리서치사:Market Glass, Inc. (Formerly Global Industry Analysts, Inc.)
발행일:2025년 02월
페이지 정보:영문 276 Pages
라이선스 & 가격 (부가세 별도)
한글목차
세계 3D 칩(3D IC) 시장은 2030년까지 452억 달러에 이를 전망
2024년에 168억 달러로 추정되는 3D 칩(3D IC) 세계 시장은 2024-2030년간 CAGR 18.0%로 성장하여 2030년에는 452억 달러에 이를 것으로 예측됩니다. 본 보고서에서 분석한 부문 중 하나인 메모리는 CAGR 19.2%를 나타내고, 분석 기간 종료시에는 222억 달러에 이를 것으로 예측됩니다. LED 부문의 성장률은 분석 기간중 CAGR 18.2%를 나타낼 전망입니다.
미국 시장은 46억 달러, 중국은 CAGR 16.6%로 성장 예측
미국의 3D 칩(3D IC) 시장은 2024년에 46억 달러에 이른 것으로 추정됩니다. 세계 2위 경제대국인 중국은 2030년까지 67억 달러 규모에 이를 것으로 예측되며, 분석 기간인 2024-2030년간 CAGR은 16.6%를 나타낼 전망입니다. 기타 주목해야 할 지역별 시장으로서는 일본과 캐나다가 있으며, 분석 기간중 CAGR은 각각 16.5%와 15.2%를 나타낼 것으로 예측됩니다. 유럽에서는 독일이 CAGR 약 12.6%로 성장할 것으로 예측됩니다.
3D 칩(3D IC) - 주요 동향과 성장 촉진요인
3D 집적회로(3D IC)라고도 불리는 3D 칩은 기존 2D IC의 한계를 극복한 반도체 기술의 혁신적 발전입니다. 이 칩은 실리콘 웨이퍼 또는 다이를 다층으로 쌓고 실리콘 관통 전극(TSV)을 사용하여 수직으로 연결하여 만들어집니다. 이 아키텍처 설계는 집적도를 높이고 전력 소비를 줄임으로써 칩 성능을 크게 향상시킵니다. 수직 적층으로 층간 인터커넥트 길이가 짧아지기 때문에 신호 전송 속도가 향상되고 지연 시간이 단축됩니다. 이를 통해 로직, 메모리, 아날로그 등 다양한 유형의 회로를 하나의 패키지에 집적할 수 있어 컴팩트한 폼 팩터로 기능과 성능을 향상시킬 수 있습니다. 사물인터넷(IoT) 기기 등 다양한 용도에 걸쳐 큰 영향을 미치고 있으며, 기존 반도체 스케일링의 물리적, 경제적 장벽을 극복할 수 있는 길을 제공합니다.
3D IC 시장의 가장 두드러진 트렌드 중 하나는 고성능, 에너지 효율적인 컴퓨팅 솔루션에 대한 수요가 증가하고 있다는 점입니다. 데이터센터와 클라우드 컴퓨팅 서비스가 빠르게 성장함에 따라, 최소한의 에너지 소비로 방대한 양의 데이터를 처리할 수 있는 프로세서에 대한 수요가 급증하고 있으며, 3D IC는 뛰어난 성능과 에너지 효율성으로 인해 이러한 수요에 특히 적합합니다. 또한, 인공지능(AI) 및 머신러닝(ML) 용도의 급증으로 복잡한 계산을 빠르게 수행할 수 있는 칩이 필요하며, 3D IC의 소형화 및 성능 향상은 이러한 용도에 이상적입니다. 또한, 스마트폰, 웨어러블 기기 등 가전제품의 소형화 추세는 3D IC의 채택을 촉진하고 있습니다. 이러한 칩은 더 작은 패키지에 더 많은 기능을 구현하여 더 강력하면서도 컴팩트한 디바이스를 원하는 소비자의 요구에 부응하고 있습니다. 서로 다른 유형의 회로를 하나의 3D 패키지에 통합하는 이종 통합의 개발은 3D IC의 잠재적 응용 분야를 더욱 확장하여 다양한 분야의 특정 요구에 맞는 솔루션을 제공합니다.
