Stratistics MRC에 따르면 세계의 하이브리드 메모리 큐브(HMC) 시장은 2025년 24억 달러를 차지하고 예측 기간 동안 CAGR 20%로 성장했으며 2032년에는 87억 달러에 이를 전망입니다.
하이브리드 메모리 큐브(HMC)는 데이터 처리 속도와 효율성을 높이기 위해 설계된 고성능 메모리 아키텍처입니다. 하이 퍼포먼스 컴퓨팅, 인공지능, 데이터센터 등의 용도에 이상적입니다.
GSMA 보고서에 따르면 2030년 말까지 아시아태평양에서 약 14억 개의 5G 연결이 예상됩니다.
고성능 컴퓨팅(HPC) 및 AI/ML의 폭발적 성장
데이터 집약적인 워크로드가 확대됨에 따라 기존의 메모리 아키텍처는 처리 요구 사항을 따라잡기 어려워지고 있습니다. 보다 빠른 계산을 가능하게 하고 대기 시간을 단축할 수 있습니다.
고대역폭 메모리(HBM)의 이점과 경쟁
GPU, AI 가속기 및 데이터센터에서 널리 채택된 HBM은 HMC 시장 침투에 어려움을 겪고 있습니다. HMC를 기존 시스템에 통합하는 비용과 복잡성은 HMC의 채택을 더욱 제한하기 때문에 HMC의 기능을 차별화하고 시장 수용성을 높이기 위한 전략적 노력이 필요합니다.
3D 적층 및 상호 연결 기술의 추가 발전
실리콘 관통 전극(TSV) 및 상호 연결 아키텍처 개선을 포함한 고급 패키징 솔루션의 개발은 메모리 효율성과 확장성을 향상시킵니다. 반도체 제조업체가 메모리 아키텍처 최적화에 투자하는 동안 HMC는 AI 프로세서, 클라우드 인프라, 고속 네트워킹 용도과의 통합성 향상을 통해 혜택을 누릴 수 있습니다.
대체 고 대역폭 메모리의 출현
DDR5와 차세대 HBM과 같은 새로운 메모리 기술은 경쟁력있는 성능과 비용 우위를 제공합니다. HMC 개발자는 효율성을 높이고 제조 비용을 줄이고 전략적 파트너십을 확보하고 다양한 컴퓨팅 용도에서 채택을 강화해야 할 수 있습니다.
COVID-19의 유행은 HMC 시장에 다양한 영향을 주었고 공급망과 반도체 생산에 영향을 미쳤습니다. 이니셔티브를 가속화하였습니다. 산업계가 유행 후 비즈니스 모델에 적응함에 따라 HPC 및 AI 인프라에 대한 투자가 급증하고 첨단 컴퓨팅 환경에서 HMC 기술의 회복과 성장을 지원했습니다.
예측 기간 동안 2GB HMC 모듈 부문이 최대가 될 전망
2GB HMC 모듈 부문은 고성능으로 중간 정도의 메모리 용량을 필요로 하는 컴퓨팅 시스템에 널리 채용되고 있기 때문에 예측 기간 중에 최대 시장 점유율을 차지할 것으로 예측됩니다.
예측 기간 동안 필드 프로그래머블 게이트 어레이(FPGA) 분야의 CAGR이 가장 높을 것으로 예상
예측 기간 동안 필드 프로그래머블 게이트 어레이(FPGA) 부문은 AI, 네트워킹 및 고속 데이터 분석을 위한 맞춤형 하드웨어 가속기에서 사용하여 가장 높은 성장률을 나타낼 것으로 예측됩니다. 그리고 고대역폭 기능의 이점을 통해 프로그래머블 아키텍처의 전반적인 성능을 향상시킬 수 있습니다.
예측 기간 동안 북미는 고성능 컴퓨팅, AI 혁신, 첨단 반도체 산업의 강력한 존재에 견인되어 최대 시장 점유율을 차지할 것으로 예측됩니다. 주요 기술 기업과 연구 기관은 메모리 기술을 포함한 차세대 컴퓨팅 인프라에 많은 투자를 하고 있습니다.
예측 기간 동안 아시아태평양은 급속한 디지털 전환과 AI 및 5G 기술에 대한 투자 증가로 가장 높은 CAGR을 보여줄 것으로 예측됩니다.
According to Stratistics MRC, the Global Hybrid Memory Cube (HMC) Market is accounted for $2.4 billion in 2025 and is expected to reach $8.7 billion by 2032 growing at a CAGR of 20% during the forecast period. Hybrid Memory Cube (HMC) is high-performance memory architecture designed to enhance data processing speed and efficiency. It utilizes stacked memory layers interconnected through high-bandwidth pathways, significantly outperforming traditional DRAM solutions. HMC reduces latency, increases bandwidth, and optimizes power consumption, making it ideal for applications in high-performance computing, artificial intelligence, and data centers. By integrating logic-based memory controllers, HMC offers streamlined data management and improved parallel processing, enabling faster and more energy-efficient operations in advanced computing systems.
