하이브리드 메모리 큐브 시장 - 세계 산업 규모, 점유율, 동향, 기회 및 예측 : 제품 유형별, 용도별, 지역별, 경쟁 구도별(2021-2031년)
Hybrid Memory Cube Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Product Type, By Application (High-Performance Computing, Networking, Data Centers & Graphics), By Region & Competition, 2021-2031F
상품코드:1901712
리서치사:TechSci Research
발행일:2026년 01월
페이지 정보:영문 182 Pages
라이선스 & 가격 (부가세 별도)
ㅁ Add-on 가능: 고객의 요청에 따라 일정한 범위 내에서 Customization이 가능합니다. 자세한 사항은 문의해 주시기 바랍니다.
한글목차
세계의 하이브리드 메모리 큐브 시장은 2025년 37억 1,000만 달러에서 2031년까지 100억 7,000만 달러에 이르고, CAGR 18.11%로 성장할 전망입니다.
하이브리드 메모리 큐브(HMC)는 동적 랜덤 액세스 메모리(DRAM) 다이를 수직 적층하고 실리콘 관통 전극(TSV)을 통해 고속 로직 층에 연결하여 정의되는 고성능 메모리 아키텍처입니다. 이 혁신적인 설계는 기존 평면형 메모리에 내재된 대역폭 병목현상을 해소하고, 데이터 처리속도를 크게 향상시키고 에너지 효율을 개선합니다.
시장 개요
예측 기간
2027-2031년
시장 규모 : 2025년
37억 1,000만 달러
시장 규모 : 2031년
100억 7,000만 달러
CAGR : 2026-2031년
18.11%
가장 성장이 빠른 부문
고성능 컴퓨팅(HPC)
최대 시장
북미
주요 시장 성장 촉진요인
인공지능 및 머신러닝 워크로드 도입이 가속화되면서 세계 하이브리드 메모리 큐브 시장의 주요 촉진요인으로 작용하고 있습니다. 신경망과 대규모 언어 모델의 복잡성에 따라 처리 병목현상을 방지하기 위해 방대한 데이터 처리량을 유지할 수 있는 메모리 아키텍처가 요구되고 있습니다.
주요 시장 과제
정밀한 3D 적층 및 실리콘 관통전극(TSV) 제조에 따른 높은 제조 비용과 기술적 복잡성은 하이브리드 메모리 큐브 시장 확대에 큰 걸림돌이 되고 있습니다. DRAM 다이를 로직 레이어에 수직으로 연결하는 복잡한 공정은 고도로 전문화된 생산 환경을 필요로 하며, 이는 필연적으로 생산 수율을 제한하고 단가를 상승시키는 요인으로 작용합니다.
주요 시장 동향
칩렛 기반 및 이기종 아키텍처의 채택은 반도체 설계를 근본적으로 변화시키고 3D 메모리 기술의 통합을 촉진하고 있습니다. 제조업체들이 물리적 미세화의 한계를 극복하기 위해 모놀리식 다이 설계에서 벗어나 다양한 로직과 메모리 부품을 수직으로 상호 연결하기 위해 첨단 패키징 기술을 활용하고 있습니다.
목차
제1장 개요
제2장 조사 방법
제3장 주요 요약
제4장 고객의 소리
제5장 세계의 하이브리드 메모리 큐브 시장 전망
시장 규모와 예측
금액별
시장 점유율과 예측
제품 유형별(중앙 처리장치, 필드 프로그래머블 게이트 어레이, 그래픽 처리 장치, 주문형 집적회로, 고속 처리 장비)
용도별(고성능 컴퓨팅(HPC), 네트워크, 데이터센터 및 그래픽스)
지역별
기업별(2025)
시장 맵
제6장 북미의 하이브리드 메모리 큐브 시장 전망
시장 규모와 예측
시장 점유율과 예측
북미 : 국가별 분석
미국
캐나다
멕시코
제7장 유럽의 하이브리드 메모리 큐브 시장 전망
시장 규모와 예측
시장 점유율과 예측
유럽 : 국가별 분석
독일
프랑스
영국
이탈리아
스페인
제8장 아시아태평양의 하이브리드 메모리 큐브 시장 전망
시장 규모와 예측
시장 점유율과 예측
아시아태평양 : 국가별 분석
중국
인도
일본
한국
호주
제9장 중동 및 아프리카의 하이브리드 메모리 큐브 시장 전망
시장 규모와 예측
시장 점유율과 예측
중동 및 아프리카 : 국가별 분석
사우디아라비아
아랍에미리트(UAE)
남아프리카공화국
제10장 남미의 하이브리드 메모리 큐브 시장 전망
시장 규모와 예측
시장 점유율과 예측
남미 : 국가별 분석
브라질
콜롬비아
아르헨티나
제11장 시장 역학
성장 촉진요인
과제
제12장 시장 동향과 발전
인수합병(M&A)
제품 출시
최근 동향
제13장 세계의 하이브리드 메모리 큐브 시장 : SWOT 분석
제14장 Porter의 Five Forces 분석
업계내 경쟁
신규 참여 가능성
공급업체의 힘
고객의 힘
대체품의 위협
제15장 경쟁 구도
Micron Technology, Inc.
