세계의 내방사선성 일렉트로닉스 시장 예측(-2029년) : 컴포넌트(믹스드 시그널 IC, 프로세서 및 컨트롤러, 메모리, 전원 관리), 제조 기술(RHBD, RHBP), 제품 유형, 용도, 지역별

Radiation Hardened Electronics Market by Component (Mixed Signal ICs, Processors & Controllers, Memory, Power Management), Manufacturing Techniques (RHBD, RHBP), Product Type, Application and Geography - Global Forecast to 2029

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한글목차

내방사선성 일렉트로닉스 시장 규모는 예측 기간 중 4.8%의 CAGR로 추이하며, 2024년 17억 달러에서 2029년에는 21억 달러 규모로 성장할 것으로 예측됩니다.

내방사선성 일렉트로닉스의 수요는 우주 용도, 정부의 구상, 기술의 진보에 의해 증가하고 있습니다.

조사 범위
조사 대상년	2020-2029년
기준년	2023년
예측 기간	2024-2029년
단위	금액(달러)
부문별	컴포넌트·제조 기술·제품 유형·용도·지역별
대상 지역	아시아태평양·북미·유럽·기타 지역

컴포넌트별로는 메모리 부문이 2029년까지 최대의 CAGR로 성장할 전망 :

우주선 및 핵무기 등의 중요 용도에 사용되는 메모리 제품은 반도체 부품이 받는 총전리 선량(TID)을 저감하기 위해 내방사선성이 필요합니다. 항공우주 분야의 연산 집약적인 용도에서는 다양한 프로세서 노드 및 센서에서 발생하는 대량의 데이터를 처리하기 위해 고밀도, 고성능의 내방사선 메모리 솔루션에 대한 요구가 증가하고 있습니다.

용도별로는 우주 용도가 예측 기간 중 최대 점유율을 차지할 전망 :

내방사선 일렉트로닉스는 다양한 우주 용도에서 가혹한 환경을 극복하고, 신뢰성 높은 동작을 보증하기 위해 특별히 설계되고 있습니다. 인공위성을 관리하는 온보드 컴퓨터의 핵심부터 로켓을 조종하는 유도 시스템까지 이 견고한 컴포넌트는 놀랍도록 다양한 작업에 전력을 공급합니다. 이 부품들은 통신, 연료 효율성, 과학 데이터 수집, 그리고 먼 행성 표면에서 복잡한 로봇 조종에 이르기까지 다양한 작업을 수행합니다.

북미 지역이 2029년까지 최대의 시장 규모를 차지할 전망 :

북미 지역은 2023년에 최대 점유율을 차지했습니다. 이 분야의 지속적인 기술 발전, 다양한 정부 우주 기관의 존재, 이 지역의 주요 진출기업의 존재와 같은 요인은 이 지역의 방사선 내성 전자제품의 성장 잠재력을 촉진하고 있습니다. 또한 미국 정부는 방사선 내성 전자제품 제조에 대한 지속적인 노력을 기울이고 있습니다.

세계의 내방사선성 일렉트로닉스 시장을 조사했으며, 시장 개요, 시장 영향요인 및 시장 기회의 분석, 기술·특허의 동향, 법규제 환경, 시장 규모의 추이·예측, 각종 구분·지역별 상세 분석, 경쟁 구도, 주요 기업의 개요 등을 정리하여 전해드립니다.

목차

제1장 서론

제2장 조사 방법

제3장 주요 요약

제4장 중요 인사이트

제5장 시장 개요

• 진화 : 내방사선성 일렉트로닉스 시장
• 시장 역학
  • 촉진요인
  • 억제요인
  • 기회
  • 과제
• 고객에게 영향을 미치는 동향/디스럽션
• 가격 분석
• 공급망/밸류체인 분석
• 에코시스템/시장 맵
• 투자와 자금조달 시나리오
• 기술 분석
• Porter's Five Forces 분석
• 주요 이해관계자와 구입 기준
• 사례 연구 분석
• 무역 분석
• 특허 분석
• 주요 컨퍼런스와 이벤트
• 규제 상황

제6장 내방사선성 일렉트로닉스 시장에서 재료 선택과 포장 유형

• 재료 선택
  • 규소
  • 탄화규소(SIC)
  • 질화갈륨(GAN)
  • 갈륨 비소(GAAS)
• 포장 유형
  • 플립칩
  • 세라믹 패키지

제7장 내방사선성 일렉트로닉스 시장 : 컴포넌트별

• 믹스드 시그널 ICS
  • RAD-HARD A/D·D/A컨버터
  • 멀티플렉서·저항기
• 프로세서 컨트롤러
  • 마이크로프로세서 유닛(MPUS)
  • 마이크로컨트롤러 유닛(MCUS)
  • 특정 용도용 집적회로(ASICS)
  • FPGAS
• 메모리
  • 휘발성 메모리
  • 비휘발성 메모리
• 파워 관리
  • MOSFET
  • 다이오드
  • 사이리스터
  • IGBT
• 기타(정성적)

제8장 내방사선성 일렉트로닉스 시장 : 제조 기술별

• RHBD(RADIATION-HARDENING BY DESIGN)
  • TOTAL IONIZING DOSE(TID)
  • SINGLE EVENT EFFECT(SEE)
• RHBP(RADIATION-HARDENING BY PROCESS)
  • SOI(SILICON ON INSULATOR)
  • SOS(SILICON ON SAPPHIRE)
• RHBS(RADIATION HARDENING BY SOFTWARE)(정성적)

제9장 내방사선성 일렉트로닉스 시장 : 제품 유형별

• 시판품(COTS)
• 커스텀 메이드

제10장 내방사선성 일렉트로닉스 시장 : 용도별

• 우주
  • 상용
  • 군
• 항공우주·방위
  • 무기·미사일
  • 차량/아비오닉스
• 원자력발전소
• 의료
  • 삽입형 의료기기
  • 방사선
• 기타

제11장 지역 분석

• 북미
• 유럽
• 아시아태평양
• 기타 지역

제12장 경쟁 구도

• 주요 기업의 전략
• 시장 매출 분석
• 시장 점유율 분석
• 내방사선성 일렉트로닉스 시장에서 평가와 재무 지표
• 브랜드/제품의 비교 분석
• 기업 평가 매트릭스
• 내방사선성 일렉트로닉스 시장 : 기업 발자국(15사)
• 스타트업/중소기업 평가 쿼드런트
• 경쟁 벤치마킹
• 경쟁 시나리오와 동향

제13장 기업 개요

• 주요 기업
  • MICROCHIP TECHNOLOGY INC.
  • BAE SYSTEMS
  • RENESAS ELECTRONICS CORPORATION
  • INFINEON TECHNOLOGIES AG
  • STMICROELECTRONICS
  • ADVANCED MICRO DEVICES, INC(AMD)
  • TEXAS INSTRUMENTS INCORPORATED
  • HONEYWELL INTERNATIONAL INC.
  • TELEDYNE TECHNOLOGIES INC.
  • TTM TECHNOLOGIES, INC.
• 기타 기업
  • COBHAM LIMITED
  • ANALOG DEVICES, INC
  • DATA DEVICE CORPORATION
  • 3D PLUS
  • MERCURY SYSTEMS, INC.
  • PCB PIEZOTRONICS, INC.
  • VORAGO TECHNOLOGIES
  • MICROPAC INDUSTRIES, INC.
  • GSI TECHNOLOGY, INC.
  • EVERSPIN TECHNOLOGIES INC
  • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC(ON SEMICONDUCTOR)
  • AITECH
  • MICROELECTRONICS RESEARCH DEVELOPMENT CORPORATION
  • SPACE MICRO INC
  • TRIAD SEMICONDUCTOR

제14장 부록

KSA

영문 목차

영문목차

The radiation-hardened electronics market is expected to grow from USD 1.7 billion in 2024 to USD 2.1 billion by 2029, at a CAGR of 4.8% during the forecast period. The demand for radiation-hardened electronics is increasing due to space applications, government initiatives, and technological advancements.

