한글목차

세계 웨이퍼 본딩 장비 시장은 2025년 3억 4,400만 달러에서 2031년 4억 4,433만 달러로 성장할 것으로 예상되며, 예측 기간 동안 4.36%의 연평균 성장률(CAGR)을 기록할 것으로 예상됩니다.

웨이퍼 본딩 장비의 세계 주요 제조업체는 EV Group, SUSS MicroTec, Tokyo Electron, Applied Microengineering, Nidec Machine Tool, Ayumi Industry, Shanghai Micro Electronics, U-Precision Tech, Hutem 등이며, 2024년 세계 주요 5개 기업의 매출 점유율은 약 84%였습니다.

세계의 웨이퍼 본딩 장비 시장에 대해 조사했으며, 시장 개요, 유형별·용도별·지역별 동향, 시장 진입 기업 프로파일 등의 정보를 전해드립니다.

목차

제1장 조사 대상 범위

• 웨이퍼 본딩 장비 제품 소개
• 유형별 시장
• 용도별 시장
• 가정과 제한
• 조사 목적
• 대상 연도

제2장 주요 요약

제3장 제조업체간 경쟁

제4장 시장 규모, 유형별

• 세계의 웨이퍼 본딩 장비 판매량, 유형별
• 세계의 웨이퍼 본딩 장비 매출, 유형별
• 세계의 웨이퍼 본딩 장비 가격, 유형별

제5장 시장 규모, 용도별

• 세계의 웨이퍼 본딩 장비 판매량, 용도별
• 세계의 웨이퍼 본딩 장비 매출, 용도별
• 세계의 웨이퍼 본딩 장비 가격, 용도별

제6장 북미

제7장 유럽

제8장 아시아태평양

제9장 남미

제10장 중동 및 아프리카

제11장 주요 기업 개요

• EV Group
• SUSS MicroTec
• Tokyo Electron
• Applied Microengineering
• Nidec Machine Tool
• Ayumi Industry
• Shanghai Micro Electronics
• U-Precision Tech
• Hutem
• Canon
• Bondtech
• TAZMO
• Aimechatec

제12장 웨이퍼 본딩 장비 제조 비용 분석

제13장 판매 채널, 판매업체, 트레이더, 딜러

제14장 시장 역학

제15장 세계의 웨이퍼 본딩 장비 조사의 주요 조사 결과

제16장 부록

영문목차

The global Wafer Bonding Equipment market is projected to grow from US$ 344.00 million in 2025 to US$ 444.33 million by 2031, at a Compound Annual Growth Rate (CAGR) of 4.36% during the forecast period.

The global key manufacturers of Wafer Bonding Equipment include EV Group, SUSS MicroTec, Tokyo Electron, Applied Microengineering, Nidec Machine Tool, Ayumi Industry, Shanghai Micro Electronics, U-Precision Tech, and Hutem, etc. In 2024, the global top five players had a share approximately 84% in terms of revenue.

In terms of production side, this report researches the Wafer Bonding Equipment production, growth rate, market share by manufacturers and by region (region level and country level), from 2020 to 2025, and forecast to 2031.

In terms of consumption side, this report focuses on the sales of Wafer Bonding Equipment by region (region level and country level), by company, by Type and by Application. from 2020 to 2025 and forecast to 2031.

Report Includes:

This report presents an overview of global market for Wafer Bonding Equipment, capacity, output, revenue and price. Analyses of the global market trends, with historic market revenue/sales data for 2020 - 2024, estimates for 2025, and projections of CAGR through 2031.

This report researches the key producers of Wafer Bonding Equipment, also provides the consumption of main regions and countries. Highlights of the upcoming market potential for Wafer Bonding Equipment, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.

This report focuses on the Wafer Bonding Equipment sales, revenue, market share and industry ranking of main manufacturers, data from 2020 to 2025. Identification of the major stakeholders in the global Wafer Bonding Equipment market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.

This report analyzes the segments data by Type and by Application, sales, revenue, and price, from 2020 to 2031. Evaluation and forecast the market size for Wafer Bonding Equipment sales, projected growth trends, production technology, application and end-user industry.

