칩렛 시장은 예측 기간 중(2023-2030년) CAGR 6.4%로 성장할 것으로 예측됩니다. 칩렛은 일반적으로 동일한 패키지 내의 I/O 컨트롤러 칩에 의해 제어되는 서브 프로세싱 유닛입니다. 칩렛 설계의 개념에는 프로세서를 구성하기 위한 모듈식 방식이 포함되며, AMD 및 인텔과 같은 CPU 제조업체는 칩렛 설계를 제품 라인업에 도입하여 실리콘 수율을 향상시켜 생산 효율을 높이고 있습니다. 수율 향상과 모듈식 구조로 인해 코어 수가 많은 부품을 제조할 때 낭비를 줄일 수 있습니다. 칩렛을 사용하면 프로세싱 유닛의 모든 부품이 하나의 실리콘에 통합된 모놀리식 CPU 설계보다 칩 수율을 향상시킬 수 있습니다.
정보기술(IT) 및 통신 분야에서 수요 증가가 기대되는 칩렛
IT 및 통신 분야에서는 기술 발전과 함께 더 높은 처리 능력과 성능에 대한 수요도 증가하고 있습니다. 칩렛을 사용하면 제조업체는 여러 개의 특수 칩을 단일 패키지에 통합하여 성능을 확장할 수 있습니다. 또한 칩렛은 특정 전력 소비 프로파일로 설계할 수 있으며, 에너지를 효율적으로 활용하고 비용을 절감할 수 있습니다. 또한 칩렛 산업의 이용 사례 증가와 연구개발 활동은 전체 칩렛 산업 수요를 증가시키고 있습니다.
정보 기술 및 통신 분야는 급속한 기술 발전으로 인해 처리 능력과 성능 향상에 대한 요구가 증가하고 있습니다. 이 분야에서의 칩렛 채택은 다수의 특수 반도체 칩을 단일 패키지에 통합하여 시스템 성능을 향상시킬 수 있는 솔루션을 제조업체에 제공합니다. 이러한 칩렛은 특정 전력 소비 프로파일을 준수하도록 쉽게 설계할 수 있으며, 에너지 자원을 보다 현명하고 경제적으로 사용할 수 있습니다. 또한 용도의 확대와 칩렛 산업의 연구개발이 진행됨에 따라 이 분야의 전반적인 성장과 수요를 견인하고 있습니다. 예를 들어 2023년 10월에는 TSMC의 2nm 제조 공정이 현재 개발 중이며, 일본 기업이 Arm Neoverse 아키텍처를 통합한 칩렛 기반 CPU를 생산하고 있습니다. 이 새로운 칩은 맞춤형 칩렛을 탑재하여 성능을 최적화하면서 다양한 용도에 대응할 수 있습니다. 자동차, 데이터센터, 네트워크, 스마트 기기 등 다양한 산업 분야에 시스템온칩(SoC) 설계를 제공하는 일본의 소시오넥스트(Socionext)는 칩렛 기술을 활용한 새로운 32코어 Arm CPU를 발표했습니다. 이 혁신적인 접근 방식은 하이퍼스케일 데이터센터 및 5G 및 6G 네트워크를 지원하도록 설계된 것을 포함한 최첨단 모바일 인프라에 배치하기에 이상적인 확장 가능한 성능을 제공할 수 있다는 것이 회사 측의 설명입니다.
북미는 인텔(Intel Corp.), 엔비디아(Nvidia), 텍사스 기기(Texas Instruments) 등 반도체 산업과 최종사용자 산업에서 큰 영향력을 행사하고 있는 기업으로 인해 시장이 크게 성장할 것으로 예상됩니다. 이들 기업은 전략적 구상 채택과 제품 출시에 집중하고 있습니다. 예를 들어 2023년 11월, 에지에서 필수적인 처리 능력을 제공하는 전문 기술 기업인 Mercury Systems, Inc, 미 해군과의 협력 관계를 밝혔습니다.
또한 지난 수년간 각국 정부는 반도체 산업의 연구개발 활동에 대한 투자를 강화하고 있으며, 이는 북미 시장 성장을 더욱 촉진하고 있습니다. 예를 들어 미국 정부는 2022년 CHIPS and Science Act를 통과시켰는데, 여기에는 520억 달러의 칩 제조 인센티브와 연구 투자, 반도체 제조 및 반도체 장비 제조에 대한 투자 세액 공제 혜택이 포함되어 있습니다. 반도체산업협회의 2022년 보고서에 따르면 미국 반도체 기업은 2021년에 연간 매출의 약 5분의 1에 해당하는 502억 달러를 연구개발에 투자할 것으로 예상했습니다.
