IC Packaging Market Size, Share, Growth Analysis, By Type (Surface Mount Technology Packaging, Through-Hole Packaging), By Technology (Traditional Packaging, Dual In-Line Package ), By Material, By End User, By Region - Industry Forecast 2025-2032
IC 패키징 세계 시장 규모는 2023년 409억 달러로 평가되며, 2024년 443억 달러에서 2032년 838억 3,000만 달러로 성장할 것으로 예상되며, 예측 기간(2025-2032년) 동안 8.3%의 CAGR로 성장할 것으로 예상됩니다. e의 2023년 시장 규모는 409억 4,000만 달러로 예측 기간(2025-2032년) 동안 8.37%의 CAGR로 2024년 443억 7,000만 달러에서 2032년 844억 1,000만 달러로 성장할 것으로 예상됩니다.
IC 패키징 시장은 전자 기술, 특히 AI와 클라우드 컴퓨팅의 급속한 발전으로 인해 큰 성장이 예상됩니다. 고속, 고집적, 저전력 집적회로(IC)에 대한 수요가 증가함에 따라 IC 패키징의 보호 역할이 점점 더 중요해지고 있습니다. 반도체 제조의 후반 단계에서 실리콘 웨이퍼, 로직 유닛, 메모리를 안전하게 보호하고 물리적 손상과 부식을 방지합니다. 또한, 인쇄회로기판에 칩을 장착하기 위한 안정적인 전기적 연결을 용이하게 하고, 다양한 유형의 IC의 다양한 패키징 요구 사항을 충족시킵니다. 진화하는 기술과 IC 패키징의 중요한 역할 사이의 이러한 상호 작용은 2023년 이후까지 시장 기회 확대에 박차를 가할 것으로 예상됩니다.
목차
소개
조사 방법
- 정보 조달
- 2차 데이터와 1차 데이터 방법
- 시장 규모 예측
- 시장 가정과 제한
주요 요약
- 세계 시장 전망
- 공급과 수요 동향 분석
- 부문별 기회 분석
시장 역학과 전망
- 시장 개요
- 시장 규모
- 시장 역학
- Porters 분석
주요 시장 인사이트
- 핵심성공요인
- 경쟁 정도
- 주요 투자 기회
- 시장 생태계
- 시장 매력 지수(2024년)
- PESTEL 분석
- 거시경제 지표
- 밸류체인 분석
- 가격 분석
- 규제 상황
- 사례 연구
- 기술의 진보
IC 패키징 시장 규모 : 유형별
- 시장 개요
- 표면 실장 기술(SMT) 패키징
- 스루홀 패키징
IC 패키징 시장 규모 : 기술별
- 시장 개요
- 전통적인 포장
- 듀얼 인라인 패키지(DIP)
- 소형 아웃라인 집적회로(SOIC)
- 플라스틱 리드 칩 캐리어(PLCC)
- 세라믹 패키지
- 첨단 포장
- 볼 그리드 어레이(BGA)
- 쿼드 플랫 패키지(QFP)
- 웨이퍼 레벨 패키징(WLP)
- 플립칩 패키징
- 시스템 인 패키지(SIP)
- 3D 패키징
IC 패키징 시장 규모 : 소재별
- 시장 개요
- 유기 기질
- 세라믹 기판
- 금속 기판
- 기타
IC 패키징 시장 규모 : 최종사용자별
- 시장 개요
- 가전
- 자동차
- 산업
- 헬스케어
- 항공우주 및 방위
- 통신·IT
- 기타
IC 패키징 시장 규모
- 북미
- 유럽
- 아시아태평양
- 라틴아메리카
- 중동 및 아프리카
- GCC 국가
- 남아프리카공화국
- 기타 중동 및 아프리카
경쟁 정보
- 상위 5개사의 비교
- 주요 기업의 시장 포지셔닝(2024년)
- 주요 시장 기업이 채용한 전략
- 시장의 최근 동향
- 기업의 시장 점유율 분석(2024년)
- 주요 기업 개요
- 기업 개요
- 제품 포트폴리오 분석
- 부문별 점유율 분석
- 매출 전년비 비교(2022-2024)
주요 기업 개요
- Amkor Technology(USA)
- ASE Group(Taiwan)
- STATS ChipPAC(Singapore)
- Siliconware Precision Industries Co., Ltd.(Taiwan)
- Jiangsu Changjiang Electronics Technology Co., Ltd.(China)
- Powertech Technology Inc.(Taiwan)
- UTAC Holdings Ltd.(Singapore)
- Chipbond Technology Corporation(Taiwan)
- King Yuan Electronics Co., Ltd.(Taiwan)
- TongFu Microelectronics Co., Ltd.(China)
- Nepes Corporation(South Korea)
- Advanced Semiconductor Engineering Inc.(Taiwan)
- Shinko Electric Industries Co., Ltd.(Japan)
- Kyocera Corporation(Japan)
- Samsung Electro-Mechanics Co., Ltd.(South Korea)
- Fujitsu Limited(Japan)
- JCET Group Co., Ltd.(China)
- Texas Instruments Incorporated(USA)
- Infineon Technologies AG(Germany)
- NXP Semiconductors N.V.(Netherlands)
결론과 추천사항
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Global IC Packaging Market size was valued at USD 40.9 billion in 2023 and is poised to grow from USD 44.3 billion in 2024 to USD 83.83 billion by 2032, growing at a CAGR of 8.3% during the forecast period (2025-2032). e was valued at USD 40.94 Billion in 2023 and is poised to grow from USD 44.37 Billion in 2024 to USD 84.41 Billion by 2032, growing at a CAGR of 8.37% during the forecast period (2025-2032).
The IC packaging market is poised for significant growth, driven by the rapid advancements in electronics technology, particularly in AI and cloud computing. As demand escalates for high-speed, high-integration, and low-power integrated circuits (ICs), the protective role of IC packaging becomes increasingly vital. It ensures the safeguarding of silicon wafers, logic units, and memory during the latter stages of semiconductor manufacturing, preventing physical damage and corrosion. Furthermore, it facilitates secure electrical connections for chip mounting on printed circuit boards, addressing the diverse packaging requirements of various IC types. This interplay between evolving technology and the essential role of IC packaging is expected to fuel expanding market opportunities through 2023 and beyond.