3D IC 시장의 성장은 몇 가지 요인에 의해 이루어집니다. 주요 요인 중 하나는 전자기기의 복잡성과 고집적화에 대한 요구입니다. 디바이스가 고도화됨에 따라 하나의 패키지에 더 많은 기능을 통합할 수 있는 칩에 대한 수요가 증가하고 있으며, 3D IC가 이를 실현할 수 있습니다. 또 다른 중요한 원동력은 데이터 집약적 용도의 에너지 효율과 성능 향상에 대한 요구입니다. 3D IC는 처리 속도를 향상시키면서 전력 소비를 줄일 수 있기 때문에 데이터센터 및 고성능 컴퓨팅 환경에서 사용하기에 매력적입니다. 또한, 제조 기술의 발전으로 3D IC의 제조 관련 비용이 절감되어 보다 광범위한 용도에 쉽게 사용할 수 있게 되었습니다. 또한, IoT 디바이스의 보급과 엣지 컴퓨팅의 중요성 증가도 시장 성장에 기여하고 있습니다. 이러한 용도에는 작고 효율적인 고성능 칩이 필요하기 때문입니다. 또한, 주요 반도체 업체들의 전략적 제휴와 연구개발에 대한 투자가 3D IC 기술의 혁신과 채택을 가속화하고 있습니다. 신소재의 통합과 첨단 패키징 기술의 개발도 3D IC의 기능과 응용을 확대하고 있습니다. 요약하면, 기술 발전, 시장 수요, 전략적 투자의 수렴은 3D IC 시장을 발전시키고 있으며, 컴퓨팅 성능, 에너지 효율 및 장치 기능의 상당한 진전을 가져올 것으로 예상됩니다.
부문
제품(메모리, LED, 센서, MEMS);& 유형(적층 3D, 모놀리식 3D);& 최종사용자(가전, 통신, 자동차, 군/항공우주, 의료기기, 산업 분야, 기타 최종사용자)
Global 3D Chips (3D IC) Market to Reach US$45.2 Billion by 2030
The global market for 3D Chips (3D IC) estimated at US$16.8 Billion in the year 2024, is expected to reach US$45.2 Billion by 2030, growing at a CAGR of 18.0% over the analysis period 2024-2030. Memory, one of the segments analyzed in the report, is expected to record a 19.2% CAGR and reach US$22.2 Billion by the end of the analysis period. Growth in the LEDs segment is estimated at 18.2% CAGR over the analysis period.
The U.S. Market is Estimated at US$4.6 Billion While China is Forecast to Grow at 16.6% CAGR
The 3D Chips (3D IC) market in the U.S. is estimated at US$4.6 Billion in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$6.7 Billion by the year 2030 trailing a CAGR of 16.6% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 16.5% and 15.2% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 12.6% CAGR.
3D Chips (3D IC) - Key Trends and Drivers
3D chips, also known as 3D integrated circuits (3D ICs), represent a transformative advancement in semiconductor technology, addressing the limitations of traditional 2D ICs. These chips are created by stacking multiple layers of silicon wafers or dies and connecting them vertically using through-silicon vias (TSVs). This architectural design significantly enhances chip performance by increasing density and reducing power consumption. The vertical stacking shortens the interconnect lengths between layers, which improves signal transmission speed and reduces latency. This allows for integrating various types of circuits, such as logic, memory, and analog, within a single package, enhancing functionality and performance in a compact form factor. The impact of 3D ICs is profound across various applications, including high-performance computing, mobile devices, data centers, and Internet of Things (IoT) devices, offering a path to overcoming the physical and economic barriers of traditional semiconductor scaling.
One of the most prominent trends in the 3D IC market is the escalating demand for high-performance and energy-efficient computing solutions. As data centers and cloud computing services expand rapidly, there is a pressing need for processors capable of handling vast amounts of data with minimal energy consumption. 3D ICs are particularly well-suited for these demands due to their superior performance and energy efficiency. Additionally, the surge in artificial intelligence (AI) and machine learning (ML) applications necessitates chips that can execute complex computations swiftly. The compactness and enhanced performance of 3D ICs make them ideal for these applications. Moreover, the ongoing trend of miniaturization in consumer electronics, such as smartphones and wearable devices, is propelling the adoption of 3D ICs. These chips enable more functionality within smaller packages, addressing consumer demand for more powerful yet compact devices. The development of heterogeneous integration, where different types of circuits are combined in a single 3D package, further expands the potential applications of 3D ICs, offering solutions tailored to specific needs across various sectors.
