세계의 반도체 유전체 에칭 장비 시장 보고서 : 유형별, 용도별, 지역별(2025-2033년)
Semiconductor Dielectric Etching Equipment Market Report by Type (Wet Etching Equipment, Dry Etching Equipment), Application (Foundries, Integrated Device Manufacturers (IDMs)), and Region 2025-2033
상품코드:1636334
리서치사:IMARC
발행일:2025년 01월
페이지 정보:영문 142 Pages
라이선스 & 가격 (부가세 별도)
ㅁ Add-on 가능: 고객의 요청에 따라 일정한 범위 내에서 Customization이 가능합니다. 자세한 사항은 문의해 주시기 바랍니다.
한글목차
반도체 유전체 에칭 장비 시장 세계 시장 규모는 2024년 13억 달러에 달했습니다. 향후 IMARC Group은 2033년에는 18억 달러에 달할 것으로 예상하며, 2025-2033년간 연평균 성장률(CAGR)은 3.09%를 나타낼 것으로 전망하고 있습니다. 전자 산업의 대폭적인 확대, 반도체 수요 증가, 스마트 기기의 보급 확대가 시장을 견인하는 주요 요인 중 하나입니다.
반도체 유전체 에칭 장비(SDEE)는 반도체 제조 공정에서 포토레지스트 마스크, 산화규소, 질화규소 등 다양한 유전체 물질을 연마 및 제거하기 위해 사용되는 전용 장비를 말합니다. 습식 에칭 장비와 건식 에칭 장비가 포함되며, 다양한 화학물질이 사용됩니다. 유전체 에칭은 더 높은 프로파일 제어를 위해 일산화탄소를 사용하기도 합니다. 이러한 제품은 높은 종횡비(HAR), 깊은 트렌치, 큰 캐비티와 같은 다양한 물리적 특징을 잘라내는 데 도움이되며, SDEE는 작업 중 정확도를 높이고 공정을 자동화하며 작업 위험을 줄이고 폐기하기 쉽습니다.
반도체 유전체 에칭 장비 시장 동향 :
전자 분야의 대폭적인 확대와 스마트폰, 태블릿, 데스크톱 등 다양한 고성능 소비자 전자제품의 구매 증가가 시장 성장의 주요 요인으로 작용하고 있습니다. 또한, 반도체 회로의 소형화가 진행되면서 유전체 에칭 장비에 대한 수요가 증가하고 있는 것도 시장 성장에 기여하고 있습니다. 또한, 최근 전 세계적인 산업 자동화로 인해 OEM이 플랫 패널 디스플레이 스크린과 NAND 플래시 메모리 제조에 이 제품을 널리 사용하게 된 것도 성장을 가속하는 요인으로 작용하고 있습니다. 이와 함께, 반도체 제조 공정 최적화를 위한 유전체 에칭 장비의 개발 등 기술 발전이 시장 성장을 뒷받침하고 있습니다. 또한, 머신러닝(ML), 인공지능(AI) 기능, 사물인터넷(IoT), 차량용 센서의 대규모 통합과 더 높은 정확도를 제공하는 것이 시장 성장을 가속하고 있습니다. 또한, 자율주행차의 지속적인 시장 개척은 자동차에 반도체의 사용을 더욱 강화하여 시장 성장을 가속하고 있습니다. 핀형 전계효과 트랜지스터(FinFET) 아키텍처의 확산도 시장을 견인하고 있으며, FinFET 설계에서 주요 에칭 공정 중 하나로 유전체 에칭이 사용되기 때문에 반도체 유전체 에칭 장비에 대한 수요를 촉진할 것으로 예상됩니다. 기타 요인으로는 최근 주요 기업 간 인수합병(M&A), 보다 효과적인 제품 변형을 도입하기 위한 최근의 기술 혁신, 광범위한 연구개발(R&D) 활동 등이 시장 전망을 밝게 하고 있습니다.
본 보고서에서 다룬 주요 질문
세계 반도체 유전체 에칭 장비 시장은 지금까지 어떻게 성장해 왔으며, 앞으로 어떻게 발전할 것인가?
The global semiconductor dielectric etching equipment market size reached USD 1.3 Billion in 2024. Looking forward, IMARC Group expects the market to reach USD 1.8 Billion by 2033, exhibiting a growth rate (CAGR) of 3.09% during 2025-2033. The significant expansion in the electronics industry, the rising demand for semiconductors, and the increasing penetration of smart devices represent some of the key factors driving the market.
Semiconductor dielectric etching equipment (SDEE) refers to specialized apparatus that is employed to polish and remove various dielectric substances, such as photo-resist mask, silicon oxide, and silicon nitride, during the semiconductor manufacturing procedure. It includes wet and dry etching equipment, which is used with numerous chemicals. In some instances, carbon monoxide is also utilized in the dielectric etching procedure due to higher profile control. These products help carve out varying physical features, including high aspect ratio (HAR), deep trenches, and large cavities. SDEE offers more precision during operations, automates processes, reduces work hazards, and is easier to dispose.
