세계의 방위 및 우주 용도용 HDI(고밀도 상호 연결) PCB 시장 및 기술 예측(-2032년)
High-density Interconnect PCB for Defence and Space Applications - Market and Technology Forecast to 2032
상품코드:1573258
리서치사:Market Forecast
발행일:2024년 08월
페이지 정보:영문 145 Pages
라이선스 & 가격 (부가세 별도)
한글목차
고밀도 상호연결(HDI) PCB는 현재 차세대 방어 및 우주 페이로드 및 장치에서 중요한 기술이 되었습니다. 상업용도에서 군사·항공우주용도로의 이행은 그 범용성과 고도의 기능을 상징하고 있으며, 미션 크리티컬한 환경에서의 소형화, 성능 향상, 내구성에 대한 증가 요구에 부응하고 있습니다.
HDI PCB의 중요한 공헌 중 하나는 현대의 방어 및 우주 일렉트로닉스 기기에 요구되는 속도와 성능 향상을 지원하는 능력입니다. 고속 처리 칩의 보급과 고속 데이터 전송의 필요성이 높아짐에 따라 HDI PCB는 이러한 진보를 촉진하는 독자적인 지위를 확립하고 있습니다. 다층 설계와 고급 재료의 사용은 뛰어난 신호 무결성을 제공하고 레이더, 네비게이션, 전자전 시스템 등의 고주파 용도에서도 간섭 및 신호 손실을 줄여줍니다. 이러한 이유로 HDI PCB는 속도와 정밀도가 모두 최우선인 UAV, 전투기 및 기타 차세대 방어 시스템과 같은 고급 군사 플랫폼에 이상적입니다.
방위 및 우주 분야에서 HDI PCB는 컴팩트한 폼 팩터로 복잡한 설계를 지원하고 높은 수준의 기능을 유지하면서 부품의 크기와 무게를 크게 줄일 수 있으므로 평가가 높아지고 있습니다. 방위 시스템과 우주 임무에서는 소형 경량화뿐만 아니라 가혹한 조건에도 견딜 수 있는 전자 기기가 요구되기 때문에 HDI PCB는 독특한 이점을 제공합니다. HDI PCB는 회로 밀도를 높일 수 있으므로 전체 장치의 크기를 늘리지 않고 다층 기능을 통합할 수 있습니다.
전략적인 관점에서 방위 및 우주용도에 있어서의 HDI PCB 시장은 2032년에 걸쳐 크게 성장할 전망입니다. 세계의 방위 근대화 프로그램이 기세를 늘리고 우주분야가 급속한 상업화와 탐사활동을 진행하는 가운데 고도로 고성능인 전자부품에 대한 수요가 급증할 것으로 예상되고 있습니다.
본 보고서에서는 방위 및 우주 용도용 HDI(고밀도 상호연결) PCB 시장 및 기술을 조사하고, 기술의 개요·최신 동향, 시장 성장에 대한 각종 영향요인 분석, 시장 규모 추이와 예측, 각종 구분·지역/주요 국가별 상세 분석, 경쟁 구도, 주요 기업 프로파일 등을 정리했습니다.
목차
제1장 주요 요약
제2장 소개
제3장 기술과 개발
기술 개요
HDI PCB의 진화
HDI PCB에서 사용되는 중요한 기술
레이저 드릴링 기술
레이저 직접 이미징
레이저 드릴 가능 라미네이트 및 프리프레그
마이크로비아와 고밀도 커넥터
마이크로비아
고밀도 PCB 커넥터
연속 적층 및 적층 기술
주목해야 할 기술 개발
Ultra HDI PCB
제4장 시장 개요
HDI PCB 시장 분포 : 지역별
주요 기업의 개요
HDI PCB 재료 회사
HDI PCB 기계 회사
HDI PCB 제조 및 조립
최근 계약의 개요
주요 고객: 개요
최근 제품 소개 개요
공급망 개요
중요한 원재료
제5장 시장 역학과 예측요인
시장 세분화
주요 지역별 부문
용도별 부문
성장 촉진요인
동향
기회
과제
제6장 국가별 분석
개요
미국
캐나다
멕시코
EU
ESA
중국
대만
제7장 세계 및 지역 시장 예측
HDI PCB 시장 개요:지역별
HDI PCB 시장 : 지역 및 기술별
북미
유럽 : EU27개국
유럽 : 비EU27개국
아시아태평양
중동 및 아프리카
라틴아메리카
기회 분석
지역별
제8장 시장 예측 : 용도별
HDI PCB 시장 개요: 용도별
HDI PCB 시장 : 지역 및 용도별
항공
육상
해양 및 선박
우주
기회 분석
용도별
제9장 영향 분석
예측 요인과 시장에 미치는 영향
"Silicon to System" 접근법의 중요성 향상
원재료의 가용성과 조달 장벽
시나리오 분석
제10장 주요 기업
ACB Group
AGC Multi Materials
Amphenol Invotec
Austria Technologies & Systemtechnik AG(AT&S)
Introduction
DuPont(Electrical & Industrial)
Firan Technology Group(FTG)
Isola Group
NCAB Group
Sierra Circuits Inc.
