3D IC 시장 : 최종 용도 부문별, 기판 유형별, 제조 프로세스별, 제품 유형별, 지역별 - 시장 규모, 점유율, 전망, 기회 분석(2020-2027년)
3D ICs Market, By End-Use Sectors, by Substrate Type, by Fabrication Process, by Product and by Region - Size, Share, Outlook, and Opportunity Analysis, 2020 - 2027
상품코드
:
1672644
리서치사
:
Coherent Market Insights
발행일
:
2025년 02월
페이지 정보
:
영문
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세계의 3D IC 시장은 2025년에 198억 4,000만 달러로 추정되며, 2032년에는 736억 6,000만 달러에 달할 것으로 예측되며, 2025-2032년에 20.6%의 연평균 성장률(CAGR)로 성장할 것으로 예측됩니다.
| 리포트 범위 |
리포트 상세 |
| 기준연도 |
2024 |
2025년 시장 규모 |
198억 4,000만 달러 |
| 실적 데이터 |
2020-2024년 |
예측 기간 |
2025-2032년 |
| 예측 기간 : 2025-2032년 CAGR : |
20.60% |
2032년 가치 예측 |
736억 6,000만 달러 |
도표. 3D IC 시장 점유율(%), 2025년 지역별
3D IC는 3차원 집적회로라고도 불리며, 두개 이상의 IC 칩을 적층하고 실리콘 관통전극(TSV)을 통해 수직으로 연결하여 배선 길이를 단축하고 신호 전파 속도를 향상시키는 수직 어셈블리를 말합니다. 속도를 향상시키는 수직 어셈블리를 말합니다. 3D IC 기술은 실리콘 다이를 적층하여 하나의 패키지에 통합함으로써 칩 밀도를 극대화하고 칩 비용 절감에 기여하며, 작은 실적에 많은 부품을 집적하여 디바이스의 소형화를 가능하게 합니다. 메모리, 그래픽, 프로세서, 무선 전자기기 등 다양한 부품을 하나의 모듈에 배치할 수 있으며, 3D IC와 관련된 높은 대역폭과 저전력 소비 기능은 가전, 의료기기, 자동차 산업 등 다양한 용도에서 수요를 촉진하고 있습니다. 수요를 촉진하고 있습니다.
시장 역학:
세계 3D IC 시장은 고성능 휴대용 소비자 전자제품에 대한 수요 증가로 인해 3D IC 시장이 주도하고 있습니다. 컴팩트한 폼팩터에 향상된 기능을 갖춘 디바이스에 대한 수요가 3D IC에 대한 수요를 촉진하고 있습니다. 그러나 3D IC 제조에 따른 높은 제조비용이 3D IC의 보급에 걸림돌이 되고 있습니다. 설계 및 제조 공정의 복잡성이 제조 비용을 상승시킵니다. 3D IC 기술을 이용한 로직 칩, 메모리, 센서 부품의 통합은 자동차의 첨단 운전 보조, 내비게이션, 인포테인먼트 서비스를 실현하는 데 도움이 될 수 있습니다. 3D IC는 더 높은 대역폭과 낮은 전력 소비를 지원하므로 그래픽 및 처리 부하가 높은 배터리 구동 장비에 채택이 확대될 것으로 보입니다. 새로운 재료와 설계 기술을 통한 제조 비용 절감 노력은 장벽을 극복하는 데 더욱 도움이 될 것으로 보입니다.
본 조사의 주요 특징
- 세계의 3D IC 시장에 대해 조사 분석했으며, 2024년을 기준 연도로 하여 예측 기간(2025-2032년) 시장 규모와 연평균 성장률(CAGR)을 조사하여 전해드립니다.
- 또한 다양한 부문에 걸친 잠재적 매출 기회를 밝히고, 이 시장의 매력적인 투자 제안 매트릭스를 설명합니다.
- 또한 시장 성장 촉진요인, 억제요인, 기회, 신제품 출시 및 승인, 시장 동향, 지역별 전망, 주요 기업의 경쟁 전략 등에 대한 중요한 인사이트를 제공합니다.
- 이 보고서는 기업 하이라이트, 제품 포트폴리오, 주요 하이라이트, 재무 성과, 전략 등의 매개 변수를 기반으로 세계 3D IC 시장의 주요 기업을 프로파일링합니다.
- 이 보고서의 인사이트를 통해 마케팅 담당자와 기업 경영진은 향후 제품 출시, 유형화, 시장 확대, 마케팅 전략에 대한 정보에 입각한 의사결정을 내릴 수 있습니다.
- 이 보고서는 투자자, 공급업체, 제품 제조업체, 유통업체, 신규 시장 진출기업, 재무 분석가 등 업계의 다양한 이해관계자를 대상으로 합니다.
