첨단 패키징 시장 규모는 2023년 353억 3,670만 달러에서 예측 기간 동안 5.6%의 CAGR로 성장할 것으로 예상됩니다.
첨단 패키징 시장을 이끄는 주요 요인은 전자 산업의 폭발적인 성장과 웨어러블, 노트북, 데스크톱, 스마트폰, 소형 가제트 등 다양한 CE 제품에 대한 수요 증가입니다.
지역별 전망
아시아태평양은 2022년에 가장 큰 점유율을 차지했으며, 2030년에는 365억 2,858만 달러로 성장할 것으로 예상됩니다. 이 지역에는 많은 반도체 제조 시설이 있기 때문에 이 지역의 시장 점유율은 매우 큽니다. 팹리스 공급업체의 수요 증가에 대응하기 위해 이 지역의 제조업체들은 생산능력을 확대하고 있으며, 중국은 기판 제조 사업을 통합하려고 노력하고 있습니다.
몇 가지 이유로 북미의 첨단 패키징 시장도 크게 성장하고 있습니다. 첫째, 이 시장은 CE 제품에 대한 수요 증가에 직접적인 영향을 받고 있습니다. 사람들은 커뮤니케이션, 레저 및 업무 관련 작업을 위해 전자기기를 점점 더 많이 사용하고 있으며, 이러한 장치의 복잡하고 작은 디자인에 맞는 고급 패키징 솔루션이 요구되고 있습니다. 또한 고급 칩에 대한 수요가 증가함에 따라 시장도 확대되고 있습니다.
유럽의 첨단 패키징 시장은 스마트폰, 전자제품, IoT에 대한 수요 증가로 인해 특히 웨이퍼 레벨 패키징이 빠르게 성장하고 있는 것이 성장의 원동력이 되고 있습니다. 첨단 패키징 공급업체들은 이러한 수요 증가를 충족시키기 위해 첨단 패키징의 총 비용을 낮추고 운영 효율성을 극대화하기 위한 절차 및 계획을 적극적으로 수립하고 있습니다.
세계 첨단 패키징 시장을 조사했으며, 시장의 정의와 개요, 시장 성장에 영향을 미치는 요인과 시장 기회 분석, 시장 규모 추정 및 예측, 각 부문별·지역별·주요 국가별 분석, 경쟁 환경, 주요 기업 개요 등의 정보를 정리하여 전해드립니다.
Global Advanced Packaging Market Research Report Information by Type (Flip Chip Scale Package, Flip Chip Ball Grid Array, Wafer Level Chip Scale Packaging, 5D/3D, Fan Out Wafer-level Packaging and Others), by End-user (Consumer Electronics, Healthcare, Industrial, Aerospace and Defense, Automotive and Other), and by Region (North America, Europe, Asia Pacific, South America, and Middle East & Africa) -Forecast Till 2030
In 2023, the advanced packaging market was estimated to be worth USD 35,336.7 million. Over the course of the projection period, the Advanced Packaging industry is expected to increase at a compound annual growth rate (CAGR) of 5.6%. The collection and linking of Types prior to conventional integrated circuit packaging is known as advanced packaging. Multiple devices can be combined and packed as a single electrical device thanks to advanced packaging. The industrial segment that deals with creating, designing, and producing sophisticated and novel packaging solutions for a range of products is known as the advanced packaging market. Modern packaging methods are used to improve the performance, usefulness, and dependability of packaged items while guaranteeing its preservation, protection, and appearance. The increased need for embedded die packaging can also be attributed to the increasing downsizing of devices and the increasing use of micro-electromechanical systems (MEMS) in manufacturing. Although the technology has been available for some time, its low yields and high costs have restricted its applicability to specialized fields.
As technology develops, producers are moving toward producing small electronic devices for a variety of markets, including consumer electronics, healthcare, automotive, and semiconductor IC manufacture.
The main factors driving the Advanced Packaging Market are the electronics industry's explosive expansion and the rising demand for a range of consumer electronics, including wearables, laptops, desktops, smartphones, and tiny gadgets.
The Flip Chip Scale Package, Flip Chip Ball Grid Array, Wafer Level Chip Scale Packaging, 5D/3D, Fan Out Wafer-level Packaging, and Others are the segments of the Advanced Packaging Market based on type.
The Advanced Packaging Market has been divided into Consumer Electronics, Healthcare, Industrial, Aerospace and Defense, Automotive, and Other segments based on the end-user.
Regional Perspectives
The Asia-Pacific region is predicted to account for the largest share in 2022 and grow to USD 36,528.58 million by 2030. Because there are so many semiconductor production facilities in the Asia-Pacific region, the market share is substantial in that area. In order to fulfill the increased demand from fabless suppliers, manufacturers in this region are expanding their production capacity, and China is attempting to consolidate its substrate manufacturing business.
For several reasons, the advanced packaging market in North America is expanding significantly. First, the market is directly impacted by the growing demand for consumer electronics. People are using electronic gadgets more and more for communication, leisure, and work-related tasks, which means that sophisticated packaging solutions are required to fit the intricate and small designs of these devices. The market is also expanding due to the rising demand for premium chips.
The rapid expansion of the advanced packaging market, especially in wafer level packaging, driven by the rising demand for smartphones, electronics, and the Internet of Things (IoT), is responsible for the growth of the Europe Advanced Packaging Market. Providers of advanced packaging are actively creating procedures and plans to lower the total cost of advanced packaging and guarantee maximum operational effectiveness to satisfy this expanding demand.
South America's market for innovative packaging materials is expanding gradually due to a number of factors. The need for improved packaging solutions is being driven by the rising demand for sophisticated electronic gadgets like wearables, tablets, and smartphones. Advanced packaging technologies enable the production of semiconductor chips that are more compact, powerful, and energy-efficient-all necessary for these devices.
The market for advanced packaging semiconductor materials is expanding significantly in the Middle East and Africa (MEA) region. In order to enable more performance and usefulness in electronic devices, advanced packaging refers to the compact and efficient integration and encapsulation of semiconductor chips.
Principal Players
Amkor Technology Inc., ASE Technology Holding Co. Ltd., China Wafer Level CSP Co. Ltd., ChipMOS Technologies Inc., FlipChip International LLC, HANA Micron Inc., Jiangsu Changjiang Electronics Technology Co. Ltd., King Yuan Electronics Corp., Nepes Corporation, Powertech Technology Inc., and numerous other notable businesses are among those that lead the advanced packaging market.