세계의 반도체 제조 장비 시장 예측(-2029년) : 프론트엔드 장비별, 백엔드 장비별, 제품 유형별, 디멘션별, 공급망 참여 기업별, 지역별

Semiconductor Manufacturing Equipment Market by Lithography, Wafer Surface Conditioning, Etching, CMP, Deposition, Wafer Cleaning, Assembly & Packaging, Dicing, Bonding, Metrology, Wafer/IC Testing, Logic, Memory, MPU, Discrete - Global Forecast to 2029

US $ 4,950 ￦ 7,184,000

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한글목차

반도체 제조 장비 시장 규모는 예측 기간 중 7.3%의 CAGR로 확대하며, 2024년 1,092억 4,000만 달러에서 2029년에는 1,550억 9,000만 달러에 달할 것으로 예측됩니다.

시장 성장을 촉진하는 주요 요인은 반도체 제조 설비의 확대, 자동차용 반도체 시장의 급성장, 고효율 칩에 대한 수요 증가입니다. 또한 첨단 포장 기술의 발전과 국내 반도체 산업에 대한 정부의 지원 증가는 시장 진출기업에게 새로운 성장 수단이 되고 있습니다. 팹센터내 대규모 확장, 클라우드 컴퓨팅에 대한 의존도 증가, 전기자동차 및 커넥티드카로의 구성 변화가 반도체 제조 장비 시장을 구성하고 있습니다. 이 모든 것은 에너지 효율적인 제조, 첨단 반도체 제조 장비의 발전, 더 작은 칩으로 인한 더 많은 압력에 의해 지원되고 있습니다. 이는 기술 혁신과 생산 규모 확대를 촉진하고 있으며, 그 결과 다른 산업 분야에서도 반도체 제조 장비의 사용이 증가하고 있습니다.

조사 범위
조사 대상연도	2020-2029년
기준연도	2023년
예측 기간	2024-2029년
검토 단위	금액(10억 달러)
부문별	프론트엔드 장비별, 백엔드 장비별, 제품 유형별, 디멘션별, 공급망 참여 기업별, 지역별
대상 지역	북미, 유럽, 아시아태평양, 기타 지역

EUV 기술의 발전과 과제 대응을 위한 고정밀 장비에 대한 투자 증가가 반도체 제조 장비 전 공정 장비 시장에서 리소그래피 분야의 주요 촉진요인이 되어 큰 점유율을 차지하고 있습니다. 리소그래피는 실리콘 웨이퍼 위에 미세한 회로 패턴을 미세한 해상도로 패터닝하는 주요 반도체 제조 공정 중 하나입니다. 이 공정에서는 빛이나 전자빔을 사용하여 웨이퍼 표면에 IC 레이아웃을 배치하여 극히 미세한 특징을 모방합니다. 이 기술, 특히 EUV 리소그래피의 발전은 더 작고 고성능의 칩을 제조할 수 있는 길을 제공하고 있으며, ASML(네덜란드)과 같은 회사는 EUV 리소그래피를 사용하고 있습니다. 이는 더 짧은 파장의 빛을 사용하는 공정으로 최대 5nm의 특징을 제조할 수 있습니다.

반도체 제조 장비 시장에서 본딩 분야는 정밀한 반도체 디바이스에 대한 요구가 증가하고 수율과 생산 효율이 높은 공정에 대한 요구가 증가함에 따라 가장 높은 성장세를 보일 것으로 예상됩니다. 본딩 장비는 반도체 소자가 작동할 수 있도록 반도체 다이와 그 패키지 또는 기판 사이에 전기적 상호 연결을 형성할 때 필요합니다. 일반적으로 사용되는 기술에는 와이어 본딩, 볼 본딩, 솔더 범프 본딩 등이 있습니다. 적절한 본딩 기술에 따라 반도체 제조 공정의 성능이나 비용 효율성이 크게 달라질 수 있습니다. 첨단 반도체 패키징 기술의 발전과 비용 효율적이고 신뢰성이 높은 자동차 부품 및 가전 부품 수요가 본딩 장비 수요를 견인하고 있습니다.