Descriptive company profiles of the major global players, including EV Group, SUSS MicroTec, Tokyo Electron, Applied Microengineering, Nidec Machine Tool, Ayumi Industry, Shanghai Micro Electronics, U-Precision Tech, and Hutem, etc.

By Company

• EV Group
• SUSS MicroTec
• Tokyo Electron
• Applied Microengineering
• Nidec Machine Tool
• Ayumi Industry
• Shanghai Micro Electronics
• U-Precision Tech
• Hutem
• Canon
• Bondtech
• TAZMO
• Aimechatec

Segment by Type

• Fully Automatic
• Semi Automatic

Segment by Application

• MEMS
• Advanced Packaging
• CIS
• Others

Sales by Region

North America

• U.S.
• Canada
• Mexico

Asia Pacific

• Japan
• China
• South Korea
• India
• Southeast Asia
• Others

Europe

• Germany
• France
• U.K.
• Italy
• Russia
• Others

South America

• Brazil
• Others

Middle East, Africa

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type and by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.

Chapter 2: Sales (consumption), revenue of Wafer Bonding Equipment in global, regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.

Chapter 3: Detailed analysis of Wafer Bonding Equipment manufacturers competitive landscape, price, sales, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.

Chapter 4: Provides the analysis of various market segments by Type, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 5: Provides the analysis of various market segments by Application, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 6-10: Region by Type, by Application and by country, sales, and revenue for each segment.

Chapter 11: Provides profiles of key manufacturers, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Wafer Bonding Equipment sales, revenue, price, gross margin, and recent development, etc.

Chapter 12-14: Analysis of industrial chain, sales channel, key raw materials, distributors and customers. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 15: The main points and conclusions of the report.

Table of Contents

1 Study Coverage

• 1.1 Wafer Bonding Equipment Product Introduction
• 1.2 Market by Type
  • 1.2.1 Global Wafer Bonding Equipment Market Size by Type, 2020 VS 2024 VS 2031
  • 1.2.2 Market by Type
• 1.3 Market by Application
  • 1.3.1 Global Wafer Bonding Equipment Market Size by Application, 2020 VS 2024 VS 2031
  • 1.3.2 Market by Application
• 1.4 Assumptions and Limitations
• 1.5 Study Objectives
• 1.6 Years Considered

2 Executive Summary

• 2.1 Global Wafer Bonding Equipment Revenue Estimates and Forecasts 2020-2031
• 2.2 Global Wafer Bonding Equipment Revenue by Region
  • 2.2.1 Global Wafer Bonding Equipment Revenue by Region: 2020 VS 2024 VS 2031
  • 2.2.2 Global Wafer Bonding Equipment Revenue by Region (2020-2025)
  • 2.2.3 Global Wafer Bonding Equipment Revenue by Region (2026-2031)
  • 2.2.4 Global Wafer Bonding Equipment Revenue Market Share by Region (2020-2031)
• 2.3 Global Wafer Bonding Equipment Sales Estimates and Forecasts 2020-2031
• 2.4 Global Wafer Bonding Equipment Sales by Region
  • 2.4.1 Global Wafer Bonding Equipment Sales by Region: 2020 VS 2024 VS 2031
  • 2.4.2 Global Wafer Bonding Equipment Sales by Region (2020-2025)
  • 2.4.3 Global Wafer Bonding Equipment Sales by Region (2026-2031)
  • 2.4.4 Global Wafer Bonding Equipment Sales Market Share by Region (2020-2031)
• 2.5 North America
• 2.6 Europe
• 2.7 Asia Pacific
• 2.8 South America
• 2.9 Middle East, Africa

3 Competition by Manufacturers

• 3.1 Global Wafer Bonding Equipment Sales by Manufacturers
  • 3.1.1 Global Wafer Bonding Equipment Sales by Manufacturers (2021-2024)
  • 3.1.2 Global Wafer Bonding Equipment Sales Market Share by Manufacturers (2021-2024)
• 3.2 Global Wafer Bonding Equipment Revenue by Manufacturers
  • 3.2.1 Global Wafer Bonding Equipment Revenue by Manufacturers (2021-2024)
  • 3.2.2 Global Wafer Bonding Equipment Revenue Market Share by Manufacturers (2021-2024)
• 3.3 Global Wafer Bonding Equipment Sales Price by Manufacturers (2021-2024)
• 3.4 Analysis of Competitive Landscape
  • 3.4.1 Manufacturers Market Concentration Ratio
  • 3.4.2 Global Wafer Bonding Equipment Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
• 3.5 Global Key Manufacturers of Wafer Bonding Equipment, Manufacturing Base Distribution and Headquarters
• 3.6 Mergers & Acquisitions, Expansion Plans

