IC 패키징 시장 규모, 점유율, 성장 분석 : 유형별, 기술별, 재료별, 최종사용자별, 지역별 - 산업 예측(2025-2032년)
IC Packaging Market Size, Share, Growth Analysis, By Type (Surface Mount Technology Packaging, Through-Hole Packaging), By Technology (Traditional Packaging, Dual In-Line Package ), By Material, By End User, By Region - Industry Forecast 2025-2032
상품코드:1623689
리서치사:SkyQuest Technology Consulting Pvt. Ltd.
발행일:2024년 12월
페이지 정보:영문 221 Pages
라이선스 & 가격 (부가세 별도)
한글목차
IC 패키징 세계 시장 규모는 2023년 409억 달러로 평가되며, 2024년 443억 달러에서 2032년 838억 3,000만 달러로 성장할 것으로 예상되며, 예측 기간(2025-2032년) 동안 8.3%의 CAGR로 성장할 것으로 예상됩니다. e의 2023년 시장 규모는 409억 4,000만 달러로 예측 기간(2025-2032년) 동안 8.37%의 CAGR로 2024년 443억 7,000만 달러에서 2032년 844억 1,000만 달러로 성장할 것으로 예상됩니다.
IC 패키징 시장은 전자 기술, 특히 AI와 클라우드 컴퓨팅의 급속한 발전으로 인해 큰 성장이 예상됩니다. 고속, 고집적, 저전력 집적회로(IC)에 대한 수요가 증가함에 따라 IC 패키징의 보호 역할이 점점 더 중요해지고 있습니다. 반도체 제조의 후반 단계에서 실리콘 웨이퍼, 로직 유닛, 메모리를 안전하게 보호하고 물리적 손상과 부식을 방지합니다. 또한, 인쇄회로기판에 칩을 장착하기 위한 안정적인 전기적 연결을 용이하게 하고, 다양한 유형의 IC의 다양한 패키징 요구 사항을 충족시킵니다. 진화하는 기술과 IC 패키징의 중요한 역할 사이의 이러한 상호 작용은 2023년 이후까지 시장 기회 확대에 박차를 가할 것으로 예상됩니다.
Global IC Packaging Market size was valued at USD 40.9 billion in 2023 and is poised to grow from USD 44.3 billion in 2024 to USD 83.83 billion by 2032, growing at a CAGR of 8.3% during the forecast period (2025-2032). e was valued at USD 40.94 Billion in 2023 and is poised to grow from USD 44.37 Billion in 2024 to USD 84.41 Billion by 2032, growing at a CAGR of 8.37% during the forecast period (2025-2032).
The IC packaging market is poised for significant growth, driven by the rapid advancements in electronics technology, particularly in AI and cloud computing. As demand escalates for high-speed, high-integration, and low-power integrated circuits (ICs), the protective role of IC packaging becomes increasingly vital. It ensures the safeguarding of silicon wafers, logic units, and memory during the latter stages of semiconductor manufacturing, preventing physical damage and corrosion. Furthermore, it facilitates secure electrical connections for chip mounting on printed circuit boards, addressing the diverse packaging requirements of various IC types. This interplay between evolving technology and the essential role of IC packaging is expected to fuel expanding market opportunities through 2023 and beyond.
Top-down and bottom-up approaches were used to estimate and validate the size of the Global Ic Packaging market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.
Global Ic Packaging Market Segmental Analysis
Global IC Packaging Market is segmented by type, technology, material, end user and region. Based on type, the market is segmented into surface mount technology (SMT) packaging and through-hole packaging. Based on technology, the market is segmented into traditional packaging, dual in-line package (DIP) and advanced packaging. Based on material, the market is segmented into organic substrates, ceramic substrates, metal substrates and others. Based on end user, the market is segmented into consumer electronics, automotive, industrial, healthcare, aerospace & defense, telecom & it and others. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.