아시아태평양은 가장 높은 CAGR을 나타낼 것으로 예상됩니다. 이 지역은 중국, 일본, 일본, 대만, 한국 등 주요 국가에서 주요 반도체 제조 장비 공급업체가 가장 많이 진출해 있으며, 이 지역의 반도체 생산 및 기술 혁신에서 우위를 점하고 있습니다. 이 지역은 첨단 생산 능력을 갖추고 있으며, 가전제품 부문도 잘 발달되어 있습니다. 또한 정부 구상 증가, 끊임없는 기술 발전, 국내외 기업의 대규모 투자가 이루어지고 있습니다. 가전, 자동차, 통신 분야의 반도체 수요 증가가 성장 확대에 기여하고 있습니다. 혁신적인 문화와 인프라 개척에 주력하고 있는 것도 이 지역이 세계 시장에서 경쟁력을 갖출 수 있는 원동력이 되고 있습니다. 높은 성장은 인공지능(Al), 사물인터넷(IoT), 5G의 기술 발전에 기인합니다. 이 지역은 가전제품 제조가 활발하고, 전자기기 및 전기자동차 수요가 높은 것이 특징이며, 기본적으로 신뢰성과 성능이 높은 반도체 제조 장비에 대한 니즈가 높을 것으로 예상됩니다.

세계의 반도체 제조 장비 시장에 대해 조사했으며, 프론트엔드 장비별, 백엔드 장비별, 제품 유형별, 디멘션별, 공급망 참여 기업별, 지역별 동향 및 시장에 참여하는 기업의 개요 등을 정리하여 전해드립니다.

목차

제1장 서론

제2장 조사 방법

제3장 개요

제4장 주요 인사이트

제5장 시장 개요

• 서론
• 시장 역학
• 밸류체인 분석
• 에코시스템 분석
• 투자와 자금조달 시나리오
• 고객 비즈니스에 영향을 미치는 동향과 혼란
• 기술 분석
• 가격 분석
• 주요 이해관계자와 구입 기준
• Porter's Five Forces 분석
• 사례 연구 분석
• 무역 분석
• 특허 분석
• 규제 상황
• 2025-2026년의 주요 컨퍼런스와 이벤트
• AI/생성형 AI가 반도체 제조 장비 시장에 미치는 영향
• 반도체 제조 장비 시장 참여 기업의 제조 설비에서 사용되는 커넥터

제6장 반도체 제조 장비 시장(프론트엔드 장비별)

• 서론
• 리소그래피
• 웨이퍼 표면 처리
• 웨이퍼 세정
• 증착
• 기타

제7장 반도체 제조 장비 시장(백엔드 장비별)

• 서론
• 조립과 포장
• 다이싱
• 계측
• 본딩
• 웨이퍼 테스트/IC 테스트

제8장 반도체 제조 장비에 사용되는 제조 설비

• 서론
• 자동화
• 화학제품
• 가스 제어
• 기타

제9장 반도체 제조 장비 시장(제품 유형별)

• 서론
• 메모리
• 로직
• MPU
• 디스크리트
• 아날로그
• 기타

제10장 반도체 제조 장비 시장(디멘션별)

• 서론
• 2D ICS
• 2.5D ICS
• 3D ICS

제11장 반도체 제조 장비 시장(공급망 참여 기업별)

• 서론
• 주조
• IDM 기업
• OSAT 기업

제12장 반도체 제조 장비 시장(지역별)

• 서론
• 아메리카
  • 북미의 거시경제 전망
  • 미국
  • 캐나다
  • 기타
• 유럽, 중동 및 아프리카(EMEA)
  • EMEA 거시경제 전망
  • 독일
  • 영국
  • 아일랜드
  • 프랑스
  • 이탈리아
  • 네덜란드
  • EMEA
• 아시아태평양
  • 아시아태평양의 거시경제 전망
  • 중국
  • 일본
  • 한국
  • 대만
  • 기타

제13장 경쟁 구도

• 개요
• 주요 참여 기업의 전략/강점, 2020-2025년
• 시장 점유율 분석, 2023년
• 매출 분석, 2019-2023년
• 기업 가치 평가와 재무 지표
• 기업 평가 매트릭스 : 주요 참여 기업, 2023년
• 기업 평가 매트릭스 : 스타트업/중소기업, 2023년
• 브랜드/제품 비교
• 경쟁 시나리오와 동향
• 상위 5사 지불자 시설 개요

제14장 기업 개요

• 서론
• 주요 참여 기업
  • APPLIED MATERIALS, INC.
  • ASML
  • TOKYO ELECTRON LIMITED
  • LAM RESEARCH CORPORATION
  • KLA CORPORATION
  • SCREEN HOLDINGS CO., LTD.
  • TERADYNE, INC.
  • ADVANTEST CORPORATION
  • HITACHI HIGH-TECH CORPORATION
  • PLASMA-THERM
• 기타 기업
  • ASM INTERNATIONAL N.V.
  • EV GROUP(EVG)
  • ONTO INNOVATION
  • NORDSON CORPORATION
  • ADT
  • BENEQ
  • CVD EQUIPMENT CORPORATION
  • EUGENE TECHNOLOGY CO. LTD.
  • NIKON CORPORATION
  • SEMICONDUCTOR EQUIPMENT CORP.
  • SENTECH INSTRUMENTS GMBH
  • CANON INC.
  • KOKUSAI ELECTRIC CORPORATION
  • SEMES
  • FORMFACTOR