Scope of the Report
Years Considered for the Study	2020-2029
Base Year	2023
Forecast Period	2024-2029
Units Considered	Value (USD Billion)
Segments	By Component, Manufacturing Techniques, Product Type, Application and Geography
Regions covered	Asia Pacific, North America, Europe, and Rest of the World

"Memory component is expected to grow at higher CAGR from 2024 to 2029".

Memory in the component segment is expected to grow at the fastest CAGR during the forecast period. A memory device is a hardware component that retains data, enabling communication or functionality. The memory products used for critical applications such as spacecraft and nuclear weapons need to be radiation-hardened to reduce the total ionizing dose (TID) received by the semiconductor components. Compute-intensive applications in the aerospace and space sector are increasingly demanding radiation-hardened memory solutions with high density and performance to handle large quantities of data obtained from various processor nodes and sensors.

"Space application is expected to grow with the largest market share during the forecast period"

Radiation-hardened electronics are specifically designed to weather the storm and ensure reliable operation across diverse space applications. From the beating heart of onboard computers managing satellites to the guidance systems steering rockets, these robust components power a remarkable range of tasks. They handle communication, fuel efficiency, scientific data collection, and even complex robotic maneuvers on distant planetary surfaces.

"Radiation hardened electronics market in North American region to register largest market size from 2024 to 2029."

North America accounted for the largest share of the radiation-hardened electronics market in 2023. Factors such as continuous technological advancements in this field, the presence of various government-owned space organizations, and a majority of the key market players in the region are driving the growth potential for radiation-hardened electronics in the region. The US government is continuously making working on capabilities in the manufacture of radiation-hardened electronics.

Breakdown of primaries

In the process of determining and verifying the market size for several segments and subsegments gathered through secondary research, extensive primary interviews have been conducted with key industry experts in the radiation-hardened electronics market space. The break-up of primary participants for the radiation hardened electronics market has been shown below:

• By Company Type: Tier 1 - 40%, Tier 2 - 30%, and Tier 3 - 30%
• By Designation: C-level Executives - 40%, Directors - 40%, and Others - 20%
• By Region: North America -40%, Europe - 30%, Asia Pacific- 20%, and Rest of the World - 10%

Key players in the radiation-hardened electronics market are Microchip Technology Inc.(US), BAE Systems (UK), Renesas Electronics Corporation (Japan), Infineon Technologies AG (Germany), STMicroelectronics (Switzerland), AMD (US), Texas Instruments Incorporated (US), Honeywell International Inc. (US), Teledyne Technologies Inc. (US), and TTM Technologies, Inc. (US). SMEs/startups covered in the study are Cobham Limited (UK), Analog Devices, Inc (US), Data Devices Corporation (US), 3D Plus (France), Mercury Systems, Inc. (US), PCB Piezotronics, Inc (US), Vorago (US), Micropac Industries, Inc (US), GSI technology, Inc (US), Everspin Technologies Inc (US), Semiconductor Components Industries, LLC (US), AiTech (US), Microelectronics Research Development Corporation (US), Space Micro, Inc (US), and Triad Semiconductor ( US).

Research Coverage:

The report describes detailed information regarding the key factors such as drivers, restraints, challenges, and opportunities influencing the growth of the radiation-hardened electronics market. It also includes informations like technology trends, trade data, and patent analysis. This research report categorizes the radiation-hardened electronics market based on components, manufacturing techniques, product type, and region. A detailed analysis of the major industry players was carried out to provide insights into their business overviews, products offered, major strategies adopted that include new product launches, deals (acquisitions, partnerships, agreements, and contracts), and others (expansions), and recession impact on the radiation-hardened electronics market.

Reasons to Buy This Report

The report will help the market leaders/new entrants in the market with information on the closest approximations of the revenue for the overall radiation-hardened electronics market and the subsegments. The report will help stakeholders understand the competitive landscape and gain more insight to position their business better and plan suitable go-to-market strategies. The report also helps stakeholders understand the market's pulse and provides information on key drivers, restraints, opportunities, and challenges.

The report will provide insights into the following pointers:

• Analysis of key drivers (Increasing use of radiation-hardened electronics in space applications), restraints (Difficulty in creating real testing environment), opportunities (Favorable government initiatives and increasing space missions), and challenges (Customization required for high-end consumers)
• Product development /Innovation: Detailed insights on growing technologies, research and development activities, and new product and service launches in the radiation-hardened electronics market.
• Market Development: Comprehensive information about adjacent markets; the report analyses the radiation-hardened electronics market across various geographies.
• Market Diversification: Exhaustive information about new products and services, untapped geographies, recent developments, and investments in the radiation-hardened electronics market.
• Competitive Assessment: In-depth assessment of market share, growth strategies, and services, offering of leading players Microchip Technology Inc.(US), BAE Systems (UK), Renesas Electronics Corporation (Japan), Infineon Technologies AG (Germany), STMicroelectronics (Switzerland), among others in the radiation-hardened electronics market.

TABLE OF CONTENTS

1 INTRODUCTION

• 1.1 STUDY OBJECTIVES
• 1.2 MARKET DEFINITION
  • 1.2.1 MARKETS COVERED
  • FIGURE 1 MARKET SEGMENTATION
• 1.3 REGIONAL SCOPE
  • 1.3.1 YEARS CONSIDERED
  • 1.3.2 INCLUSIONS AND EXCLUSIONS
• 1.4 CURRENCY
• 1.5 STAKEHOLDERS
• 1.6 SUMMARY OF CHANGES
• 1.7 LIMITATIONS
• 1.8 RECESSION IMPACT

