내방사선 FPGA 시장 규모는 2024년 4억 6,550만 달러에 달했습니다.
이 시장은 5.54%의 연평균 복합 성장률(CAGR)로 확대되어 2034년에는 7억 9,830만 달러에 달할 것으로 예상됩니다. 방사선 내성 FPGA에 대한 수요 증가는 우주, 군사, 원자력 분야에서 방사선 내성 전자 부품의 필요성에 기인합니다. 이러한 FPGA는 고방사선 환경의 가혹한 조건을 견딜 수 있도록 설계되어 위성 통신, 방위 장비, 원자력 시설과 같은 중요한 시스템에서 안정적인 성능을 발휘합니다. 우주 탐사 및 군사 기술의 발전에 따라 내방사선 FPGA에 대한 수요는 앞으로도 계속 증가할 것입니다. 고성능, 저전력, 내결함성 및 에너지 효율이 우수한 FPGA의 개발이 진행됨에 따라 시장 성장은 더욱 가속화될 것으로 예상됩니다.
| 주요 시장 통계 | |
|---|---|
| 예측 기간 | 2024-2034년 |
| 2024년 평가액 | 4억 6,550만 달러 |
| 2034년 예측 | 7억 9,830만 달러 |
| CAGR | 5.54% |
내방사선 필드 프로그래머블 게이트 어레이(FPGA)는 우주, 군사, 원자력에서 흔히 볼 수 있는 고방사선 환경에서 안정적으로 작동하도록 설계된 특수 집적회로입니다. 이러한 FPGA는 위성통신, 국방, 항공우주 기술 등 방사선에 의한 장애에 강해야 하는 시스템에 매우 중요합니다. 그 설계에는 극한의 방사선 노출에도 안정적인 동작을 보장하는 첨단 기술과 재료가 내장되어 있습니다. 우주 개발, 국방, 원자력 등의 분야가 발전함에 따라 내방사선 칩의 필요성은 점점 더 커지고 있으며, FPGA 기술의 혁신은 처리 능력과 에너지 효율을 향상시켜 이 고신뢰성 부품에 대한 수요를 더욱 증가시키고 있습니다.
방사선 내성 FPGA 시장은 우주개발, 국방, 원자력 등 견고한 전자 시스템을 필요로 하는 산업에 대한 투자가 증가함에 따라 확대되고 있습니다. 표준 FPGA와 달리, 이들 디바이스는 중요한 용도에서 안정적인 성능을 유지하면서 가혹한 고방사선 환경을 견딜 수 있도록 특별히 설계되었습니다. 우주 임무, 위성 통신, 군사 방어 시스템이 고도화됨에 따라 방사선 내성 FPGA에 대한 의존도가 높아지고 있습니다. 또한, FPGA 기술의 발전으로 우주 및 방위 임무의 복잡성을 충족시킬 수 있는 FPGA의 성능이 향상되고 있는 것도 시장 성장을 가속하고 있습니다. 또한, 이러한 분야에 대한 정부 및 민간 기업의 자금 조달이 증가함에 따라 내방사선 FPGA의 채택이 가속화되고 있습니다.
내방사선 FPGA 시장이 산업계에 미치는 영향은 항공우주, 국방, 우주개발 등 다양한 중요 부문에 걸쳐 있습니다. 이러한 FPGA는 위성 통신, 군사 시스템, 우주 임무 등 열악한 환경에서 안정적인 성능을 필요로 하는 용도에 필수적입니다. 방사능과 가혹한 조건에도 견딜 수 있기 때문에 안전, 정확성, 중단 없는 작동이 필수적인 산업 분야에 필수적입니다. 이러한 성장은 반도체 제조업체, 항공우주 기업, 방위산업체 간의 협력을 촉진하고, 미션 크리티컬한 용도를 위한 탄력적인 시스템 개발을 더욱 강화하는 데 기여하고 있습니다. 우주 프로그램, 군사 계약 및 위성 시스템의 확장은 반도체 및 전자 분야의 엔지니어링, 제조 및 연구 분야에도 기회를 제공합니다.
