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SLP(Substrate Like PCB) 시장 분석 및 예측(-2034년) : 유형, 제품, 기술, 구성 요소, 용도, 재료 유형, 프로세스, 최종 사용자, 기능
Substrate-Like PCB Market Analysis and Forecast to 2034: Type, Product, Technology, Component, Application, Material Type, Process, End User, Functionality
상품코드 : 1762219
리서치사 : Global Insight Services
발행일 : 2025년 07월
페이지 정보 : 영문 357 Pages
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한글목차

SLP(Substrate Like PCB) 시장은 2024년 21억 달러에서 2034년까지는 73억 달러로 확대되며 약 13.6%의 연평균 복합 성장률(CAGR)을 나타낼 것으로 예측되고 있습니다. 이 PCB는 스마트폰 및 IoT 장치와 같은 고밀도 애플리케이션에 필수적인 전기 성능 향상과 소형화를 실현합니다.

업계 개요

SLP(Substrate Like PCB) 시장은 복잡한 세계적 관세, 지정학적 리스크, 진화하는 공급망 역학을 극복하고 있습니다. 따라서 국내 생산으로의 전략적 시프트가 현저합니다. 중국은 무역 마찰 속에서 자립 전략을 가속시키고 있으며, PCB 제조의 국산화를 촉진하고 있습니다. 정학적인 불확실성, 특히 미국과 중국의 관계에 취약한 채로 남아 있습니다. 2035년까지는 전략적 제휴와 시장의 다양화로 시장이 확대될 것입니다.

시장 세분화
유형 단면, 양면, 다층, 고밀도 상호 연결(HDI), 연성, 리지드 플렉스
제품 베어 보드, 인쇄 회로 기판 어셈블리(PCBA)
기술 표면실장기술(SMT), 스루홀 기술, 칩 온 보드
구성 요소 저항기, 커패시터, 집적 회로, 커넥터, 다이오드, 트랜지스터
용도 소비자 가전, 통신, 자동차 전자, 산업용 전자, 의료기기, 항공우주 및 방위
재료 유형 FR-4, 폴리이미드, PTFE, 로저스, 금속 코어
프로세스 에칭, 적층, 드릴링, 도금, 납땜
최종 사용자 OEM, EMS 공급업체, ODM
기능 아날로그, 디지털, 혼합 신호, RF

시장 개요 :

SLP(Substrate Like PCB) 시장은 주로 소형화된 고성능 전자 기기에 대한 수요 증가로 인해 대폭적인 성장을 이루고 있습니다. 의자의 보급으로 소비자 일렉트로닉스 부문이 주요 시장 부문으로 부상하고 있습니다. 하위 부문은 고속 데이터 전송과 견고한 연결성을 지원할 수 있는 고급 PCB가 요구되고 있습니다.

충돌 개요 :

SLP(Substrate Like PCB) 시장에서는 수요의 주요 촉진요인인 첨단 가전과 통신 분야의 존재감이 강한 것이 시장 점유율 분포의 특징이 되고 있습니다. 태평양, 특히 중국과 한국 등의 국가들은 그 견고한 전자기기 제조거점으로 시장 도입의 최전선에 있습니다. Electro-Mechanics, Unimicron Technology, AT&S 등 주요 기업은 생산 능력을 확대하고 연구개발 노력을 강화함으로써 수요를 활용하고 있습니다. 대규모 기업은 경쟁력을 유지하기 위해 최첨단 제조 기술에 투자하고 있습니다. 제조 관행과 재료 선택에 영향을 미치고 있습니다. SLP(Substrate Like PCB) 시장의 미래는 5G 기술과 사물인터넷(IoT)의 진전에 견인되어 고밀도 상호 연결 수요에 박차가 걸릴 것으로 예상되고 유망시 그러나 공급망의 혼란과 원재료 상승 등의 과제도 남아 있습니다.