레이저 직접 이미징(LDI)의 주요 기업
Orbotech(a KLA Company)
LPKF Laser & Electronics
Mitsubishi Electric
SCREEN Holdings Co., Ltd.
Manz AG
First EIE SA
Limata GmbH
Miva Technologies GmbH
제11장 결과·총론
제12장 시장 예측에 대해서
부록 A: 게재 기업
부록 B: 약어
JHS
영문 목차
영문목차
Market forecasts by Regions and Applications. Market and Technologies Overview, Critical Raw Materials, Country Analysis, Opportunity and Impact Analysis, , and Leading Companies.
High-Density Interconnect (HDI) PCBs have now become a crucial technology in next-generation defence and space payloads and devices. Their transition from commercial to military and aerospace applications highlights their versatility and advanced capabilities, meeting the growing demands for miniaturization, enhanced performance, and durability in mission-critical environments.
One of the key contributions of HDI PCBs is their ability to support the increasing speed and performance demands of modern defence and space electronics. With the proliferation of high-speed processing chips and the growing need for rapid data transfer, HDI PCBs are uniquely positioned to facilitate these advancements. Their multi-layer designs and use of advanced materials enable superior signal integrity, reducing interference and signal loss even in high-frequency applications such as radar, navigation, and electronic warfare systems. This makes HDI PCBs ideal for advanced military platforms, including UAVs, fighter jets, and other next-generation defence systems, where both speed and precision are paramount.
Our study "High-Density Interconnect PCB Technology - Market and Technology Forecast to 2032" covers the market demand potential for HDI PCBs in the defence and space sectors.
In the defence and space sectors, HDI PCBs are increasingly valued for their ability to handle complex designs within a compact form factor, significantly reducing the size and weight of components while maintaining high levels of functionality. As defence systems and space missions require electronics that are not only smaller and lighter but also capable of withstanding extreme conditions, HDI PCBs offer a unique advantage. They allow for increased circuit density, enabling the integration of multiple layers of functionality without increasing the overall size of the device.
From a strategic perspective, the market for HDI PCBs in defence and space applications is poised for significant growth through 2032. As global defence modernization programs gain momentum and the space sector witnesses rapid commercialization and exploration activities, the demand for advanced, high-performance electronic components is expected to soar. This study highlights key market trends, including the increasing collaboration between defence contractors, aerospace companies, and HDI PCB manufacturers, as well as the emergence of new manufacturing techniques that further drive innovation in this sector.
Additionally, regional insights are provided to outline the adoption trends across key markets worldwide. The study examines how different regions are responding to the technological shift towards HDI PCBs, with a focus on defence investments, space exploration initiatives, and the evolving regulatory landscape. Moreover, the competitive analysis section profiles leading HDI PCB manufacturers, offering insights into their technological advancements, market positioning, and product portfolios.
The study particularly addresses the recent developments and emphasis on reshoring PCB production by North American and European governments. The shifting landscape of global electronics production is driving developed countries to reevaluate their reliance on Asian manufacturers, especially in the context of critical raw materials and the growing emphasis on local production of Printed Circuit Boards (PCBs). This transformation is significantly impacting the dynamics of the HDI PCB value chain, as governments and industries in the West increasingly prioritize supply chain security and technological sovereignty.