내방사선 FPGA 시장에 진출한 기업으로는 BAE Systems,Honeywell International,Airbus,Microchip Technology,NanoXplore,Advanced Micro Devices,Teledyne,TT Electronics, VORAGO Technologies, Thales, Infineon Technologies AG, Renesas Electronics Corporation 등의 있습니다. 이 기업들은 전략적 파트너십과 협력, 기술 발전을 통해 역량을 강화하고 열악한 환경에서 내방사선 FPGA의 내결함성과 성능을 향상시키고 있습니다. 연구개발에 대한 지속적인 투자는 우주 개발, 방위 기술, 중요 인프라 전자 시스템 등 광범위한 트렌드를 지원하면서 이 틈새 시장의 성장을 주도하고 있습니다.
우주 탐사는 심우주 탐사, 행성 탐사, 위성 기반 조사 등의 복잡성으로 인해 내방사선 FPGA 시장의 성장을 주도할 것으로 예상됩니다. 우주선이 지구 저궤도(LEO)를 넘어 달, 화성, 항성간으로 진출함에 따라 내방사선 컴퓨팅 솔루션에 대한 수요는 지속적으로 증가하고 있습니다. 방사선 내성 FPGA는 온보드 데이터 처리, AI 기반 자율성, 실시간 내비게이션, 적응형 미션 제어에 필수적인 요소로, 높은 방사선 환경에서 지속적이고 안정적인 작동을 보장합니다.
NASA, 유럽우주국(ESA) 등 우주 기관과 SpaceX, Blue Origin 등 민간 기업이 우주 기술의 한계에 도전하는 가운데, 차세대 우주선 및 로봇 미션에서 고성능, 전력 효율이 높은 FPGA에 대한 의존도가 높아지고 있습니다.
SRAM 기반 방사선 내성 FPGA는 고성능, 재프로그래밍 가능성, 뛰어난 로직 밀도로 인해 시장을 장악할 것으로 예상됩니다. 안티퓨즈 FPGA 및 플래시 기반 FPGA와 달리, SRAM FPGA는 유연성이 뛰어나며, 미션 내 업데이트, AI 기반 처리, 우주 및 국방, 고방사선 환경에 필수적인 복잡한 실시간 계산이 가능합니다. 이러한 FPGA는 위성 탑재체, 미사일 유도 시스템, 심우주 탐사선 및 적응성과 계산 효율성이 중요한 보안 군사 용도에 널리 사용되고 있습니다.
단일 이벤트 업셋(SEU) 및 전체 이온화 선량(TID)의 영향을 받기 쉽지만, 트리플 모듈식 이중화(TMR), 구성 스크러빙, 오류 수정 알고리즘과 같은 방사선 경화 기술의 발전으로 내결함성 및 신뢰성이 크게 향상되었습니다. 크게 향상되었습니다.
실리콘(Si)은 널리 이용 가능하고, 반도체 제조 생태계가 구축되어 있으며, 방사선 경화 기술에 대한 적응성이 높기 때문에 방사선 경화 FPGA 시장을 독점할 것으로 예상됩니다.
실리콘 기반 FPGA는 성능, 전력 효율, 내방사선성이 균형을 이루며, 우주선 항공전자, 군사 방위 시스템, 고신뢰성 산업용도에 필수적인 요소입니다. 실리콘 온 인슐레이터(SOI), 딥 트렌치 절연, 도핑 수정과 같은 첨단 반도체 공정은 실리콘의 내방사선성을 강화하여 열악한 환경에서도 고속의 내결함성 컴퓨팅을 보장합니다.
설계에 의한 방사선 경화(RHBD)는 비용 효율성, 확장성, 특수한 제조 공정 없이도 시스템 신뢰성을 향상시킬 수 있어 방사선 경화 FPGA 시장을 독점할 것으로 예상됩니다.
이 접근 방식은 표준 반도체 공정으로 대량 생산이 가능하기 때문에 항공우주, 방위, 고방사선 산업용도에 적합합니다. 심우주 탐사, 자율 군사 시스템, AI 기반 위성 컴퓨팅에 대한 정부 및 상업적 투자가 증가함에 따라 RHBD 기반 방사선 내성 FPGA는 열악한 환경에서 미션 크리티컬한 신뢰성과 비용 효율적인 배치를 보장하여 시장을 주도할 것으로 예상됩니다.
51-100MHz에서 동작하는 내방사선 FPGA는 성능, 전력 효율, 내방사선성이 최적의 균형을 이루며, 미션 크리티컬한 항공우주, 국방, 우주개발 용도에 적합합니다.
