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Unimicron
Ibiden
Nan Ya PCB
Shinko Electric Industries
Kinsus Interconnect Technology
AT&S
Semco
Kyocera
TOPPAN
Zhen Ding Technology
Daeduck Electronics
Zhuhai Access Semiconductor Co., Ltd.
LG InnoTek
Shennan Circuit
Shenzhen Fastprint Circuit Tech
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PCBs are key component of various electronic products. They are used in computers, communications, and various consumer electronic products and equipment. In recent years, they have been widely used in the automotive, industrial, medical, military and aerospace industries. Therefore, the development of this industry is driven by the advancement of modern science and technology, and is closely related to the demand of various end products.
The global market for ABF (FCBGA) Substrate was valued at US$ 5.16 billion in the year 2023, is projected to reach a revised size of US$ 10.2 billion by 2030, growing at a CAGR of 9.86% during the forecast period 2024-2030.
Currently the ABF (FCBGA) Substrates are mainly produced in Japan, China Taiwan, South Korea, Southeast Asia and China Mainland, etc.
The Japan market for ABF (FCBGA) substrates was valued at US$ 1,684 million in 2023 and will reach US$ 2,746 million by 2030, at a CAGR of 7.21% during the forecast period of 2024 through 2030.
The China Taiwan market for ABF (FCBGA) substrates was valued at US$ 2,011 million in 2023 and will reach US$ 3,079 million by 2030, at a CAGR of 6.03% during the forecast period of 2024 through 2030.
The South Korea market for ABF (FCBGA) substrates was valued at US$ 614 million in 2023 and will reach US$ 1,677 million by 2030, at a CAGR of 12.97% during the forecast period of 2024 through 2030.
The China Mainland market for ABF (FCBGA) substrates was valued at US$ 654 million in 2023 and will reach US$ 2,284 million by 2030, at a CAGR of 18.92% during the forecast period of 2024 through 2030.
The global key manufacturers of ABF (FCBGA) substrates include Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect, AT&S, Semco, Kyocera, and TOPPAN, etc. In 2023, the global top five players had a share approximately 73% in terms of revenue.
Asia Pacific is the largest market, holds a share about 78%, key consumers in Asia are Chinese Taiwan, South Korea, Japan, China mainland, and Southeast Asia.
In terms of products, 4-8 Layers ABF substrates are the most common used products, due to the strong demand from PC. In next few years, the segment over 10 layers ABF substrate will be widely used, driven by the demand of AI, HPC chips, high end servers and 5G.
Key end users are Intel, AMD, Nvidia, Apple, and Samsung, etc. In 2023, the key end users are heating up competition to win more capacity support from suppliers of ABF substrates needed to process their HPC chips through at least 2025. Almost all of ABF substrates manufacturers have plans to expand production capacity in next few years, and there also several companies have planned to enter to produce ABF substrates, such as Anhui Splendid Technology, Aoxin Semiconductor Technology (Taicang), and Keruisi Semiconductor Technology (Dongyang) etc. The global competitive situation will be totally different after two or five years, filled with uncertainty.
FC BGA market is segmented in regional and country level, by players, by Product, and by Application. Companies, stakeholders, and other participants in the global FC BGA market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by Product and by Application for the period 2019-2030.
For China market, this report focuses on the FC BGA market size by players, by Product, and by Application, for the period 2019-2030. The key players include the global and local players which play important roles in China.
Market Segmentation
By Company
Unimicron
Ibiden
Nan Ya PCB
Shinko Electric Industries
Kinsus Interconnect
AT&S
Semco
Kyocera
TOPPAN
Zhen Ding Technology
Daeduck Electronics
ACCESS
LG InnoTek
Shennan Circuit
Shenzhen Fastprint Circuit Tech
Segment by Product
4-8 Layers FC BGA Substrate
8-16 Layers FC BGA Substrate
Others
Segment by Application
PCs
Server & Data Center
HPC/AI Chips
Communication
Others
By Region
North America
United States
Canada
Mexico
Brazil
Europe
Germany
France
U.K.
Italy
Nordic Countries
Netherlands
Rest of Europe
APAC
China
Japan
South Korea
China Taiwan
ASEAN
India
Latin America, Middle East & Africa
Mexico
Brazil
Israel
Chapter Outline
Chapter 1: Introduces FC BGA definition, global sales (volume and revenue), China market size, China percentage in global market. This section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Provides the analysis of various market segments by Product, covering the volume, price, revenue, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 3: Provides the analysis of various market segments by Application, covering the revenue, price, volume, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 4: Detailed analysis of FC BGA companies' competitive landscape, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 5: Revenue and volume of FC BGA in global and regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 6: Americas by Product, by Application and by country, sales, and revenue for each segment.