Top-down and bottom-up approaches were used to estimate and validate the size of the Global Ic Packaging market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.
Global Ic Packaging Market Segmental Analysis
Global IC Packaging Market is segmented by type, technology, material, end user and region. Based on type, the market is segmented into surface mount technology (SMT) packaging and through-hole packaging. Based on technology, the market is segmented into traditional packaging, dual in-line package (DIP) and advanced packaging. Based on material, the market is segmented into organic substrates, ceramic substrates, metal substrates and others. Based on end user, the market is segmented into consumer electronics, automotive, industrial, healthcare, aerospace & defense, telecom & it and others. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.
Driver of the Global Ic Packaging Market
The global IC packaging market is expected to experience significant growth propelled by increasing government support, particularly through initiatives like the CHIPS for America Act, which promotes investments in semiconductor manufacturing, research, and supply chain security in the U.S. Additionally, the surging demand for AI-driven applications across diverse sectors-including healthcare, telecommunications, finance, and automotive-will create fresh opportunities for semiconductor manufacturers and suppliers. AI advancements are likely to streamline manufacturing processes, enhance chip efficacy, cut down production costs, and boost output. Moreover, the evolving automotive landscape demands semiconductors that enhance connectivity and performance in electrified vehicles, further driving the IC packaging market forward.
Restraints in the Global Ic Packaging Market
The global IC packaging market faces significant restraints due to its concentrated nature, dominated by a handful of countries including the United States, Taiwan, South Korea, Japan, China, and Europe. This uneven distribution of production means that no single region manages the entire production spectrum. For instance, Asian countries account for 57% of semiconductor materials, 56% of wafer fabrications, and an impressive 70% of memory production. Meanwhile, the United States excels in electronic design automation (EDA) and various logic and equipment categories. Consequently, this interdependence among countries inhibits any one nation from achieving total leadership within the entire value chain.
Market Trends of the Global Ic Packaging Market
The global IC packaging market is experiencing significant pressure due to the surging demand for integrated circuits across various sectors, including consumer electronics, automotive, and telecommunications. This escalating demand has exacerbated the ongoing semiconductor shortage, posing formidable challenges to the industry's growth trajectory. Additionally, environmental factors, such as the recent drought in Taiwan-home to key semiconductor manufacturing facilities-have further strained supply chains and production capabilities. These issues underscore the need for innovation and diversification within the IC packaging sector to enhance resilience and adapt to market fluctuations. The market's future will hinge on overcoming these supply challenges while meeting global technological demands.
