세계의 첨단 패키징 기술 시장 보고서(2025년)
Advanced Packaging Technologies Global Market Report 2025
상품코드 : 1818777
리서치사 : The Business Research Company
발행일 : On Demand Report
페이지 정보 : 영문 250 Pages
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한글목차

첨단 패키징 기술 시장 규모는 향후 수년간 급성장할 것으로 전망됩니다. 2029년에는 137억 6,000만 달러로 성장할 전망이며, CAGR 14.4%로 성장이 예측됩니다. 예측 기간의 성장은 이기종 통합, 양자 컴퓨팅, 유연하고 스트레처블한 일렉트로닉스, 공급망의 탄력성, 스마트 매뉴팩처링에 기인합니다. 예측 기간 주요 동향에는 첨단 상호 연결 기술, 팬아웃 웨이퍼 레벨 패키징, 시스템 임패키징, 열 관리 솔루션, IoT 디바이스용 임베디드 패키징 등이 포함됩니다.

향후 5년간의 성장률 14.4%라고 하는 예측은 이 시장 전회 예측으로부터 0.5%라고 하는 소폭의 감소를 반영하고 있습니다. 이 감소는 주로 미국과 타국가 간 관세의 영향 때문입니다. 이는 주로 일본과 네덜란드에서 수입되는 반도체 패키징 재료의 비용 상승을 통해 미국에 직접 영향을 미치고 칩 생산의 확장성을 늦출 가능성이 높습니다. 또한 상호 관세와 무역 긴장 증가 및 제한으로 인한 세계 경제와 무역에 대한 악영향으로 그 영향이 더 광범위하게 늘어날 것으로 보입니다.

소비자용 전자기기에 대한 수요 증가가 향후 첨단 패키징 시장의 성장을 견인할 것으로 예측됩니다. 가전 기기에는 소비자가 비상업적 또는 전문적 목적으로 정기적으로 구매하고 사용하도록 설계된 모든 전자기기, 가젯 및 장비가 포함됩니다. 소비자용 전자기기의 고도화로 첨단 패키징의 요구가 생겨 제품의 프레젠테이션에 큰 영향을 미칩니다. 예를 들어 2023년 5월 일본 업계 단체인 전자정보기술 산업협회는 일본 전자기기 생산량이 77만 1,457대에 달했다고 보고했습니다. 또한 가전제품 생산량은 2022년 5월 2만 5,268대에서 2023년 5월 3만 2,099대로 증가했습니다. 이와 같이 소비자용 전자기기 수요 증가는 첨단 패키징 시장의 성장을 뒷받침하고 있습니다.

목차

제1장 주요 요약

제2장 시장 특징

제3장 시장 동향 및 전략

제4장 시장 : 거시경제 시나리오 금리, 인플레이션, 지정학, 무역전쟁 및 관세, 그리고 코로나 및 회복이 시장에 미치는 영향을 포함한 거시경제 시나리오

제5장 세계의 성장 분석 및 전략 분석 프레임워크

제6장 시장 세분화

제7장 지역별 및 국가별 분석

제8장 아시아태평양 시장

제9장 중국 시장

제10장 인도 시장

제11장 일본 시장

제12장 호주 시장

제13장 인도네시아 시장

제14장 한국 시장

제15장 서유럽 시장

제16장 영국 시장

제17장 독일 시장

제18장 프랑스 시장

제19장 이탈리아 시장

제20장 스페인 시장

제21장 동유럽 시장

제22장 러시아 시장

제23장 북미 시장

제24장 미국 시장

제25장 캐나다 시장

제26장 남미 시장

제27장 브라질 시장

제28장 중동 시장

제29장 아프리카 시장

제30장 경쟁 구도 및 기업 프로파일

제31장 기타 주요 기업 및 혁신 기업

제32장 세계 시장 경쟁 벤치마킹 및 대시보드

제33장 주요 인수합병(M&A)

제34장 최근 시장 동향

제35장 시장의 잠재력이 높은 국가, 부문 및 전략

제36장 부록

AJY
영문 목차

영문목차

Advanced packaging technologies encompass the methodologies associated with aggregating and interconnecting components prior to conventional electronic packaging processes. These technologies facilitate the encapsulation of integrated circuits within a protective casing, shielding metallic parts from corrosion and physical damage.