Intel Corporation
Samsung Electronics Co., Ltd.
SK hynix Inc.
Advanced Micro Devices, Inc.
Xilinx, Inc.
Fujitsu Limited
NVIDIA Corporation
International Business Machines Corporation
Open-Silicon, Inc.
제16장 전략적 제안
제17장 회사 소개 및 면책조항
LSH
영문 목차
영문목차
The Global Hybrid Memory Cube Market will grow from USD 3.71 Billion in 2025 to USD 10.07 Billion by 2031 at a 18.11% CAGR. Hybrid Memory Cube (HMC) is a high-performance memory architecture defined by the vertical stacking of Dynamic Random Access Memory (DRAM) dies connected via Through-Silicon Vias (TSV) to a high-speed logic layer. This innovative design addresses the bandwidth bottleneck inherent in traditional planar memory by facilitating significantly faster data throughput and improved energy efficiency.
Market Overview
Forecast Period
2027-2031
Market Size 2025
USD 3.71 Billion
Market Size 2031
USD 10.07 Billion
CAGR 2026-2031
18.11%
Fastest Growing Segment
High-Performance Computing (HPC)
Largest Market
North America
Key Market Drivers
The accelerating deployment of artificial intelligence and machine learning workloads serves as a primary catalyst for the Global Hybrid Memory Cube Market. As neural networks and large language models grow in complexity, they require memory architectures capable of sustaining massive data throughput to prevent processing bottlenecks. Traditional planar DRAM often struggles to meet these latency and bandwidth requirements, compelling the industry to adopt vertical stacking solutions that offer superior density and speed. This critical shift in industrial demand is evidenced by the financial performance of major memory manufacturers.
Key Market Challenges
The high manufacturing cost and technical complexity associated with precision 3D stacking and Through-Silicon Via fabrication constitute a significant barrier to the expansion of the Hybrid Memory Cube market. The intricate process of vertically connecting DRAM dies to a logic layer requires highly specialized production environments, which inevitably limits production yields and increases unit costs. This economic structure forces manufacturers to price these memory modules at a premium, restricting their adoption to high-budget enterprise sectors such as high-performance computing.
Key Market Trends
The adoption of chiplet-based and heterogeneous architectures is fundamentally altering semiconductor design, driving the integration of 3D memory technologies. As manufacturers move away from monolithic die designs to overcome physical scaling limits, they are utilizing advanced packaging to interconnect disparate logic and memory components vertically. This structural disaggregation necessitates the high-density interconnects provided by hybrid memory solutions to maintain signal integrity and bandwidth between the separated chiplets.
Key Market Players
Micron Technology, Inc.
Intel Corporation
Samsung Electronics Co., Ltd.
SK hynix Inc.
Advanced Micro Devices, Inc.
Xilinx, Inc.
Fujitsu Limited
NVIDIA Corporation
International Business Machines Corporation
Open-Silicon, Inc.
Report Scope:
In this report, the Global Hybrid Memory Cube Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:
Hybrid Memory Cube Market, By Product Type:
Central Processing Unit
Field-Programmable Gate Array
Graphics Processing Unit
Application-Specific Integrated Circuit and Accelerated Processing Unit
Hybrid Memory Cube Market, By Application:
High-Performance Computing (HPC)
Networking
Data Centers & Graphics
Hybrid Memory Cube Market, By Region:
North America
United States
Canada
Mexico
Europe
France
United Kingdom
Italy
Germany
Spain
Asia Pacific
China
India
Japan
Australia
South Korea
South America
Brazil
Argentina
Colombia
Middle East & Africa
South Africa
Saudi Arabia
UAE
Competitive Landscape
Company Profiles: Detailed analysis of the major companies present in the Global Hybrid Memory Cube Market.