According to the GSMA report, by the end of 2030, there will be around 1.4 billion 5G connections in Asia Pacific.
Explosive growth in high-performance computing (HPC) and AI/ML
As data-intensive workloads expand, traditional memory architectures struggle to keep pace with processing requirements. HMC offers superior bandwidth and efficiency, enabling faster computations and reducing latency in AI-driven analytics, deep learning, and cloud-based applications. The surge in AI accelerators and next-generation processors further strengthens the need for high-speed memory solutions, positioning HMC as a critical component in advanced computing environments.
Dominance and competition from high bandwidth memory (HBM)
HBM's widespread adoption in GPUs, AI accelerators, and data centers presents a challenge for HMC's market penetration. Additionally, HBM benefits from strong industry backing and established manufacturing processes, making it a preferred choice for many high-performance applications. The cost and complexity of integrating HMC into existing systems further limit its adoption, requiring strategic efforts to differentiate its capabilities and enhance market acceptance.
Further advancements in 3D stacking and interconnect technologies
The development of advanced packaging solutions, including through-silicon vias (TSVs) and improved interconnect architectures, enhances memory efficiency and scalability. These advancements enable higher data transfer rates while reducing power consumption, making HMC an attractive option for next-generation computing systems. As semiconductor manufacturers invest in optimizing memory architectures, HMC stands to benefit from improved integration with AI processors, cloud infrastructure, and high-speed networking applications.
Emergence of alternative high-bandwidth memory
Emerging memory technologies, such as DDR5 and next-generation HBM variants, offer competitive performance and cost advantages. Additionally, ongoing research into non-volatile memory and optical memory solutions could disrupt the market landscape, shifting demand away from HMC. To maintain relevance, HMC developers must focus on enhancing efficiency, reducing production costs, and securing strategic partnerships to strengthen adoption across diverse computing applications.
he COVID-19 pandemic had a mixed impact on the HMC market, affecting supply chains and semiconductor production. While initial disruptions led to delays in manufacturing and component shortages, the crisis also accelerated digital transformation initiatives. As industries adapted to post-pandemic operational models, investments in HPC and AI infrastructure surged, supporting the recovery and growth of HMC technology in advanced computing environments.
The 2GB HMC modules segment is expected to be the largest during the forecast period
The 2GB HMC modules segment is expected to account for the largest market share during the forecast period due to its widespread adoption in computing systems that require moderate memory capacity with high performance. These modules strike an optimal balance between power efficiency and bandwidth, making them suitable for a variety of applications, including embedded systems and networking equipment. Their cost-effectiveness compared to higher-capacity modules also makes them attractive for volume-based implementations.
The field-programmable gate array (FPGA) segment is expected to have the highest CAGR during the forecast period
Over the forecast period, the field-programmable gate array (FPGA) segment is predicted to witness the highest growth rate owing to their use in custom hardware accelerators for AI, networking, and high-speed data analytics. These devices benefit from HMC's low-latency and high-bandwidth capabilities, enhancing the overall performance of programmable architectures. As industries seek flexible, reconfigurable computing platforms, FPGAs paired with HMC offer a powerful combination of speed and adaptability.
During the forecast period, the North America region is expected to hold the largest market share driven by its strong presence in high-performance computing, AI innovation, and advanced semiconductor industries. Major technology firms and research institutions in the U.S. are investing heavily in next-generation computing infrastructure, including memory technologies. Government initiatives promoting technological sovereignty and defense applications also contribute to demand.
Over the forecast period, the Asia Pacific region is anticipated to exhibit the highest CAGR fueled by rapid digital transformation and increasing investments in AI and 5G technologies. Countries like China, South Korea, Taiwan, and India are expanding their semiconductor manufacturing capacities and developing advanced computing infrastructure. Regional tech giants are embracing HMC for its performance benefits, particularly in AI processing and cloud services.
Key players in the market
Some of the key players in Hybrid Memory Cube (HMC) Market include Samsung Electronics, Micron Technology, Intel Corporation, IBM Corporation, NVIDIA Corporation, Broadcom Inc., G.Skill International Enterprise Co., Ltd., Corsair Memory Inc., Marvell Technology Group, Western Digital Corporation, Kingston Technology Corporation, Fujitsu Limited, Advanced Micro Devices (AMD), Toshiba Memory Corporation, and Rambus Inc.
In May 2025, Sanmina announced the acquisition of ZT Systems' manufacturing business from AMD for up to $3 billion, with AMD retaining the AI systems design segment and partnering with Sanmina for new product introductions.
In April 2025, Rambus and Micron Technology extended their patent license agreement for five years, enabling broad access to Rambus innovations and continuing their product collaboration.
In April 2025, Fujitsu expanded its strategic collaboration with Supermicro to offer a comprehensive generative AI platform, including OEM servers and managed services for large language models.