The primary types of advanced packaging technologies comprise 3D integrated circuits, 2D integrated circuits, 2.5D integrated circuits, and other related methods. 3D integrated circuits, in particular, offer attributes such as high bandwidth, compact form factors, and comprehensive multi-function integration within packaging. Three-Dimensional Integrated Circuit (3DIC) technology involves vertically stacking homogeneous or heterogeneous dies into Multi-Chip Modules (MCM) utilizing Through-Silicon-Via (TSV) connections. These advancements enable enhanced performance and efficiency. Various product categories arising from these technologies include active packaging, smart and intelligent packaging, and they find applications across multiple industries such as automotive and transport, consumer electronics, industrial sectors, IT and telecommunications, and other diverse verticals.

Note that the outlook for this market is being affected by rapid changes in trade relations and tariffs globally. The report will be updated prior to delivery to reflect the latest status, including revised forecasts and quantified impact analysis. The report's Recommendations and Conclusions sections will be updated to give strategies for entities dealing with the fast-moving international environment.

The rapid escalation of U.S. tariffs and rising trade tensions in spring 2025 are having a substantial impact on the machinery sector, driving up the costs of essential components such as steel, hydraulic systems, and precision bearings many of which are sourced from regions affected by the tariffs. Manufacturers of construction, agricultural, and industrial machinery are now facing tighter profit margins, as existing long-term contracts limit their ability to raise prices immediately. This climate of uncertainty has also led to postponed investments in automation and smart machinery, slowing potential productivity improvements. In response, companies are focusing on developing local suppliers, redesigning products to incorporate alternative materials, and adopting predictive maintenance strategies to extend equipment life and reduce the need for costly replacements.

The advanced packaging technologies market research report is one of a series of new reports from The Business Research Company that provides advanced packaging technologies market statistics, including advanced packaging technologies industry global market size, regional shares, competitors with a advanced packaging technologies market share, detailed advanced packaging technologies market segments, market trends and opportunities, and any further data you may need to thrive in the advanced packaging technologies industry. This advanced packaging technologies market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.

The advanced packaging technologies market size has grown rapidly in recent years. It will grow from $7.24 billion in 2024 to $8.03 billion in 2025 at a compound annual growth rate (CAGR) of 10.9%. The growth in the historic period can be attributed to consumer electronics growth, mobile computing, enhanced thermal management, automotive electronics, environmental considerations.

The advanced packaging technologies market size is expected to see rapid growth in the next few years. It will grow to $13.76 billion in 2029 at a compound annual growth rate (CAGR) of 14.4%. The growth in the forecast period can be attributed to heterogeneous integration, quantum computing, flexible and stretchable electronics, supply chain resilience, smart manufacturing. Major trends in the forecast period include advanced interconnect technologies, fan-out wafer-level packaging, system-in-package, thermal management solutions, embedded packaging for IoT devices.

The forecast of 14.4% growth over the next five years reflects a modest reduction of 0.5% from the previous estimate for this market. This reduction is primarily due to the impact of tariffs between the US and other countries. This is likely to directly affect the US through increased costs for semiconductor packaging materials, primarily imported from Japan and the Netherlands, delaying chip production scalability. The effect will also be felt more widely due to reciprocal tariffs and the negative effect on the global economy and trade due to increased trade tensions and restrictions.