제15장 부록

KSA

영문 목차

영문목차

The semiconductor manufacturing equipment market is projected to reach USD 155.09 billion by 2029 from USD 109.24 billion in 2024 at a CAGR of 7.3% during the forecast period. The major factors driving the growth of the market are expansion of semiconductor fabrication facilities, surge in automotive semiconductor market, and increasing demand for advanced and efficient chips. Further, advancements in advanced packaging technologies and increasing government support for domestic semiconductor industry are some new growth avenues for market participants. Large-scale expansions within fab centers, the dependence of rising cloud computing and change to electric, connected vehicle configurations make up the semiconductor manufacturing equipment market. All this is backed by much energy-efficient manufacture, advance regarding advanced semiconductor manufacturing facilities, and more pressure from smaller chips. It inspires innovation and scaling of production, resulting in increased usage of semiconductor manufacturing equipment in other industries as well.

Scope of the Report
Years Considered for the Study	2020-2029
Base Year	2023
Forecast Period	2024-2029
Units Considered	Value (USD Billion)
Segments	By Front-end Equipment, Back-end Equipment, Product Type, Dimension, Supply Chain Participants, and Region
Regions covered	North America, Europe, APAC, RoW

"Lithography to register the largest market share in semiconductor manufacturing front-end equipment segment during the forecast period."

Advances in EUV technology and increasing investment in high-precision equipment for handling the challenges will be key drivers of the lithography segment in the front-end equipment market of semiconductor manufacturing equipment, accounting for a significant share. Lithography is one of the principal semiconductor fabrication processes of patterning intricate circuit patterns at microscopic resolution on silicon wafers. This step places the IC layout onto the surface of the wafer with light or electron beams imitating extremely minute features. Advances in the technology, most specifically in EUV lithography, provide a pathway to fabricate chips that are smaller and more powerful. Companies such as ASML (Netherlands) use EUV lithography, a process employing shorter wavelengths of light to fabricate features down to 5nm.

"Bonding to account for the highest CAGR in back-end equipment segment during the forecast period."

The bonding segment of the semiconductor manufacturing equipment market is expected to grow the most due to the increasing requirement for the precise semiconductor devices and for the processes of high yield and efficiency of production. Bonding equipment is needed in the formation of electrical interconnections between semiconductor dies and their packages or substrates so that semiconductor devices can function. Some generally used techniques include wire bonding, ball bonding, and solder bump bonding. The right bonding technology will make all the difference in either performance or cost-effectiveness in the semiconductor manufacturing process. Growth in the development of advanced semiconductor packaging technology and demand for cost-effective, high-reliability automotive and consumer-electronics components are driving demand for bonding equipment.

"Asia Pacific to register the fastest growth during the forecast period."

The highest CAGR is expected to be registered in the Asia Pacific region, which has the highest presence of leading semiconductor manufacturing equipment providers in key countries such as China, Japan, Taiwan, and South Korea, that ascertain dominance in semiconductor production and innovation in this region. The region has advanced production capabilities and a substantial consumer electronics sector. In addition, the growing government initiatives, the relentless advances in technology, and the substantial investments of local and international players. The increasing semiconductor need across consumer electronics, automotive, and telecommunications contribute to increasing growth. The concentration on innovative culture and infrastructure development is also a driving factor in the region's competitive position in the global market. The high growth is attributed to technological advancements in artificial intelligence (Al), Internet of Things (IoT), and 5G. The region is characterized with the robust manufacturing of consumer electronics and high demand for electronic appliances and electric vehicles, which basically calls for a huge need for a reliable as well as performance semiconductor manufacturing equipment.

The break-up of the profile of primary participants in the semiconductor manufacturing equipment market-

• By Company Type: Tier 1 - 25%, Tier 2 - 35%, Tier 3 - 40%
• By Designation Type: C Level - 40%, Director Level - 30%, Others - 30%
• By Region Type: Asia Pacific - 45%, Americas - 35%, Europe, Middle East & Africa - 20%

The major players in the semiconductor manufacturing equipment market with a significant global presence include Applied Materials, Inc. (US), ASML (Netherlands), Tokyo Electron Limited (Japan), Lam Research Corporation (US), KLA Corporation (US), and others.

Research Coverage

The report segments the semiconductor manufacturing equipment market and forecasts its size by front-end equipment, back-end equipment, product type, dimension, supply chain participant, and region. It also provides a comprehensive review of drivers, restraints, opportunities, and challenges influencing market growth. The report covers qualitative aspects in addition to quantitative aspects of the market.