Driver of the Global Ic Packaging Market
The global IC packaging market is expected to experience significant growth propelled by increasing government support, particularly through initiatives like the CHIPS for America Act, which promotes investments in semiconductor manufacturing, research, and supply chain security in the U.S. Additionally, the surging demand for AI-driven applications across diverse sectors-including healthcare, telecommunications, finance, and automotive-will create fresh opportunities for semiconductor manufacturers and suppliers. AI advancements are likely to streamline manufacturing processes, enhance chip efficacy, cut down production costs, and boost output. Moreover, the evolving automotive landscape demands semiconductors that enhance connectivity and performance in electrified vehicles, further driving the IC packaging market forward.
Restraints in the Global Ic Packaging Market
The global IC packaging market faces significant restraints due to its concentrated nature, dominated by a handful of countries including the United States, Taiwan, South Korea, Japan, China, and Europe. This uneven distribution of production means that no single region manages the entire production spectrum. For instance, Asian countries account for 57% of semiconductor materials, 56% of wafer fabrications, and an impressive 70% of memory production. Meanwhile, the United States excels in electronic design automation (EDA) and various logic and equipment categories. Consequently, this interdependence among countries inhibits any one nation from achieving total leadership within the entire value chain.
Market Trends of the Global Ic Packaging Market
The global IC packaging market is experiencing significant pressure due to the surging demand for integrated circuits across various sectors, including consumer electronics, automotive, and telecommunications. This escalating demand has exacerbated the ongoing semiconductor shortage, posing formidable challenges to the industry's growth trajectory. Additionally, environmental factors, such as the recent drought in Taiwan-home to key semiconductor manufacturing facilities-have further strained supply chains and production capabilities. These issues underscore the need for innovation and diversification within the IC packaging sector to enhance resilience and adapt to market fluctuations. The market's future will hinge on overcoming these supply challenges while meeting global technological demands.
Table of Contents
Introduction
Objectives of the Study
Scope of the Report
Definitions
Research Methodology
Information Procurement
Secondary & Primary Data Methods
Market Size Estimation
Market Assumptions & Limitations
Executive Summary
Global Market Outlook
Supply & Demand Trend Analysis
Segmental Opportunity Analysis
Market Dynamics & Outlook
Market Overview
Market Size
Market Dynamics
Drivers & Opportunities
Restraints & Challenges
Porters Analysis
Competitive rivalry
Threat of substitute
Bargaining power of buyers
Threat of new entrants
Bargaining power of suppliers
Key Market Insights
Key Success Factors
Degree of Competition
Top Investment Pockets
Market Ecosystem
Market Attractiveness Index, 2024
PESTEL Analysis
Macro-Economic Indicators
Value Chain Analysis
Pricing Analysis
Regulatory Landscape
Case Studies
Technological Advancement
Global IC Packaging Market Size by Type & CAGR (2025-2032)
Market Overview
Surface Mount Technology (SMT) Packaging
Through-Hole Packaging
Global IC Packaging Market Size by Technology & CAGR (2025-2032)
Market Overview
Traditional Packaging
Dual In-Line Package (DIP)
Small Outline Integrated Circuit (SOIC)
Plastic Leaded Chip Carrier (PLCC)
Ceramic Package
Advanced Packaging
Ball Grid Array (BGA)
Quad Flat Package (QFP)
Wafer-Level Packaging (WLP)
Flip-Chip Packaging
System-In-Package (SIP)
3D Packaging
Global IC Packaging Market Size by Material & CAGR (2025-2032)
Market Overview
Organic Substrates
Ceramic Substrates
Metal Substrates
Others
Global IC Packaging Market Size by End User & CAGR (2025-2032)
Market Overview
Consumer Electronics
Automotive
Industrial
Healthcare
Aerospace & Defense
Telecom & IT
Others
Global IC Packaging Market Size & CAGR (2025-2032)
North America (Type, Technology, Material, End User)
US
Canada
Europe (Type, Technology, Material, End User)
Germany
Spain
France
UK
Italy
Rest of Europe
Asia Pacific (Type, Technology, Material, End User)
China
India
Japan
South Korea
Rest of Asia-Pacific
Latin America (Type, Technology, Material, End User)
Brazil
Rest of Latin America
Middle East & Africa (Type, Technology, Material, End User)