이 FPGA는 이온화 방사선 및 단일 이벤트 업셋(SEU)에 대한 높은 내성을 유지하면서 실시간 데이터 처리, 안전한 통신 및 제어 시스템에 충분한 처리 능력을 제공합니다. 또한, 적당한 동작 주파수로 과도한 전력 소비 없이 효율적인 시스템 성능을 구현하여 위성 탑재체 처리, 군용 항공전자, 심우주 탐사 임무에 적합합니다.
북미는 기술 리더십, 강력한 국방 투자, 첨단 반도체 제조 능력을 바탕으로 내방사선 FPGA 시장을 독점할 것으로 예상됩니다. 미국 국방부(DoD), NASA, 주요 항공우주 기업들은 안전한 위성 통신, AI 기반 국방 시스템, 심우주 탐사를 위해 내방사선 FPGA의 혁신을 개척하고 있습니다.
이 지역의 광범위한 위성 네트워크, AI 및 보안 컴퓨팅에 대한 높은 수준의 연구 개발, 강력한 민관 협력은 이 지역의 리더십을 더욱 강화시키고 있습니다. 혹독한 환경에서 고신뢰성 컴퓨팅에 대한 수요가 증가함에 따라 북미는 차세대 FPGA 개발을 촉진하고, 군사, 항공우주, 고보안 용도의 미션 크리티컬한 내결함성을 보장하며, 미래의 자율 우주 임무를 위한 기반을 마련하고, AI 기반 국방 인프라를 확보할 수 있는 유리한 위치에 있습니다. AI 기반 국방 인프라를 확보할 수 있는 위치에 있습니다.
세계의 내방사선성 FPGA 시장에 대해 조사했으며, 시장 개요와 함께 용도별/유형별/재료별/제조 기술별/동작 주파수별/국가별 동향, 시장 진출 기업 프로파일 등의 정보를 전해드립니다.
Radiation-Hardened FPGA Market Overview
The radiation-hardened FPGA market was valued at $465.5 million in 2024 and is expected to grow at a CAGR of 5.54%, reaching $798.3 million by 2034. The increasing demand for radiation-hardened FPGAs is driven by the need for radiation-hardened electronic components in space, military, and nuclear applications. These FPGAs are designed to withstand the harsh conditions of high-radiation environments, ensuring consistent performance in critical systems such as satellite communications, defense equipment, and nuclear facilities. As space exploration and military technologies continue to advance, the demand for radiation-hardened FPGAs will continue to rise. The ongoing development of more resilient, energy-efficient FPGAs with higher performance and lower power consumption is expected to increase the market's growth further.
Introduction to the Radiation-Hardened FPGA Market
| KEY MARKET STATISTICS | |
|---|---|
| Forecast Period | 2024 - 2034 |
| 2024 Evaluation | $465.5 Million |
| 2034 Forecast | $798.3 Million |
| CAGR | 5.54% |
Radiation-hardened field-programmable gate arrays (FPGAs) are specialized integrated circuits engineered to function reliably in high-radiation environments, which are typical in space, military, and nuclear applications. These FPGAs are crucial for systems that demand resilience against radiation-induced disruptions, such as satellite communications, defense, and aerospace technologies. Their design incorporates advanced techniques and materials to ensure consistent operation in the face of extreme radiation exposure. As sectors such as space exploration, defense, and nuclear energy continue to advance, the need for radiation-hardened chips is growing. Innovations in FPGA technology are enhancing processing power and energy efficiency, further driving the demand for these highly reliable components in high-stakes industries.
Market Introduction
The radiation-hardened FPGA market is expanding due to increasing investments in industries that require robust electronic systems, including space exploration, defense, and nuclear energy. Unlike standard FPGAs, these devices are specifically designed to endure harsh, high-radiation environments while maintaining consistent performance in critical applications. As space missions, satellite communications, and military defense systems become more sophisticated, the reliance on radiation-hardened FPGAs is intensifying. The market's growth is also driven by advancements in FPGA technology, which are making these devices more capable of handling the increasing complexity of space and defense missions. Additionally, rising government and private sector funding for these sectors is further contributing to the accelerated adoption of radiation-hardened FPGAs.