Reasons to buy the report:

The report will help the market leaders/new entrants in this market with information on the closest approximate revenues for the overall semiconductor manufacturing equipment market and related segments. This report will help stakeholders understand the competitive landscape and gain more insights to strengthen their position in the market and plan suitable go-to-market strategies. The report also helps stakeholders understand the pulse of the market and provides them with information on key market drivers, restraints, opportunities, and challenges.

The report provides insights on the following pointers:

• Analysis of key drivers (expansion of semiconductor fabrication facilities, surge in automotive semiconductor market, and increased demand for advanced and efficient chips), restraints (high capital investment requirements and complexity of manufacturing processes), opportunities (expansion of advanced packaging technologies and government support for domestic semiconductor industry), and challenges (rapid pace of technological advancements and environmental and regulatory compliance in manufacturing)
• Product Development/Innovation: Detailed insights on upcoming technologies, research & development activities, and new solution and service launches in the semiconductor manufacturing equipment market.
• Market Development: Comprehensive information about lucrative markets - the report analyses the semiconductor manufacturing equipment market across varied regions.
• Market Diversification: Exhaustive information about new solutions and services, untapped geographies, recent developments, and investments in the semiconductor manufacturing equipment market.
• Competitive Assessment: In-depth assessment of market shares, growth strategies, and solution and service offerings of leading players, including Applied Materials, Inc. (US), ASML (Netherlands), Tokyo Electron Limited (Japan), Lam Research Corporation (US), and KLA Corporation (US).

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 STUDY OBJECTIVES
• 1.2 MARKET DEFINITION
  • 1.2.1 INCLUSIONS AND EXCLUSIONS
• 1.3 STUDY SCOPE
  • 1.3.1 MARKETS COVERED AND REGIONAL SCOPE
  • 1.3.2 YEARS CONSIDERED
• 1.4 CURRENCY CONSIDERED
• 1.5 UNIT CONSIDERED
• 1.6 STAKEHOLDERS

2 RESEARCH METHODOLOGY

• 2.1 RESEARCH DATA
  • 2.1.1 SECONDARY DATA
    • 2.1.1.1 Secondary sources
    • 2.1.1.2 Key data from secondary sources
  • 2.1.2 PRIMARY DATA
    • 2.1.2.1 List of primary participants
    • 2.1.2.2 Breakdown of primary interviews
    • 2.1.2.3 Key data from primary sources
  • 2.1.3 SECONDARY AND PRIMARY RESEARCH
    • 2.1.3.1 Key industry insights
• 2.2 MARKET SIZE ESTIMATION
  • 2.2.1 BOTTOM-UP APPROACH
  • 2.2.2 TOP-DOWN APPROACH
• 2.3 FACTOR ANALYSIS
  • 2.3.1 DEMAND-SIDE ANALYSIS
  • 2.3.2 SUPPLY-SIDE ANALYSIS
• 2.4 DATA TRIANGULATION
• 2.5 RESEARCH ASSUMPTIONS
• 2.6 RESEARCH LIMITATIONS
• 2.7 RISK ASSESSMENT

3 EXECUTIVE SUMMARY

4 PREMIUM INSIGHTS

• 4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET
• 4.2 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY FRONT-END EQUIPMENT
• 4.3 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY BACK-END EQUIPMENT
• 4.4 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY PRODUCT TYPE
• 4.5 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY DIMENSION
• 4.6 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT
• 4.7 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION
• 4.8 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY COUNTRY