- 이해관계자들은 세계 3D IC 시장 분석에 사용되는 다양한 전략 매트릭스를 통해 의사결정을 용이하게 할 수 있습니다.
목차
제1장 조사의 목적과 전제조건
제2장 시장 전망
- 리포트 설명
- 개요
- Coherent Opportunity Map(COM)
제3장 시장 역학, 규제, 동향 분석
- 시장 역학
- 규제 시나리오
- 업계 동향
- 합병과 인수
- 신시스템 출시/승인
제4장 3D IC 시장에 대한 COVID-19 팬데믹의 영향
- 지역별 단기적 및 장기적인 영향
- 북미
- 유럽
- 아시아태평양
- 라틴아메리카
- 중동 및 아프리카
제5장 세계의 3D IC 시장, 최종 용도별, 2018-2028년
- 가전
- 정보 통신 기술
- 운송(자동차 및 항공우주)
- 군대
- 기타(바이오메디컬 응용·연구개발)
제6장 세계의 3D IC 시장, 기판 유형별, 2018-2028년
- SOI(Silicon on insulator)
- 벌크 실리콘
제7장 세계의 3D IC 시장, 제조 프로세스별, 2018-2028년
- 빔 재결정화
- 웨이퍼 본딩
- 실리콘 에피택셜 성장
- 고상 결정화
제8장 세계의 3D IC 시장, 프로세스별, 2018-2028년
- MEMS와 센서
- RF SiP
- 옵토일렉트로닉스와 이미징
- 메모리(3D 스택)
- 로직(3D SIP/SOC)
- HB LED
제9장 세계의 3D IC 시장, 지역별, 2018-2028년
- 북미
- 유럽
- 아시아태평양
- 라틴아메리카
- 중동 및 아프리카
제10장 경쟁 구도
- 기업 개요
- Taiwan Semiconductor Manufacturing Company, Ltd
- MonolithIC 3D Inc.
- XILINX, Inc.
- Elpida Memory, Inc.
- (Micron Technology, Inc.)
- The 3M Company,
- Ziptronix, Inc.
- STATS ChipPAC Ltd.
- United Microelectronics Corporation
- Tezzaron Semiconductor Corporation
제11장 섹션
KSA
영문 목차
Global 3d Ics Market is estimated to be valued at USD 19.84 Bn in 2025 and is expected to reach USD 73.66 Bn by 2032, growing at a compound annual growth rate (CAGR) of 20.6% from 2025 to 2032.
| Report Coverage |
Report Details |
| Base Year: |
2024 |
Market Size in 2025: |
USD 19.84 Bn |
| Historical Data for: |
2020 To 2024 |
Forecast Period: |
2025 To 2032 |
| Forecast Period 2025 to 2032 CAGR: |
20.60% |
2032 Value Projection: |
USD 73.66 Bn |
Figure. 3d Ics Market Share (%), By Region 2025
The global 3D ICs market is witnessing robust growth with the rising demand for more compact and high-performance electronic devices. 3D ICs, also known as three-dimensional integrated circuits, refers to the vertical assembly of two or more IC chips stacked and connected vertically via through-silicon vias (TSVs) to reduce wire length and improve the signal propagation speeds. It enables device miniaturization by integrating more components in a small footprint. 3D ICs technology helps maximize chip density by stacking silicon dies and integrating them into one package which helps reduce the chip cost. It allows the placement of different components such as memory, graphics, processors, and radio electronics in one module. The higher bandwidth and low power consumption features associated with 3D ICs are fueling their demand for various applications across consumer electronics, medical devices, and automotive industries.
Market Dynamics:
The global 3D ICs market is driven by the increasing demand for high performance portable consumer electronics. The demand for devices with improved functionality in a compact form factor is propelling the need for 3D ICs. However, the high manufacturing cost associated with 3D ICs fabrication poses a challenge for widespread adoption. The complexity in the design and manufacturing process increases production costs. Opportunities lies in the emerging applications of 3D ICs in autonomous vehicles, augmented and virtual reality devices. The integration of logic chips, memory, and sensor components using 3D ICs technology can help enable advanced driver assistance, navigation, and infotainment services in vehicles. 3D ICs supports higher bandwidth and low-power consumption which will drive their adoption in battery-operated devices with graphics and processing-intensive requirements. efforts to lower manufacturing costs through new materials and design techniques will further help address barriers.
