semiconductor packaging solution that utilizes the controlled collapse chip connection technology, also known as flip chip, for its die to substrate interconnection. FC BGA provides the design flexibility for much higher signal density and functionality into a smaller die and packaging footprint. FC BGA packaging is attractive where performance is more important than cost. Flip-chip BGA packages can be mounted using standard printed circuit boards and can be replaced using existing standard repair practices.

The ABF (Ajinomoto Build-up Film) substrate consists of multiple layers of microcircuits, known as a "build-up substrate" which allows the formation of these miniature components as its surface is receptive to laser processing and direct copper plating. Most modern chipmakers use ABF to design the smaller components of their CPUs and GPUs.

Global key players of FC BGA Substrate include Unimicron, Ibiden, AT&S, Nan Ya PCB, Shinko Electric Industries, etc. The top five players hold a share about 74%. China Taiwan is the world's largest market for FC BGA Substrate and holds a share about 30%, followed by China mainland and South Korea, with share about 17% and 17%, separately. In terms of product type, 4-8 Layers ABF Substrate is the largest segment, accounting for a share about 69%. In terms of application, PCs is the largest field with a share about 40 percent.

This report aims to provide a comprehensive presentation of the global market for FC BGA, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of FC BGA by region & country, by Type, and by Application.

The FC BGA market size, estimations, and forecasts are provided in terms of sales volume (K Square Meters) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding FC BGA.

Market Segmentation

By Company

• Unimicron
• Ibiden
• Nan Ya PCB
• Shinko Electric Industries
• Kinsus Interconnect
• AT&S
• Semco
• Kyocera
• TOPPAN
• Zhen Ding Technology
• Daeduck Electronics
• Shenzhen Fastprint Circuit Tech
• Zhuhai Access Semiconductor
• LG InnoTek
• Shennan Circuit
• Korea Circuit
• FICT LIMITED
• AKM Meadville

Segment by Type

• 4-8 Layers FCBGA Substrate
• 8-16 Layers FCBGA Substrate
• Others

Segment by Application

• PCs
• Server & Data Center
• HPC/AI Chips
• Communication
• Others

By Region

• North America
  • United States
  • Canada
• Asia-Pacific
  • China
  • Japan
  • South Korea
  • Southeast Asia
  • India
  • Australia
  • Rest of Asia-Pacific
• Europe
  • Germany
  • France
  • U.K.
  • Italy
  • Netherlands
  • Nordic Countries
  • Rest of Europe
• Latin America
  • Mexico
  • Brazil
  • Rest of Latin America
• Middle East & Africa
  • Turkey
  • Saudi Arabia
  • UAE
  • Rest of MEA

Chapter Outline

Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 2: Detailed analysis of FC BGA manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 5: Sales, revenue of FC BGA in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.

Chapter 6: Sales, revenue of FC BGA in country level. It provides sigmate data by Type, and by Application for each country/region.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Conclusion.

Table of Contents

1 Market Overview

• 1.1 FC BGA Product Introduction
• 1.2 Global FC BGA Market Size Forecast
  • 1.2.1 Global FC BGA Sales Value (2020-2031)
  • 1.2.2 Global FC BGA Sales Volume (2020-2031)
  • 1.2.3 Global FC BGA Sales Price (2020-2031)
• 1.3 FC BGA Market Trends & Drivers
  • 1.3.1 FC BGA Industry Trends
  • 1.3.2 FC BGA Market Drivers & Opportunity
  • 1.3.3 FC BGA Market Challenges
  • 1.3.4 FC BGA Market Restraints
• 1.4 Assumptions and Limitations
• 1.5 Study Objectives
• 1.6 Years Considered

2 Competitive Analysis by Company

• 2.1 Global FC BGA Players Revenue Ranking (2024)
• 2.2 Global FC BGA Revenue by Company (2020-2025)
• 2.3 Global FC BGA Players Sales Volume Ranking (2024)
• 2.4 Global FC BGA Sales Volume by Company Players (2020-2025)
• 2.5 Global FC BGA Average Price by Company (2020-2025)
• 2.6 Key Manufacturers FC BGA Manufacturing Base and Headquarters
• 2.7 Key Manufacturers FC BGA Product Offered
• 2.8 Key Manufacturers Time to Begin Mass Production of FC BGA
• 2.9 FC BGA Market Competitive Analysis
  • 2.9.1 FC BGA Market Concentration Rate (2020-2025)
  • 2.9.2 Global 5 and 10 Largest Manufacturers by FC BGA Revenue in 2024
  • 2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in FC BGA as of 2024)
• 2.10 Mergers & Acquisitions, Expansion

