Global Hybrid Bonding Technology Market Research Report 2024
상품코드:1619372
리서치사:QYResearch
발행일:2024년 12월
페이지 정보:영문
라이선스 & 가격 (부가세 별도)
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한글목차
세계 하이브리드 본딩 기술 시장 규모는 2023년 1억 2,349만 달러에서 2030년 6억 1,842만 달러에 이르며, 2024년부터 2030년까지의 CAGR은 24.70%로 예측됩니다.
북미 하이브리드 본딩 기술 시장 규모는 2023년 2,586만 달러에서 2030년 1억 1,645만 달러에 이르며, 2024년부터 2030년까지의 CAGR은 21.13%로 예측되고 있습니다.
유럽의 하이브리드 본딩 기술 시장 규모는 2023년 1,320만 달러에서 2030년 6,223만 달러에 이르며, 2024년부터 2030년까지의 CAGR은 23.43%로 예측됩니다.
아시아태평양 하이브리드 본딩 기술 시장 규모는 2023년 8,140만 달러에서 2030년 4억 2,472만 달러에 이르며, 2024년부터 2030년까지의 CAGR은 26.05%로 예측됩니다.
하이브리드 본딩 기술의 주요 세계 제조업체로는 EV Group(EVG), Applied Materials, Adeia, SUSS MicroTec, Intel, Huawei 등이 차지하고 있습니다.
이 보고서는 세계의 하이브리드 본딩 기술 시장에 대해 조사했으며, 시장 개요와 함께 유형별, 용도별, 지역별 동향, 시장 진출기업 프로파일 등의 정보를 제공합니다.
목차
제1장 보고서 개요
조사 범위
유형별 시장 분석
용도별 시장
전제와 제한
조사 목적
대상 연도
제2장 세계의 성장 동향
세계의 하이브리드 본딩 기술 시장 전망(2019-2030년)
하이브리드 본딩 기술의 세계적 성장 동향, 지역별
하이브리드 본딩 기술 시장 역학
제3장 주요 참가 기업의 경쟁 구도
제4장 하이브리드 본딩 기술의 분석 데이터, 유형별
세계의 하이브리드 본딩 기술 시장 규모 실적, 유형별(2019-2024년)
세계의 하이브리드 본딩 기술 시장 규모 예측, 유형별(2025-2030년)
제5장 하이브리드 본딩 기술의 분석 데이터, 용도별
세계의 하이브리드 본딩 기술 시장 규모 실적, 용도별(2019-2024년)
세계의 하이브리드 본딩 기술 시장 규모 예측, 용도별(2025-2030년)
제6장 북미
제7장 유럽
제8장 아시아태평양
제9장 라틴아메리카
제10장 중동 및 아프리카
제11장 주요 기업 프로파일
EV Group(EVG)
Applied Materials
Adeia
SUSS MicroTec
Intel
Huawei
제12장 애널리스트의 시점/결론
제13장 부록
JHS
영문 목차
영문목차
The global Hybrid Bonding Technology market size in terms of revenue is projected to reach 618.42 million USD by 2030 from 123.49 million USD in 2023, with a CAGR 24.70% during 2024-2030.
North America market for Hybrid Bonding Technology is estimated to increase from 25.86 million USD in 2023 to reach 116.45 million USD by 2030, at a CAGR of 21.13% during the forecast period of 2024 through 2030.
Europe market for Hybrid Bonding Technology is estimated to increase from 13.20 million USD in 2023 to reach 62.23 million USD by 2030, at a CAGR of 23.43% during the forecast period of 2024 through 2030.
Asia-Pacific market for Hybrid Bonding Technology is estimated to increase from 81.40 million USD in 2023 to reach 424.72 million USD by 2030, at a CAGR of 26.05% during the forecast period of 2024 through 2030.
The major global manufacturers of Hybrid Bonding Technology include EV Group (EVG), Applied Materials, Adeia, SUSS MicroTec, Intel, Huawei, etc. In 2023, the world's top five vendors accounted for approximately 74.57% of the revenue.
This report aims to provide a comprehensive presentation of the global market for Hybrid Bonding Technology, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Hybrid Bonding Technology.
The Hybrid Bonding Technology market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Hybrid Bonding Technology market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Hybrid Bonding Technology companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
EV Group (EVG)
Applied Materials
Adeia
SUSS MicroTec
Intel
Huawei
Segment by Type
Wafer-to-wafer Hybrid Bonding
Die-to-wafer Hybrid Bonding
Segment by Application
CMOS Image Sensor (CIS)
NAND
DRAM
High Bandwidth Memory (HBM)
Others
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Israel
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Hybrid Bonding Technology company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
Table of Contents
1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Hybrid Bonding Technology Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 Wafer-to-wafer Hybrid Bonding
1.2.3 Die-to-wafer Hybrid Bonding
1.3 Market by Application
1.3.1 Global Hybrid Bonding Technology Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 CMOS Image Sensor (CIS)
1.3.3 NAND
1.3.4 DRAM
1.3.5 High Bandwidth Memory (HBM)
1.3.6 Others
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Growth Trends
2.1 Global Hybrid Bonding Technology Market Perspective (2019-2030)
2.2 Global Hybrid Bonding Technology Growth Trends by Region
2.2.1 Global Hybrid Bonding Technology Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Hybrid Bonding Technology Historic Market Size by Region (2019-2024)
2.2.3 Hybrid Bonding Technology Forecasted Market Size by Region (2025-2030)
2.3 Hybrid Bonding Technology Market Dynamics
2.3.1 Hybrid Bonding Technology Industry Trends
2.3.2 Hybrid Bonding Technology Market Drivers
2.3.3 Hybrid Bonding Technology Market Challenges
2.3.4 Hybrid Bonding Technology Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Hybrid Bonding Technology Players by Revenue
3.1.1 Global Top Hybrid Bonding Technology Players by Revenue (2019-2024)
3.1.2 Global Hybrid Bonding Technology Revenue Market Share by Players (2019-2024)
3.2 Global Hybrid Bonding Technology Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Global Key Players Ranking by Hybrid Bonding Technology Revenue
3.4 Global Hybrid Bonding Technology Market Concentration Ratio
3.4.1 Global Hybrid Bonding Technology Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 5 Companies by Hybrid Bonding Technology Revenue in 2023
3.5 Global Key Players of Hybrid Bonding Technology Head office and Area Served
3.6 Global Key Players of Hybrid Bonding Technology, Product and Application
3.7 Global Key Players of Hybrid Bonding Technology, Date of Enter into This Industry