Industrial Impact
The industrial impact of the radiation-hardened FPGA market is significant across a range of critical sectors, including aerospace, defense, and space exploration. These FPGAs are integral in applications that require reliable performance in extreme environments, such as satellite communications, military systems, and space missions. Their ability to withstand radiation and harsh conditions makes them vital for industries where safety, precision, and uninterrupted operation are essential. This growth is promoting collaborations among semiconductor manufacturers, aerospace companies, and defense contractors, further enhancing the development of resilient systems for mission-critical applications. The expansion of space programs, military contracts, and satellite systems also presents opportunities for engineering, manufacturing, and research in the semiconductor and electronics sectors.
The companies involved in the radiation-hardened FPGA market include major industry players such as BAE Systems, Honeywell International Inc., Airbus, Microchip Technology Inc., NanoXplore Inc., Advanced Micro Devices, Inc., Teledyne, TT Electronics, VORAGO Technologies, Thales, Infineon Technologies AG, Renesas Electronics Corporation, and others. These companies are enhancing their capabilities through strategic partnerships, collaborations, and technology advancements to improve the resilience and performance of radiation-hardened FPGAs in demanding environments. Their continued investments in research and development are driving the growth of this niche market while supporting the broader trends in space exploration, defense technologies, and electronic systems for critical infrastructure.
Market Segmentation:
Segmentation 1: by Application
Space Exploration to Dominate the Radiation-Hardened FPGA Market (by Application)
Space exploration is expected to lead the growth of the radiation-hardened FPGA market, driven by the increasing complexity of deep-space missions, planetary exploration, and satellite-based research. As spacecraft venture beyond low Earth orbit (LEO) to lunar, Martian, and interstellar destinations, the demand for radiation-tolerant computing solutions continues to rise. Radiation-hardened FPGAs are essential for onboard data processing, AI-driven autonomy, real-time navigation, and adaptive mission control, ensuring continuous and reliable operation in high-radiation environments.
With space agencies such as NASA, the European Space Agency (ESA), and private firms such as SpaceX and Blue Origin pushing the boundaries of space technology, next-generation spacecraft and robotic missions increasingly rely on high-performance, power-efficient FPGAs.
Segmentation 2: by Type
SRAM to Dominate the Radiation-Hardened FPGA Market (by Type)
SRAM-based radiation-hardened FPGAs are expected to dominate the market due to their high-performance capabilities, reprogrammability, and superior logic density. Unlike anti-fuse and flash-based FPGAs, SRAM FPGAs offer flexibility, allowing for in-mission updates, AI-driven processing, and complex real-time computations essential for space, defense, and high-radiation environments. These FPGAs are widely used in satellite payloads, missile guidance systems, deep-space probes, and secure military applications, where adaptability and computational efficiency are critical.
Despite their susceptibility to single-event upsets (SEUs) and total ionizing dose (TID) effects, advancements in radiation-hardening techniques, including triple modular redundancy (TMR), configuration scrubbing, and error correction algorithms, have significantly improved their resilience and reliability.
Segmentation 3: by Material
Silicon (Si) to Dominate the Radiation-Hardened FPGA Market (by Material)
Silicon (Si) is expected to dominate the radiation-hardened FPGA market owing to its widespread availability, well-established semiconductor manufacturing ecosystem, and adaptability to radiation-hardening techniques.
Silicon-based FPGAs offer a balance of performance, power efficiency, and radiation resilience, making them essential for spacecraft avionics, military defense systems, and high-reliability industrial applications. Advanced semiconductor processes, such as silicon-on-insulator (SOI), deep trench isolation, and doping modifications, enhance silicon's radiation tolerance, ensuring high-speed, fault-tolerant computing in extreme environments.
Segmentation 4: by Manufacturing Technique
Radiation-Hardening by Design to Dominate the Radiation-Hardened FPGA Market (by Manufacturing Technique)
Radiation-hardening by design (RHBD) is expected to dominate the radiation-hardened FPGA market due to its cost-effectiveness, scalability, and ability to enhance system reliability without requiring specialized fabrication processes.
This approach enables mass production using standard semiconductor processes, making it a preferred choice for aerospace, defense, and high-radiation industrial applications. With increasing government and commercial investments in deep-space exploration, autonomous military systems, and AI-driven satellite computing, RHBD-based radiation-hardened FPGAs are projected to drive the market, ensuring mission-critical reliability and cost-efficient deployment in extreme environments.
Segmentation 5: by Operating Frequency
Radiation-hardened FPGAs operating in the 51-100 MHz range offer an optimal balance between performance, power efficiency, and radiation resistance, making them well-suited for mission-critical aerospace, defense, and space exploration applications.