3 Segmentation by Type

• 3.1 Introduction by Type
  • 3.1.1 4-8 Layers FCBGA Substrate
  • 3.1.2 8-16 Layers FCBGA Substrate
  • 3.1.3 Others
• 3.2 Global FC BGA Sales Value by Type
  • 3.2.1 Global FC BGA Sales Value by Type (2020 VS 2024 VS 2031)
  • 3.2.2 Global FC BGA Sales Value, by Type (2020-2031)
  • 3.2.3 Global FC BGA Sales Value, by Type (%) (2020-2031)
• 3.3 Global FC BGA Sales Volume by Type
  • 3.3.1 Global FC BGA Sales Volume by Type (2020 VS 2024 VS 2031)
  • 3.3.2 Global FC BGA Sales Volume, by Type (2020-2031)
  • 3.3.3 Global FC BGA Sales Volume, by Type (%) (2020-2031)
• 3.4 Global FC BGA Average Price by Type (2020-2031)

4 Segmentation by Application

• 4.1 Introduction by Application
  • 4.1.1 PCs
  • 4.1.2 Server & Data Center
  • 4.1.3 HPC/AI Chips
  • 4.1.4 Communication
  • 4.1.5 Others
• 4.2 Global FC BGA Sales Value by Application
  • 4.2.1 Global FC BGA Sales Value by Application (2020 VS 2024 VS 2031)
  • 4.2.2 Global FC BGA Sales Value, by Application (2020-2031)
  • 4.2.3 Global FC BGA Sales Value, by Application (%) (2020-2031)
• 4.3 Global FC BGA Sales Volume by Application
  • 4.3.1 Global FC BGA Sales Volume by Application (2020 VS 2024 VS 2031)
  • 4.3.2 Global FC BGA Sales Volume, by Application (2020-2031)
  • 4.3.3 Global FC BGA Sales Volume, by Application (%) (2020-2031)
• 4.4 Global FC BGA Average Price by Application (2020-2031)

5 Segmentation by Region

• 5.1 Global FC BGA Sales Value by Region
  • 5.1.1 Global FC BGA Sales Value by Region: 2020 VS 2024 VS 2031
  • 5.1.2 Global FC BGA Sales Value by Region (2020-2025)
  • 5.1.3 Global FC BGA Sales Value by Region (2026-2031)
  • 5.1.4 Global FC BGA Sales Value by Region (%), (2020-2031)
• 5.2 Global FC BGA Sales Volume by Region
  • 5.2.1 Global FC BGA Sales Volume by Region: 2020 VS 2024 VS 2031
  • 5.2.2 Global FC BGA Sales Volume by Region (2020-2025)
  • 5.2.3 Global FC BGA Sales Volume by Region (2026-2031)
  • 5.2.4 Global FC BGA Sales Volume by Region (%), (2020-2031)
• 5.3 Global FC BGA Average Price by Region (2020-2031)
• 5.4 North America
  • 5.4.1 North America FC BGA Sales Value, 2020-2031
  • 5.4.2 North America FC BGA Sales Value by Country (%), 2024 VS 2031
• 5.5 Europe
  • 5.5.1 Europe FC BGA Sales Value, 2020-2031
  • 5.5.2 Europe FC BGA Sales Value by Country (%), 2024 VS 2031
• 5.6 Asia Pacific
  • 5.6.1 Asia Pacific FC BGA Sales Value, 2020-2031
  • 5.6.2 Asia Pacific FC BGA Sales Value by Region (%), 2024 VS 2031
• 5.7 South America
  • 5.7.1 South America FC BGA Sales Value, 2020-2031
  • 5.7.2 South America FC BGA Sales Value by Country (%), 2024 VS 2031
• 5.8 Middle East & Africa
  • 5.8.1 Middle East & Africa FC BGA Sales Value, 2020-2031
  • 5.8.2 Middle East & Africa FC BGA Sales Value by Country (%), 2024 VS 2031