4 Market Size by Type

• 4.1 Global Wafer Bonding Equipment Sales by Type
  • 4.1.1 Global Wafer Bonding Equipment Historical Sales by Type (2020-2025)
  • 4.1.2 Global Wafer Bonding Equipment Forecasted Sales by Type (2026-2031)
  • 4.1.3 Global Wafer Bonding Equipment Sales Market Share by Type (2020-2031)
• 4.2 Global Wafer Bonding Equipment Revenue by Type
  • 4.2.1 Global Wafer Bonding Equipment Historical Revenue by Type (2020-2025)
  • 4.2.2 Global Wafer Bonding Equipment Forecasted Revenue by Type (2026-2031)
  • 4.2.3 Global Wafer Bonding Equipment Revenue Market Share by Type (2020-2031)
• 4.3 Global Wafer Bonding Equipment Price by Type
  • 4.3.1 Global Wafer Bonding Equipment Price by Type (2020-2025)
  • 4.3.2 Global Wafer Bonding Equipment Price Forecast by Type (2026-2031)

5 Market Size by Application

• 5.1 Global Wafer Bonding Equipment Sales by Application
  • 5.1.1 Global Wafer Bonding Equipment Historical Sales by Application (2020-2025)
  • 5.1.2 Global Wafer Bonding Equipment Forecasted Sales by Application (2026-2031)
  • 5.1.3 Global Wafer Bonding Equipment Sales Market Share by Application (2020-2031)
• 5.2 Global Wafer Bonding Equipment Revenue by Application
  • 5.2.1 Global Wafer Bonding Equipment Historical Revenue by Application (2020-2025)
  • 5.2.2 Global Wafer Bonding Equipment Forecasted Revenue by Application (2026-2031)
  • 5.2.3 Global Wafer Bonding Equipment Revenue Market Share by Application (2020-2031)
• 5.3 Global Wafer Bonding Equipment Price by Application
  • 5.3.1 Global Wafer Bonding Equipment Price by Application (2020-2025)
  • 5.3.2 Global Wafer Bonding Equipment Price Forecast by Application (2026-2031)

6 North America

• 6.1 North America Wafer Bonding Equipment Market Size by Type
  • 6.1.1 North America Wafer Bonding Equipment Sales by Type (2020-2031)
  • 6.1.2 North America Wafer Bonding Equipment Revenue by Type (2020-2031)
• 6.2 North America Wafer Bonding Equipment Market Size by Application
  • 6.2.1 North America Wafer Bonding Equipment Sales by Application (2020-2031)
  • 6.2.2 North America Wafer Bonding Equipment Revenue by Application (2020-2031)
• 6.3 North America Wafer Bonding Equipment Market Size by Country
  • 6.3.1 North America Wafer Bonding Equipment Revenue by Country (2020-2031)
  • 6.3.2 North America Wafer Bonding Equipment Sales by Country (2020-2031)
  • 6.3.3 US
  • 6.3.4 Canada
  • 6.3.5 Mexico

7 Europe

• 7.1 Europe Wafer Bonding Equipment Market Size by Type
  • 7.1.1 Europe Wafer Bonding Equipment Sales by Type (2020-2031)
  • 7.1.2 Europe Wafer Bonding Equipment Revenue by Type (2020-2031)
• 7.2 Europe Wafer Bonding Equipment Market Size by Application
  • 7.2.1 Europe Wafer Bonding Equipment Sales by Application (2020-2031)
  • 7.2.2 Europe Wafer Bonding Equipment Revenue by Application (2020-2031)
• 7.3 Europe Wafer Bonding Equipment Market Size by Country
  • 7.3.1 Europe Wafer Bonding Equipment Revenue by Country (2020-2031)
  • 7.3.2 Europe Wafer Bonding Equipment Sales by Country (2020-2031)
  • 7.3.3 Germany
  • 7.3.4 France
  • 7.3.5 U.K.
  • 7.3.6 Italy
  • 7.3.7 Russia