5 MARKET OVERVIEW

• 5.1 INTRODUCTION
• 5.2 MARKET DYNAMICS
  • 5.2.1 DRIVERS
    • 5.2.1.1 Expansion of semiconductor fabrication facilities
    • 5.2.1.2 Surge in automotive semiconductor market
    • 5.2.1.3 Increasing demand for advanced and efficient chips
  • 5.2.2 RESTRAINTS
    • 5.2.2.1 High capital investment requirements
    • 5.2.2.2 Complexity of manufacturing processes
  • 5.2.3 OPPORTUNITIES
    • 5.2.3.1 Expansion of advanced packaging technologies
    • 5.2.3.2 Government support for domestic semiconductor industry
  • 5.2.4 CHALLENGES
    • 5.2.4.1 Rapid pace of technological advancements
    • 5.2.4.2 Environmental and regulatory compliance in manufacturing
• 5.3 VALUE CHAIN ANALYSIS
• 5.4 ECOSYSTEM ANALYSIS
• 5.5 INVESTMENT AND FUNDING SCENARIO
• 5.6 TRENDS AND DISRUPTIONS IMPACTING CUSTOMER BUSINESS
• 5.7 TECHNOLOGY ANALYSIS
  • 5.7.1 KEY TECHNOLOGIES
    • 5.7.1.1 Wafer Bonding
  • 5.7.2 COMPLEMENTARY TECHNOLOGIES
    • 5.7.2.1 Flip Chip
  • 5.7.3 ADJACENT TECHNOLOGIES
    • 5.7.3.1 3D Stacking
• 5.8 PRICING ANALYSIS
  • 5.8.1 AVERAGE SELLING PRICE OF PRODUCTS OFFERED BY KEY PLAYERS
  • 5.8.2 AVERAGE SELLING PRICE, BY REGION
• 5.9 KEY STAKEHOLDERS AND BUYING CRITERIA
  • 5.9.1 KEY STAKEHOLDERS IN BUYING PROCESS
  • 5.9.2 BUYING CRITERIA
• 5.10 PORTER'S FIVE FORCES ANALYSIS
  • 5.10.1 THREAT OF NEW ENTRANTS
  • 5.10.2 THREAT OF SUBSTITUTES
  • 5.10.3 BARGAINING POWER OF SUPPLIERS
  • 5.10.4 BARGAINING POWER OF BUYERS
  • 5.10.5 INTENSITY OF COMPETITIVE RIVALRY
• 5.11 CASE STUDY ANALYSIS
  • 5.11.1 ENHANCING LED MANUFACTURING THROUGH ELMO'S ADVANCED MOTION CONTROL SOLUTIONS
  • 5.11.2 SYNOVA SA ADDRESSES CHALLENGES AND SOLUTIONS IN ADVANCED DIE SINGULATION AND WAFER DICING WITH LMJ TECHNOLOGY
  • 5.11.3 OPTIMIZING PHOTORESISTS FOR ADVANCED LITHOGRAPHY TECHNIQUES
• 5.12 TRADE ANALYSIS
  • 5.12.1 IMPORT SCENARIO (HS CODE 848620)
  • 5.12.2 EXPORT SCENARIO (HS CODE 848620)
• 5.13 PATENT ANALYSIS
• 5.14 REGULATORY LANDSCAPE
  • 5.14.1 STANDARDS
    • 5.14.1.1 47 CFR 15
    • 5.14.1.2 NAICS code 334413
    • 5.14.1.3 29 CFR 1910
    • 5.14.1.4 SEMI E6, E76, F5, F14, S6, S1, S10, S12, S13, S14, S18, and S22
    • 5.14.1.5 IEC 60204-33:2009
• 5.15 KEY CONFERENCES AND EVENTS, 2025-2026
• 5.16 IMPACT OF AI/GEN AI ON SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET
• 5.17 CONNECTORS USED IN MANUFACTURING FACILITIES OF SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET PLAYERS
  • 5.17.1 METRIC CIRCULAR
  • 5.17.2 CPC, RECTANGULAR
  • 5.17.3 D-SUB
  • 5.17.4 OVERMOLDED ASSEMBLIES
  • 5.17.5 CABLE HARNESS
  • 5.17.6 OTHER DEVICES

6 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY FRONT-END EQUIPMENT

• 6.1 INTRODUCTION
• 6.2 LITHOGRAPHY
  • 6.2.1 PHOTOLITHOGRAPHY
    • 6.2.1.1 Deep ultraviolet (DUV) lithography
    • 6.2.1.2 Extreme ultraviolet (EUV) lithography
  • 6.2.2 ELECTRON BEAM LITHOGRAPHY
  • 6.2.3 ION BEAM LITHOGRAPHY
  • 6.2.4 NANOIMPRINT LITHOGRAPHY
  • 6.2.5 OTHERS
• 6.3 WAFER SURFACE CONDITIONING
  • 6.3.1 ETCHING
    • 6.3.1.1 Advancements in dry etching technologies to drive market growth
  • 6.3.2 CHEMICAL MECHANICAL PLANARIZATION (CMP)
    • 6.3.2.1 Demand for high-performance devices driving market growth
• 6.4 WAFER CLEANING
  • 6.4.1 DEMAND FOR HIGH-PERFORMANCE AND RELIABLE SEMICONDUCTOR DEVICES TO FUEL MARKET GROWTH
• 6.5 DEPOSITION
  • 6.5.1 ADVANCEMENTS IN DEPOSITION PROCESSES TO DRIVE MARKET GROWTH
• 6.6 OTHER FRONT-END EQUIPMENT

