와이어 본더 장비 시장 : 시장 규모, 점유율, 성장 분석 - 장비 유형별, 본딩 기술별, 최종 이용 산업별, 와이어 재질별, 지역별 산업 예측(2025-2032년)
Wire Bonder Equipment Market Size, Share, and Growth Analysis, By Equipment Type (Ball Bonder, Flip Chip Bonder), By Bonding Technology (Thermocompression, Thermosonic), By End-User Industry, By Wire Material, By Region - Industry Forecast 2025-2032
상품코드:1758604
리서치사:SkyQuest Technology Consulting Pvt. Ltd.
발행일:2025년 06월
페이지 정보:영문 193 Pages
라이선스 & 가격 (부가세 별도)
한글목차
세계의 와이어 본더 장비 시장 규모는 2023년에 12억 달러로 평가되었고, 2024년 13억 2,000만 달러에서 2032년에는 27억 4,000만 달러로 확대될 전망이며, 예측 기간인 2025-2032년 CAGR 9.6%로 성장할 전망입니다.
와이어 본더 장비 시장은 반도체와 가전기기 수요 증가, 자동차용 전자기기의 채용 증가, 산업 자동화의 대두에 의해 크게 확대될 전망입니다. 와이어 본딩 기술의 발전과 반도체 조립 및 검사(OSAT) 서비스의 아웃소싱 요구는 특히 제조업체가 비용 효율적인 솔루션을 추구하는 동안 매력을 더욱 향상시키고 있습니다. 최신 자동차에 일렉트로닉스 통합, IoT 장치 및 인더스트리 4.0 기술의 성장은 와이어 본딩 장치의 판매를 촉진하는 또다른 촉매입니다. 특히 아시아태평양의 OSAT 기업은 이러한 수요에 대응하기 위해 급성장하고 있지만, 첨단 포장 기술과의 경쟁, 공급망 불안정성, 유지 보수 비용 등의 과제는 장기적으로 시장 성장을 방해할 수 있습니다.
목차
서문
조사의 목적
조사 범위
정의
조사 방법
정보 조달
2차 및 1차 데이터의 방법
시장 규모 예측
시장의 전제조건 및 제한
주요 요약
세계 시장 전망
공급 및 수요 동향 분석
부문별 기회 분석
시장 역학 및 전망
시장 개요
시장 규모
시장 역학
성장 촉진요인 및 기회
성장 억제요인 및 과제
Porter's Five Forces 분석
주요 시장 인사이트
중요 성공 요인
경쟁도
주요 투자 기회
시장 생태계
시장의 매력 지수(2024년)
PESTEL 분석
거시경제지표
밸류체인 분석
가격 분석
사례 연구
와이어 본더 장비 시장 규모 : 장치 유형별 CAGR(2025-2032년)
시장 개요
볼본더
플립칩 본더
웨지 본더
와이어 본더 장비 시장 규모 : 본딩 기술별 CAGR(2025-2032년)
시장 개요
열 압축
열 모드
고온
저온
서모소닉
열 모드
고온
저온
초음파
열 모드
고온
저온
와이어 본더 장비 시장 규모 : 최종 용도 산업별 CAGR(2025-2032년)
시장 개요
항공우주 및 방위
자동차용 전자 기기
가전
산업용 전자 기기
통신
와이어 본더 장비 시장 규모 : 와이어 재질별 CAGR(2025-2032년)
시장 개요
알루미늄
구리
금
와이어 본더 장비 시장 규모 : 지역별 CAGR(2025-2032년)
북미
미국
캐나다
유럽
독일
스페인
프랑스
영국
이탈리아
기타 유럽
아시아태평양
중국
인도
일본
한국
기타 아시아태평양
라틴아메리카
브라질
기타 라틴아메리카
중동 및 아프리카
GCC 국가
남아프리카
기타 중동 및 아프리카
경쟁 정보
상위 5개사 비교
주요 기업의 시장 포지셔닝(2024년)
주요 시장 기업이 채용한 전략
최근 시장 동향
기업의 시장 점유율 분석(2024년)
주요 기업의 기업 프로파일
기업의 상세
제품 포트폴리오 분석
기업의 부문별 점유율 분석
수익의 전년대비 비교(2022-2024년)
주요 기업 프로파일
ASM Pacific Technology
Kulicke & Sofa Industries Inc.
Palomar Technologies
F&K Delvotec Bondetechnik
DIAS Automation(HK) Ltd.
F & S Bondtec Semiconductor GmbH
Shinkawa Ltd.
TPT Wirebonder GmbH & Co.
West Bond Inc.
BE Semiconductor Industries NV
Hesse GmbH
Toray Engineering
Hybond Inc.
Boston Micro-Components
Guangzhou Minder-Hightech Co., Ltd.
Shenzhen Shuangshi Technology Co., Ltd.
Anza Technology
Kaijo Corporation
Mech-El Industries
Questar Products International
결론 및 권고
AJY
영문 목차
영문목차
Global Wire Bonder Equipment Market size was valued at USD 1.2 billion in 2023 and is poised to grow from USD 1.32 billion in 2024 to USD 2.74 billion by 2032, growing at a CAGR of 9.6% during the forecast period (2025-2032).
