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High Bandwidth Memory - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2025 - 2030)
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High Bandwidth Memory-Market-IMG1

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°í´ë¿ªÆø ¸Þ¸ð¸®(HBM) ½ÃÀåÀÇ ¼ºÀåÀ» °ßÀÎÇÏ´Â ÁÖ¿ä ¿äÀÎÀ¸·Î´Â °í´ë¿ªÆø, Àú¼Òºñ Àü·Â, °íÈ®À强 ¸Þ¸ð¸®¿¡ ´ëÇÑ ¿ä±¸ Áõ°¡, ÀΰøÁö´É ä¿ë Áõ°¡, ÀüÀÚ±â±âÀÇ ¼ÒÇüÈ­ µ¿Çâ Áõ°¡ µîÀÌ ÀÖ½À´Ï´Ù.

ȸ·Î¿¡ 8°³ÀÇ DRAM ´ÙÀ̸¦ ÀûÃþÇϰí TSV·Î »óÈ£ ¿¬°áÇÔÀ¸·Î½á HBMÀº ºñ±³Àû ÀÛÀº Æû ÆÑÅÍ·Î ÀûÀº Àü·Â ¼Ò¸ð·Î »ó´çÈ÷ ³ôÀº ´ë¿ªÆøÀ» Á¦°øÇÕ´Ï´Ù. ¶ÇÇÑ 128ºñÆ® ä³Î°ú ÃÑ 8ä³Î·Î HBMÀº 1,024ºñÆ® ÀÎÅÍÆäÀ̽º¸¦ ¼³¸íÇÕ´Ï´Ù. 4°³ÀÇ HBM ½ºÅÃÀÌ ÀÖ´Â GPU´Â 4,096ºñÆ® ¸Þ¸ð¸® ¹ö½º¸¦ Á¦°øÇÕ´Ï´Ù.

¿¹¸¦ µé¾î, 2024³â 6¿ù ¹Ì±¹ÀÇ ¸Þ¸ð¸® Ĩ Á¦Á¶¾÷üÀÎ Micron Technology´Â ¹Ì±¹ ³»¿¡¼­ °í±Þ °í´ë¿ªÆø ¸Þ¸ð¸®(HBM) Ĩ Å×½ºÆ® »ý»ê ¶óÀÎÀ» °Ç¼³Çß½À´Ï´Ù. ÀÌ È¸»ç´Â AI ºÕ¿¡ ´ëÇÑ ¼ö¿ä¸¦ ´õ¿í ĸóÇϱâ À§ÇØ ¸»·¹À̽þƿ¡¼­ óÀ½À¸·Î HBMÀ» Á¦Á¶ÇÏ´Â °ÍÀ» °í·ÁÇϰí ÀÖ½À´Ï´Ù.

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The High Bandwidth Memory Market size is estimated at USD 3.17 billion in 2025, and is expected to reach USD 10.02 billion by 2030, at a CAGR of 25.86% during the forecast period (2025-2030).

High Bandwidth Memory - Market - IMG1

High bandwidth memory (HBM) is a high-speed computer memory interface for 3D-stacked SDRAM, usually used with high-performance graphics accelerators, network devices, and supercomputers.

Major factors driving the growth of the high bandwidth memory (HBM) market include the growing need for high bandwidth, low power, and highly scalable memories, increasing adoption of artificial intelligence, and a rising trend of miniaturization of electronic devices.

By stacking up 8 DRAM dies on the circuit and interconnecting them with TSVs, HBM offers a substantially higher bandwidth while using less power in a relatively minor form factor. Also, with 128-bit channels and a total of 8 channels, the HBM offers a 1,024-bit interface. A GPU with four HBM stacks would provide a memory bus with 4,096 bits.

For instance, in June 2024, US memory chip maker Micron Technology built test production lines for advanced high bandwidth memory chips in the United States. The company is considering manufacturing HBM in Malaysia for the first time to capture more demand from the AI boom.

With the growing graphics application, the appetite for fast information delivery (bandwidth) has also increased. Therefore, HBM performs better than GDDR5, which was used earlier in terms of performance and power efficiency, resulting in growth opportunities for the high bandwidth memory market.

Moreover, the major semiconductor vendors worked with reduced capacity due to the COVID-19 pandemic. Additionally, due to the shortage of laborers, many packages and testing plants in China reduced or even stopped operations. This created a bottleneck for chip companies that rely on such back-end packages and testing capacity.

However, some factors driving the market's growth include the increasing adoption of artificial intelligence, increasing demand for low power consumption, high bandwidth, highly scalable memories, and a rising trend of miniaturization of electronic devices.

High Bandwidth Memory Market Trends

The Automotive and Other Applications Segment is Expected to Grow Significantly

North America to Hold the Largest Share in the Market

High Bandwidth Memory Industry Overview

The high bandwidth memory market is highly fragmented. The market is highly competitive and consists of several major players. This industry's competitive rivalry primarily depends on sustainable competitive advantage through innovation, market penetration, and competitive strategy power. Since the market is capital-intensive, the barriers to exit are also high. Some of the key players in the market are Intel Corporation, Toshiba Corporation, and Fujitsu Ltd.

Additional Benefits:

TABLE OF CONTENTS

1 INTRODUCTION

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

5 MARKET SEGMENTATION

6 COMPETITIVE LANDSCAPE

7 INVESTMENT ANALYSIS

8 MARKET OPPORTUNITIES AND FUTURE TRENDS

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