These FPGAs provide sufficient processing power for real-time data handling, secure communication, and control systems while maintaining high resilience against ionizing radiation and single-event upsets (SEUs). Their moderate operating frequency ensures efficient system performance without excessive power consumption, making them ideal for satellite payload processing, military avionics, and deep-space exploration missions.
Segmentation 6: by Region
North America is expected to dominate the radiation-hardened FPGA market, driven by technological leadership, strong defense investments, and advanced semiconductor manufacturing capabilities. The U.S. Department of Defense (DoD), NASA, and leading aerospace firms are pioneering radiation-hardened FPGA innovations for secure satellite communications, AI-powered defense systems, and deep-space exploration.
The region's extensive satellite networks, advanced R&D in AI and secure computing, and strong public-private collaborations further reinforce its leadership. With the increasing demand for high-reliability computing in extreme environments, North America is positioned to drive next-generation FPGA developments, ensuring mission-critical resilience in military, aerospace, and high-security applications, setting the stage for future autonomous space missions, and securing AI-driven defense infrastructure.
Recent Developments in the Radiation-Hardened FPGA Market
Demand - Drivers, Limitations, and Opportunities
Market Drivers: Increasing Space Exploration and Satellite Launches
The surge in space exploration and the proliferation of satellite launches have significantly propelled the demand for radiation-hardened field-programmable gate arrays (FPGAs). These specialized FPGAs are engineered to withstand the harsh radiation environments encountered in space, ensuring the reliability and longevity of satellite and spacecraft systems. As missions venture deeper into space and satellite constellations and expand, the necessity for robust electronic components that can endure cosmic radiation becomes paramount, positioning radiation-hardened FPGAs as critical components in modern aerospace technology.
Industry leaders have recognized this need, leading to the development of advanced radiation-hardened FPGAs. For instance, NASA's SpaceCube platform utilizes Xilinx's Virtex-4 commercial FPGAs, offering reconfigurable, high-performance systems designed for spaceflight applications requiring intensive onboard processing. Additionally, in May 2023, BAE Systems introduced the RH1020B, a radiation-hardened field-programmable gate array designed for military and space applications. Built on BAE Systems' 0.8µ epitaxial bulk complementary metal-oxide semiconductor (CMOS) process, this FPGA delivers high performance, gate array flexibility, and fast design implementation while ensuring radiation resistance.
Overall, the increasing integration of radiation-hardened FPGAs in space missions highlights their pivotal role in advancing aerospace technology. As space agencies and private enterprises continue to embark on ambitious projects, the reliance on these resilient components is expected to grow, driving innovation and ensuring the success of future explorations. This trend highlights the importance of developing durable electronic systems and signifies a robust market trajectory for radiation-hardened FPGAs in the aerospace sector.
Market Challenges: High Costs of Development and Production
The development and production of radiation-hardened field-programmable gate arrays (FPGAs) present significant financial challenges due to the specialized materials, manufacturing processes, and rigorous testing required to ensure resilience in high-radiation environments. These stringent requirements lead to substantially higher costs than standard electronic components, limiting their accessibility and adoption, particularly in cost-sensitive projects or emerging markets.
For instance, the higher cost of a radiation-hardened FPGA could prompt some space missions to consider using radiation-tolerant or even automotive/industrial-grade versions as alternatives. Additionally, the extensive testing and validation processes necessary to certify these components for high-radiation environments further escalate production costs, posing substantial financial hurdles for manufacturers and end users alike.
The industry is exploring cost-effective approaches, such as developing radiation-hardened commercial off-the-shelf (COTS) products to mitigate these challenges. This strategy involves modifying standard, mass-produced components to resist radiation effects through physical alterations or software techniques, thereby reducing development time and production expenses. Implementing such solutions could lower the entry barrier for companies aiming to participate in sectors such as space, defense, and nuclear industries, promoting broader adoption of radiation-hardened FPGAs.
Market Opportunities: Development of Rad Hard Commercial Off-the-Shelf (COTS) Products
The development of radiation-hardened commercial off-the-shelf (COTS) products presents a significant opportunity in the radiation-hardened FPGA market, aiming to balance cost-effectiveness with the stringent reliability requirements of space and defense applications. By utilizing existing commercial technologies and enhancing them for radiation tolerance, manufacturers can reduce development time and costs associated with custom radiation-hardened components, thereby making advanced technologies more accessible to a broader range of missions.
