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하이브리드 메모리 큐브(HMC) 및 고대역폭 메모리(HBM) 시장 - 용도별, 최종 용도별, 메모리 유형별, 용량별, 지역별 및 국가별 분석 : 분석 및 예측(2023-2033년)
Hybrid Memory Cube and High-Bandwidth Memory Market: Focus on Application, End Use, Memory Type, Capacity, and Regional and Country-Level Analysis - Analysis and Forecast, 2023-2033
상품코드 : 1420108
리서치사 : BIS Research Inc.
발행일 : 2024년 02월
페이지 정보 : 영문
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한글목차

하이브리드 메모리 큐브(HMC) 및 고대역폭 메모리(HBM) 시장 규모는 2023년에 약 40억 7,890만 달러로 평가되었습니다.

이 시장은 2023년부터 2033년까지 20.84%의 연평균 복합 성장률(CAGR)로 확대될 전망이며, 2033년에는 270억 7,860만 달러에 달할 것으로 예측되고 있습니다. AI, 빅데이터 분석, 고성능 컴퓨팅 등의 용도에 견인되어 다양한 산업에서 데이터 생성량이 급격히 증가하고 있는 것이, 특히 AI 가속기나 IoT 및 자율 시스템용 엣지 컴퓨팅으로, 대형 용량 데이터 세트를 효율적으로 처리하기 위한 고대역 및 대용량 메모리 솔루션 수요에 박차를 가해 시장 성장을 견인하고 있습니다.

주요 시장 통계
예측 기간 2023-2033년
평가액(2023년) 40억 7,000만 달러
예측(2033년) 270억 7,000만 달러
CAGR 20.84%

하이브리드 메모리 큐브는 TSV(through-silicon via-based: 실리콘 관통 전극) 기술을 이용한 스택드 다이나믹 랜덤 액세스 메모리(DRAM)용으로 설계된 컴퓨터 랜덤 액세스 메모리용 고성능 인터페이스입니다. 4개 또는 8개의 DRAM 다이와 1개의 로직 다이가 TSV를 통해 적층된 통합 패키지로 구성됩니다. 각 큐브의 메모리는 각 메모리 다이의 일부를 스택의 다른 메모리 다이의 해당 부분과 결합하여 수직으로 구성됩니다. 이와 대조적으로, 고대역폭 메모리(HBM)는 고대역폭과 저전력 소비를 겸비하도록 설계된 혁신적인 컴퓨터 메모리입니다. HBM은 주로 빠른 데이터 속도가 요구되는 고성능 컴퓨팅 용도에 적용되며 3D 스태킹 기술을 활용합니다. 이것은 스루 실리콘 비아(TSV)로 알려진 산업 채널을 통해 여러 칩 층을 서로 쌓는 것입니다.

하이브리드 메모리 큐브(HMC) 및 고대역폭 메모리(HBM) 기술은 반도체 및 메모리 분야에 큰 영향을 미쳤습니다. 이러한 도입은 메모리 성능과 데이터 대역폭을 크게 향상시켜 다양한 용도에서 보다 빠르고 효율적인 데이터 처리로 이어졌습니다. 이러한 기술 혁신은 인공지능(AI), 고성능 컴퓨팅, 그래픽 처리 유닛(GPU)의 확대를 지원하는 데 특히 중요하다는 것이 입증되었습니다. HMC 및 HBM은 신경망의 훈련과 추론을 포함한 메모리 집약적인 작업 수행을 효과적으로 촉진하고 AI와 머신러닝의 발전에 기여하고 있습니다. 또한 HMC 및 HBM을 에지 컴퓨팅에 통합하여 대기 시간을 줄이고 실시간 데이터 처리를 향상시켜 사물 인터넷(IoT) 및 자율 시스템 분야에서 필수적인 구성 요소가 되었습니다. HMC 및 HBM의 기술은 전체로서 메모리 기능의 향상과 기술 진보의 촉진에 매우 중요한 역할을 하고 있습니다.

본 보고서에서는 세계의 하이브리드 메모리 큐브(HMC) 및 고대역폭 메모리(HBM) 시장에 대해 조사했으며, 시장 개요와 함께 용도별, 최종 용도별, 메모리 유형별, 용량별, 지역 및 국가별 동향 및 시장 진출기업 프로파일 등의 정보를 제공합니다.