2 RESEARCH METHODOLOGY

• 2.1 RESEARCH DATA
  • FIGURE 2 PROCESS FLOW: RADIATION-HARDENED ELECTRONICS MARKET ESTIMATION
  • FIGURE 3 RESEARCH DESIGN
  • 2.1.1 SECONDARY AND PRIMARY RESEARCH
    • 2.1.1.1 Key industry insights
  • 2.1.2 SECONDARY DATA
    • 2.1.2.1 List of key secondary sources
    • 2.1.2.2 Key data from secondary sources
  • 2.1.3 PRIMARY DATA
    • 2.1.3.1 Breakdown of primaries
    • 2.1.3.2 Key data from primary sources
• 2.2 MARKET SIZE ESTIMATION
  • 2.2.1 BOTTOM-UP APPROACH
    • 2.2.1.1 Approach to obtain market size using bottom-up analysis (demand side)
  • FIGURE 4 MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH
  • 2.2.2 TOP-DOWN APPROACH
    • 2.2.2.1 Approach to capture market size using top-down analysis
  • FIGURE 5 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH
• 2.3 DATA TRIANGULATION
  • FIGURE 6 DATA TRIANGULATION
• 2.4 RESEARCH ASSUMPTIONS
• 2.5 LIMITATIONS
• 2.6 RISK ASSESSMENT
• 2.7 APPROACH TO ANALYZE IMPACT OF RECESSION ON RADIATION-HARDENED ELECTRONICS MARKET

3 EXECUTIVE SUMMARY

• 3.1 RADIATION-HARDENED ELECTRONICS MARKET: RECESSION IMPACT
  • FIGURE 7 RECESSION IMPACT ON RADIATION-HARDENED ELECTRONICS MARKET, 2020-2029 (USD MILLION)
  • FIGURE 8 POWER MANAGEMENT SEGMENT TO ACCOUNT FOR LARGEST SHARE, BY COMPONENT, DURING FORECAST PERIOD
  • FIGURE 9 RADIATION-HARDENED BY DESIGN - FASTEST SEGMENT DURING FORECAST PERIOD
  • FIGURE 10 SPACE APPLICATION TO GROW AT HIGHEST CAGR IN RADIATION-HARDENED ELECTRONICS MARKET FROM 2024 TO 2029
  • FIGURE 11 NORTH AMERICA ACCOUNTED FOR LARGEST MARKET SHARE IN 2023

4 PREMIUM INSIGHTS

• 4.1 ATTRACTIVE GROWTH OPPORTUNITIES IN RADIATION-HARDENED ELECTRONICS MARKET
  • FIGURE 12 INCREASING DEMAND FOR RADIATION-HARDENED ELECTRONICS IN COMMERCIAL SATELLITES EXPECTED TO PROPEL MARKET GROWTH
• 4.2 RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT
  • FIGURE 13 POWER MANAGEMENT SEGMENT TO ACCOUNT FOR LARGEST SHARE FROM 2024 TO 2029
• 4.3 RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE
  • FIGURE 14 RADIATION-HARDENED BY DESIGN SEGMENT TO DOMINATE MARKET FROM 2024 TO 2029
• 4.4 RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE
  • FIGURE 15 COTS SEGMENT TO LEAD MARKET WITH MAJOR SHARE THROUGH 2029
• 4.5 RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION
  • FIGURE 16 SPACE SEGMENT TO COMMAND LARGEST SHARE OF RADIATION-HARDENED ELECTRONICS MARKET IN 2024
• 4.6 RADIATION-HARDENED ELECTRONICS MARKET, BY COUNTRY AND REGION
  • FIGURE 17 RADIATION-HARDENED ELECTRONICS MARKET IN CHINA TO GROW AT HIGHEST CAGR FROM 2024 TO2029