Available Customizations:
Global Hybrid Memory Cube Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:
Company Information
Detailed analysis and profiling of additional market players (up to five).
Table of Contents
1. Product Overview
1.1. Market Definition
1.2. Scope of the Market
1.2.1. Markets Covered
1.2.2. Years Considered for Study
1.2.3. Key Market Segmentations
2. Research Methodology
2.1. Objective of the Study
2.2. Baseline Methodology
2.3. Key Industry Partners
2.4. Major Association and Secondary Sources
2.5. Forecasting Methodology
2.6. Data Triangulation & Validation
2.7. Assumptions and Limitations
3. Executive Summary
3.1. Overview of the Market
3.2. Overview of Key Market Segmentations
3.3. Overview of Key Market Players
3.4. Overview of Key Regions/Countries
3.5. Overview of Market Drivers, Challenges, Trends
4. Voice of Customer
5. Global Hybrid Memory Cube Market Outlook
5.1. Market Size & Forecast
5.1.1. By Value
5.2. Market Share & Forecast
5.2.1. By Product Type (Central Processing Unit, Field-Programmable Gate Array, Graphics Processing Unit, Application-Specific Integrated Circuit and Accelerated Processing Unit)
5.2.2. By Application (High-Performance Computing (HPC), Networking, Data Centers & Graphics)
5.2.3. By Region
5.2.4. By Company (2025)
5.3. Market Map
6. North America Hybrid Memory Cube Market Outlook
6.1. Market Size & Forecast
6.1.1. By Value
6.2. Market Share & Forecast
6.2.1. By Product Type
6.2.2. By Application
6.2.3. By Country
6.3. North America: Country Analysis
6.3.1. United States Hybrid Memory Cube Market Outlook
6.3.1.1. Market Size & Forecast
6.3.1.1.1. By Value
6.3.1.2. Market Share & Forecast
6.3.1.2.1. By Product Type
6.3.1.2.2. By Application
6.3.2. Canada Hybrid Memory Cube Market Outlook
6.3.2.1. Market Size & Forecast
6.3.2.1.1. By Value
6.3.2.2. Market Share & Forecast
6.3.2.2.1. By Product Type
6.3.2.2.2. By Application
6.3.3. Mexico Hybrid Memory Cube Market Outlook
6.3.3.1. Market Size & Forecast
6.3.3.1.1. By Value
6.3.3.2. Market Share & Forecast
6.3.3.2.1. By Product Type
6.3.3.2.2. By Application
7. Europe Hybrid Memory Cube Market Outlook
7.1. Market Size & Forecast
7.1.1. By Value
7.2. Market Share & Forecast
7.2.1. By Product Type
7.2.2. By Application
7.2.3. By Country
7.3. Europe: Country Analysis
7.3.1. Germany Hybrid Memory Cube Market Outlook
7.3.1.1. Market Size & Forecast
7.3.1.1.1. By Value
7.3.1.2. Market Share & Forecast
7.3.1.2.1. By Product Type
7.3.1.2.2. By Application
7.3.2. France Hybrid Memory Cube Market Outlook
7.3.2.1. Market Size & Forecast
7.3.2.1.1. By Value
7.3.2.2. Market Share & Forecast
7.3.2.2.1. By Product Type
7.3.2.2.2. By Application
7.3.3. United Kingdom Hybrid Memory Cube Market Outlook
7.3.3.1. Market Size & Forecast
7.3.3.1.1. By Value
7.3.3.2. Market Share & Forecast
7.3.3.2.1. By Product Type
7.3.3.2.2. By Application
7.3.4. Italy Hybrid Memory Cube Market Outlook
7.3.4.1. Market Size & Forecast
7.3.4.1.1. By Value
7.3.4.2. Market Share & Forecast
7.3.4.2.1. By Product Type
7.3.4.2.2. By Application
7.3.5. Spain Hybrid Memory Cube Market Outlook
7.3.5.1. Market Size & Forecast