칩렛 시장, 아시아태평양에서 큰 성장세 보일 것으로 전망
아시아태평양에서 칩렛 솔루션과 서비스에 대한 수요가 크게 증가할 것으로 예상됩니다. 이 지역은 자동차, 가전, IT 및 통신 등 최종사용자 산업의 생산 및 판매에서 가장 높은 점유율을 차지하고 있습니다. 국제자동차산업협회에 따르면 2022년 연간 자동차 생산량 상위 4개국은 중국, 일본, 인도, 한국 등 아시아태평양입니다. 또한 이 지역은 세계 반도체 산업에서도 큰 비중을 차지하고 있습니다. 반도체산업협회에 따르면 아시아태평양의 반도체 산업은 2001년 398억 달러에서 2022년 3,309억 4,000만 달러 이상으로 성장할 것으로 예상됩니다. 또한 지역 정부의 칩렛 및 반도체 산업에 대한 지원 증가도 수요를 촉진하고 있습니다. 예를 들어 2023년 5월 인도의 첨단 컴퓨팅 개발 센터(C-DAC)는 플래그십 AUM 칩을 포함한 일련의 ARM 기반 CPU를 개발 중이라고 발표했습니다. 또한 2023년 1월 중국 전자 설계 자동화(EDA) 기업 엠피리언 테크놀러지(Empyrean Technology)는 칩렛 기반 첨단 포장과 AI 기반 설계 자동화 연구개발에 착수한다고 발표했습니다.
Global Chiplet Market Size, Share & Trends Analysis Report by Type (Central Processing Unit (CPU) Chiplets, Graphics Processing Unit (GPU) Chiplets, Field-Programmable Gate Array (FPGA) Chiplets, Application-Specific Integrated Circuit (ASIC) Chiplets, and Memory Chiplets) and by End-User Industry (Automotive electronics, Consumer electronics, Industrial Automation, Healthcare, Military, and IT & Telecommunication) Forecast Period (2023-2030)
The Chiplet market is anticipated to grow at a CAGR of 6.4% during the forecast period (2023-2030). a chiplet is a sub-processing unit that is typically controlled by an I/O controller chip within the same package. The concept of chiplet design involves a modular method for constructing processors. CPU manufacturers such as AMD and Intel Corporation use chiplet designs in their product lineups which enhance production efficiency through improved silicon yields. Higher yields and modular construction help to reduce waste when manufacturing high core count components. Using chiplets allows manufacturers to increase yields of chips over monolithic CPU designs where all pieces of a processing unit are built into a single piece of silicon.
The global chiplet market is segmented by type and end-user industry. By type, the market is sub-segmented into CP) chiplet, GPU chiplet, FPGA chiplet, ASIC chiplet, and memory chiplet. By end-user industry, the market is sub-segmented into automotive electronics, consumer electronics, industrial automation, healthcare, military, IT, and telecommunication. Among the end-users, the demand for chiplets is expected to grow in automotive electronics. The growth is primarily owing to the increasing demand for software-enabled use cases such as advanced driver assistance systems (ADAS), and infotainment systems. Additionally, growing technological advancements in automobiles and the growth of the global electric vehicles (EV) market is also driving demand for chiplets. According to the 2023 Global EV outlook by the International Energy Agency (IEA), the electric car market has seen exponential growth as sales exceeded 10 million in 2022. A total of 14% of all new cars sold were electric in 2022, up from around 9% in 2021 and less than 5% in 2020. In automobiles, chiplets offer multiple advantages over conventional monolithic chip designs. Their modular nature facilitates rapid customization and upgrades, leading to reduced development time and costs. This adaptability enables manufacturers to swiftly respond to shifting market trends and embrace technological breakthroughs. Additionally, car manufacturers (along with their tier 1 suppliers) gain greater flexibility in mixing and matching components from various subcontractors, eliminating the risk of vendor lock-in and fostering a more resilient, healthy, and dynamic supply chain. Considering the growing demand and advantages of using chiplets in automobiles, industries are also focusing on research and development and collaborations which is further driving demand. For instance, in May 2023, MediaTek partnered With NVIDIA to offer transform AI and accelerated computing solutions for automobiles. This collaboration will result in the development of automotive SoCs that incorporate NVIDIA GPU chiplets. These chiplets will be interconnected using an ultra-fast and coherent chiplet interconnect technology. Additionally, MediaTek will implement NVIDIA DRIVE OS, DRIVE IX, CUDA, and TensorRT software technologies on these new automotive SoCs to enable connected infotainment, in-cabin convenience, and safety features. This partnership is expected to expand the range of in-vehicle infotainment options available to automakers on the NVIDIA DRIVE platform.