5 MARKET OVERVIEW

• 5.1 INTRODUCTION
• 5.2 EVOLUTION: RADIATION-HARDENED ELECTRONICS MARKET
  • FIGURE 18 EVOLUTION OF RADIATION-HARDENED ELECTRONICS TECHNOLOGY
• 5.3 MARKET DYNAMICS
  • FIGURE 19 DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES: RADIATION-HARDENED ELECTRONICS MARKET
  • 5.3.1 DRIVERS
  • FIGURE 20 DRIVERS FOR RADIATION-HARDENED ELECTRONICS MARKET AND THEIR IMPACT
    • 5.3.1.1 Rising intelligence, surveillance, and reconnaissance (ISR) activities
    • 5.3.1.2 Technology advancements in multicore processors used for military and space applications
    • 5.3.1.3 Increasing demand for use in commercial satellites
    • 5.3.1.4 Proliferation of electronic systems that can withstand severe nuclear environments
  • 5.3.2 RESTRAINTS
  • FIGURE 21 RESTRAINTS IN RADIATION-HARDENED ELECTRONICS MARKET AND THEIR IMPACT
    • 5.3.2.1 Difficulties in creating real testing environments
    • 5.3.2.2 High costs associated with development of radiation-hardened products
  • 5.3.3 OPPORTUNITIES
  • FIGURE 22 OPPORTUNITIES IN RADIATION-HARDENED ELECTRONICS MARKET AND THEIR IMPACT
    • 5.3.3.1 Increasing space missions globally
    • 5.3.3.2 Demand for reconfigurable radiation-hardened electronics
    • 5.3.3.3 Rising demand for commercial-off-the-shelf components in space satellites
  • 5.3.4 CHALLENGES
  • FIGURE 23 CHALLENGES IN RADIATION-HARDENED ELECTRONICS MARKET AND THEIR IMPACT
    • 5.3.4.1 Customization requirements from high-end consumers
• 5.4 TRENDS/DISRUPTIONS IMPACTING CUSTOMERS
  • FIGURE 24 REVENUE SHIFT FOR RADIATION-HARDENED ELECTRONICS
• 5.5 PRICING ANALYSIS
  • 5.5.1 AVERAGE SELLING PRICE OF POWER MANAGEMENT PRODUCTS
  • FIGURE 25 AVERAGE SELLING PRICE OF POWER MANAGEMENT PRODUCTS
  • 5.5.2 POWER MANAGEMENT
  • TABLE 1 AVERAGE SELLING PRICE ANALYSIS OF KEY PLAYERS
  • 5.5.3 MIXED SIGNAL ICS
  • TABLE 2 AVERAGE SELLING PRICE OF A/D & D/A CONVERTERS
  • 5.5.4 PROCESSORS & CONTROLLERS
  • TABLE 3 AVERAGE SELLING PRICE OF PROCESSORS & CONTROLLERS
  • 5.5.5 MEMORY
  • TABLE 4 AVERAGE SELLING PRICE OF MEMORY PRODUCTS
• 5.6 SUPPLY/VALUE CHAIN ANALYSIS
  • FIGURE 26 VALUE CHAIN ANALYSIS: MAJOR VALUE ADDED DURING MANUFACTURING, FABRICATION & PACKAGING AND INTERFACING & SOFTWARE DEVELOPMENT
• 5.7 ECOSYSTEM/MARKET MAP
  • FIGURE 27 RADIATION-HARDENED ELECTRONICS MARKET: ECOSYSTEM
  • TABLE 5 RADIATION-HARDENED ELECTRONICS MARKET: ECOSYSTEM
• 5.8 INVESTMENT AND FUNDING SCENARIO
  • FIGURE 28 FUNDS AUTHORIZED BY COMPANIES IN RADIATION-HARDENED ELECTRONICS MARKET
• 5.9 TECHNOLOGY ANALYSIS
  • 5.9.1 DEVELOPMENT OF PLASTIC PACKAGING FOR SPACE-GRADE ELECTRONICS
  • 5.9.2 SMART CHIPSETS FOR SATELLITES
  • 5.9.3 ADVANCED PACKAGING OF SPACE ELECTRONICS
• 5.10 PORTER'S FIVE FORCES ANALYSIS
  • TABLE 6 RADIATION-HARDENED ELECTRONICS MARKET: PORTER'S FIVE FORCES ANALYSIS
  • 5.10.1 INTENSITY OF COMPETITIVE RIVALRY
  • 5.10.2 BARGAINING POWER OF SUPPLIERS
  • 5.10.3 BARGAINING POWER OF BUYERS
  • 5.10.4 THREAT OF SUBSTITUTES
  • 5.10.5 THREAT OF NEW ENTRANTS
• 5.11 KEY STAKEHOLDERS & BUYING CRITERIA
  • 5.11.1 KEY STAKEHOLDERS IN BUYING PROCESS
  • FIGURE 29 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP THREE INDUSTRIES
  • TABLE 7 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP THREE INDUSTRIES
  • 5.11.2 BUYING CRITERIA
  • FIGURE 30 KEY BUYING CRITERIA FOR TOP THREE INDUSTRIES
  • TABLE 8 KEY BUYING CRITERIA FOR TOP THREE INDUSTRIES
• 5.12 CASE STUDY ANALYSIS
  • TABLE 9 ASSESSMENT OF 90 MM PROCESS HARDENING TECHNIQUE
  • TABLE 10 ASSESSMENT OF 4MBIT MRAM DEVICE IN SATELLITES
  • TABLE 11 ASSESSMENT OF RADIATION-HARDENED BY DESIGN MICROELECTRONICS
  • TABLE 12 ASSESSMENT OF ARM MCUS FOR SPACE CONDITIONS
  • TABLE 13 ASSESSMENT OF SSDS FOR LOW EARTH ORBIT SATELLITES
• 5.13 TRADE ANALYSIS
  • 5.13.1 IMPORT SCENARIO
  • FIGURE 31 IMPORTS, BY KEY COUNTRY, 2019-2022 (USD THOUSAND)
  • 5.13.2 EXPORT SCENARIO
  • FIGURE 32 EXPORTS, BY KEY COUNTRY, 2019-2022 (USD THOUSAND)
• 5.14 PATENT ANALYSIS
  • FIGURE 33 TOP 10 COMPANIES WITH HIGHEST NUMBER OF PATENT APPLICATIONS IN LAST 10 YEARS
  • TABLE 14 TOP 20 PATENT OWNERS IN LAST 10 YEARS
  • FIGURE 34 NUMBER OF PATENTS GRANTED PER YEAR FROM 2013 TO 2023
  • TABLE 15 LIST OF MAJOR PATENTS
• 5.15 KEY CONFERENCES & EVENTS DURING 2024-2025
  • TABLE 16 RADIATION-HARDENED ELECTRONICS MARKET: CONFERENCES & EVENTS
• 5.16 REGULATORY LANDSCAPE
  • 5.16.1 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
  • TABLE 17 NORTH AMERICA: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
  • TABLE 18 EUROPE: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
  • TABLE 19 ASIA PACIFIC: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
  • TABLE 20 REST OF THE WORLD: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
  • 5.16.2 STANDARDS AND REGULATIONS RELATED TO MARKET
    • 5.16.2.1 North America
      • 5.16.2.1.1 US
        • 5.16.2.1.1.1 MIL-STD-750D
        • 5.16.2.1.1.2 MIL-STD-750F
        • 5.16.2.1.1.3 Radiation Hardness Assurance SSB1_005
        • 5.16.2.1.1.4 MIL-STD-975M (NASA)
      • 5.16.2.1.2 Canada
        • 5.16.2.1.2.1 Radiation Emitting Devices Regulations (C.R.C., c. 1370)
    • 5.16.2.2 Europe
      • 5.16.2.2.1 ECSS-Q-60-01A
      • 5.16.2.2.2 ECSS-Q-ST-60-15C
      • 5.16.2.2.3 ECSS-Q-HB-60-02A
    • 5.16.2.3 Asia Pacific
      • 5.16.2.3.1 India
        • 5.16.2.3.1.1 IS:1885
      • 5.16.2.3.2 Japan
        • 5.16.2.3.2.1 Japan Product Safety Compliance
        • 5.16.2.3.2.2 JMR-001

6 MATERIAL SELECTION AND PACKAGING TYPES IN RADIATION-HARDENED ELECTRONICS MARKET

• 6.1 INTRODUCTION
• 6.2 MATERIAL SELECTION
  • 6.2.1 SILICON
  • 6.2.2 SILICON CARBIDE (SIC)
  • 6.2.3 GALLIUM NITRIDE (GAN)
  • 6.2.4 GALLIUM ARSENIDE (GAAS)
• 6.3 PACKAGING TYPES
  • 6.3.1 FLIP-CHIP
  • 6.3.2 CERAMIC PACKAGES