6 Segmentation by Key Countries/Regions

• 6.1 Key Countries/Regions FC BGA Sales Value Growth Trends, 2020 VS 2024 VS 2031
• 6.2 Key Countries/Regions FC BGA Sales Value and Sales Volume
  • 6.2.1 Key Countries/Regions FC BGA Sales Value, 2020-2031
  • 6.2.2 Key Countries/Regions FC BGA Sales Volume, 2020-2031
• 6.3 United States
  • 6.3.1 United States FC BGA Sales Value, 2020-2031
  • 6.3.2 United States FC BGA Sales Value by Type (%), 2024 VS 2031
  • 6.3.3 United States FC BGA Sales Value by Application, 2024 VS 2031
• 6.4 Europe
  • 6.4.1 Europe FC BGA Sales Value, 2020-2031
  • 6.4.2 Europe FC BGA Sales Value by Type (%), 2024 VS 2031
  • 6.4.3 Europe FC BGA Sales Value by Application, 2024 VS 2031
• 6.5 China
  • 6.5.1 China FC BGA Sales Value, 2020-2031
  • 6.5.2 China FC BGA Sales Value by Type (%), 2024 VS 2031
  • 6.5.3 China FC BGA Sales Value by Application, 2024 VS 2031
• 6.6 Japan
  • 6.6.1 Japan FC BGA Sales Value, 2020-2031
  • 6.6.2 Japan FC BGA Sales Value by Type (%), 2024 VS 2031
  • 6.6.3 Japan FC BGA Sales Value by Application, 2024 VS 2031
• 6.7 South Korea
  • 6.7.1 South Korea FC BGA Sales Value, 2020-2031
  • 6.7.2 South Korea FC BGA Sales Value by Type (%), 2024 VS 2031
  • 6.7.3 South Korea FC BGA Sales Value by Application, 2024 VS 2031
• 6.8 Southeast Asia
  • 6.8.1 Southeast Asia FC BGA Sales Value, 2020-2031
  • 6.8.2 Southeast Asia FC BGA Sales Value by Type (%), 2024 VS 2031
  • 6.8.3 Southeast Asia FC BGA Sales Value by Application, 2024 VS 2031
• 6.9 India
  • 6.9.1 India FC BGA Sales Value, 2020-2031
  • 6.9.2 India FC BGA Sales Value by Type (%), 2024 VS 2031
  • 6.9.3 India FC BGA Sales Value by Application, 2024 VS 2031