7.3.5.1.1. By Value
7.3.5.2. Market Share & Forecast
7.3.5.2.1. By Product Type
7.3.5.2.2. By Application
8. Asia Pacific Hybrid Memory Cube Market Outlook
8.1. Market Size & Forecast
8.1.1. By Value
8.2. Market Share & Forecast
8.2.1. By Product Type
8.2.2. By Application
8.2.3. By Country
8.3. Asia Pacific: Country Analysis
8.3.1. China Hybrid Memory Cube Market Outlook
8.3.1.1. Market Size & Forecast
8.3.1.1.1. By Value
8.3.1.2. Market Share & Forecast
8.3.1.2.1. By Product Type
8.3.1.2.2. By Application
8.3.2. India Hybrid Memory Cube Market Outlook
8.3.2.1. Market Size & Forecast
8.3.2.1.1. By Value
8.3.2.2. Market Share & Forecast
8.3.2.2.1. By Product Type
8.3.2.2.2. By Application
8.3.3. Japan Hybrid Memory Cube Market Outlook
8.3.3.1. Market Size & Forecast
8.3.3.1.1. By Value
8.3.3.2. Market Share & Forecast
8.3.3.2.1. By Product Type
8.3.3.2.2. By Application
8.3.4. South Korea Hybrid Memory Cube Market Outlook
8.3.4.1. Market Size & Forecast
8.3.4.1.1. By Value
8.3.4.2. Market Share & Forecast
8.3.4.2.1. By Product Type
8.3.4.2.2. By Application
8.3.5. Australia Hybrid Memory Cube Market Outlook
8.3.5.1. Market Size & Forecast
8.3.5.1.1. By Value
8.3.5.2. Market Share & Forecast
8.3.5.2.1. By Product Type
8.3.5.2.2. By Application
9. Middle East & Africa Hybrid Memory Cube Market Outlook
9.1. Market Size & Forecast
9.1.1. By Value
9.2. Market Share & Forecast
9.2.1. By Product Type
9.2.2. By Application
9.2.3. By Country
9.3. Middle East & Africa: Country Analysis
9.3.1. Saudi Arabia Hybrid Memory Cube Market Outlook
9.3.1.1. Market Size & Forecast
9.3.1.1.1. By Value
9.3.1.2. Market Share & Forecast
9.3.1.2.1. By Product Type
9.3.1.2.2. By Application
9.3.2. UAE Hybrid Memory Cube Market Outlook
9.3.2.1. Market Size & Forecast
9.3.2.1.1. By Value
9.3.2.2. Market Share & Forecast
9.3.2.2.1. By Product Type
9.3.2.2.2. By Application
9.3.3. South Africa Hybrid Memory Cube Market Outlook
9.3.3.1. Market Size & Forecast
9.3.3.1.1. By Value
9.3.3.2. Market Share & Forecast
9.3.3.2.1. By Product Type
9.3.3.2.2. By Application
10. South America Hybrid Memory Cube Market Outlook
10.1. Market Size & Forecast
10.1.1. By Value
10.2. Market Share & Forecast
10.2.1. By Product Type
10.2.2. By Application
10.2.3. By Country
10.3. South America: Country Analysis
10.3.1. Brazil Hybrid Memory Cube Market Outlook
10.3.1.1. Market Size & Forecast
10.3.1.1.1. By Value
10.3.1.2. Market Share & Forecast
10.3.1.2.1. By Product Type
10.3.1.2.2. By Application
10.3.2. Colombia Hybrid Memory Cube Market Outlook
10.3.2.1. Market Size & Forecast
10.3.2.1.1. By Value
10.3.2.2. Market Share & Forecast
10.3.2.2.1. By Product Type
10.3.2.2.2. By Application
10.3.3. Argentina Hybrid Memory Cube Market Outlook
10.3.3.1. Market Size & Forecast
10.3.3.1.1. By Value
10.3.3.2. Market Share & Forecast
10.3.3.2.1. By Product Type
10.3.3.2.2. By Application
11. Market Dynamics
11.1. Drivers
11.2. Challenges
12. Market Trends & Developments
12.1. Merger & Acquisition (If Any)
12.2. Product Launches (If Any)
12.3. Recent Developments
13. Global Hybrid Memory Cube Market: SWOT Analysis