7 RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT

• 7.1 INTRODUCTION
  • FIGURE 35 POWER MANAGEMENT SEGMENT TO ACCOUNT FOR LARGEST SHARE DURING FORECAST PERIOD
  • TABLE 21 RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2020-2023 (USD MILLION)
  • TABLE 22 RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2024-2029 (USD MILLION)
• 7.2 MIXED SIGNAL ICS
  • TABLE 23 MIXED SIGNAL DEVICES: RADIATION-HARDENED ELECTRONICS MARKET, BY TYPE, 2020-2023 (USD MILLION)
  • TABLE 24 MIXED SIGNAL DEVICES: RADIATION-HARDENED ELECTRONICS MARKET, BY TYPE, 2024-2029 (USD MILLION)
  • TABLE 25 MIXED SIGNAL ICS: RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2020-2023 (USD MILLION)
  • TABLE 26 MIXED SIGNAL ICS: RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2024-2029 (USD MILLION)
  • TABLE 27 MIXED SIGNAL ICS: RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2020-2023 (USD MILLION)
  • TABLE 28 MIXED SIGNAL ICS: RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2024-2029 (USD MILLION)
  • 7.2.1 RAD-HARD A/D AND D/A CONVERTERS
    • 7.2.1.1 Increasing usage in space applications
  • 7.2.2 MULTIPLEXERS & RESISTORS
    • 7.2.2.1 High demand for multiplexers in data acquisition systems
• 7.3 PROCESSORS & CONTROLLERS
  • TABLE 29 PROCESSORS & CONTROLLERS: RADIATION-HARDENED ELECTRONICS MARKET, BY TYPE, 2020-2023 (USD MILLION)
  • TABLE 30 PROCESSORS & CONTROLLERS: RADIATION-HARDENED ELECTRONICS MARKET, BY TYPE, 2024-2029 (USD MILLION)
  • TABLE 31 PROCESSORS & CONTROLLERS: RADIATION-HARDENED ELECTRONICS MARKET, BY TYPE, 2020-2023 (THOUSAND UNITS)
  • TABLE 32 PROCESSORS & CONTROLLERS: RADIATION-HARDENED ELECTRONICS MARKET, BY TYPE, 2024-2029 (THOUSAND UNITS)
  • TABLE 33 PROCESSORS & CONTROLLERS: RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2020-2023 (USD MILLION)
  • TABLE 34 PROCESSORS & CONTROLLERS: RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2024-2029 (USD MILLION)
  • TABLE 35 PROCESSORS & CONTROLLERS: RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2020-2023 (USD MILLION)
  • TABLE 36 PROCESSORS & CONTROLLERS: RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2024-2029 (USD MILLION)
  • 7.3.1 MICROPROCESSOR UNITS (MPUS)
    • 7.3.1.1 Developments in multicore processors for space & defense applications
  • 7.3.2 MICROCONTROLLER UNITS (MCUS)
    • 7.3.2.1 Development of ARM-based microcontrollers for spacecraft subsystems
  • 7.3.3 APPLICATION-SPECIFIC INTEGRATED CIRCUITS (ASICS)
    • 7.3.3.1 Increasing demand for highly customized design
  • 7.3.4 FPGAS
    • 7.3.4.1 Help eliminate costs related to re-designing or manual updating
• 7.4 MEMORY
  • TABLE 37 MEMORY: RADIATION-HARDENED ELECTRONICS MARKET, BY TYPE, 2020-2023 (USD MILLION)
  • TABLE 38 MEMORY: RADIATION-HARDENED ELECTRONICS MARKET, BY TYPE, 2024-2029 (USD MILLION)
  • TABLE 39 MEMORY: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2020-2023 (USD MILLION)
  • TABLE 40 MEMORY: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2024-2029 (USD MILLION)
  • TABLE 41 MEMORY: RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2020-2023 (USD MILLION)
  • TABLE 42 MEMORY: RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2024-2029 (USD MILLION)
  • TABLE 43 MEMORY: RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2020-2023 (USD MILLION)
  • TABLE 44 MEMORY: RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2024-2029 (USD MILLION)
  • 7.4.1 VOLATILE MEMORY
    • 7.4.1.1 Dynamic Random-Access Memory (DRAM)
      • 7.4.1.1.1 Low retention time expected to increase adoption in spacecraft
    • 7.4.1.2 Static random-access memory (SRAM)
      • 7.4.1.2.1 High adoption in image processing applications
  • 7.4.2 NON-VOLATILE MEMORY
    • 7.4.2.1 Magnetoresistive random-access memory (MRAM)
      • 7.4.2.1.1 Increasing developments in MRAM technologies for space environment
    • 7.4.2.2 Flash
      • 7.4.2.2.1 Increasing requirement for NOR flash memory in processing applications
    • 7.4.2.3 Others (ReRAM, EEPROM, NVRAM)
• 7.5 POWER MANAGEMENT
  • TABLE 45 POWER MANAGEMENT: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2020-2023 (USD MILLION)
  • TABLE 46 POWER MANAGEMENT: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2024-2029 (USD MILLION)
  • TABLE 47 POWER MANAGEMENT: RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2020-2023 (USD MILLION)
  • TABLE 48 POWER MANAGEMENT: RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2024-2029 (USD MILLION)
  • TABLE 49 POWER MANAGEMENT: RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2020-2023 (USD MILLION)
  • TABLE 50 POWER MANAGEMENT: RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2024-2029 (USD MILLION)
  • 7.5.1 MOSFETS
    • 7.5.1.1 Increasing adoption for outer space applications
  • 7.5.2 DIODES
    • 7.5.2.1 Integration of ceramic packaging technology to improve performance in space applications
  • 7.5.3 THYRISTORS
    • 7.5.3.1 Increasing adoption in aerospace & defense applications
  • 7.5.4 IGBTS
    • 7.5.4.1 High current density and low power dissipation drive adoption
• 7.6 OTHERS (QUALITATIVE)

8 RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE

• 8.1 INTRODUCTION
  • FIGURE 36 RHBD SEGMENT TO LEAD RADIATION-HARDENED ELECTRONICS MARKET DURING FORECAST PERIOD
  • TABLE 51 RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2020-2023 (USD MILLION)
  • TABLE 52 RADIATION-HARDENED ELECTRONICS MARKET, BY MANUFACTURING TECHNIQUE, 2024-2029 (USD MILLION)
• 8.2 RADIATION-HARDENING BY DESIGN (RHBD)
  • TABLE 53 RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2020-2023 (USD MILLION)
  • TABLE 54 RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2024-2029 (USD MILLION)
  • TABLE 55 RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY MIXED SIGNAL IC, 2020-2023 (USD MILLION)
  • TABLE 56 RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY MIXED SIGNAL IC, 2024-2029 (USD MILLION)
  • TABLE 57 RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY PROCESSOR & CONTROLLER, 2020-2023 (USD MILLION)
  • TABLE 58 RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY PROCESSOR & CONTROLLER, 2024-2029 (USD MILLION)
  • TABLE 59 RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY, 2020-2023 (USD MILLION)
  • TABLE 60 RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY, 2024-2029 (USD MILLION)
  • TABLE 61 RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY POWER MANAGEMENT, 2020-2023 (USD MILLION)
  • TABLE 62 RHBD: RADIATION-HARDENED ELECTRONICS MARKET, BY POWER MANAGEMENT, 2024-2029 (USD MILLION)
  • 8.2.1 TOTAL IONIZING DOSE
    • 8.2.1.1 Long-term ionizing damage could result in malfunctioning of electronic components
  • 8.2.2 SINGLE EVENT EFFECT (SEE)
    • 8.2.2.1 RHBD approach favored in space electronics
• 8.3 RADIATION-HARDENING BY PROCESS (RHBP)
  • TABLE 63 RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2020-2023 (USD MILLION)
  • TABLE 64 RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2024-2029 (USD MILLION)
  • TABLE 65 RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY MIXED SIGNAL IC, 2020-2023 (USD MILLION)
  • TABLE 66 RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY MIXED SIGNAL IC, 2024-2029 (USD MILLION)
  • TABLE 67 RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY PROCESSOR & CONTROLLER, 2020-2023 (USD MILLION)
  • TABLE 68 RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY PROCESSOR & CONTROLLER, 2024-2029 (USD MILLION)
  • TABLE 69 RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY, 2020-2023 (USD MILLION)
  • TABLE 70 RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY, 2024-2029 (USD MILLION)
  • TABLE 71 RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY POWER MANAGEMENT, 2020-2023 (USD MILLION)
  • TABLE 72 RHBP: RADIATION-HARDENED ELECTRONICS MARKET, BY POWER MANAGEMENT, 2024-2029 (USD MILLION)
  • 8.3.1 SILICON ON INSULATOR (SOI)
    • 8.3.1.1 Integration of SOI ICs in insulation layers provides benefits in high-radiation environments
  • 8.3.2 SILICON ON SAPPHIRE (SOS)
    • 8.3.2.1 High resistance to radiation increases demand in aerospace and military applications
• 8.4 RADIATION HARDENING BY SOFTWARE (RHBS) (QUALITATIVE)

