÷´Ü ÆÐŰ¡ ½ÃÀå(2025-2030³â) : ½ÃÀå Á¡À¯À² ºÐ¼®, »ê¾÷ µ¿Çâ, Åë°è ¹× ¼ºÀå ¿¹Ãø
Advanced Packaging - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2025 - 2030)
»óǰÄÚµå : 1685832
¸®¼­Ä¡»ç : Mordor Intelligence Pvt Ltd
¹ßÇàÀÏ : 2025³â 03¿ù
ÆäÀÌÁö Á¤º¸ : ¿µ¹®
 ¶óÀ̼±½º & °¡°Ý (ºÎ°¡¼¼ º°µµ)
US $ 4,750 £Ü 6,580,000
PDF & Excel (Single User License) help
PDF & Excel º¸°í¼­¸¦ 1¸í¸¸ ÀÌ¿ëÇÒ ¼ö ÀÖ´Â ¶óÀ̼±½ºÀÔ´Ï´Ù. ÆÄÀÏ ³» ÅØ½ºÆ® µîÀÇ Copy & Paste °¡´ÉÇÕ´Ï´Ù. Àμ⠰¡´ÉÇϸç Àμ⹰ÀÇ ÀÌ¿ë ¹üÀ§´Â PDF ÀÌ¿ë ¹üÀ§¿Í µ¿ÀÏÇÕ´Ï´Ù.
US $ 5,250 £Ü 7,272,000
PDF & Excel (Team License: Up to 7 Users) help
PDF & Excel º¸°í¼­¸¦ µ¿ÀÏ ±â¾÷³» 7¸í±îÁö ÀÌ¿ëÇÒ ¼ö ÀÖ´Â ¶óÀ̼±½ºÀÔ´Ï´Ù. ÆÄÀÏ ³» ÅØ½ºÆ® µîÀÇ Copy & Paste °¡´ÉÇÕ´Ï´Ù. Àμ⠰¡´ÉÇϸç Àμ⹰ÀÇ ÀÌ¿ë ¹üÀ§´Â PDF ÀÌ¿ë ¹üÀ§¿Í µ¿ÀÏÇÕ´Ï´Ù.
US $ 6,500 £Ü 9,004,000
PDF & Excel (Site License) help
PDF & Excel º¸°í¼­¸¦ µ¿ÀÏÇÑ Áö¸®Àû À§Ä¡¿¡ ÀÖ´Â »ç¾÷Àå³» ¸ðµç ºÐÀÌ ÀÌ¿ëÇÒ ¼ö ÀÖ´Â ¶óÀ̼±½ºÀÔ´Ï´Ù. ÆÄÀÏ ³» ÅØ½ºÆ® µîÀÇ Copy & Paste °¡´ÉÇÕ´Ï´Ù. Àμ⠰¡´ÉÇϸç Àμ⹰ÀÇ ÀÌ¿ë ¹üÀ§´Â PDF ÀÌ¿ë ¹üÀ§¿Í µ¿ÀÏÇÕ´Ï´Ù.
US $ 8,750 £Ü 12,121,000
PDF & Excel (Corporate License) help
PDF & Excel º¸°í¼­¸¦ µ¿ÀÏ ±â¾÷ÀÇ Àü ¼¼°è ¸ðµç ºÐÀÌ ÀÌ¿ëÇÒ ¼ö ÀÖ´Â ¶óÀ̼±½ºÀÔ´Ï´Ù. ÆÄÀÏ ³» ÅØ½ºÆ® µîÀÇ Copy & Paste °¡´ÉÇÕ´Ï´Ù. Àμ⠰¡´ÉÇϸç Àμ⹰ÀÇ ÀÌ¿ë ¹üÀ§´Â PDF ÀÌ¿ë ¹üÀ§¿Í µ¿ÀÏÇÕ´Ï´Ù.