The wire bonder equipment market is set for significant expansion, driven by increasing demand for semiconductors and consumer electronics, heightened adoption of automotive electronics, and the rise of industrial automation. Advancements in wire bonding technology and the need for outsourced semiconductor assembly and testing (OSAT) services further enhance its appeal, particularly as manufacturers seek cost-effective solutions. The integration of electronics in modern vehicles and the growth of IoT devices and Industry 4.0 technologies are additional catalysts propelling sales of wire bonding equipment. While OSAT companies, especially in the Asia-Pacific region, ramp up to meet this demand, challenges such as competition from advanced packaging technologies, supply chain volatility, and maintenance costs could potentially hinder market growth in the long term.
Top-down and bottom-up approaches were used to estimate and validate the size of the Global Wire Bonder Equipment market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.
Global Wire Bonder Equipment Market Segments Analysis
Global Wire Bonder Equipment Market is segmented by Equipment Type, Bonding Technology, End-User Industry, Wire Material and region. Based on Equipment Type, the market is segmented into Ball Bonder, Flip Chip Bonder and Wedge Bonder. Based on Bonding Technology, the market is segmented into Thermocompression, Thermosonic and Ultrasonic. Based on End-User Industry, the market is segmented into Aerospace & Defense, Automotive Electronics, Consumer Electronics, Industrial Electronics and Telecommunications. Based on Wire Material, the market is segmented into Aluminum, Copper and Gold. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.
Driver of the Global Wire Bonder Equipment Market
The global wire bonder equipment market is driven by the widespread use of wire bonding, which provides an ideal mix of performance, reliability, and affordability. Despite the rising popularity of advanced packaging methods such as flip-chip and wafer-level packaging, these alternatives come with increased capital investment and greater process complexity. Wire bonding continues to hold a leading position for devices with low to medium pin counts, including analog ICs, MEMS, power electronics, and RF components. The well-established process ecosystem and comparatively low tooling and setup costs further enhance the positive outlook for the wire bonder equipment market.
Restraints in the Global Wire Bonder Equipment Market
The Global Wire Bonder Equipment market is facing significant constraints due to the growing demand for high I/O density and fine-pitch interconnections in advanced semiconductor chips. While alternative techniques like flip-chip and bump-based technologies provide advantages such as reduced interconnect distances, diminished parasitics, and enhanced thermal efficiency, wire bonding, particularly when utilizing fine gold or copper wires, encounters inherent physical and geometric limitations. These constraints hinder its ability to scale effectively for ultra-high-performance applications, potentially impacting revenue generation for companies operating in this sector, as indicated in the current market forecasts for wire bonder equipment.
Market Trends of the Global Wire Bonder Equipment Market
The Global Wire Bonder Equipment market is witnessing a significant trend towards the transition from gold to more cost-effective wire materials such as copper, silver, and aluminum. Driven by the high price volatility of gold, manufacturers are innovating equipment with advanced features, including enhanced environmental sealing, adaptive force control, and optimized capillary designs tailored for these alternative materials. This shift not only seeks to mitigate material costs but also aims to improve bonding performance, particularly in sectors like automotive and high-reliability applications. As a result, the market is evolving to meet the demands of cost efficiency and reliability, ensuring sustained growth and development.
Table of Contents
Introduction
Objectives of the Study
Scope of the Report
Definitions
Research Methodology
Information Procurement
Secondary & Primary Data Methods
Market Size Estimation
Market Assumptions & Limitations
Executive Summary
Global Market Outlook
Supply & Demand Trend Analysis
Segmental Opportunity Analysis
Market Dynamics & Outlook
Market Overview
Market Size
Market Dynamics
Drivers & Opportunities
Restraints & Challenges
Porters Analysis
Competitive rivalry
Threat of substitute
Bargaining power of buyers
Threat of new entrants
Bargaining power of suppliers
Key Market Insights
Key Success Factors
Degree of Competition
Top Investment Pockets
Market Ecosystem
Market Attractiveness Index, 2024
PESTEL Analysis
Macro-Economic Indicators
Value Chain Analysis
Pricing Analysis
Case Studies
Global Wire Bonder Equipment Market Size by Equipment Type & CAGR (2025-2032)
Market Overview
Ball Bonder
Flip Chip Bonder
Wedge Bonder
Global Wire Bonder Equipment Market Size by Bonding Technology & CAGR (2025-2032)
Market Overview
Thermocompression
Thermal Mode
High Temperature
Low Temperature
Thermosonic
Thermal Mode
High Temperature
Low Temperature
Ultrasonic
Thermal Mode
High Temperature
Low Temperature
Global Wire Bonder Equipment Market Size by End-User Industry & CAGR (2025-2032)
Market Overview
Aerospace & Defense
Automotive Electronics
Consumer Electronics
Industrial Electronics
Telecommunications
Global Wire Bonder Equipment Market Size by Wire Material & CAGR (2025-2032)
Market Overview
Aluminum
Copper
Gold
Global Wire Bonder Equipment Market Size & CAGR (2025-2032)
North America (Equipment Type, Bonding Technology, End-User Industry, Wire Material)
US
Canada
Europe (Equipment Type, Bonding Technology, End-User Industry, Wire Material)
Germany
Spain
France
UK
Italy
Rest of Europe
Asia Pacific (Equipment Type, Bonding Technology, End-User Industry, Wire Material)
China
India
Japan
South Korea
Rest of Asia-Pacific
Latin America (Equipment Type, Bonding Technology, End-User Industry, Wire Material)
Brazil
Rest of Latin America
Middle East & Africa (Equipment Type, Bonding Technology, End-User Industry, Wire Material)