주요 동향과 촉진요인 :

SLP(Substrate Like PCB) 시장은 소형화된 전자기기와 강화된 성능 요건에 대한 수요가 높아짐에 따라 강력한 성장을 이루고 있습니다. 새로운 회로를 필요로 하는 스마트폰 및 웨어러블과 같은 최신 전자 기기의 까다로운 요구에 부응할 수 있습니다. 이 동향은 신뢰성이 높고 고성능 PCB 솔루션이 필요한 자율 주행 기술의 진보에 의해 더욱 강화됩니다. 이크 PCB가 이상적인 선택이 되고 있습니다. 시장은 또한 디바이스 전체의 성능을 향상시키는 통합 솔루션을 개발하기 위해 PCB 제조업체와 반도체 기업과의 협업을 목격하고 있습니다.

성장 억제요인과 도전 :

SLP(Substrate Like PCB) 시장에는 몇 가지 현저한 억제요인과 과제가 있습니다. 프로세스는 특별한 설비와 숙련된 노동력이 필요하며, 이로 인해 비용이 늘어나고 있습니다. 빠른 기술진보는 연구개발에 지속적인 투자를 필요로 하고 경쟁력 유지를 목표로 하는 기업에 재정적 부담을 강하게 하고 있습니다. 폐기물에 대한 환경에 대한 우려와 지속 가능한 제조 방법의 필요성도 기업에 책임있는 기술 혁신을 강요하고 있습니다.

목차

제1장 SLP(Substrate Like PCB) 시장 개요

제2장 주요 요약

제3장 시장에 관한 중요 인사이트

제4장 SLP(Substrate Like PCB) 시장 전망

제5장 SLP(Substrate Like PCB) 시장 전략

제6장 SLP(Substrate Like PCB) 시장 규모

제7장 SLP(Substrate Like PCB) 시장 : 유형별

제8장 SLP(Substrate Like PCB) 시장 : 제품별

제9장 SLP(Substrate Like PCB) 시장 : 기술별

제10장 SLP(Substrate Like PCB) 시장 : 구성 요소별

제11장 SLP(Substrate Like PCB) 시장 : 용도별

제12장 SLP(Substrate Like PCB) 시장 : 재료 유형별

제13장 SLP(Substrate Like PCB) 시장 : 프로세스별

제14장 SLP(Substrate Like PCB) 시장 : 최종 사용자별

제15장 SLP(Substrate Like PCB) 시장 : 기능별

제16장 SLP(Substrate Like PCB) 시장 : 지역별

제17장 경쟁 구도

제18장 기업 프로파일

KTH
영문 목차

영문목차

Substrate-Like PCB Market is anticipated to expand from $2.1 billion in 2024 to $7.3 billion by 2034, growing at a CAGR of approximately 13.6%. Substrate-Like PCB Market encompasses advanced printed circuit boards with finer lines and spaces, resembling semiconductor substrates. These PCBs offer enhanced electrical performance and miniaturization, crucial for high-density applications such as smartphones and IoT devices. The market is driven by the demand for compact electronics and advancements in consumer technology, necessitating innovations in manufacturing precision and materials.

Industry Overview:

The Substrate-Like PCB Market is navigating complex global tariffs, geopolitical risks, and evolving supply chain dynamics. In Japan and South Korea, strategic shifts towards domestic production are evident as tariff impacts on electronic components drive innovation in substrate-like PCB technologies. China is accelerating its self-reliance strategy amidst trade tensions, fostering indigenous advancements in PCB manufacturing. Taiwan, a pivotal player, leverages its expertise but remains vulnerable to geopolitical uncertainties, particularly US-China relations. Globally, the parent market is witnessing robust growth driven by electronics and automotive sectors, yet supply chain resilience is paramount. By 2035, the market is poised for expansion, contingent on strategic alliances and diversification. Middle East conflicts could exacerbate supply chain disruptions and elevate energy prices, influencing production costs and timelines.

Market Segmentation
TypeSingle-sided, Double-sided, Multilayer, High-Density Interconnect (HDI), Flexible, Rigid-Flex
ProductBare Boards, Printed Circuit Board Assemblies (PCBA)
TechnologySurface Mount Technology (SMT), Through-Hole Technology, Chip-on-Board
ComponentResistors, Capacitors, Integrated Circuits, Connectors, Diodes, Transistors
ApplicationConsumer Electronics, Telecommunications, Automotive Electronics, Industrial Electronics, Medical Devices, Aerospace and Defense
Material TypeFR-4, Polyimide, PTFE, Rogers, Metal Core
ProcessEtching, Lamination, Drilling, Plating, Soldering
End UserOEMs, EMS Providers, ODM
FunctionalityAnalog, Digital, Mixed-Signal, RF