9 RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE

• 9.1 INTRODUCTION
  • FIGURE 37 COTS SEGMENT TO HOLD LARGER SHARE AND REGISTER HIGHER CAGR DURING FORECAST PERIOD
  • TABLE 73 RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2020-2023 (USD MILLION)
  • TABLE 74 RADIATION-HARDENED ELECTRONICS MARKET, BY PRODUCT TYPE, 2024-2029 (USD MILLION)
• 9.2 COMMERCIAL-OFF-THE-SHELF (COTS)
  • 9.2.1 INCREASING ADOPTION IN COMMERCIAL AND MILITARY SATELLITES DUE TO LOW-COST BENEFITS
  • TABLE 75 COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2020-2023 (USD MILLION)
  • TABLE 76 COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2024-2029 (USD MILLION)
  • TABLE 77 COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY MIXED SIGNAL IC, 2020-2023 (USD MILLION)
  • TABLE 78 COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY MIXED SIGNAL IC, 2024-2029 (USD MILLION)
  • TABLE 79 COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY PROCESSOR & CONTROLLER, 2020-2023 (USD MILLION)
  • TABLE 80 COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY PROCESSOR & CONTROLLER, 2024-2029 (USD MILLION)
  • TABLE 81 COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY, 2020-2023 (USD MILLION)
  • TABLE 82 COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY, 2024-2029 (USD MILLION)
  • TABLE 83 COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY POWER MANAGEMENT, 2020-2023 (USD MILLION)
  • TABLE 84 COTS: RADIATION-HARDENED ELECTRONICS MARKET, BY POWER MANAGEMENT, 2024-2029 (USD MILLION)
• 9.3 CUSTOM-MADE
  • 9.3.1 HIGH PREFERENCE IN DEFENSE MISSION-CRITICAL APPLICATIONS
  • TABLE 85 CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2020-2023 (USD MILLION)
  • TABLE 86 CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY COMPONENT, 2024-2029 (USD MILLION)
  • TABLE 87 CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY MIXED SIGNAL IC, 2020-2023 (USD MILLION)
  • TABLE 88 CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY MIXED SIGNAL IC, 2024-2029 (USD MILLION)
  • TABLE 89 CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY PROCESSOR & CONTROLLER, 2020-2023 (USD MILLION)
  • TABLE 90 CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY PROCESSOR & CONTROLLER, 2024-2029 (USD MILLION)
  • TABLE 91 CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY, 2020-2023 (USD MILLION)
  • TABLE 92 CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY MEMORY, 2024-2029 (USD MILLION)
  • TABLE 93 CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY POWER MANAGEMENT, 2020-2023 (USD MILLION)
  • TABLE 94 CUSTOM-MADE: RADIATION-HARDENED ELECTRONICS MARKET, BY POWER MANAGEMENT, 2024-2029 (USD MILLION)

10 RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION

• 10.1 INTRODUCTION
  • FIGURE 38 SPACE APPLICATION SEGMENT TO HOLD LARGEST SHARE AND REGISTER HIGHEST CAGR DURING FORECAST PERIOD
  • TABLE 95 RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION, 2020-2023 (USD MILLION)
  • TABLE 96 RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION, 2024-2029 (USD MILLION)
• 10.2 SPACE
  • 10.2.1 PROLIFERATION IN GLOBAL SPACE ECONOMY TO DRIVE GROWTH OPPORTUNITIES
  • TABLE 97 SPACE: RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION, 2020-2023 (USD MILLION)
  • TABLE 98 SPACE: RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION, 2024-2029 (USD MILLION)
  • TABLE 99 SPACE: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2020-2023 (USD MILLION)
  • TABLE 100 SPACE: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2024-2029 (USD MILLION)
  • 10.2.2 COMMERCIAL
    • 10.2.2.1 Small satellites
    • 10.2.2.2 New Space
    • 10.2.2.3 Nanosatellites
  • 10.2.3 MILITARY
• 10.3 AEROSPACE & DEFENSE
  • 10.3.1 INCREASING FUNDING FOR MILITARY SECTOR IN EMERGING COUNTRIES TO DRIVE MARKET GROWTH
  • TABLE 101 AEROSPACE & DEFENSE: RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION, 2020-2023 (USD MILLION)
  • TABLE 102 AEROSPACE & DEFENSE: RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION, 2024-2029 (USD MILLION)
  • TABLE 103 AEROSPACE & DEFENSE: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2020-2023 (USD MILLION)
  • TABLE 104 AEROSPACE & DEFENSE: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2024-2029 (USD MILLION)
  • 10.3.2 WEAPONS AND MISSILES
  • 10.3.3 VEHICLES/AVIONICS
• 10.4 NUCLEAR POWER PLANTS
  • 10.4.1 RISE IN CONSTRUCTION OF NUCLEAR REACTORS FOR POWER GENERATION TO DRIVE MARKET GROWTH
  • TABLE 105 NUCLEAR POWER PLANTS: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2020-2023 (USD MILLION)
  • TABLE 106 NUCLEAR POWER PLANTS: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2024-2029 (USD MILLION)
• 10.5 MEDICAL
  • 10.5.1 INTEGRATION OF EMI SHIELDING AND FILTERING IN IMPLANTABLE DEVICES TO BOOST GROWTH
  • 10.5.2 IMPLANTABLE MEDICAL DEVICES
  • TABLE 107 MEDICAL: RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION 2020-2023 (USD MILLION)
  • TABLE 108 MEDICAL: RADIATION-HARDENED ELECTRONICS MARKET, BY APPLICATION, 2024-2029 (USD MILLION)
  • TABLE 109 MEDICAL: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2020-2023 (USD MILLION)
  • TABLE 110 MEDICAL: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2024-2029 (USD MILLION)
  • 10.5.3 RADIOLOGY
• 10.6 OTHERS
  • TABLE 111 OTHER APPLICATIONS: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2020-2023 (USD MILLION)
  • TABLE 112 OTHER APPLICATIONS: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2024-2029 (USD MILLION)