Critical raw materials, such as rare earth elements and high-performance substrates essential for HDI PCBs, have become central to this strategic shift. Supply chain disruptions and geopolitical tensions have highlighted the vulnerability of relying on a concentrated pool of suppliers, particularly from Asia. In response, developed nations are ramping up efforts to secure these materials through domestic production, recycling initiatives, and strategic partnerships, aiming to reduce their dependence on imports from key Asian markets.
This move towards restoring local manufacturing capabilities is driven by the need for greater control over the production of advanced electronics, particularly in defence, aerospace, and other high-tech industries where HDI PCBs are critical. As the demand for HDI PCBs in these sectors grows, ensuring a steady, reliable supply of components is essential for national security and technological competitiveness. Countries like the United States and those within the European Union are investing heavily in PCB fabrication infrastructure, incentivizing local manufacturers, and encouraging innovation in PCB technology to meet these evolving demands.
This study has many such insights that will unveil the market demand and potential challenges the technology might face through 2032.
Covered in this study:
Overview: Snapshot of the HDI PCB technology in the defence and space market during 2024-2032, including highlights of the demand drivers, trends, and challenges. It also provides a snapshot of the spending with respect to regions as well as segments and sheds light on the emergence of new technologies.
Market Dynamics: Insights into the technological developments in the HDI PCB market and a detailed analysis of the changing preferences of governments around the world. It also analyses changing industry structure trends and the challenges faced by the industry participants.
Segment Analysis:Insights into the various HDI PCB markets from a segmental perspective and a detailed analysis of factors influencing the market for each segment.
Regional Review: Insights into modernization patterns and budgetary allocation for top countries within a region.
Regional Analysis: Insights into the HDI PCB market from a regional perspective and a detailed analysis of factors influencing the market for each region.
Impact Analysis: Analysis of how certain events will impact the HDI PCBs market. This will give you an indication of which factors are important for the forecast.
Key Program Analysis: Details of the top programmes in each segment expected to be executed during the forecast period.
Competitive landscape Analysis: Analysis of the competitive landscape of this industry. It provides an overview of key companies, together with insights such as key alliances, strategic initiatives, and a SWOT analysis.
Segmentation
The market has is segmented by Region and Application:
Region
EU-27
Non-EU 27
North America
Asia Pacific
Middle East & Africa
Latin America
Applications
Ground
Air
Marine
Space
Reasons to buy:
To address the procurement and market analysis needs for HDI PCBs in defence and space applications over the next eight years.
Conduct a comprehensive analysis of prospective procurement areas based on market trends and government programs. Identify specific areas of demand growth for HDI PCBs in defence and space applications, such as communication systems, command and control systems, radars,weapon systems, next-generation avionics and countermeasures.
Develop a procurement plan that aligns with technological advancements and industry dynamics.
Gain insights into the factors driving demand for HDI PCBs in leading countries and emerging markets. Identify opportunities presented by each market segment based on defence spending, technological advancements, and geopolitical factors. Analyze market potential in terms of applications like space-based internet, inter-satellite communication, and deep space missions.
Strengthen understanding of market demand drivers, industry trends, regulatory landscapes, and technological developments influencing the adoption of HDI PCBs in defence and space applications. Monitor advancements in HDI PCB technology.
Identify key channels driving the global HDI PCBs market for defence and space applications. Evaluate opportunities in government procurement programs, defence contracts, research collaborations, and commercial partnerships. Explore avenues for revenue expansion through market penetration and diversification.
Conduct a comprehensive analysis of the competitive landscape in the HDI PCBs market. Profile leading providers of HDI PCbs for defence and space applications worldwide, including their product offerings, market presence, research capabilities, and strategic initiatives. Assess competitive positioning to make informed business decisions and identify potential partnership opportunities.
Companies Listed:
Advanced Circuits
AGC Multi Material America, Inc. (AMMA)
Austria Technologie & Systemtechnik AG
Cicor Group
DuPont
Electro Scientific Industries, Inc.
