한글목차

이 보고서는 세계 칩렛 시장을 조사했으며, 시장 개요, 시장 영향요인 및 시장 기회 분석, 법 규제 환경, 신기술 및 기술 개발 동향, 시장 규모 추이· 예측, 각종 구분· 지역별의 상세 분석, 경쟁 구도, 주요 기업 프로파일 등을 정리했습니다.

목차

제1장 주요 요약

• 시장 전망
• 조사 범위
• 시장 분석

제2장 시장 개요

• 개요
• 거시경제 요인
• 첨단 패키징 기술
• 지정학적 긴장
• 전망

제3장 시장 역학

• 개요
• 시장 성장 촉진요인
• 고성능 컴퓨팅
• 5G 칩렛에 대한 요구 증가
• 시장 성장 억제요인/과제
• 숙련 기술자의 부족
• 세계의 정치·금융 위기
• 시장 기회
• 반도체 산업에 대한 지속적인 투자
• 첨단 운전 지원 시스템(ADAS)에서의 사용

제4장 규제 상황

• 개요
• 북미
• 아시아태평양
• 유럽
• 기타

제5장 신기술

• 신흥기술
• 이종 통합
• 3D 통합
• 첨단 포장
• 공 패키지 광학 부품
• 칩렛 기반 시스템 온칩

제6장 시장 세분화 분석

• 세분화의 내역
• 시장 분석 : 프로세서별
• CPU
• 그래픽 프로세싱 유닛
• 필드 프로그래머블 게이트 어레이
• AI-ASIC 코프로세서
• 용도 처리 유닛
• 시장 분석 : 패키징 기술별
• 3D
• 시스템 인 패키지
• 웨이퍼 레벨 칩 스케일 패키징
• 플립 칩 칩 스케일 패키지
• 플립 칩 볼 그리드 어레이
• 팬아웃
• 시장 분석 : 최종사용자산업별
• 엔터프라이즈 일렉트로닉스
• CE 제품
• 산업 자동화
• 자동차
• 헬스케어
• 군사 및 항공우주
• 기타
• 지리적 내역
• 시장 분석 : 지역별
• 북미
• 유럽
• 아시아태평양
• 기타 지역

제7장 경쟁 구도

• 시장 생태계 분석
• 주요 기업의 분석
• 전략 분석

제8장 부록

• 조사 방법
• 참고문헌
• 약어
• 기업 프로파일
• ACHRONIX SEMICONDUCTOR CORP.
• ADVANCED MICRO DEVICES INC.
• BROADCOM
• GLOBALFOUNDRIES INC.
• IBM CORP.
• INTEL CORP.
• NVIDIA CORP.
• RANOVUS
• SAMSUNG
• TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.

영문목차

This report assesses the chiplets market by processor, packaging technology, end-user, and regions. It also analyzes related companies and service providers. The report also discusses market dynamics, such as drivers, opportunities, and restraints. The study forecasts the market value ($ million) of chiplets for key geographies. The report also focuses on the key emerging technologies that will fuel their adoption in the near future.

Report Scope

This report offers a comprehensive analysis of chiplets, with a focus on five processor segments: CPUs, GPUs, field-programmable gate arrays (FPGAs), AI-application-specific integrated circuit (AI-ASIC) coprocessors and application processing units (APUs). The report further segments the market by packaging technology, specifically 2.5D/3D, system-in-package (SiP), wafer-level chip-scale package (WLCSP), flip chip chip-scale package (FCCSP), flip chip ball grid array (FCBGA) and fan-out (FO). In addition, the chiplet market is segmented by end users: enterprise electronics, consumer electronics, industrial automation, automotive, healthcare, military and aerospace. The use of chiplets in other sectors, such as IT and telecommunication, scientific research and gaming, is also analyzed. Regions covered include North America, Europe, Asia-Pacific and the rest of the world (RoW), which includes Latin America, the Middle East and Africa.

The study also analyzes the key drivers, macroeconomic factors and regional dynamics of the chiplet market. The report concludes by providing profiles of the leading chiplet manufacturers. The base year for the study is 2023, with market forecasts for 2024 through 2029, including projections of the compound annual growth rates (CAGRs) for the forecast period 2024-2029.

Report Includes

• In-depth assessment of the global market for semiconductor chiplets
• Analyses of global market trends, with market revenue data for 2023, estimates for 2024, forecasts for 2025 and 2027, and projected CAGRs through 2029
• Estimates of the market size and revenue growth prospects, along with a market share analysis by processor type, packaging technology, end use (application) industry and region
• Facts and figures pertaining to the market dynamics, technical advances, regulations, and the impact of macroeconomic factors
• Analysis of the industry structure, including companies' market shares and rankings, strategic alliances, M&A activities, and a venture funding outlook
• Company profiles

Table of Contents

Chapter 1 Executive Summary

• Market Outlook
• Scope of the Report
• Market Summary

Chapter 2 Market Overview

• Overview
• Macroeconomic Factors
• Advanced Packaging Technologies
• Geopolitical Tensions
• Outlook

Chapter 3 Market Dynamics

• Overview
• Market Drivers
• High-Performance Computing
• 5G's Growing Need for Chiplets
• Market Restraints/Challenges
• Shortage of Skilled Labor
• Global Political and Financial Crises
• Market Opportunities
• Continuing Investment in the Semiconductor Industry
• Use in Advanced Driver-Assistance Systems (ADAS)

Chapter 4 Regulatory Landscape

• Overview
• North America
• Asia-Pacific
• Europe
• RoW

Chapter 5 Emerging Technologies

• Emerging Technologies
• Heterogeneous Integration
• 3D Integration
• Advanced Packaging
• Co-Packaged Optics
• Chiplet-Based Systems-on-Chip

Chapter 6 Market Segmentation Analysis

• Segmentation Breakdown
• Market Breakdown by Processor
• CPUs
• Graphics Processing Units
• Field-Programmable Gate Arrays
• AI-ASIC Coprocessors
• Application Processing Units
• Market Breakdown by Packaging Technology
• 2.5D/3D
• System-in-Package
• Wafer-Level Chip-Scale Packaging
• Flip Chip Chip-Scale Package
• Flip Chip Ball Grid Array
• Fan-Out
• Market Breakdown by End-User Industry
• Enterprise Electronics
• Consumer Electronics
• Industrial Automation
• Automotive
• Healthcare
• Military and Aerospace
• Other End-User Industries
• Geographical Breakdown
• Market Breakdown by Region
• North America
• Europe
• Asia-Pacific
• Rest of the World

Chapter 7 Competitive Landscape

• Market Ecosystem Analysis
• Analysis of Leading Companies
• Strategic Analysis
• Recent Developments

Chapter 8 Appendix

• Research Methodology
• References
• Abbreviations
• Company Profiles
• ACHRONIX SEMICONDUCTOR CORP.
• ADVANCED MICRO DEVICES INC.
• BROADCOM
• GLOBALFOUNDRIES INC.
• IBM CORP.
• INTEL CORP.
• NVIDIA CORP.
• RANOVUS
• SAMSUNG
• TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.