목차

주요 요약

범위 및 정의

제1장 시장

제2장 용도

제3장 제품

제4장 지역

제5장 시장 : 경쟁 벤치마킹 및 기업 프로파일

제6장 조사 방법

AJY
영문 목차

영문목차

“The Global Hybrid Memory Cube and High-Bandwidth Memory Market Expected to Reach $27,078.6 Million by 2033.”

Introduction to Hybrid Memory Cube and High-Bandwidth Memory Market

The hybrid memory cube and high-bandwidth memory market was valued at around $4,078.9 million in 2023 and is expected to reach $27,078.6 million by 2033, at a CAGR of 20.84% from 2023 to 2033. The exponential growth in data generation across various industries, driven by applications such as AI, big data analytics, and high-performance computing, is fueling the demand for high-bandwidth and high-capacity memory solutions to efficiently handle large datasets, particularly in AI accelerators and edge computing for IoT and autonomous systems, driving market growth.

KEY MARKET STATISTICS
Forecast Period2023 - 2033
2023 Evaluation$4.07 Billion
2033 Forecast$27.07 Billion
CAGR20.84%

Market Introduction

A hybrid memory cube serves as a high-performance interface for computer random-access memory designed for stacked dynamic random-access memory (DRAM) using through-silicon via-based (TSV) technology. It comprises a consolidated package with either four or eight DRAM dies and one logic die, all stacked together through TSV. Memory within each cube is vertically organized, combining sections of each memory die with corresponding portions of others in the stack. In contrast, high-bandwidth memory (HBM) represents an innovative form of computer memory engineered to deliver a blend of high-bandwidth and low power consumption. Primarily applied in high-performance computing applications that demand swift data speeds, HBM utilizes 3D stacking technology. This involves stacking multiple layers of chips on top of each other through vertical channels known as through-silicon vias (TSVs)

Industry Impact

Hybrid memory cube (HMC) and high-bandwidth memory (HBM) technologies have exerted a profound influence on the semiconductor and memory sectors. Their introduction has brought significant enhancements in memory performance and data bandwidth, leading to swifter and more efficient data processing across various applications. These innovations have proven particularly pivotal in underpinning the expansion of artificial intelligence (AI), high-performance computing, and graphics processing units (GPUs). HMC and HBM have effectively facilitated the execution of memory-intensive tasks, such as neural network training and inference, thereby contributing to the advancement of AI and machine learning. Furthermore, their integration into edge computing has yielded reductions in latency and improvements in real-time data processing, rendering them indispensable components in the realms of the Internet of Things (IoT) and autonomous systems. Collectively, HMC and HBM technologies have played a pivotal role in elevating memory capabilities and expediting technological advancements.

Market Segmentation:

Segmentation 1: by Application

Graphics Processing Unit (GPU) to Lead the Market (by Application)

Hybrid memory cubes and high-bandwidth memory offer significant memory bandwidth improvements, particularly beneficial for GPUs in graphics rendering and parallel computing. They excel in gaming and professional graphics applications, enabling efficient handling of large textures and high-resolution graphics. The 3D stacking feature also enables compact GPU designs, ideal for space-constrained environments such as laptops and small form factor PCs.

Segmentation 2: by End Use

High-Performance Computing to Lead the Market (by End Use)

In high-performance computing (HPC) environments, GPUs are widely used for parallel processing tasks. Hybrid memory cubes and high-bandwidth memory provide substantial benefits in managing large datasets and parallel workloads, enhancing the overall performance of HPC applications, including simulations, data analytics, machine learning, and scientific research, where high-bandwidth memory plays a crucial role in efficiently processing complex and data-intensive tasks.

Segmentation 3: by Memory Type

High-Bandwidth Memory to Lead the Market (by Memory Type)

High-bandwidth memory is commonly employed in GPUs and accelerators for applications such as gaming, graphics rendering, and high-performance computing (HPC), where high memory bandwidth is crucial for optimal performance. It is particularly suitable for scenarios with limited space constraints, where a compact footprint is essential.

Segmentation 4: by Capacity

High-bandwidth memory is available in various capacities, typically from 1GB to 8GB per stack, and GPUs can use multiple stacks to increase memory capacity for handling diverse computational tasks and larger datasets. Hybrid memory cubes come in capacities ranging from 2GB to 16GB per module, offering scalability to configure systems based on performance requirements. This modularity provides flexibility to adapt memory configurations for various applications and computing environments.

