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3D TSV And 2.5D - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2025 - 2030)
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3D TSV And 2.5D-Market-IMG1

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The 3D TSV And 2.5D Market size is estimated at USD 59.92 billion in 2025, and is expected to reach USD 223.35 billion by 2030, at a CAGR of 30.1% during the forecast period (2025-2030).

3D TSV And 2.5D - Market - IMG1

Packaging in the semiconductor industry has noticed a continuous transformation. As the semiconductor applications are growing, the slowdown in CMOS scaling and escalating prices have forced the industry to rely on the advancement in IC packaging. 3D stacking technologies are the solution that meets the required performance of applications like AI, ML, and data centers. Therefore, the growing requirement for high-performance computing applications mainly drives the TSV (Through Silicon Via) market over the forecast period.

Key Highlights

3D TSV And 2.5D Market Trends

LED Packaging Expected to Witness the Significant Growth

Asia-Pacific is Expected to Hold the Significant Market Share

3D TSV And 2.5D Industry Overview

The 3D TSV and 2.5D market is highly competitive and consists of various significant performers as it is diversified. The existence of small, large, and local vendors in the Market creates excellent competition. These firms leverage strategic collaborative endeavors to expand their market share and increase profitability. The companies in the Market are also acquiring start-ups performing on enterprise network equipment technologies to strengthen their product capabilities.

In August 2022, Intel showcased the unique architectural and packaging breakthroughs that help 2.5D and 3D-based chip designs, ushering in a remarkable era in chipmaking technologies and their importance. Intel's system foundry model features enhanced packaging. The organization intends to improve the number of transistors on a package from 100 billion to 1 trillion by 2030.

In March 2022, Apple adopted a 2.5D approach to boost the enactment of its latest M1 Ultra device that unlocks the door to future designs utilizing chiplets. A packaging architecture called UltraFusion interconnects the die of two M1 Max chips on a silicon interposer to build a system on a chip (SoC) with 114bn transistors. This utilizes a silicon substrate and interposer that supports the two dies with 10,000 interconnects with 2.5 TB/s of low latency and inter-processor bandwidth between the die. This also connects the die to 128 GB of low-latency unified memory operating an 800 GB/s interface.

Additional Benefits:

TABLE OF CONTENTS

1 INTRODUCTION

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

5 MARKET DYNAMICS

6 TECHNOLOGICAL SNAPSHOT

7 MARKET SEGMENTATION

8 COMPETITIVE LANDSCAPE

9 INVESTMENT ANALYSIS

10 FUTURE OF THE MARKET

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