8 Asia Pacific

• 8.1 Asia Pacific Wafer Bonding Equipment Market Size by Type
  • 8.1.1 Asia Pacific Wafer Bonding Equipment Sales by Type (2020-2031)
  • 8.1.2 Asia Pacific Wafer Bonding Equipment Revenue by Type (2020-2031)
• 8.2 Asia Pacific Wafer Bonding Equipment Market Size by Application
  • 8.2.1 Asia Pacific Wafer Bonding Equipment Sales by Application (2020-2031)
  • 8.2.2 Asia Pacific Wafer Bonding Equipment Revenue by Application (2020-2031)
• 8.3 Asia Pacific Wafer Bonding Equipment Market Size by Region
  • 8.3.1 Asia Pacific Wafer Bonding Equipment Revenue by Region (2020-2031)
  • 8.3.2 Asia Pacific Wafer Bonding Equipment Sales by Region (2020-2031)
  • 8.3.3 China
  • 8.3.4 Japan
  • 8.3.5 South Korea
  • 8.3.6 India
  • 8.3.7 Southeast Asia

9 South America

• 9.1 South America Wafer Bonding Equipment Market Size by Type
  • 9.1.1 South America Wafer Bonding Equipment Sales by Type (2020-2031)
  • 9.1.2 South America Wafer Bonding Equipment Revenue by Type (2020-2031)
• 9.2 South America Wafer Bonding Equipment Market Size by Application
  • 9.2.1 South America Wafer Bonding Equipment Sales by Application (2020-2031)
  • 9.2.2 South America Wafer Bonding Equipment Revenue by Application (2020-2031)
• 9.3 South America Wafer Bonding Equipment Market Size by Country
  • 9.3.1 South America Wafer Bonding Equipment Revenue by Country (2020-2031)
  • 9.3.2 South America Wafer Bonding Equipment Sales by Country (2020-2031)
  • 9.3.3 Brazil

10 Middle East and Africa

• 10.1 Middle East and Africa Wafer Bonding Equipment Market Size by Type
  • 10.1.1 Middle East and Africa Wafer Bonding Equipment Sales by Type (2020-2031)
  • 10.1.2 Middle East and Africa Wafer Bonding Equipment Revenue by Type (2020-2031)
• 10.2 Middle East and Africa Wafer Bonding Equipment Market Size by Application
  • 10.2.1 Middle East and Africa Wafer Bonding Equipment Sales by Application (2020-2031)
  • 10.2.2 Middle East and Africa Wafer Bonding Equipment Revenue by Application (2020-2031)
• 10.3 Middle East and Africa Wafer Bonding Equipment Market Size by Country
  • 10.3.1 Middle East and Africa Wafer Bonding Equipment Revenue by Country (2020-2031)
  • 10.3.2 Middle East and Africa Wafer Bonding Equipment Sales by Country (2020-2031)

