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Advanced Packaging Market Size, Share & Trends Analysis Report By Packaging Type, By Application, By Region, And Segment Forecasts, 2025 - 2030
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Advanced Packaging Market Growth & Trends:

The global advanced packaging market size is anticipated to reach USD 55.00 billion by 2030 and is projected to grow at a CAGR of 5.7% from 2025 to 2030, according to a new report by Grand View Research, Inc. The market is experiencing robust growth primarily due to the increasing demand for smaller, faster, and more energy-efficient electronic devices. As traditional Moore's Law scaling faces physical limitations, semiconductor manufacturers are turning to advanced packaging technologies such as 2.5D/3D integration, fan-out wafer-level packaging (FOWLP), and system-in-package (SiP) solutions to improve performance without shrinking transistor sizes. These technologies enable heterogeneous integration, allowing different types of chips to be combined in a single package, which is crucial for applications in artificial intelligence, automotive electronics, and data centers.

The proliferation of Internet of Things (IoT) devices, smartphones, and wearable technology is another significant driver for advanced packaging solutions. These devices require compact form factors while maintaining high performance and low power consumption - demands that advanced packaging technologies are uniquely positioned to address. Additionally, the automotive industry's shift toward electric vehicles and autonomous driving systems necessitates sophisticated semiconductor packages that can withstand harsh environments while delivering reliable performance, further accelerating market growth.

The emergence of 5G technology and high-performance computing applications represents another crucial catalyst for the advanced packaging sector. These technologies demand unprecedented levels of interconnect density, thermal management, and signal integrity that only advanced packaging solutions can provide. The ability to integrate RF components, memory, and processors in tightly coupled packages is becoming essential for next-generation computing and communication systems, stimulating innovation and investment in packaging technologies.

Global supply chain diversification efforts following recent disruptions have also contributed to market expansion as countries and companies seek to establish resilient semiconductor manufacturing ecosystems. This has led to increased investment in advanced packaging facilities worldwide, with growth in Asia-Pacific regions. Furthermore, sustainability concerns are influencing packaging design choices, with manufacturers focusing on developing environmentally friendly materials and processes that reduce waste and energy consumption, aligning with broader industry trends toward green technology solutions.

Advanced Packaging Market Report Highlights:

Table of Contents

Chapter 1. Methodology and Scope

Chapter 2. Executive Summary

Chapter 3. Global Advanced Packaging Market Variables, Trends, and Scope

Chapter 4. Global Advanced Packaging Market: Packaging Type Estimates & Trend Analysis

Chapter 5. Global Advanced Packaging Market: Application Estimates & Trend Analysis

Chapter 6. Global Advanced Packaging Market: Region Estimates & Trend Analysis

Chapter 7. Competitive Landscape

Chapter 8. Company Listing (Overview, Financial Performance, Products Overview)

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