The growth in the 3D IC market is driven by several factors. One major driver is the increasing complexity of electronic devices and the need for higher integration levels. As devices become more sophisticated, there is a greater demand for chips that can integrate more functions within a single package, which 3D ICs can provide. Another key driver is the push for improved energy efficiency and performance in data-intensive applications. The ability of 3D ICs to reduce power consumption while enhancing processing speed makes them attractive for use in data centers and high-performance computing environments. Additionally, advancements in fabrication and manufacturing technologies have reduced the costs associated with 3D IC production, making them more accessible to a broader range of applications. The proliferation of IoT devices and the increasing importance of edge computing also contribute to the market growth, as these applications require compact, efficient, and high-performance chips. Moreover, strategic collaborations and investments in research and development by major semiconductor companies are accelerating the innovation and adoption of 3D IC technologies. The integration of new materials and the development of advanced packaging techniques are also expanding the capabilities and applications of 3D ICs. In summary, the convergence of technological advancements, market demands, and strategic investments is propelling the 3D IC market forward, promising significant advancements in computing performance, energy efficiency, and device functionality.
SCOPE OF STUDY:
The report analyzes the 3D Chips (3D IC) market in terms of units by the following Segments, and Geographic Regions/Countries:
Segments:
Product (Memory, LEDs, Sensors, MEMS); Type (Stacked 3D, Monolithic 3D); End-Use (Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector, Other End-Uses)
Geographic Regions/Countries:
World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.
3D Chips (3D IC) - Global Key Competitors Percentage Market Share in 2025 (E)
Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
2. FOCUS ON SELECT PLAYERS
3. MARKET TRENDS & DRIVERS
Increasing Demand for High-Performance Computing Drives Adoption
Advances in Through-Silicon Via (TSV) Technology Propel Growth
Expansion of Data Centers Spurs Demand for Energy-Efficient 3D ICs
Rise of AI and Machine Learning Applications Expands Addressable Market Opportunity
Miniaturization Trends in Consumer Electronics Strengthen Business Case for 3D ICs
Growing Complexity of Electronic Devices Generates Demand for Higher Integration
Innovations in Heterogeneous Integration Techniques Accelerate Adoption
Shift Towards Edge Computing Sustains Growth in 3D IC Market
Consumer Demand for Compact and Powerful Devices Propels Market Growth
Development of Advanced Packaging Solutions Expands Market Opportunities
Emergence of Smart Devices Accelerates Demand for 3D ICs
Integration of New Materials in 3D ICs Generates Opportunities for Enhanced Functionality
Evolving Cloud Computing Requirements Propel Need for High-Density 3D ICs
Focus on Reducing Latency in Data Processing: Here's the Story of 3D IC Impact
Adoption of Biometric and Security Technologies Drives Market Growth for 3D ICs
4. GLOBAL MARKET PERSPECTIVE
TABLE 1: World 3D Chips (3D IC) Market Analysis of Annual Sales in US$ Million for Years 2015 through 2030
TABLE 2: World Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
TABLE 3: World 6-Year Perspective for 3D Chips (3D IC) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2025 & 2030
TABLE 4: World Recent Past, Current & Future Analysis for Memory by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
TABLE 5: World 6-Year Perspective for Memory by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
TABLE 6: World Recent Past, Current & Future Analysis for LEDs by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
TABLE 7: World 6-Year Perspective for LEDs by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
TABLE 8: World Recent Past, Current & Future Analysis for Sensors by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
TABLE 9: World 6-Year Perspective for Sensors by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
TABLE 10: World Recent Past, Current & Future Analysis for MEMS by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
TABLE 11: World 6-Year Perspective for MEMS by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
TABLE 12: World Recent Past, Current & Future Analysis for Stacked 3D by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
TABLE 13: World 6-Year Perspective for Stacked 3D by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
TABLE 14: World Recent Past, Current & Future Analysis for Monolithic 3D by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
TABLE 15: World 6-Year Perspective for Monolithic 3D by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
TABLE 16: World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
TABLE 17: World 6-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
TABLE 18: World Recent Past, Current & Future Analysis for Telecommunications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
TABLE 19: World 6-Year Perspective for Telecommunications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
TABLE 20: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
TABLE 21: World 6-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
TABLE 22: World Recent Past, Current & Future Analysis for Military & Aerospace by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
TABLE 23: World 6-Year Perspective for Military & Aerospace by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
TABLE 24: World Recent Past, Current & Future Analysis for Medical Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
TABLE 25: World 6-Year Perspective for Medical Devices by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
TABLE 26: World Recent Past, Current & Future Analysis for Industrial Sector by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
TABLE 27: World 6-Year Perspective for Industrial Sector by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
TABLE 28: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
TABLE 29: World 6-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2025 & 2030