¤± Add-on °¡´É: °í°´ÀÇ ¿äû¿¡ µû¶ó ÀÏÁ¤ÇÑ ¹üÀ§ ³»¿¡¼­ CustomizationÀÌ °¡´ÉÇÕ´Ï´Ù. ÀÚ¼¼ÇÑ »çÇ×Àº ¹®ÀÇÇØ Áֽñ⠹ٶø´Ï´Ù.
¤± º¸°í¼­¿¡ µû¶ó ÃֽŠÁ¤º¸·Î ¾÷µ¥ÀÌÆ®ÇÏ¿© º¸³»µå¸³´Ï´Ù. ¹è¼Û±âÀÏÀº ¹®ÀÇÇØ Áֽñ⠹ٶø´Ï´Ù.

Çѱ۸ñÂ÷

÷´Ü ÆÐŰ¡ ½ÃÀå ±Ô¸ð´Â 2025³â¿¡ 348¾ï ´Þ·¯·Î ÃßÁ¤µÇ¸ç, ¿¹Ãø ±â°£(2025-2030³â) µ¿¾È CAGR 6.63%·Î ¼ºÀåÇÏ¿© 2030³â¿¡´Â 479¾ï 8,000¸¸ ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù.

Advanced Packaging-Market-IMG1

ÁÖ¿ä ÇÏÀ̶óÀÌÆ®

÷´Ü ÆÐŰ¡ ½ÃÀå µ¿Çâ

ÀÓº£µðµå ´ÙÀ̰¡ ÇöÀúÇÑ ¼ºÀå·üÀ» º¸ÀÏ Àü¸ÁÀÔ´Ï´Ù.

¾Æ½Ã¾ÆÅÂÆò¾çÀº Å« ¼ºÀå·üÀÌ ¿¹»óµË´Ï´Ù.

÷´Ü ÆÐŰ¡ ½ÃÀå °³¿ä

÷´Ü ÆÐŰ¡ ½ÃÀåÀº Advanced Semiconductor Engineering Inc., Taiwan Semiconductor Manufacturing Company Limited, Amkor Technology, Intel Corporation, JCIVE Group µî ÁÖ¿ä ±â¾÷¿¡ ÀÇÇØ ¹Ý°íüȭµÇ¾î ÀÖ½À´Ï´Ù.

±âŸ ÇýÅÃ

¸ñÂ÷

Á¦1Àå ¼­·Ð

Á¦2Àå Á¶»ç ¹æ¹ý

Á¦3Àå ÁÖ¿ä ¿ä¾à

Á¦4Àå ½ÃÀå ÀλçÀÌÆ®

Á¦5Àå ½ÃÀå ¿ªÇÐ

Á¦6Àå ½ÃÀå ¼¼ºÐÈ­

Á¦7Àå °æÀï ±¸µµ

Á¦8Àå ÅõÀÚ ºÐ¼®

Á¦9Àå ½ÃÀå ±âȸ¿Í ¹Ì·¡ µ¿Çâ

CSM
¿µ¹® ¸ñÂ÷

¿µ¹®¸ñÂ÷

The Advanced Packaging Market size is estimated at USD 34.80 billion in 2025, and is expected to reach USD 47.98 billion by 2030, at a CAGR of 6.63% during the forecast period (2025-2030).

Advanced Packaging - Market - IMG1

Key Highlights

Advanced Packaging Market Trends

Embedded Die to Witness Significant Growth Rate

Asia Pacific is Expected to Witness Significant Growth Rate

Advanced Packaging Market Overview

The Advanced Packaging Market had a semi-consolidated landscape with key players like Advanced Semiconductor Engineering Inc., Taiwan Semiconductor Manufacturing Company Limited, Amkor Technology, Intel Corporation, and JCET Group Co. Ltd. A significant shift was noted as numerous IC manufacturers transitioned to sub-advanced packaging, spurring market demand and heightening competition.

Additional Benefits:

TABLE OF CONTENTS

1 INTRODUCTION

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

5 MARKET DYNAMICS

6 MARKET SEGMENTATION

7 COMPETITIVE LANDSCAPE

8 INVESTMENT ANALYSIS

9 MARKET OPPORTUNITIES AND FUTURE TRENDS

(ÁÖ)±Û·Î¹úÀÎÆ÷¸ÞÀÌ¼Ç 02-2025-2992 kr-info@giikorea.co.kr
¨Ï Copyright Global Information, Inc. All rights reserved.
PC¹öÀü º¸±â