11 REGIONAL ANALYSIS

• 11.1 INTRODUCTION
  • FIGURE 39 REGIONAL SNAPSHOT: CHINA EXPECTED TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
  • FIGURE 40 RADIATION-HARDENED ELECTRONICS MARKET, BY REGION
  • TABLE 113 RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2020-2023 (USD MILLION)
  • TABLE 114 RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2024-2029 (USD MILLION)
• 11.2 NORTH AMERICA
  • FIGURE 41 NORTH AMERICA: RADIATION-HARDENED ELECTRONICS MARKET SNAPSHOT
  • TABLE 115 NORTH AMERICA: RADIATION-HARDENED ELECTRONICS MARKET, BY COUNTRY, 2020-2023 (USD MILLION)
  • TABLE 116 NORTH AMERICA: RADIATION-HARDENED ELECTRONICS MARKET, BY COUNTRY, 2024-2029 (USD MILLION)
  • 11.2.1 US
    • 11.2.1.1 Increase in space missions from government and private agencies to drive demand
  • 11.2.2 CANADA
    • 11.2.2.1 Ongoing developments in satellites expected to drive market
  • 11.2.3 MEXICO
    • 11.2.3.1 Growing economy and increasing urban mobility increase demand for satellites
  • 11.2.4 IMPACT OF RECESSION ON MARKET IN NORTH AMERICA
• 11.3 EUROPE
  • FIGURE 42 EUROPE: RADIATION-HARDENED ELECTRONICS MARKET SNAPSHOT
  • TABLE 117 EUROPE: RADIATION-HARDENED ELECTRONICS MARKET, BY COUNTRY, 2020-2023 (USD MILLION)
  • TABLE 118 EUROPE: RADIATION-HARDENED ELECTRONICS MARKET, BY COUNTRY, 2024-2029 (USD MILLION)
  • 11.3.1 UK
    • 11.3.1.1 Increasing initiatives by government and private entities in space sector to fuel market growth
  • 11.3.2 GERMANY
    • 11.3.2.1 Proliferation in national space programs to boost demand for radiation-hardened electronics
  • 11.3.3 FRANCE
    • 11.3.3.1 Increasing partnerships in space industry to increase competitiveness of France in European Union
  • 11.3.4 REST OF EUROPE
  • 11.3.5 IMPACT OF RECESSION ON MARKET IN EUROPE
• 11.4 ASIA PACIFIC
  • FIGURE 43 ASIA PACIFIC: RADIATION-HARDENED ELECTRONICS MARKET SNAPSHOT
  • TABLE 119 ASIA PACIFIC: RADIATION-HARDENED ELECTRONICS MARKET, BY COUNTRY, 2020-2023 (USD MILLION)
  • TABLE 120 ASIA PACIFIC: RADIATION-HARDENED ELECTRONICS MARKET, BY COUNTRY, 2024-2029 (USD MILLION)
  • 11.4.1 CHINA
    • 11.4.1.1 Advancements in space missions expected to drive market
  • 11.4.2 INDIA
    • 11.4.2.1 Increasing developments by ISRO to drive market
  • 11.4.3 JAPAN
    • 11.4.3.1 Involvement of private space companies in government space programs to boost market
  • 11.4.4 SOUTH KOREA
    • 11.4.4.1 Private-public investments in infrastructure, industrial, commercial, military, space, and defense projects - key driver
  • 11.4.5 REST OF ASIA PACIFIC
  • 11.4.6 IMPACT OF RECESSION ON MARKET IN ASIA PACIFIC
• 11.5 REST OF THE WORLD (ROW)
  • TABLE 121 ROW: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2020-2023 (USD MILLION)
  • TABLE 122 ROW: RADIATION-HARDENED ELECTRONICS MARKET, BY REGION, 2024-2029 (USD MILLION)
  • 11.5.1 GULF COOPERATION COUNCIL (GCC)
    • 11.5.1.1 Proliferation of satellite operations to drive market
  • 11.5.2 SOUTH AMERICA
    • 11.5.2.1 Tie-ups with foreign agencies for space missions to propel market growth
  • 11.5.3 REST OF MIDDLE EAST AND AFRICA
    • 11.5.3.1 Increasing investments by governments to boost market growth
  • 11.5.4 RECESSION IMPACT ON MARKET IN REST OF MIDDLE EAST AND AFRICA

12 COMPETITIVE LANDSCAPE

• 12.1 INTRODUCTION
• 12.2 KEY PLAYER STRATEGIES
  • TABLE 123 KEY PLAYER STRATEGIES
• 12.3 MARKET REVENUE ANALYSIS
  • FIGURE 44 RADIATION-HARDENED ELECTRONICS MARKET: REVENUE ANALYSIS OF TOP FIVE PLAYERS, 2020-2022
• 12.4 MARKET SHARE ANALYSIS
  • FIGURE 45 MARKET SHARE ANALYSIS, 2023
  • TABLE 124 DEGREE OF COMPETITION, RADIATION-HARDENED ELECTRONICS MARKET (2023)
  • TABLE 125 MARKET RANKING ANALYSIS
• 12.5 VALUATION AND FINANCIAL METRICS IN RADIATION-HARDENED ELECTRONICS MARKET
  • FIGURE 46 EV/EBITDA OF KEY VENDORS
• 12.6 BRAND/PRODUCT COMPARATIVE ANALYSIS
  • FIGURE 47 RADIATION-HARDENED ELECTRONICS MARKET: TOP TRENDING BRAND/PRODUCTS
• 12.7 COMPANY EVALUATION MATRIX
  • 12.7.1 STARS
  • 12.7.2 EMERGING LEADERS
  • 12.7.3 PERVASIVE PLAYERS
  • 12.7.4 PARTICIPANTS
  • FIGURE 48 RADIATION-HARDENED ELECTRONICS MARKET: TOP COMPANY EVALUATION QUADRANT, 2023
• 12.8 RADIATION-HARDENED ELECTRONICS MARKET: COMPANY FOOTPRINT (15 COMPANIES)
  • TABLE 126 COMPANY FOOTPRINT
  • TABLE 127 COMPANY COMPONENT FOOTPRINT (15 COMPANIES)
  • TABLE 128 COMPANY APPLICATION FOOTPRINT (15 COMPANIES)
  • TABLE 129 COMPANY REGION FOOTPRINT (15 COMPANIES)
  • TABLE 130 COMPANY PRODUCT TYPE FOOTPRINT (15 COMPANIES)
  • TABLE 131 COMPANY MANUFACTURING TECHNIQUE FOOTPRINT (15 COMPANIES)
• 12.9 STARTUP/SME EVALUATION QUADRANT, 2023
  • 12.9.1 PROGRESSIVE COMPANIES
  • 12.9.2 RESPONSIVE COMPANIES
  • 12.9.3 DYNAMIC COMPANIES
  • 12.9.4 STARTING BLOCKS
  • FIGURE 49 RADIATION-HARDENED ELECTRONICS MARKET, STARTUP/SME EVALUATION QUADRANT, 2023
• 12.10 COMPETITIVE BENCHMARKING
  • TABLE 132 RADIATION-HARDENED ELECTRONICS MARKET: KEY STARTUPS/SMES
  • TABLE 133 RADIATION-HARDENED ELECTRONICS MARKET: COMPETITIVE BENCHMARKING OF KEY STARTUPS/SMES
• 12.11 COMPETITIVE SCENARIOS AND TRENDS
  • 12.11.1 PRODUCT LAUNCHES/DEVELOPMENTS
  • TABLE 134 RADIATION-HARDENED ELECTRONICS MARKET: PRODUCT LAUNCHES/DEVELOPMENTS, 2021-2024
  • 12.11.2 DEALS
  • TABLE 135 RADIATION-HARDENED ELECTRONICS MARKET: DEALS, 2021-2024
  • 12.11.3 OTHERS
  • TABLE 136 RADIATION-HARDENED ELECTRONICS MARKET: OTHER DEALS, 2021-2024