Table of Contents
Introduction
- Objectives of the Study
- Scope of the Report
- Definitions
Research Methodology
- Information Procurement
- Secondary & Primary Data Methods
- Market Size Estimation
- Market Assumptions & Limitations
Executive Summary
- Global Market Outlook
- Supply & Demand Trend Analysis
- Segmental Opportunity Analysis
Market Dynamics & Outlook
- Market Overview
- Market Size
- Market Dynamics
- Drivers & Opportunities
- Restraints & Challenges
- Porters Analysis
- Competitive rivalry
- Threat of substitute
- Bargaining power of buyers
- Threat of new entrants
- Bargaining power of suppliers
Key Market Insights
- Key Success Factors
- Degree of Competition
- Top Investment Pockets
- Market Ecosystem
- Market Attractiveness Index, 2024
- PESTEL Analysis
- Macro-Economic Indicators
- Value Chain Analysis
- Pricing Analysis
- Regulatory Landscape
- Case Studies
- Technological Advancement
Global IC Packaging Market Size by Type & CAGR (2025-2032)
- Market Overview
- Surface Mount Technology (SMT) Packaging
- Through-Hole Packaging
Global IC Packaging Market Size by Technology & CAGR (2025-2032)
- Market Overview
- Traditional Packaging
- Dual In-Line Package (DIP)
- Small Outline Integrated Circuit (SOIC)
- Plastic Leaded Chip Carrier (PLCC)
- Ceramic Package
- Advanced Packaging
- Ball Grid Array (BGA)
- Quad Flat Package (QFP)
- Wafer-Level Packaging (WLP)
- Flip-Chip Packaging
- System-In-Package (SIP)
- 3D Packaging
Global IC Packaging Market Size by Material & CAGR (2025-2032)
- Market Overview
- Organic Substrates
- Ceramic Substrates
- Metal Substrates
- Others
Global IC Packaging Market Size by End User & CAGR (2025-2032)
- Market Overview
- Consumer Electronics
- Automotive
- Industrial
- Healthcare
- Aerospace & Defense
- Telecom & IT
- Others
Global IC Packaging Market Size & CAGR (2025-2032)
- North America (Type, Technology, Material, End User)
- Europe (Type, Technology, Material, End User)
- Germany
- Spain
- France
- UK
- Italy
- Rest of Europe
- Asia Pacific (Type, Technology, Material, End User)
- China
- India
- Japan
- South Korea
- Rest of Asia-Pacific
- Latin America (Type, Technology, Material, End User)
- Brazil
- Rest of Latin America
- Middle East & Africa (Type, Technology, Material, End User)
- GCC Countries
- South Africa
- Rest of Middle East & Africa
Competitive Intelligence
- Top 5 Player Comparison
- Market Positioning of Key Players, 2024
- Strategies Adopted by Key Market Players
- Recent Developments in the Market
- Company Market Share Analysis, 2024
- Company Profiles of All Key Players
- Company Details
- Product Portfolio Analysis
- Company's Segmental Share Analysis
- Revenue Y-O-Y Comparison (2022-2024)
Key Company Profiles
- Amkor Technology (USA)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- ASE Group (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- STATS ChipPAC (Singapore)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Siliconware Precision Industries Co., Ltd. (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Jiangsu Changjiang Electronics Technology Co., Ltd. (China)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Powertech Technology Inc. (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- UTAC Holdings Ltd. (Singapore)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Chipbond Technology Corporation (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- King Yuan Electronics Co., Ltd. (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- TongFu Microelectronics Co., Ltd. (China)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Nepes Corporation (South Korea)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Advanced Semiconductor Engineering Inc. (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Shinko Electric Industries Co., Ltd. (Japan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Kyocera Corporation (Japan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Samsung Electro-Mechanics Co., Ltd. (South Korea)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Fujitsu Limited (Japan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- JCET Group Co., Ltd. (China)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Texas Instruments Incorporated (USA)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Infineon Technologies AG (Germany)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- NXP Semiconductors N.V. (Netherlands)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Conclusion & Recommendations