11 Key Players Profiles

• 11.1 EV Group
  • 11.1.1 EV Group Company Details
  • 11.1.2 Company and Business Overview
  • 11.1.3 Wafer Bonding Equipment Introduction
  • 11.1.4 EV Group Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)
• 11.2 SUSS MicroTec
  • 11.2.1 SUSS MicroTec Company Details
  • 11.2.2 Company and Business Overview
  • 11.2.3 Wafer Bonding Equipment Introduction
  • 11.2.4 SUSS MicroTec Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)
• 11.3 Tokyo Electron
  • 11.3.1 Tokyo Electron Company Details
  • 11.3.2 Company and Business Overview
  • 11.3.3 Wafer Bonding Equipment Introduction
  • 11.3.4 Tokyo Electron Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)
• 11.4 Applied Microengineering
  • 11.4.1 Applied Microengineering Company Details
  • 11.4.2 Company and Business Overview
  • 11.4.3 Wafer Bonding Equipment Introduction
  • 11.4.4 Applied Microengineering Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)
• 11.5 Nidec Machine Tool
  • 11.5.1 Nidec Machine Tool Company Details
  • 11.5.2 Company and Business Overview
  • 11.5.3 Wafer Bonding Equipment Introduction
  • 11.5.4 Nidec Machine Tool Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)
• 11.6 Ayumi Industry
  • 11.6.1 Ayumi Industry Company Details
  • 11.6.2 Company and Business Overview
  • 11.6.3 Wafer Bonding Equipment Introduction
  • 11.6.4 Ayumi Industry Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)
• 11.7 Shanghai Micro Electronics
  • 11.7.1 Shanghai Micro Electronics Company Details
  • 11.7.2 Company and Business Overview
  • 11.7.3 Wafer Bonding Equipment Introduction
  • 11.7.4 Shanghai Micro Electronics Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)
• 11.8 U-Precision Tech
  • 11.8.1 U-Precision Tech Company Details
  • 11.8.2 Company and Business Overview
  • 11.8.3 Wafer Bonding Equipment Introduction
  • 11.8.4 U-Precision Tech Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)
• 11.9 Hutem
  • 11.9.1 Hutem Company Details
  • 11.9.2 Company and Business Overview
  • 11.9.3 Wafer Bonding Equipment Introduction
  • 11.9.4 Hutem Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)
• 11.10 Canon
  • 11.10.1 Canon Company Details
  • 11.10.2 Company and Business Overview
  • 11.10.3 Wafer Bonding Equipment Introduction
  • 11.10.4 Canon Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)
• 11.11 Bondtech
  • 11.11.1 Bondtech Company Details
  • 11.11.2 Company and Business Overview
  • 11.11.3 Wafer Bonding Equipment Introduction
  • 11.11.4 Bondtech Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)
• 11.12 TAZMO
  • 11.12.1 TAZMO Company Details
  • 11.12.2 Company and Business Overview
  • 11.12.3 Wafer Bonding Equipment Introduction
  • 11.12.4 TAZMO Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)
• 11.13 Aimechatec
  • 11.13.1 Aimechatec Company Details
  • 11.13.2 Company and Business Overview
  • 11.13.3 Wafer Bonding Equipment Introduction
  • 11.13.4 Aimechatec Revenue, Sales, Price and Gross Margin in Wafer Bonding Equipment Business (2021-2024)

12 Wafer Bonding Equipment Manufacturing Cost Analysis

• 12.1 Wafer Bonding Equipment Key Raw Materials Analysis
  • 12.1.1 Key Raw Materials
  • 12.1.2 Key Raw Materials Price Trend
• 12.2 Key Raw Materials Steel SFE Price Trend (Yuan/MT)
• 12.3 Key Raw Materials Aluminum LME Price Trend (USD/Tonne)
• 12.4 Key Raw Materials Copper LME Price Trend (USD/LBs)
• 12.5 Proportion of Manufacturing Cost Structure
  • 12.5.1 Raw Materials
  • 12.5.2 Labor Cost
  • 12.5.3 Manufacturing Expenses
• 12.6 Manufacturing Process Analysis of Wafer Bonding Equipment

13 Sales Channel, Distributors, Traders and Dealers

• 13.1 Sales Channel
  • 13.1.1 Direct Channel
  • 13.1.2 Indirect Channel
• 13.2 Marketing Channels Status of Wafer Bonding Equipment
• 13.3 Market Positioning
  • 13.3.1 Pricing Strategy
  • 13.3.2 Brand Strategy
• 13.4 Wafer Bonding Equipment Distributors
• 13.5 Wafer Bonding Equipment Customers

14 Market Dynamics

• 14.1 Market Trends
• 14.2 Challenges
• 14.3 Market Favorable Factors and Unfavorable Factors
• 14.4 Market Risks
• 14.5 Industry Enters Major Barriers
• 14.6 Porter's Five Forces Analysis

15 Key Findings in the Global Wafer Bonding Equipment Study

16 Appendix

• 16.1 Research Methodology
  • 16.1.1 Methodology/Research Approach
  • 16.1.2 Data Source
• 16.2 Author Details
• 16.3 Disclaimer