13 COMPANY PROFILES

• 13.1 KEY PLAYERS
• (Business Overview, Products/Solutions/Services Offered, Recent Developments, MnM view (Key strengths/Right to win, Strategic choices made, Weakness/competitive threats)**
• 13.1.1 MICROCHIP TECHNOLOGY INC.
• TABLE 137 MICROCHIP TECHNOLOGY INC.: BUSINESS OVERVIEW
• FIGURE 50 MICROCHIP TECHNOLOGY INC.: COMPANY SNAPSHOT
• TABLE 138 MICROCHIP TECHNOLOGY INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
• TABLE 139 MICROCHIP TECHNOLOGY INC.: PRODUCT LAUNCHES
• TABLE 140 MICROCHIP TECHNOLOGY INC.: DEALS
• TABLE 141 MICROCHIP TECHNOLOGY INC.: OTHERS
• 13.1.2 BAE SYSTEMS
• TABLE 142 BAE SYSTEMS: BUSINESS OVERVIEW
• FIGURE 51 BAE SYSTEMS: COMPANY SNAPSHOT
• TABLE 143 BAE SYSTEMS: PRODUCTS/SOLUTIONS/SERVICES OFFERED
• TABLE 144 BAE SYSTEMS: PRODUCT LAUNCHES
• TABLE 145 BAE SYSTEMS: DEALS
• TABLE 146 BAE SYSTEMS: OTHERS
• 13.1.3 RENESAS ELECTRONICS CORPORATION
• TABLE 147 RENESAS ELECTRONICS CORPORATION: BUSINESS OVERVIEW
• FIGURE 52 RENESAS ELECTRONICS CORPORATION: COMPANY SNAPSHOT
• TABLE 148 RENESAS ELECTRONICS CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED
• TABLE 149 RENESAS ELECTRONICS CORPORATION: PRODUCT LAUNCHES
• TABLE 150 RENESAS ELECTRONICS CORPORATION: DEALS
• TABLE 151 RENESAS ELECTRONICS CORPORATION: OTHERS
• 13.1.4 INFINEON TECHNOLOGIES AG
• TABLE 152 INFINEON TECHNOLOGIES AG: BUSINESS OVERVIEW
• FIGURE 53 INFINEON TECHNOLOGIES AG: COMPANY SNAPSHOT
• TABLE 153 INFINEON TECHNOLOGIES AG: PRODUCTS/SOLUTIONS/SERVICES OFFERED
• TABLE 154 INFINEON TECHNOLOGIES AG: PRODUCT LAUNCHES
• TABLE 155 INFINEON TECHNOLOGIES AG: DEALS
• TABLE 156 INFINEON TECHNOLOGIES AG: OTHERS
• 13.1.5 STMICROELECTRONICS
• TABLE 157 STMICROELECTRONICS: BUSINESS OVERVIEW
• FIGURE 54 STMICROELECTRONICS: COMPANY SNAPSHOT
• TABLE 158 STMICROELECTRONICS: PRODUCTS/SOLUTIONS/SERVICES OFFERED
• TABLE 159 STMICROELECTRONICS: PRODUCT LAUNCHES
• TABLE 160 STMICROELECTRONICS: DEALS
• 13.1.6 ADVANCED MICRO DEVICES, INC (AMD)
• TABLE 161 ADVANCED MICRO DEVICES, INC: BUSINESS OVERVIEW
• FIGURE 55 ADVANCED MICRO DEVICES, INC: COMPANY SNAPSHOT
• TABLE 162 ADVANCED MICRO DEVICES, INC: PRODUCTS/SOLUTIONS/SERVICES OFFERED
• TABLE 163 ADVANCED MICRO DEVICES, INC: PRODUCT LAUNCHES
• TABLE 164 ADVANCED MICRO DEVICES, INC: DEALS
• 13.1.7 TEXAS INSTRUMENTS INCORPORATED
• TABLE 165 TEXAS INSTRUMENTS INCORPORATED: BUSINESS OVERVIEW
• FIGURE 56 TEXAS INSTRUMENTS INCORPORATED: COMPANY SNAPSHOT
• TABLE 166 TEXAS INSTRUMENTS INCORPORATED: PRODUCTS/SOLUTIONS/SERVICES OFFERED
• TABLE 167 TEXAS INSTRUMENTS INCORPORATED: PRODUCT LAUNCHES
• TABLE 168 TEXAS INSTRUMENTS INCORPORATED: DEALS
• TABLE 169 TEXAS INSTRUMENTS INCORPORATED: DEALS
• 13.1.8 HONEYWELL INTERNATIONAL INC.
• TABLE 170 HONEYWELL INTERNATIONAL INC.: BUSINESS OVERVIEW
• FIGURE 57 HONEYWELL INTERNATIONAL INC.: COMPANY SNAPSHOT
• TABLE 171 HONEYWELL INTERNATIONAL INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
• TABLE 172 HONEYWELL INTERNATIONAL INC.: PRODUCT LAUNCHES
• TABLE 173 HONEYWELL INTERNATIONAL INC.: DEALS
• TABLE 174 HONEYWELL INTERNATIONAL INC.: OTHERS
• 13.1.9 TELEDYNE TECHNOLOGIES INC.
• TABLE 175 TELEDYNE TECHNOLOGIES INC.: BUSINESS OVERVIEW
• FIGURE 58 TELEDYNE TECHNOLOGIES INC.: COMPANY SNAPSHOT
• TABLE 176 TELEDYNE TECHNOLOGIES INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
• TABLE 177 TELEDYNE TECHNOLOGIES INC.: PRODUCT LAUNCHES
• TABLE 178 TELEDYNE TECHNOLOGIES INC.: DEALS
• TABLE 179 TELEDYNE TECHNOLOGIES INC.: OTHERS
• 13.1.10 TTM TECHNOLOGIES, INC.
• TABLE 180 TTM TECHNOLOGIES, INC.: BUSINESS OVERVIEW
• FIGURE 59 TTM TECHNOLOGIES, INC.: COMPANY SNAPSHOT
• TABLE 181 TTM TECHNOLOGIES, INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
• TABLE 182 TTM TECHNOLOGIES, INC.: OTHERS
• 13.2 OTHER PLAYERS
  • 13.2.1 COBHAM LIMITED
  • 13.2.2 ANALOG DEVICES, INC
  • 13.2.3 DATA DEVICE CORPORATION
  • 13.2.4 3D PLUS
  • 13.2.5 MERCURY SYSTEMS, INC.
  • 13.2.6 PCB PIEZOTRONICS, INC.
  • 13.2.7 VORAGO TECHNOLOGIES
  • 13.2.8 MICROPAC INDUSTRIES, INC.
  • 13.2.9 GSI TECHNOLOGY, INC.
  • 13.2.10 EVERSPIN TECHNOLOGIES INC
  • 13.2.11 SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (ON SEMICONDUCTOR)
  • 13.2.12 AITECH
  • 13.2.13 MICROELECTRONICS RESEARCH DEVELOPMENT CORPORATION
  • 13.2.14 SPACE MICRO INC
  • 13.2.15 TRIAD SEMICONDUCTOR
• *Details on Business Overview, Products/Solutions/Services Offered, Recent Developments, MnM view (Key strengths/Right to win, Strategic choices made, Weakness/competitive threats)** might not be captured in case of unlisted companies.

14 APPENDIX

• 14.1 DISCUSSION GUIDE
• 14.2 KNOWLEDGESTORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL
• 14.3 CUSTOMIZATION OPTIONS
• 14.4 RELATED REPORTS
• 14.5 AUTHOR DETAILS

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