Key Features of the Study:
- This report provides in-depth analysis of the global 3D ICs market, and provides market size (US$ Billion) and compound annual growth rate (CAGR%) for the forecast period (2025-2032), considering 2024 as the base year
- It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrices for this market
- This study also provides key insights about market drivers, restraints, opportunities, new product launches or approval, market trends, regional outlook, and competitive strategies adopted by key players
- It profiles key players in the global 3D ICs market based on the following parameters - company highlights, products portfolio, key highlights, financial performance, and strategies
- Key companies covered as a part of this study include Amkor Technology, ASE Group, BeSang Inc., IBM Corporation, Intel Corporation, Jiangsu Changjiang Electronics Technology Co., Ltd., Micron Technology Inc., MonolithIC 3D ICs Inc., Samsung Electronics Co. Ltd., STATS ChipPAC Ltd., STMicroelectronics N.V., Taiwan Semiconductor Manufacturing Company, Tezzaron Semiconductor, Toshiba Corporation, United Microelectronics Corporation, and Xilinx Inc.
- Insights from this report would allow marketers and the management authorities of the companies to make informed decisions regarding their future product launches, type up-gradation, market expansion, and marketing tactics
- The global 3D ICs market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts
- Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the global 3D ICs market
Detailed Segmentation:
- By Product Type
- LED
- Memories
- MEMS
- Sensor
- Logic
- Others
- By Substrate Type
- Silicon on Insulator (SOI)
- Bulk Silicon
- By Application
- Information and Communication Technology
- Military
- Consumer Electronics
- Others
- By Region:
- North America
- Europe
- Asia Pacific
- Latin America
- Middle East
- Africa
- Key Players Insights
- Amkor Technology
- ASE Group
- BeSang Inc.
- IBM Corporation
- Intel Corporation
- Jiangsu Changjiang Electronics Technology Co., Ltd.
- Micron Technology Inc.
- MonolithIC 3D ICs Inc.
- Samsung Electronics Co. Ltd.
- STATS ChipPAC Ltd.
- STMicroelectronics N.V.
- Taiwan Semiconductor Manufacturing Company
- Tezzaron Semiconductor
- Toshiba Corporation
- United Microelectronics Corporation
- Xilinx Inc.
Table of Contents
1. Research Objectives and Assumptions
- Research Objectives
- Assumptions
- Abbreviations
2. Market Purview
- Report Description
- Market Definition and Scope
- Executive Summary
- Market Snippet, By End-Use Sectors
- Market Snippet, By Substrate Type
- Market Snippet, By Fabrication Process
- Market Snippet, By Process
- Market Snippet, By Region
- Coherent Opportunity Map (COM)
3. Market Dynamics, Regulations, and Trends Analysis
- Market Dynamics
- Drivers
- Restraints
- Market Opportunities
- Regulatory Scenario
- Industry Trend
- Merger and Acquisitions
- New System Launch/Approval
4. Impact of COVID-19 Pandemic on 3D ICs Market
- Short Term and Long Term Impact, By Region
- North America
- Europe
- Asia Pacific
- Latin America
- Middle East and Africa
5. Global 3D ICs Market, By End- Use Sectors, 2018-2028 (US$ Billion)
- Introduction
- Market Share Analysis, 2020 and 2028 (%)
- Segment Trends
- Consumer electronics
- Introduction
- Market Size and Forecast, 2021-2028, (US$ Billion)
- Information and communication technology
- Introduction
- Market Size and Forecast, 2021-2028, (US$ Billion)
- Transport (automotive and aerospace)
- Introduction
- Market Size and Forecast, 2021-2028, (US$ Billion)
- Military
- Introduction
- Market Size and Forecast, 2021-2028, (US$ Billion)
- Others (Biomedical applications and R&D)
- Introduction
- Market Size and Forecast, 2021-2028, (US$ Billion)
6. Global 3D ICs Market, By Substrate Type, 2018-2028 (US$ Billion)
- Introduction
- Market Share Analysis, 2020 and 2028 (%)
- Segment Trends
- Silicon on insulator (SOI)
- Introduction
- Market Size and Forecast, 2021-2028, (US$ Billion)
- Bulk silicon
- Introduction
- Market Size and Forecast, 2021-2028, (US$ Billion)
7. Global 3D ICs Market, By Fabrication Process, 2018-2028 (US$ Billion)
- Introduction
- Market Share Analysis, 2020 and 2028 (%)
- Segment Trends
- Beam re-crystallization
- Introduction
- Market Size and Forecast, 2021-2028, (US$ Billion)
- Wafer bonding
- Introduction
- Market Size and Forecast, 2021-2028, (US$ Billion)
- Silicon epitaxial growth
- Introduction
- Market Size and Forecast, 2021-2028, (US$ Billion)
- Solid phase crystallization