Elvia PCB Group
Eurocircuits
Hitachi High-Tech Corporation
ICAPE Group
Isola Group
LPKF Laser & Electronics AG
Manz AG
Mitsubishi Electric Corporation
NCAB Group
Oerlikon Balzers
Ohmega Technologies
Panasonic
Rogers Corporation
Sanmina Corporation
Schmid Group
Schweizer Electronic AG
Sierra Circuits
Suss MicroTec:
Ticer Technologies
TTM Technologies
Ventec International Group
Table of Contents
1. Executive Summary
1.1. Trends and Insights
1.2. Main Findings
1.3. Key Conclusions
2. Introduction
2.1. Scope
2.2. Definitions
2.3. Methodology
2.4. Who will benefit from this study?
3. Technologies and Developments
3.1. Technology Overview
3.1.1. Evolution of HDI PCBs
3.2. Critical Technologies used in HDI PCBs
3.2.1. Laser Drilling Technology
3.2.2. Laser Direct Imaging
3.2.3. Laser Drillable Laminates and Prepregs
3.3. Microvias and High-density Connectors
3.3.1. Microvias
3.3.2. High-density PCB Connectors
3.4. Sequential Lamination and Layering Technologies
3.5. Notable Technology Developments
3.5.1. Ultra HDI PCBs
4. Market Overview
4.1. Introduction
4.2. HDI PCB market volume distribution over the forecast period by Region
4.3. Main market players overview
4.3.1. HDI PCB Material Companies
4.3.2. HDI PCB Machinery Companies
4.3.3. HDI PCB Fabrication and Assembly
4.4. Recent contracts overview
4.4.1. Calumet Electronics and Green Source Awarded Major Contracts to Boost Advanced PCB Production
4.4.2. Micross Components Awarded Major Contract to Develop Advanced Packaging Capabilities for Department of Defence
4.5. Main customers overview
4.6. Recent product introductions Overview
4.6.1. ESA Approves VT-901 as the First Qualified HDI Material
4.6.2. Atotech Demonstrated Printoganth T1 and InPro
4.7. Supply Chain Overview
4.8. Critical Raw Materials
4.8.1. Laser Drillable (LD) Prepregs
4.8.2. Substrate Material
5. Market Dynamics and Forecast Factors
5.1. Market Segmentation
5.1.1. Segments by Key Regions
5.1.2. Segmentation by Application
5.2. Drivers
5.3. Trends
5.4. Opportunities
5.5. Challenges
6. Country Analysis
6.1. Overview
6.2. USA
6.2.1. Section 841 of the FY 2021 NDAA
6.2.2. NDS and NDIS
6.2.3. The CHIPS and Science Act of 2022
6.2.4. The Defence Production Act (DPA) Title III program
6.2.5. Defence Production Act Investment (DPAI) Program
6.2.6. Supporting PCB Act 2022 and PCBS Act 2023
6.2.7. Relevant contracts
6.3. Canada
6.4. Mexico
6.5. European Union
6.5.1. Europe Chips Act
6.5.2. Horizon Focusing
6.5.3. JTF-2021/23-15 - High Challenges for PCBs and SMT (Surface Mount Technologies)
6.6. ESA
6.6.1. General Support Technology Programme (GSTP)
6.6.2. G61A-017QT
6.6.3. ESA HDI PCB Technology Roadmap
6.6.4. ESA Qualified HDI PCB Suppliers
6.7. China
6.8. Taiwan
7. Global and Regional Market Forecast to 2032
7.1. Introduction
7.2. HDI PCB market by Region overview
7.3. HDI PCB Market Regions by Technology
7.3.1. North America HDI PCB Market by Technology
7.3.2. EU-27 HDI PCB Market by Technology
7.3.3. Non EU-27 HDI PCB Market by Technology
7.3.4. APAC HDI PCB Market by Technology
7.3.5. MEA HDI PCB Market by Technology
7.3.6. LATAM HDI PCB Market by Technology
7.4. Opportunity Analysis
7.4.1. By Region
8. Market Forecast to 2032 by Application
8.1. Introduction
8.2. HDI PCB market by Application overview
8.3. HDI PCB Applications Market by Region
8.3.1. Airborne HDI PCB Market by Region
8.3.2. Ground-based HDI PCB market by Region
8.3.3. Naval-based HDI PCB market by Region
8.3.4. Space-based HDI PCB market by Region
8.4. Opportunity Analysis
8.4.1. By Application
9. Impact Analysis