For instance, in February 2025, Zero-Error Systems launched the industry's first COTS FPGA-based radiation-tolerant system-on-module for space applications. This pre-integrated subsystem combines core processing components with radiation mitigation products on a single module, significantly reducing the time, complexity, and risks associated with developing satellite payload systems. The radiation-hardened by design (RHBD) platform extends satellite longevity by three times, minimizing space debris while enhancing the return on investment of expensive payloads up to four times.
Adopting radiation-hardened COTS products is expected to transform the radiation-hardened FPGA market by offering more affordable and readily available solutions without compromising performance and reliability. This approach accelerates development cycles and enables a wider array of organizations, including smaller companies and emerging nations, to participate in space and defense endeavors.
How can this report add value to an organization?
Product/Innovation Strategy: The product segment provides insights into the radiation-hardened FPGA market based on various applications of radiation-hardened FPGAs, categorized into space exploration (covering satellites and launch vehicles), defense (including defense vehicles, missiles, and munitions), and others. FPGA types segment it into antifuse-based, flash-based, and SRAM-based solutions. By material, the market focuses on silicon (Si), silicon carbide (SiC), and gallium nitride (GaN). The manufacturing techniques are categorized into radiation-hardening by design (RHBD), by process (RHBP), and by software (RHBS). Additionally, the market is analyzed by operating frequency, segmented into up to 50 MHz, 51-100 MHz, and above 100 MHz. Continuous technological innovations, growing investments in digital infrastructure, and rising demand for cloud and edge computing have been driving the adoption of these modular solutions. Consequently, the radiation-hardened FPGA market represents a high-growth and high-revenue business model with substantial opportunities for industry players.
Growth/Marketing Strategy: The radiation-hardened FPGA market has been growing at a rapid pace. The market offers enormous opportunities for existing and emerging market players. Some of the strategies covered in this segment are mergers and acquisitions, product launches, partnerships and collaborations, business expansions, and investments. The strategies preferred by companies to maintain and strengthen their market position primarily include product development.
Competitive Strategy: The key players in the radiation-hardened FPGA market analyzed and profiled in the study include professionals with expertise in the automobile and automotive domains. Additionally, a comprehensive competitive landscape such as partnerships, agreements, and collaborations are expected to aid the reader in understanding the untapped revenue pockets in the market.
Research Methodology
Factors for Data Prediction and Modelling
Market Estimation and Forecast
This research study involves the usage of extensive secondary sources, such as certified publications, articles from recognized authors, white papers, annual reports of companies, directories, and major databases to collect useful and effective information for an extensive, technical, market-oriented, and commercial study of the radiation-hardened FPGA market.
The market engineering process involves the calculation of the market statistics, market size estimation, market forecast, market crackdown, and data triangulation (the methodology for such quantitative data processes is explained in further sections). The primary research study has been undertaken to gather information and validate the market numbers for segmentation types and industry trends of the key players in the market.
Primary Research
The primary sources involve industry experts from the radiation-hardened FPGA market and various stakeholders in the ecosystem. Respondents such as CEOs, vice presidents, marketing directors, and technology and innovation directors have been interviewed to obtain and verify both qualitative and quantitative aspects of this research study.
The key data points taken from primary sources include:
Secondary Research
This research study of the radiation-hardened FPGA market involves extensive secondary research, directories, company websites, and annual reports. It also makes use of databases, such as Hoovers, Bloomberg, Businessweek, and Factiva, to collect useful and effective information for an extensive, technical, market-oriented, and commercial study of the global market. In addition to the aforementioned data sources, the study has been undertaken with the help of other data sources and websites, such as IRENA and IEA.
Secondary research was done in order to obtain crucial information about the industry's value chain, revenue models, the market's monetary chain, the total pool of key players, and the current and potential use cases and applications.
The key data points taken from secondary research include:
Key Market Players and Competition Synopsis
The companies that are profiled in the radiation-hardened FPGA market have been selected based on inputs gathered from primary experts who have analyzed company coverage, product portfolio, and market penetration.
Some of the prominent names in this market are:
Radiation-Hardened FPGA Market Manufacturers
Companies not part of the aforementioned pool have been well represented across different sections of the report (wherever applicable).
Scope and Definition