Market Overview:

The Substrate-Like PCB (SLP) Market is experiencing substantial growth, primarily driven by the increasing demand for miniaturized and high-performance electronic devices. The consumer electronics segment emerges as the leading market segment, owing to the proliferation of smartphones, tablets, and wearable devices that necessitate compact and efficient PCB solutions. This segment's dominance is attributed to technological advancements in SLPs, which offer superior electrical performance, higher wiring density, and enhanced thermal management, catering to the ever-evolving needs of consumer electronics manufacturers. Emerging sub-segments such as automotive electronics and telecommunications are poised to make a significant impact, fueled by the rise of electric vehicles and the rollout of 5G networks. These sub-segments demand advanced PCBs that can support high-speed data transmission and robust connectivity. As these industries continue to expand, the SLP market is expected to witness further diversification and innovation, presenting lucrative opportunities for stakeholders.

Geographical Overview:

The Substrate-Like PCB market is witnessing varied growth patterns across different regions, each characterized by unique factors. In North America, the market is thriving due to advanced technological infrastructure and significant investments in electronics manufacturing. The region's focus on innovation and quality further propels market expansion. Europe is experiencing steady growth, driven by a strong automotive and consumer electronics industry. The region's emphasis on sustainable manufacturing practices enhances its market position. Government initiatives supporting technological advancements also play a crucial role. In Asia Pacific, the market is expanding rapidly. This growth is fueled by the presence of major electronics manufacturers and increasing consumer demand for high-performance electronic devices. The region's competitive manufacturing landscape and cost advantages are key drivers. Latin America is emerging as a potential market, with growing investments in electronics manufacturing and infrastructure development. The region's focus on modernization and technological adoption supports market growth. The Middle East & Africa are recognizing the importance of Substrate-Like PCBs in advancing their electronics sectors. Increasing government support and international collaborations are fostering market development in these regions.

Competition Overview:

In the Substrate-Like PCB (SLP) market, the distribution of market share is characterized by a strong presence of advanced consumer electronics and telecommunications sectors, which are the primary drivers of demand. This is attributed to the increasing miniaturization and performance requirements in these industries. The Asia-Pacific region, particularly countries like China and South Korea, is at the forefront of market adoption due to its robust electronics manufacturing base. Meanwhile, North America and Europe are witnessing steady growth, propelled by innovations in automotive and industrial applications. Leading companies such as Samsung Electro-Mechanics, Unimicron Technology, and AT&S are capitalizing on the demand by expanding production capabilities and enhancing R&D efforts. The competitive landscape is shaped by technological advancements and strategic partnerships, with major players investing in cutting-edge fabrication technologies to maintain a competitive edge. Regulatory frameworks, particularly in Europe and North America, are increasingly focusing on environmental sustainability and electronic waste reduction, influencing manufacturing practices and material selection. The future of the SLP market appears promising, driven by advancements in 5G technology and the Internet of Things (IoT), which are expected to spur demand for high-density interconnects. However, challenges such as supply chain disruptions and the high cost of raw materials remain. Nevertheless, ongoing innovations in substrate materials and manufacturing processes present significant opportunities for growth and market expansion.

Recent Developments:

The Substrate-Like PCB (SLP) market has experienced noteworthy developments in the past three months, highlighting its dynamic nature. Firstly, Samsung Electronics announced a strategic partnership with a leading Taiwanese PCB manufacturer to enhance its SLP production capabilities, aiming to meet the growing demand in the consumer electronics sector. Secondly, Apple Inc. has increased its investment in SLP technology, focusing on innovations that promise to improve performance and reduce costs in its upcoming devices. Thirdly, a significant merger between two prominent Japanese firms in the SLP industry has been finalized, expected to create synergies that will drive technological advancements and market expansion. Fourthly, regulatory changes in the European Union have been introduced, setting new standards for environmentally friendly SLP production, which could impact supply chain operations. Lastly, a major Chinese electronics company has launched a new line of SLP products, featuring cutting-edge miniaturization technology, poised to capture a substantial market share in the coming years. These developments underscore the vibrant growth and innovation in the SLP market.