7 Company Profiles

• 7.1 Unimicron
  • 7.1.1 Unimicron Company Information
  • 7.1.2 Unimicron Introduction and Business Overview
  • 7.1.3 Unimicron FC BGA Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.1.4 Unimicron FC BGA Product Offerings
  • 7.1.5 Unimicron Recent Development
• 7.2 Ibiden
  • 7.2.1 Ibiden Company Information
  • 7.2.2 Ibiden Introduction and Business Overview
  • 7.2.3 Ibiden FC BGA Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.2.4 Ibiden FC BGA Product Offerings
  • 7.2.5 Ibiden Recent Development
• 7.3 Nan Ya PCB
  • 7.3.1 Nan Ya PCB Company Information
  • 7.3.2 Nan Ya PCB Introduction and Business Overview
  • 7.3.3 Nan Ya PCB FC BGA Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.3.4 Nan Ya PCB FC BGA Product Offerings
  • 7.3.5 Nan Ya PCB Recent Development
• 7.4 Shinko Electric Industries
  • 7.4.1 Shinko Electric Industries Company Information
  • 7.4.2 Shinko Electric Industries Introduction and Business Overview
  • 7.4.3 Shinko Electric Industries FC BGA Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.4.4 Shinko Electric Industries FC BGA Product Offerings
  • 7.4.5 Shinko Electric Industries Recent Development
• 7.5 Kinsus Interconnect
  • 7.5.1 Kinsus Interconnect Company Information
  • 7.5.2 Kinsus Interconnect Introduction and Business Overview
  • 7.5.3 Kinsus Interconnect FC BGA Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.5.4 Kinsus Interconnect FC BGA Product Offerings
  • 7.5.5 Kinsus Interconnect Recent Development
• 7.6 AT&S
  • 7.6.1 AT&S Company Information
  • 7.6.2 AT&S Introduction and Business Overview
  • 7.6.3 AT&S FC BGA Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.6.4 AT&S FC BGA Product Offerings
  • 7.6.5 AT&S Recent Development
• 7.7 Semco
  • 7.7.1 Semco Company Information
  • 7.7.2 Semco Introduction and Business Overview
  • 7.7.3 Semco FC BGA Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.7.4 Semco FC BGA Product Offerings
  • 7.7.5 Semco Recent Development
• 7.8 Kyocera
  • 7.8.1 Kyocera Company Information
  • 7.8.2 Kyocera Introduction and Business Overview
  • 7.8.3 Kyocera FC BGA Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.8.4 Kyocera FC BGA Product Offerings
  • 7.8.5 Kyocera Recent Development
• 7.9 TOPPAN
  • 7.9.1 TOPPAN Company Information
  • 7.9.2 TOPPAN Introduction and Business Overview
  • 7.9.3 TOPPAN FC BGA Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.9.4 TOPPAN FC BGA Product Offerings
  • 7.9.5 TOPPAN Recent Development
• 7.10 Zhen Ding Technology
  • 7.10.1 Zhen Ding Technology Company Information
  • 7.10.2 Zhen Ding Technology Introduction and Business Overview
  • 7.10.3 Zhen Ding Technology FC BGA Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.10.4 Zhen Ding Technology FC BGA Product Offerings
  • 7.10.5 Zhen Ding Technology Recent Development
• 7.11 Daeduck Electronics
  • 7.11.1 Daeduck Electronics Company Information
  • 7.11.2 Daeduck Electronics Introduction and Business Overview
  • 7.11.3 Daeduck Electronics FC BGA Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.11.4 Daeduck Electronics FC BGA Product Offerings
  • 7.11.5 Daeduck Electronics Recent Development
• 7.12 Shenzhen Fastprint Circuit Tech
  • 7.12.1 Shenzhen Fastprint Circuit Tech Company Information
  • 7.12.2 Shenzhen Fastprint Circuit Tech Introduction and Business Overview
  • 7.12.3 Shenzhen Fastprint Circuit Tech FC BGA Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.12.4 Shenzhen Fastprint Circuit Tech FC BGA Product Offerings
  • 7.12.5 Shenzhen Fastprint Circuit Tech Recent Development
• 7.13 Zhuhai Access Semiconductor
  • 7.13.1 Zhuhai Access Semiconductor Company Information
  • 7.13.2 Zhuhai Access Semiconductor Introduction and Business Overview
  • 7.13.3 Zhuhai Access Semiconductor FC BGA Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.13.4 Zhuhai Access Semiconductor FC BGA Product Offerings
  • 7.13.5 Zhuhai Access Semiconductor Recent Development
• 7.14 LG InnoTek
  • 7.14.1 LG InnoTek Company Information
  • 7.14.2 LG InnoTek Introduction and Business Overview
  • 7.14.3 LG InnoTek FC BGA Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.14.4 LG InnoTek FC BGA Product Offerings
  • 7.14.5 LG InnoTek Recent Development
• 7.15 Shennan Circuit
  • 7.15.1 Shennan Circuit Company Information
  • 7.15.2 Shennan Circuit Introduction and Business Overview
  • 7.15.3 Shennan Circuit FC BGA Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.15.4 Shennan Circuit FC BGA Product Offerings
  • 7.15.5 Shennan Circuit Recent Development
• 7.16 Korea Circuit
  • 7.16.1 Korea Circuit Company Information
  • 7.16.2 Korea Circuit Introduction and Business Overview
  • 7.16.3 Korea Circuit FC BGA Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.16.4 Korea Circuit FC BGA Product Offerings
  • 7.16.5 Korea Circuit Recent Development
• 7.17 FICT LIMITED
  • 7.17.1 FICT LIMITED Company Information
  • 7.17.2 FICT LIMITED Introduction and Business Overview
  • 7.17.3 FICT LIMITED FC BGA Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.17.4 FICT LIMITED FC BGA Product Offerings
  • 7.17.5 FICT LIMITED Recent Development
• 7.18 AKM Meadville
  • 7.18.1 AKM Meadville Company Information
  • 7.18.2 AKM Meadville Introduction and Business Overview
  • 7.18.3 AKM Meadville FC BGA Sales, Revenue, Price and Gross Margin (2020-2025)
  • 7.18.4 AKM Meadville FC BGA Product Offerings
  • 7.18.5 AKM Meadville Recent Development

8 Industry Chain Analysis

• 8.1 FC BGA Industrial Chain
• 8.2 FC BGA Upstream Analysis
  • 8.2.1 Key Raw Materials
  • 8.2.2 Raw Materials Key Suppliers
  • 8.2.3 Manufacturing Cost Structure
• 8.3 Midstream Analysis
• 8.4 Downstream Analysis (Customers Analysis)
• 8.5 Sales Model and Sales Channels
  • 8.5.1 FC BGA Sales Model
  • 8.5.2 Sales Channel
  • 8.5.3 FC BGA Distributors

9 Research Findings and Conclusion

10 Appendix

• 10.1 Research Methodology
  • 10.1.1 Methodology/Research Approach
    • 10.1.1.1 Research Programs/Design
    • 10.1.1.2 Market Size Estimation
    • 10.1.1.3 Market Breakdown and Data Triangulation
  • 10.1.2 Data Source
    • 10.1.2.1 Secondary Sources
    • 10.1.2.2 Primary Sources
• 10.2 Author Details
• 10.3 Disclaimer