Segmentation 5: by Region

North America Region to Lead the Market (by Region)

North America, especially the U.S., is a central hub for the global semiconductor industry, hosting major players heavily involved in memory technologies. The adoption of hybrid memory cubes and high-bandwidth memory across sectors such as gaming, networking, and high-performance computing has bolstered North America's leadership. Key semiconductor manufacturers in the region, such as AMD, Micron, and NVIDIA, drive innovation and competition, firmly establishing North America as a pivotal market for these memory technologies. This dynamic landscape is marked by continuous advancements in hybrid memory cubes and high-bandwidth memory.

Recent Developments

Demand - Drivers, Restraints, and Opportunities

Market Drivers

Hybrid memory cube (HMC) and high-bandwidth memory (HBM) offer exceptional performance but grapple with cost challenges in comparison to standard DRAM. Organizations must carefully balance their remarkable speed and efficiency with the higher costs associated with HMC and HBM, influencing their procurement decisions. In the consumer electronics sector, the preference for cost-effective alternatives intensifies competition, potentially limiting the demand for these advanced memory technologies. Manufacturers of HMC and HBM are actively pursuing innovations to reduce costs and enhance affordability despite the existing challenges. However, their technological advancements hold promise for cost reduction as production methods continue to evolve.

Moreover, the stacking of memory layers in HMC and HBM has raised concerns about thermal issues, which can adversely affect performance and reliability. These concerns may drive a shift in demand toward memory solutions that offer comparable performance with lower thermal footprints, potentially impacting adoption rates. Memory manufacturers are investing in the development of advanced thermal management solutions and innovative cooling techniques, which could influence pricing. Ongoing efforts to design memory modules with improved heat dissipation properties aim to enhance their reliability and long-term usability.

Market Restraints

Hybrid memory cube (HMC) and high-bandwidth memory (HBM) are valued for performance but face cost challenges compared to standard DRAM. Organizations weigh their speed and efficiency against costs, impacting procurement. In consumer electronics, cost-effectiveness favors alternatives, increasing competition. HMC and HBM manufacturers aim to innovate and reduce costs. Despite challenges, their technological advancements have the potential for cost reduction as production methods evolve.

Stacking memory layers in HMC and HBM can lead to thermal issues, impacting performance and reliability. Concerns about heat may shift demand toward memory solutions with lower thermal impact, potentially affecting adoption rates. Memory manufacturers focus on enhancing thermal management solutions and innovative cooling techniques, which may impact pricing. Efforts to design modules with improved heat dissipation continue, enhancing reliability.

Market Opportunities

The proliferation of edge-based technologies, driven by IoT devices and AI applications, has created a demand for high-performance memory solutions. Hybrid memory cube (HMC) and high-bandwidth memory (HBM) have emerged as crucial components in supporting these technologies by providing rapid data processing and low latency, essential for edge computing. The European Commission's support for initiatives in cloud, edge, and IoT technologies further underscores the importance of efficient memory solutions. HMC and HBM's capabilities align with the requirements of edge devices, enabling seamless execution of AI algorithms and real-time analytics.

The adoption of autonomous driving technology presents a lucrative opportunity for HMC and HBM. These memory solutions efficiently handle the vast data volumes generated by autonomous vehicles, ensuring rapid data access and minimal latency for swift decision-making. Their energy-efficient nature supports extended battery life, and their scalability accommodates evolving autonomous technologies, making them indispensable in meeting the demands of the autonomous driving industry.

Key Market Players and Competition Synopsis

The companies that are profiled in the hybrid memory cube and high-bandwidth memory market have been selected based on inputs gathered from primary experts and analyzing company coverage, product portfolio, and market penetration.

Some of the prominent names in the market are:

  • Samsung Electronics Co., Ltd.
  • ALPHAWAVE SEMI
  • Fujitsu Ltd.
  • NVIDIA Corporation
  • Advanced Micro Devices, Inc.
  • SK HYNIX INC.
  • Micron Technology, Inc.
  • Intel Corporation
  • Cadence Design Systems, Inc.
  • Rambus
  • Simms International plc
  • IBM
  • Achronix Semiconductor Corporation
  • Hewlett Packard Enterprise
  • Renesas Electronics Corporation

Key Questions Answered in this Report:

Table of Contents

Executive Summary

Scope and Definition

1. Markets

2. Application

3. Products

4. Regions

5. Markets - Competitive Benchmarking & Company Profiles

6. Research Methodology

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