Chapter 7: EMEA by Product, by Application and by region, sales, and revenue for each segment.
Chapter 8: China by Product, and by Application, sales, and revenue for each segment.
Chapter 9: APAC (excluding China) by Product, by Application and by region, sales, and revenue for each segment.
Chapter 10: Provides profiles of key companies, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, FC BGA sales, revenue, gross margin, and recent development, etc.
Chapter 11: Analysis of industrial chain, sales channel, key raw materials, distributors, and customers.
Chapter 12: research findings and conclusion
Table of Contents
1 Study Coverage
1.1 FC BGA Product Introduction
1.2 Global FC BGA Outlook 2019 VS 2023 VS 2030
1.2.1 Global FC BGA Sales in US$ Million for the Year 2019-2030
1.2.2 Global FC BGA Sales in Volume for the Year 2019-2030
1.3 China FC BGA Outlook 2019 VS 2023 VS 2030
1.3.1 China FC BGA Sales in US$ Million for the Year 2019-2030
1.3.2 China FC BGA Sales in Volume for the Year 2019-2030
1.4 FC BGA Market Size, China VS Global, 2019 VS 2023 VS 2030
1.4.1 The Market Share of China FC BGA in Global, 2019 VS 2023 VS 2030
1.4.2 The Growth Rate of FC BGA Market Size, China VS Global, 2019 VS 2023 VS 2030
1.5 FC-BGA Market Dynamics
1.5.1 FC-BGA Industry Trends
1.5.2 FC-BGA Market Drivers
1.5.3 FC-BGA Market Challenges
1.5.4 FC-BGA Market Restraints
1.6 Assumptions and Limitations
1.7 Study Objectives
1.8 Years Considered
2 FC BGA by Product
2.1 FC BGA Market by Product
2.1.1 4-8 Layers FC BGA Substrate
2.1.2 8-16 Layers FC BGA Substrate
2.1.3 Others
2.2 Global FC BGA Market Size by Product
2.2.1 Global FC BGA Sales in Value, by Product (2019, 2023 & 2030)
2.2.2 Global FC BGA Sales in Volume, by Product (2019, 2023 & 2030)
2.2.3 Global FC BGA Average Selling Price (ASP) by Product (2019, 2023 & 2030)
2.3 China FC BGA Market Size by Product
2.3.1 China FC BGA Sales in Value, by Product (2019, 2023 & 2030)
2.3.2 China FC BGA Sales in Volume, by Product (2019, 2023 & 2030)
2.3.3 China FC BGA Average Selling Price (ASP) by Product (2019, 2023 & 2030)
3 FC BGA by Application
3.1 FC BGA Market by Application
3.1.1 PCs
3.1.2 Server & Data Center
3.1.3 HPC/AI Chips
3.1.4 Communication
3.1.5 Others
3.2 Global FC BGA Market Size by Application
3.2.1 Global FC BGA Sales in Value, by Application (2019, 2023 & 2030)
3.2.2 Global FC BGA Sales in Volume, by Application (2019, 2023 & 2030)
3.2.3 Global FC BGA Average Selling Price (ASP) by Application (2019, 2023 & 2030)
3.3 China FC BGA Market Size by Application
3.3.1 China FC BGA Sales in Value, by Application (2019, 2023 & 2030)
3.3.2 China FC BGA Sales in Volume, by Application (2019, 2023 & 2030)
3.3.3 China FC BGA Average Selling Price (ASP) by Application (2019, 2023 & 2030)
4 Global FC BGA Competitor Landscape by Company
4.1 Global FC BGA Market Size by Company
4.1.1 Global Key Manufacturers of FC BGA, Ranked by Revenue (2023)
4.1.2 Global FC BGA Revenue by Manufacturer (2019-2024)
4.1.3 Global FC BGA Sales by Manufacturer (2019-2024)
4.1.4 Global FC BGA Price by Manufacturer (2019-2024)
4.2 Global FC BGA Concentration Ratio (CR)
4.2.1 FC BGA Market Concentration Ratio (CR) (2019-2024)
4.2.2 Global Top 5 and Top 10 Largest Manufacturers of FC BGA in 2023
4.2.3 Global FC BGA Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
4.3 Global Key Manufacturers of FC BGA, Manufacturing Base Distribution and Headquarters
4.4 Global Key Manufacturers of FC BGA, Date of Enter into This Industry