9.1. Introduction
9.2. Forecast Factors and Market Impact
9.2.1. Growing Emphasis on"Silicon to System" approach
9.2.2. Challenges in Raw Material Availability and Procurement Hurdles
9.2.3. Scenario Analysis
10. Leading Companies
10.1. ACB Group
10.1.1. Introduction
10.1.2. Related Products and Services
10.1.3. Recent Developments and Contracts
10.1.4. SWOT Analysis
10.2. AGC Multi Materials
10.2.1. Introduction
10.2.2. Related Products and Services
10.2.3. Recent Developments and Contracts
10.2.4. SWOT Analysis
10.3. Amphenol Invotec
10.3.1. Introduction
10.3.2. Related Products and Services
10.3.3. Recent Developments and Contracts
10.3.4. SWOT Analysis
10.4. Austria Technologie & Systemtechnik AG (AT&S)
10.4.1. Introduction
10.4.2. Related Products and Services
10.4.3. SWOT Analysis
10.5. Calumet Electronics Corporation
10.5.1. Introduction
10.5.2. Related Products and Services
10.5.3. Recent Developments and Contracts
10.5.4. SWOT Analysis
10.6. DuPont (Electrical & Industrial)
10.6.1. Introduction
10.6.2. Related Products and Services
10.6.3. SWOT Analysis
10.7. Firan Technology Group (FTG)
10.7.1. Introduction
10.7.2. Related Products and Services
10.7.3. Recent Developments and Contracts
10.7.4. SWOT Analysis
10.8. Isola Group
10.8.1. Introduction
10.8.2. Related Products and Services
10.8.3. Recent Developments and Contracts
10.8.4. SWOT Analysis
10.9. NCAB Group
10.9.1. Introduction
10.9.2. Related Products and Services
10.9.3. Recent Developments and Contracts
10.9.4. SWOT Analysis
10.10. Sierra Circuits Inc.
10.10.1. Introduction
10.10.2. Related Products and Services
10.10.3. Recent Developments and Contracts
10.10.4. SWOT Analysis
10.11. Leading Companies in Laser Direct Imaging (LDI)
10.11.1. Orbotech (a KLA Company)
10.11.2. LPKF Laser & Electronics
10.11.3. Mitsubishi Electric
10.11.4. SCREEN Holdings Co., Ltd.
10.11.5. Manz AG
10.11.6. First EIE SA
10.11.7. Limata GmbH
10.11.8. Miva Technologies GmbH
11. Results and Conclusions
12. About Market Forecast
12.1. General
12.2. Contact us
12.3. Disclaimer
12.4. License
Appendix A: Companies Mentioned
Appendix B: Abbreviations
List of figures
Figure 1: HDI PCB Market Summary by Region
Figure 2: Market volumes over the forecast period per region
Figure 3: Market Segmentation and Sub-Segmentation HDI PCB Market
Figure 4: Global and Regional HDI PCB Defence and Space Market 2024 - 2032 [US$ million]
Figure 5: Global HDI PCB Market Forecast to 2032 by Region [%]
Figure 6: North America HDI PCB Defence and Space Market Forecast to 2032 by Technology [US$ million]
Figure 7: EU-27 HDI PCB Defence and Space Market Forecast to 2032 by Technology [US$ million]
Figure 8: Non EU-27 HDI PCB Defence and Space Market Forecast to 2032 by Technology [US$ million]
Figure 9: APAC HDI PCB Defence and Space Market Forecast to 2032 by Technology [US$ million]
Figure 10: MEA HDI PCB Defence and Space Market Forecast to 2032 by Technology [US$ million]
Figure 11: LATAM HDI PCB Defence and Space Market Forecast to 2032 by Technology [US$ million]
Figure 12: HDI PCB market size, 2024-2032 (US$ million) by region
Figure 13: HDI PCB market CAGR, 2024-2032 by region
Figure 14: Global HDI PCB Market Forecast to 2032 by Application [US$ million]
Figure 14: Airborne HDI PCB Market Forecast to 2032 by Region [US$ million]
Figure 15: Ground-based HDI PCB Market Forecast to 2032 by Region [US$ million]
Figure 16: Naval-based HDI PCB Market Forecast to 2032 by Region [US$ million]
Figure 17: HDI PCB for Space Applications Market Forecast to 2032 by Region [US$ million]