7 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY BACK-END EQUIPMENT

• 7.1 INTRODUCTION
• 7.2 ASSEMBLY & PACKAGING
  • 7.2.1 ADVANCEMENTS IN PACKAGING TECHNOLOGIES TO DRIVE MARKET GROWTH
• 7.3 DICING
  • 7.3.1 INCREASING NEED FOR HIGH-PRECESSION SEMICONDUCTOR DEVICES TO SPUR MARKET DEMAND
• 7.4 METROLOGY
  • 7.4.1 NEED FOR PRECISION MEASUREMENT AND ADVANCED DETECTION TO FUEL MARKET GROWTH
• 7.5 BONDING
  • 7.5.1 RISING DEMAND FOR ADVANCED SEMICONDUCTOR PACKAGING TECHNOLOGY TO DRIVE MARKET GROWTH
• 7.6 WAFER TESTING/IC TESTING
  • 7.6.1 ADVANCEMENTS IN TESTING TECHNOLOGIES BOOSTING SEMICONDUCTOR RELIABILITY AND MARKET GROWTH

8 FAB FACILITY EQUIPMENT USED IN SEMICONDUCTOR MANUFACTURING EQUIPMENT

• 8.1 INTRODUCTION
• 8.2 AUTOMATION
• 8.3 CHEMICAL
• 8.4 GAS CONTROL
• 8.5 OTHER FAB FACILITY EQUIPMENT

9 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY PRODUCT TYPE

• 9.1 INTRODUCTION
• 9.2 MEMORY
  • 9.2.1 RISING DEMAND FOR HIGH-CAPACITY STORAGE AND ADVANCED PACKAGING TO ACCELERATE MARKET GROWTH
• 9.3 LOGIC
  • 9.3.1 DEMAND FOR HIGH-PERFORMANCE COMPUTING TO DRIVE MARKET GROWTH
• 9.4 MPU
  • 9.4.1 ADVANCEMENTS IN CLOUD COMPUTING AND EDGE COMPUTING TECHNOLOGIES TO DRIVE MARKET GROWTH
• 9.5 DISCRETE
  • 9.5.1 RISING DEMAND FOR DISCRETE DEVICES IN AUTOMOTIVE AND ENERGY SECTORS TO DRIVE MARKET GROWTH
• 9.6 ANALOG
  • 9.6.1 RISING ADOPTION OF IOT DEVICES TO FUEL MARKET GROWTH
• 9.7 OTHERS
  • 9.7.1 SENSORS
    • 9.7.1.1 Increased adoption of interconnected devices to drive market growth
  • 9.7.2 OPTOELECTRONIC COMPONENTS
    • 9.7.2.1 Adoption of advanced display technologies to fuel market growth

10 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY DIMENSION

• 10.1 INTRODUCTION
• 10.2 2D ICS
  • 10.2.1 HIGH-DENSITY INTEGRATION IN CONSUMER ELECTRONICS TO FOSTER MARKET GROWTH
• 10.3 2.5D ICS
  • 10.3.1 NEED FOR COST-EFFECTIVE, HIGH-PERFORMANCE SOLUTIONS TO SPUR MARKET DEMAND
• 10.4 3D ICS
  • 10.4.1 NEED FOR INTEGRATING DIVERSE FUNCTIONALITIES IN COMPACT FORM FACTOR TO FUEL MARKET GROWTH

11 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY SUPPLY CHAIN PARTICIPANT

• 11.1 INTRODUCTION
• 11.2 FOUNDRIES
  • 11.2.1 RISING DEMAND FOR ADVANCED SEMICONDUCTORS AND COST-EFFECTIVE MANUFACTURING TO DRIVE FOUNDRY GROWTH
• 11.3 IDM FIRMS
  • 11.3.1 VERTICAL INTEGRATION AND ADVANCED MANUFACTURING CAPABILITIES TO DRIVE MARKET GROWTH
• 11.4 OSAT COMPANIES
  • 11.4.1 ADVANCEMENTS IN PACKAGING TECHNOLOGIES AND OUTSOURCING TO FUEL MARKET GROWTH