Key Companies:

Unimicron Technology, AT& S Austria Technologie & Systemtechnik, TTM Technologies, Zhen Ding Technology Holding, Kinsus Interconnect Technology, Tripod Technology, Compeq Manufacturing, Shenzhen Fastprint Circuit Tech, Ibiden, Daeduck Electronics, Shinko Electric Industries, Nippon Mektron, Hann Star Board, Meiko Electronics, Wus Printed Circuit, Multek, Nan Ya PCB, Kingboard Holdings, Simmtech, Shennan Circuits

Key Trends and Drivers:

The Substrate-Like PCB market is experiencing robust growth, driven by escalating demand for miniaturized electronic devices and enhanced performance requirements. A key trend is the increasing adoption of advanced manufacturing technologies, such as laser drilling and precision etching, to produce ultra-thin PCBs. These technologies enable manufacturers to meet the stringent demands of modern electronics, such as smartphones and wearables, which require compact and efficient circuitry. Another significant trend is the integration of substrate-like PCBs in automotive applications, particularly in electric vehicles. As the automotive industry shifts towards electrification, there is a heightened need for high-density interconnects that can support sophisticated electronic systems. This trend is further bolstered by advancements in autonomous driving technologies, which necessitate reliable and high-performance PCB solutions. Additionally, the rise of 5G technology is a major driver for the substrate-like PCB market. The deployment of 5G networks requires PCBs that can handle higher frequencies and data rates, making substrate-like PCBs an ideal choice. The market is also witnessing increased collaboration between PCB manufacturers and semiconductor companies to develop integrated solutions that enhance overall device performance. This collaboration is paving the way for innovative designs and applications, expanding the market's potential.

Restraints and Challenges:

The Substrate-Like PCB Market encounters several notable restraints and challenges. A significant challenge is the high manufacturing cost associated with advanced substrate-like PCB technologies, which can deter small and medium-sized enterprises from adoption. The intricate production process requires specialized equipment and skilled labor, further driving up expenses. Additionally, the industry faces supply chain disruptions due to geopolitical tensions and material shortages, impacting timely production and delivery. The rapid technological advancements necessitate continuous investment in research and development, posing financial strain on companies aiming to stay competitive. Furthermore, the lack of standardized regulations across different regions complicates market entry and expansion strategies. Environmental concerns about electronic waste and the need for sustainable manufacturing practices also pressure companies to innovate responsibly. These factors collectively present formidable obstacles to the growth and scalability of the substrate-like PCB market.

Research Scope:

Our research scope provides comprehensive market data, insights, and analysis across a variety of critical areas. We cover Local Market Analysis, assessing consumer demographics, purchasing behaviors, and market size within specific regions to identify growth opportunities. Our Local Competition Review offers a detailed evaluation of competitors, including their strengths, weaknesses, and market positioning. We also conduct Local Regulatory Reviews to ensure businesses comply with relevant laws and regulations. Industry Analysis provides an in-depth look at market dynamics, key players, and trends. Additionally, we offer Cross-Segmental Analysis to identify synergies between different market segments, as well as Production-Consumption and Demand-Supply Analysis to optimize supply chain efficiency. Our Import-Export Analysis helps businesses navigate global trade environments by evaluating trade flows and policies. These insights empower clients to make informed strategic decisions, mitigate risks, and capitalize on market opportunities.

TABLE OF CONTENTS

1: Substrate-Like PCB Market Overview

2: Executive Summary

3: Premium Insights on the Market

4: Substrate-Like PCB Market Outlook

5: Substrate-Like PCB Market Strategy

6: Substrate-Like PCB Market Size

7: Substrate-Like PCB Market, by Type

8: Substrate-Like PCB Market, by Product

9: Substrate-Like PCB Market, by Technology

10: Substrate-Like PCB Market, by Component

11: Substrate-Like PCB Market, by Application

12: Substrate-Like PCB Market, by Material Type

13: Substrate-Like PCB Market, by Process

14: Substrate-Like PCB Market, by End User

15: Substrate-Like PCB Market, by Functionality

16: Substrate-Like PCB Market, by Region

17: Competitive Landscape

18: Company Profiles

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