III. MARKET ANALYSIS
UNITED STATES
3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
TABLE 30: USA Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 31: USA 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
TABLE 32: USA Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 33: USA 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
TABLE 34: USA Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 35: USA 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
CANADA
TABLE 36: Canada Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 37: Canada 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
TABLE 38: Canada Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 39: Canada 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
TABLE 40: Canada Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 41: Canada 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
JAPAN
3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
TABLE 42: Japan Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 43: Japan 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
TABLE 44: Japan Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 45: Japan 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
TABLE 46: Japan Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 47: Japan 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
CHINA
3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
TABLE 48: China Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 49: China 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
TABLE 50: China Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 51: China 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
TABLE 52: China Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 53: China 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
EUROPE
3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
TABLE 54: Europe Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
TABLE 55: Europe 6-Year Perspective for 3D Chips (3D IC) by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2025 & 2030
TABLE 56: Europe Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 57: Europe 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
TABLE 58: Europe Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 59: Europe 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
TABLE 60: Europe Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 61: Europe 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
FRANCE
3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
TABLE 62: France Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 63: France 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
TABLE 64: France Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 65: France 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
TABLE 66: France Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 67: France 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
GERMANY
3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
TABLE 68: Germany Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 69: Germany 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
TABLE 70: Germany Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 71: Germany 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
TABLE 72: Germany Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 73: Germany 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
ITALY
TABLE 74: Italy Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 75: Italy 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
TABLE 76: Italy Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 77: Italy 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
TABLE 78: Italy Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 79: Italy 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
UNITED KINGDOM
3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
TABLE 80: UK Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 81: UK 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
TABLE 82: UK Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 83: UK 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
TABLE 84: UK Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 85: UK 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
REST OF EUROPE
TABLE 86: Rest of Europe Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 87: Rest of Europe 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
TABLE 88: Rest of Europe Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 89: Rest of Europe 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
TABLE 90: Rest of Europe Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 91: Rest of Europe 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
ASIA-PACIFIC
3D Chips (3D IC) Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
TABLE 92: Asia-Pacific Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 93: Asia-Pacific 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
TABLE 94: Asia-Pacific Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 95: Asia-Pacific 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
TABLE 96: Asia-Pacific Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 97: Asia-Pacific 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
REST OF WORLD
TABLE 98: Rest of World Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Product - Memory, LEDs, Sensors and MEMS - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 99: Rest of World 6-Year Perspective for 3D Chips (3D IC) by Product - Percentage Breakdown of Value Sales for Memory, LEDs, Sensors and MEMS for the Years 2025 & 2030
TABLE 100: Rest of World Recent Past, Current & Future Analysis for 3D Chips (3D IC) by Type - Stacked 3D and Monolithic 3D - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 101: Rest of World 6-Year Perspective for 3D Chips (3D IC) by Type - Percentage Breakdown of Value Sales for Stacked 3D and Monolithic 3D for the Years 2025 & 2030
TABLE 102: Rest of World Recent Past, Current & Future Analysis for 3D Chips (3D IC) by End-Use - Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
TABLE 103: Rest of World 6-Year Perspective for 3D Chips (3D IC) by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Telecommunications, Automotive, Military & Aerospace, Medical Devices, Industrial Sector and Other End-Uses for the Years 2025 & 2030