12 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET, BY REGION

• 12.1 INTRODUCTION
• 12.2 AMERICAS
  • 12.2.1 MACROECONOMIC OUTLOOK FOR NORTH AMERICA
  • 12.2.2 US
    • 12.2.2.1 Government initiatives and adoption of advanced technologies to accelerate market growth
  • 12.2.3 CANADA
    • 12.2.3.1 Strategic innovation and collaboration to create growth opportunities
  • 12.2.4 REST OF AMERICAS
    • 12.2.4.1 Technological advancements in emerging economies to boost market growth
• 12.3 EUROPE, MIDDLE EAST & AFRICA (EMEA)
  • 12.3.1 MACROECONOMIC OUTLOOK FOR EMEA
  • 12.3.2 GERMANY
    • 12.3.2.1 Advanced technological infrastructure and Industry 4.0 to support market growth
  • 12.3.3 UK
    • 12.3.3.1 Strategic innovation and investment to propel market growth
  • 12.3.4 IRELAND
    • 12.3.4.1 Presence of fabrication facilities to contribute to market growth
  • 12.3.5 FRANCE
    • 12.3.5.1 Strong R&D focus and government initiatives to contribute to market growth
  • 12.3.6 ITALY
    • 12.3.6.1 Rising demand in automotive, consumer electronics, and industrial sectors to drive market
  • 12.3.7 NETHERLANDS
    • 12.3.7.1 Strategic R&D investments to propel market growth
  • 12.3.8 REST OF EMEA
• 12.4 ASIA PACIFIC
  • 12.4.1 MACROECONOMIC OUTLOOK FOR ASIA PACIFIC
  • 12.4.2 CHINA
    • 12.4.2.1 Advanced manufacturing capabilities and supportive environment for innovation to accelerate market growth
  • 12.4.3 JAPAN
    • 12.4.3.1 Demand for advanced semiconductor manufacturing technologies in automotive sector to augment market growth
  • 12.4.4 SOUTH KOREA
    • 12.4.4.1 Strong manufacturing capabilities of major companies to create opportunities
  • 12.4.5 TAIWAN
    • 12.4.5.1 Investments in advanced manufacturing technologies to fuel market growth
  • 12.4.6 REST OF ASIA PACIFIC

13 COMPETITIVE LANDSCAPE

• 13.1 OVERVIEW
• 13.2 KEY PLAYER STRATEGIES/RIGHT TO WIN, 2020-2025
• 13.3 MARKET SHARE ANALYSIS, 2023
• 13.4 REVENUE ANALYSIS, 2019-2023
• 13.5 COMPANY VALUATION AND FINANCIAL METRICS
• 13.6 COMPANY EVALUATION MATRIX: KEY PLAYERS, 2023
  • 13.6.1 STARS
  • 13.6.2 EMERGING LEADERS
  • 13.6.3 PERVASIVE PLAYERS
  • 13.6.4 PARTICIPANTS
  • 13.6.5 COMPANY FOOTPRINT: KEY PLAYERS, 2023
    • 13.6.5.1 Company footprint
    • 13.6.5.2 Front-end equipment footprint
    • 13.6.5.3 Back-end equipment footprint
    • 13.6.5.4 Product type footprint
    • 13.6.5.5 Dimension footprint
    • 13.6.5.6 Supply chain participant footprint
    • 13.6.5.7 Region footprint
• 13.7 COMPANY EVALUATION MATRIX: STARTUPS/SMES, 2023
  • 13.7.1 PROGRESSIVE COMPANIES
  • 13.7.2 RESPONSIVE COMPANIES
  • 13.7.3 DYNAMIC COMPANIES
  • 13.7.4 STARTING BLOCKS
  • 13.7.5 COMPETITIVE BENCHMARKING: STARTUPS/SMES, 2023
    • 13.7.5.1 List of startups/SMEs
    • 13.7.5.2 Competitive benchmarking of startups/SMEs
• 13.8 BRAND/PRODUCT COMPARISON
• 13.9 COMPETITIVE SCENARIO AND TRENDS
  • 13.9.1 PRODUCT LAUNCHES
  • 13.9.2 DEALS
  • 13.9.3 EXPANSIONS
• 13.10 FACILITY OVERVIEW OF TOP 5 PAYERS