The increasing demand for consumer electronics is anticipated to drive growth in the advanced packaging market in the future. Consumer electronics encompass any electronic devices, gadgets, or equipment designed for regular purchase and use by consumers for non-commercial or professional purposes. The sophistication of consumer electronics creates a need for advanced packaging, which significantly impacts product presentation. For instance, in May 2023, the Japan Electronics and Information Technology Industries Association, a trade association based in Japan, reported that Japan's electronic equipment output reached 771,457 units. Additionally, consumer electronics production rose to 32,099 units in May 2023, up from 25,268 units in May 2022. Thus, the increasing demand for consumer electronics is fueling the growth of the advanced packaging market.

The growing number of data centers is expected to boost the advanced packaging technologies market in the coming years. A data center is a centralized facility that houses computing and telecommunications resources for storing, processing, managing, and disseminating vast amounts of data. Advanced packaging technologies in data centers improve efficiency by enabling higher integration density, better thermal management, and enhanced semiconductor component performance, thereby contributing to the overall scalability and effectiveness of data processing systems. For example, in September 2024, the National Telecommunications and Information Administration, a U.S. government agency, indicated that the United States has around 5,000 data centers, with domestic demand projected to increase by approximately nine percent annually through 2030. Therefore, the expanding number of data centers is propelling the growth of the advanced packaging technologies market.

Major companies in the advanced packaging technologies sector are concentrating on creating technological solutions to enhance their leadership in semiconductor solutions. These technological solutions involve utilizing innovative methods, materials, and equipment to boost packaging efficiency, product protection, and functionality, often incorporating smart features, automation, or improved sustainability. For example, in October 2023, ASE Group, a semiconductor engineering firm based in Taiwan, introduced the Integrated Design Ecosystem, which allows for silicon package design efficiencies and reduces cycle time by half. This ecosystem fosters collaboration and optimization in the design process, enabling faster iterations and better performance in advanced packaging solutions. This advancement aligns with the growing demand for high-density packaging in areas such as artificial intelligence (AI), high-performance computing, and data centers.

Major companies within the advanced packaging technologies market are increasingly prioritizing the introduction of high-performance glass substrates as a strategic move to gain a competitive edge. Glass substrates refer to flat, rigid sheets or panels made of glass that function as a foundational base for various electronic devices, displays, sensors, or technologies requiring a smooth and transparent surface. In a notable example, in June 2023, Intel Corporation, a prominent US-based technology company, unveiled glass substrates designed for advanced packaging, aiming to secure several advantages. These glass substrates exhibit the capability to withstand higher temperatures, present a 50% reduction in pattern distortion, and possess ultra-low flatness for improved depth of focus. When compared to organic substrates, glass offers superior properties, including ultra-low flatness and enhanced thermal and mechanical characteristics, resulting in a significantly higher interconnect density within a substrate. This strategic focus on high-performance glass substrates highlights the companies' commitment to innovation and gaining a competitive advantage in the advanced packaging technologies market.

In November 2022, Lam Research Corporation, a semiconductor company headquartered in the US, completed the acquisition of Semsysco GmbH for an undisclosed sum. This acquisition is poised to facilitate Lam Research Corporation's expansion of its advanced packaging capabilities, with a specific focus on enhancing solutions for cutting-edge logic chips and chipset-based offerings tailored for high-performance computing (HPC), artificial intelligence (AI), and various data-intensive applications. Semsysco GmbH, based in Austria, specializes in manufacturing advanced plastic packaging products, adding complementary expertise to Lam Research's portfolio in this domain.

Major companies operating in the advanced packaging technologies market include Samsung Electronics, Taiwan Semiconductor Manufacturing Company, Intel Corporation, International Business Machines, Qualcomm Technologies, Advanced Semiconductor Engineering (ASE), ASE Technology Holding Co. Ltd., Texas Instruments, Shin-Etsu Chemical Co. Ltd., Renesas Electronics Corporation, GlobalFoundries Inc., Sanmina Corporation, Amkor Technology, Jiangsu Changjiang Electronics Technology, STATS ChipPAC, Tongfu Microelectronics, Powertech Technology, ChipMOS Technologies Inc., United Test and Assembly Center Holdings Ltd., Unisem (M) Berhad., Greatek Electronics, Nepes Corporation, SFA Semicon, SUSS Microtec, China WLCSP Co. LTD., Universal Instruments Corporation, Brewer Science, Chipbond Technology Corporation, Deca Technologies, Siliconware Precision Industries, Lam Research Corporation, Toshiba Electronic Devices & Storage Corporation, King Yuan Electronics Co. Ltd., Semiconductor Manufacturing International Corporation, Jiangsu Changjiang Electronics Technology Co. Ltd., Hana Micron Inc., IBIDEN Engineering CO. LTD., Aehr Test Systems