- Introduction
- Market Size and Forecast, 2021-2028, (US$ Billion)
8. Global 3D ICs Market, By Process, 2018-2028 (US$ Billion)
- Introduction
- Market Share Analysis, 2020 and 2028 (%)
- Segment Trends
- MEMS and Sensor
- Introduction
- Market Size and Forecast, 2021-2028, (US$ Billion)
- RF SiP
- Introduction
- Market Size and Forecast, 2021-2028, (US$ Billion)
- Optoelectronics and imaging
- Introduction
- Market Size and Forecast, 2021-2028, (US$ Billion)
- Memories (3D Stacks)
- Introduction
- Market Size and Forecast, 2021-2028, (US$ Billion)
- Logic (3D Sip/Soc)
- Introduction
- Market Size and Forecast, 2021-2028, (US$ Billion)
- HB LED
- Introduction
- Market Size and Forecast, 2021-2028, (US$ Billion)
9. Global 3D ICs Market, By Region, 2018-2028 (US$ Billion)
- Introduction
- Market Share Analysis, By Region, 2020 and 2028 (%)
- North America
- Regional Trends
- Market Size and Forecast, By End-Use Sectors, 2021-2028 (US$ Billion)
- Market Size and Forecast, By Substrate Type, 2021-2028 (US$ Billion)
- Market Size and Forecast, By Fabrication Process, 2021-2028 (US$ Billion)
- Market Size and Forecast, By Process, 2021-2028 (US$ Billion)
- Market Share Analysis, By Country, 2020 and 2028 (%)
- Europe
- Regional Trends
- Market Size and Forecast, By End-Use Sectors, 2021-2028 (US$ Billion)
- Market Size and Forecast, By Substrate Type, 2021-2028 (US$ Billion)
- Market Size and Forecast, By Fabrication Process, 2021-2028 (US$ Billion)
- Market Size and Forecast, By Process, 2021-2028 (US$ Billion)
- Market Share Analysis, By Country, 2020 and 2028 (%)
- U.K.
- Germany
- Italy
- France
- Russia
- Rest of Europe
- Asia Pacific
- Regional Trends
- Regional Trends
- Market Size and Forecast, By End-Use Sectors, 2021-2028 (US$ Billion)
- Market Size and Forecast, By Substrate Type, 2021-2028 (US$ Billion)
- Market Size and Forecast, By Fabrication Process, 2021-2028 (US$ Billion)
- Market Size and Forecast, By Process, 2021-2028 (US$ Billion)
- Market Share Analysis, By Country, 2020 and 2028 (%)
- India
- Japan
- ASEAN
- Australia
- South Korea
- Rest of Asia Pacific
- Latin America
- Regional Trends
- Market Size and Forecast, By End-Use Sectors, 2021-2028 (US$ Billion)
- Market Size and Forecast, By Substrate Type, 2021-2028 (US$ Billion)
- Market Size and Forecast, By Fabrication Process, 2021-2028 (US$ Billion)
- Market Size and Forecast, By Process, 2021-2028 (US$ Billion)
- Market Share Analysis, By Country, 2020 and 2028 (%)
- Brazil
- Argentina
- Mexico
- Rest of Latin America
- Middle East and Africa
- Regional Trends
- Market Size and Forecast, By End-Use Sectors, 2021-2028 (US$ Billion)
- Market Size and Forecast, By Substrate Type, 2021-2028 (US$ Billion)
- Market Size and Forecast, By Fabrication Process, 2021-2028 (US$ Billion)
- Market Size and Forecast, By Process, 2021-2028 (US$ Billion)
- Market Share Analysis, By Country, 2020 and 2028 (%)
- GCC Countries
- South Africa
- Rest of the Middle East and Africa
10. Competitive Landscape
- Company Profiles
- Taiwan Semiconductor Manufacturing Company, Ltd
- Company Overview
- Product Portfolio
- Financial Performance
- Key Strategies
- Recent Developments/Updates
- MonolithIC 3D Inc.
- Company Overview
- Product Portfolio
- Financial Performance
- Key Strategies
- Recent Developments/Updates
- XILINX, Inc.
- Company Overview
- Product Portfolio
- Financial Performance
- Key Strategies
- Recent Developments/Updates
- Elpida Memory, Inc.
- Company Overview
- Product Portfolio
- Financial Performance
- Key Strategies
- Recent Developments/Updates
- (Micron Technology, Inc.)
- Company Overview
- Product Portfolio
- Financial Performance
- Key Strategies
- Recent Developments/Updates
- The 3M Company,
- Company Overview
- Product Portfolio
- Financial Performance
- Key Strategies
- Recent Developments/Updates
- Ziptronix, Inc.
- Company Overview
- Product Portfolio
- Financial Performance
- Key Strategies
- Recent Developments/Updates
- STATS ChipPAC Ltd.
- Company Overview
- Product Portfolio
- Financial Performance
- Key Strategies
- Recent Developments/Updates
- United Microelectronics Corporation
- Company Overview
- Product Portfolio
- Financial Performance
- Key Strategies
- Recent Developments/Updates
- Tezzaron Semiconductor Corporation
- Company Overview
- Product Portfolio
- Financial Performance
- Key Strategies
- Recent Developments/Updates
11. Section
- References
- Research Methodology
- About Us and Sales Contact
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