The Demand for Chiplets Is Expected to Grow in the Information Technology (IT) and Telecommunications
In IT and telecommunications, with technological advancements, demand for higher processing power and performance is also growing. Using chiplets allows manufacturers to scale up performance by integrating multiple specialized chips into a single package. Chiplets can also be designed with specific power consumption profiles, allowing for more efficient use of energy and cost reduction. Additionally, growing use cases and research, and development activities in the chiplet industry are also driving demand for the overall chiplet industry.
In the field of information technology and telecommunications, rapid technological progress has resulted in a growing need for enhanced processing capabilities and performance. The adoption of chiplets within this domain offers manufacturers a solution to augment system performance by integrating numerous specialized semiconductor chips into a unified package. These chiplets can be easily engineered to adhere to specific power consumption profiles, thereby affording a more judicious and economical use of energy resources. Also, the expanding array of applications and ongoing research and development in the chiplet industry drive overall growth and demand within this sector. For instance, in October 2023, TSMC's 2 nm manufacturing process is currently in development, and a Japanese company is making a chiplet-based CPU that incorporates the Arm Neoverse architecture. With the inclusion of customized chiplets, this novel chip can cater to diverse purposes while optimizing performance. Socionext, a Japanese provider of System-on-Chip (SoC) designs catering to various industries such as automotive, data centers, networks, and smart devices, unveiled a new 32-core Arm CPU that leverages chiplet technology. According to the company, this innovative approach is capable of delivering scalable performance ideally suited for deployment in hyperscale data centers and cutting-edge mobile infrastructures, including those designed to support 5G and 6G networks.
The global chiplet market is further segmented based on geography including North America (the US, and Canada), Europe (UK, Italy, Spain, Germany, France, and the Rest of Europe), Asia-Pacific (India, China, Japan, South Korea, and Rest of Asia), and the Rest of the World (the Middle East & Africa, and Latin America). Among the, the market is expected to grow significantly in the North American region owing to factors including the significant presence of semiconductor and end-user industries such as Intel Corp., Nvidia, and Texas Instruments among others. These players are focusing on adopting strategic initiatives and product launches. For instance, in November 2023, Mercury Systems, Inc., a technology firm specializing in providing essential processing power at the edge, disclosed a collaboration with the US Navy to establish manufacturing capabilities aimed at enabling the utilization of commercial photonics chiplets for enhancing edge processing in defense-related contexts.
In addition, over the past few years, the regional government is increasingly inclined towards the R&D activities in semiconductor industry is further propelling the market growth in North America. For instance, in 2022, the US government passed the CHIPS and Science Act which includes $52.0 billion in chip manufacturing incentives and research investments, as well as an investment tax credit for semiconductor manufacturing and semiconductor equipment manufacturing. According to the 2022 report of the Semiconductor Industry Association, the US semiconductor companies continue to invest roughly one-fifth of annual revenue in R&D amounting to $50.2 billion in 2021.
The Chiplet Market is Expected to Grow Significantly in the Asia-Pacific Region
Among these, the demand for Chiplet solutions and services is expected to grow significantly in the Asia Pacific region. The region holds the highest share in production and sales of end-user industries such as automobiles, consumer electronics, IT, and telecommunications among others. According to the International Organization of Motor Vehicle Manufacturers, 4 out of the top countries are from Asia Pacific in terms of annual automobile production in 2022 which were China, Japan, India, and South Korea. Also, the region holds a significant share in the global semiconductor industry. According to the Semiconductor Industry Association, the Asia Pacific semiconductor industry has grown from $39.8 billion in 2001 to over $330.94 billion in 2022. Additionally, growing support for the chiplet and the semiconductor industry from regional governments is also driving the demand. For instance, in May 2023, India's Center for Development of Advanced Computing (C-DAC) announced that be working on a series of ARM-based CPUs including the flagship AUM chip. Also, in January 2023, China-based electronic design automation (EDA) company Empyrean Technology announced it to be working on research and development of chiplet-based advanced packaging as well as AI-based design automation.
The major companies serving the global chiplet market are Ampere Computing, Inc., Taiwan Semiconductor Manufacturing Co., Ltd., Intel Corp., and Marvell Technology, Inc. among others. With growing demand, companies are working on R&D and collaboration to cater to the demand and stay competitive. For instance, in November 2022, Lam Research, a US-based semiconductor equipment manufacturer, acquired Semsysco, a company located in Austria, to enhance its chiplet packaging technology. This acquisition includes the integration of cleaning and plating capabilities for chiplet-to-chiplet or chiplet-to-substrate heterogeneous integration. This encompasses support for fan-out panel-level packaging, a method in which chips or chiplets are cut from a large, rectangular substrate sheet significantly larger than a conventional silicon wafer. This approach allows chip manufacturers to improve yield and reduce waste.