Asia-Pacific was the largest region in global advanced packaging technologies market in 2024. The regions covered in the advanced packaging technologies market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

The countries covered in the advanced packaging technologies market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The advanced packaging technologies market consists of revenues earned by entities by providing packaging services such as fan-out wafer-level packaging and system-in-package used during the process. The market value includes the value of related goods sold by the service provider or included within the service offering. The advanced packaging technologies market also includes sales of image sensor, microelectronics, complementary metal oxide semiconductor, light-emitting diode, design package, external cavity, ultraviolet light, and others which are used in providing packaging services. Values in this market are 'factory gate' values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

Advanced Packaging Technologies Global Market Report 2025 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.

This report focuses on advanced packaging technologies market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.

Reasons to Purchase

Where is the largest and fastest growing market for advanced packaging technologies ? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward, including technological disruption, regulatory shifts, and changing consumer preferences? The advanced packaging technologies market global report from the Business Research Company answers all these questions and many more.

The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.

The forecasts are made after considering the major factors currently impacting the market. These include the technological advancements such as AI and automation, Russia-Ukraine war, trade tariffs (government-imposed import/export duties), elevated inflation and interest rates.

Scope

Table of Contents

1. Executive Summary

2. Advanced Packaging Technologies Market Characteristics

3. Advanced Packaging Technologies Market Trends And Strategies

4. Advanced Packaging Technologies Market - Macro Economic Scenario Macro Economic Scenario Including The Impact Of Interest Rates, Inflation, Geopolitics, Trade Wars and Tariffs, And Covid And Recovery On The Market

5. Global Advanced Packaging Technologies Growth Analysis And Strategic Analysis Framework

6. Advanced Packaging Technologies Market Segmentation

7. Advanced Packaging Technologies Market Regional And Country Analysis

8. Asia-Pacific Advanced Packaging Technologies Market

9. China Advanced Packaging Technologies Market

10. India Advanced Packaging Technologies Market

11. Japan Advanced Packaging Technologies Market

12. Australia Advanced Packaging Technologies Market

13. Indonesia Advanced Packaging Technologies Market

14. South Korea Advanced Packaging Technologies Market

15. Western Europe Advanced Packaging Technologies Market

16. UK Advanced Packaging Technologies Market

17. Germany Advanced Packaging Technologies Market

18. France Advanced Packaging Technologies Market

19. Italy Advanced Packaging Technologies Market

20. Spain Advanced Packaging Technologies Market

21. Eastern Europe Advanced Packaging Technologies Market

22. Russia Advanced Packaging Technologies Market

23. North America Advanced Packaging Technologies Market

24. USA Advanced Packaging Technologies Market

25. Canada Advanced Packaging Technologies Market

26. South America Advanced Packaging Technologies Market

27. Brazil Advanced Packaging Technologies Market

28. Middle East Advanced Packaging Technologies Market

29. Africa Advanced Packaging Technologies Market

30. Advanced Packaging Technologies Market Competitive Landscape And Company Profiles

31. Advanced Packaging Technologies Market Other Major And Innovative Companies

32. Global Advanced Packaging Technologies Market Competitive Benchmarking And Dashboard

33. Key Mergers And Acquisitions In The Advanced Packaging Technologies Market

34. Recent Developments In The Advanced Packaging Technologies Market

35. Advanced Packaging Technologies Market High Potential Countries, Segments and Strategies

36. Appendix

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