14 COMPANY PROFILES

• 14.1 INTRODUCTION
• 14.2 KEY PLAYERS
  • 14.2.1 APPLIED MATERIALS, INC.
    • 14.2.1.1 Business overview
    • 14.2.1.2 Products/Solutions/Services offered
    • 14.2.1.3 Recent developments
      • 14.2.1.3.1 Product/Service launches
      • 14.2.1.3.2 Deals
      • 14.2.1.3.3 Expansions
    • 14.2.1.4 MnM view
      • 14.2.1.4.1 Key strengths/Right to win
      • 14.2.1.4.2 Strategic choices
      • 14.2.1.4.3 Weaknesses and competitive threats
  • 14.2.2 ASML
    • 14.2.2.1 Business overview
    • 14.2.2.2 Products/Solutions/Services offered
    • 14.2.2.3 Recent developments
      • 14.2.2.3.1 Product/Solution/Service launches
      • 14.2.2.3.2 Deals
      • 14.2.2.3.3 Expansions
    • 14.2.2.4 MnM view
      • 14.2.2.4.1 Key strengths/Right to win
      • 14.2.2.4.2 Strategic choices
      • 14.2.2.4.3 Weaknesses and competitive threats
  • 14.2.3 TOKYO ELECTRON LIMITED
    • 14.2.3.1 Business overview
    • 14.2.3.2 Products/Solutions/Services offered
    • 14.2.3.3 Recent developments
      • 14.2.3.3.1 Product/Solution/Service launches
      • 14.2.3.3.2 Deals
      • 14.2.3.3.3 Expansions
    • 14.2.3.4 MnM view
      • 14.2.3.4.1 Key strengths/Right to win
      • 14.2.3.4.2 Strategic Choices
      • 14.2.3.4.3 Weaknesses and competitive threats
  • 14.2.4 LAM RESEARCH CORPORATION
    • 14.2.4.1 Business overview
    • 14.2.4.2 Products/Solutions/Services offered
    • 14.2.4.3 Recent developments
      • 14.2.4.3.1 Product/Solution/Service launches
      • 14.2.4.3.2 Deals
      • 14.2.4.3.3 Expansions
    • 14.2.4.4 MnM view
      • 14.2.4.4.1 Key strengths/Right to win
      • 14.2.4.4.2 Strategic choices
      • 14.2.4.4.3 Weaknesses and competitive threats
  • 14.2.5 KLA CORPORATION
    • 14.2.5.1 Business overview
    • 14.2.5.2 Products/Solutions/Services offered
    • 14.2.5.3 Recent developments
      • 14.2.5.3.1 Product/Service launches
      • 14.2.5.3.2 Expansions
    • 14.2.5.4 MnM view
      • 14.2.5.4.1 Key strengths/Right to win
      • 14.2.5.4.2 Strategic choices
      • 14.2.5.4.3 Weaknesses and competitive threats
  • 14.2.6 SCREEN HOLDINGS CO., LTD.
    • 14.2.6.1 Business overview
    • 14.2.6.2 Products/Solutions/Services offered
    • 14.2.6.3 Recent developments
      • 14.2.6.3.1 Product/Service launches
      • 14.2.6.3.2 Deals
      • 14.2.6.3.3 Expansions
  • 14.2.7 TERADYNE, INC.
    • 14.2.7.1 Business overview
    • 14.2.7.2 Products/Solutions/Services offered
    • 14.2.7.3 Recent developments
      • 14.2.7.3.1 Product/Service launches
      • 14.2.7.3.2 Deals
  • 14.2.8 ADVANTEST CORPORATION
    • 14.2.8.1 Business overview
    • 14.2.8.2 Products/Solutions/Services offered
    • 14.2.8.3 Recent developments
      • 14.2.8.3.1 Product/Service launches
      • 14.2.8.3.2 Deals
  • 14.2.9 HITACHI HIGH-TECH CORPORATION
    • 14.2.9.1 Business overview
    • 14.2.9.2 Products/Solutions/Services offered
    • 14.2.9.3 Recent developments
      • 14.2.9.3.1 Product/Service launches
      • 14.2.9.3.2 Deals
      • 14.2.9.3.3 Expansions
  • 14.2.10 PLASMA-THERM
    • 14.2.10.1 Business overview
    • 14.2.10.2 Products/Solutions/Services offered
    • 14.2.10.3 Recent developments
      • 14.2.10.3.1 Product/Service launches
      • 14.2.10.3.2 Deals
      • 14.2.10.3.3 Expansions
• 14.3 OTHER PLAYERS
  • 14.3.1 ASM INTERNATIONAL N.V.
  • 14.3.2 EV GROUP (EVG)
  • 14.3.3 ONTO INNOVATION
  • 14.3.4 NORDSON CORPORATION
  • 14.3.5 ADT
  • 14.3.6 BENEQ
  • 14.3.7 CVD EQUIPMENT CORPORATION
  • 14.3.8 EUGENE TECHNOLOGY CO. LTD.
  • 14.3.9 NIKON CORPORATION
  • 14.3.10 SEMICONDUCTOR EQUIPMENT CORP.
  • 14.3.11 SENTECH INSTRUMENTS GMBH
  • 14.3.12 CANON INC.
  • 14.3.13 KOKUSAI ELECTRIC CORPORATION
  • 14.3.14 SEMES
  • 14.3.15 FORMFACTOR

15 APPENDIX

• 15.1 INSIGHTS FROM INDUSTRY EXPERTS
• 15.2 DISCUSSION GUIDE
• 15.3 KNOWLEDGESTORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
• 15.4 CUSTOMIZATION OPTIONS
• 15.5 RELATED REPORTS
• 15.6 AUTHOR DETAILS

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