The significant expansion in the electronics sector and the increasing purchase of various high-performance consumer electronic products, such as smartphones, tablets, and desktops, represent a major factor driving the market toward growth. This can be further attributed to the ongoing trend of miniaturizing semiconductor circuits, which is facilitating the demand for dielectric etching equipment. Additionally, the recent industrial automation across the globe has prompted original equipment manufacturers (OEMs) to widely use the product to fabricate flat panel display screens and not-and (NAND) flash memory, which is acting as another growth-inducing factor. In line with this, significant technological advancements, such as the developments in the dielectric etching equipment capabilities to optimize the semiconductor production operations, are supporting the market growth. Moreover, the large-scale integration of machine learning (ML), artificial intelligence (AI) capabilities, Internet of Things (IoT), and automotive sensors to offer more precision is favoring the market growth. Furthermore, the continuous development of autonomous vehicles has further intensified the usage of semiconductors in vehicles, which is propelling the market growth. The market is also being driven by the widespread adoption of fin-shaped field effect transistor (FinFET) architecture. Since FinFET design uses dielectric etching as one of the major etching steps in its designing process, this is expected to facilitate the demand for semiconductor dielectric etching equipment. Other factors, such as the recent mergers and acquisitions (M&A) amongst key players, recent innovations to introduce more effective product variants, and extensive research and development (R&D) activities, are creating a positive outlook for the market.
Key Market Segmentation:
Type Insights:
Wet Etching Equipment
Dry Etching Equipment
The report has also provided a detailed breakup and analysis of the semiconductor dielectric etching equipment market based on the type. This includes wet and dry etching equipment. According to the report, dry etching equipment represented the largest segment.
Application Insights:
Foundries
Integrated Device Manufacturers (IDMs)
Regional Insights:
North America
United States
Canada
Asia Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
The report has also provided a comprehensive analysis of all the major regional markets that include North America (the United States and Canada); Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others); Latin America (Brazil, Mexico, and others); and the Middle East and Africa. According to the report, Asia Pacific was the largest market for semiconductor dielectric etching equipment. Some of the factors driving the Asia Pacific semiconductor dielectric etching equipment market included extensive research and development (R&D) activities, the increasing demand for smart devices, and significant technological advancements.
Competitive Landscape:
The report has also provided a comprehensive analysis of the competitive landscape in the global semiconductor dielectric etching equipment market. Detailed profiles of all major companies have also been provided. Some of the companies covered include Advanced Micro-Fabrication Equipment Inc. China, Applied Materials Inc., Hitachi High-Technologies Corporation (Hitachi Ltd), Lam Research Corporation, Mattson Technology, Oxford Instruments, SPTS Technologies Ltd. (KLA Corporation), Tokyo Electron Limited, etc.
Key Questions Answered in This Report:
How has the global semiconductor dielectric etching equipment market performed so far and how will it perform in the coming years?
What are the drivers, restraints, and opportunities in the global semiconductor dielectric etching equipment market?
What are the key regional markets?
Which countries represent the most attractive semiconductor dielectric etching equipment market?
What is the breakup of the market based on the type?
What is the breakup of the market based on the application?
What is the competitive structure of the global semiconductor dielectric etching equipment market?
Who are the key players/companies in the global semiconductor dielectric etching equipment market?
Table of Contents
1 Preface
2 Scope and Methodology
2.1 Objectives of the Study
2.2 Stakeholders
2.3 Data Sources
2.3.1 Primary Sources
2.3.2 Secondary Sources
2.4 Market Estimation
2.4.1 Bottom-Up Approach
2.4.2 Top-Down Approach
2.5 Forecasting Methodology
3 Executive Summary
4 Introduction
4.1 Overview
4.2 Key Industry Trends
5 Global Semiconductor Dielectric Etching Equipment Market
5.1 Market Overview
5.2 Market Performance
5.3 Impact of COVID-19
5.4 Market Forecast
6 Market Breakup by Type
6.1 Wet Etching Equipment
6.1.1 Market Trends
6.1.2 Market Forecast
6.2 Dry Etching Equipment
6.2.1 Market Trends
6.2.2 Market Forecast
7 Market Breakup by Application
7.1 Foundries
7.1.1 Market Trends
7.1.2 Market Forecast
7.2 Integrated Device Manufacturer (IDMs)
7.2.1 Market Trends
7.2.2 Market Forecast
8 Market Breakup by Region
8.1 North America
8.1.1 United States
8.1.1.1 Market Trends
8.1.1.2 Market Forecast
8.1.2 Canada
8.1.2.1 Market Trends
8.1.2.2 Market Forecast
8.2 Asia-Pacific
8.2.1 China
8.2.1.1 Market Trends
8.2.1.2 Market Forecast
8.2.2 Japan
8.2.2.1 Market Trends
8.2.2.2 Market Forecast
8.2.3 India
8.2.3.1 Market Trends
8.2.3.2 Market Forecast
8.2.4 South Korea
8.2.4.1 Market Trends
8.2.4.2 Market Forecast
8.2.5 Australia
8.2.5.1 Market Trends
8.2.5.2 Market Forecast
8.2.6 Indonesia
8.2.6.1 Market Trends
8.2.6.2 Market Forecast
8.2.7 Others
8.2.7.1 Market Trends
8.2.7.2 Market Forecast
8.3 Europe
8.3.1 Germany
8.3.1.1 Market Trends
8.3.1.2 Market Forecast
8.3.2 France
8.3.2.1 Market Trends
8.3.2.2 Market Forecast
8.3.3 United Kingdom
8.3.3.1 Market Trends
8.3.3.2 Market Forecast
8.3.4 Italy
8.3.4.1 Market Trends
8.3.4.2 Market Forecast
8.3.5 Spain
8.3.5.1 Market Trends
8.3.5.2 Market Forecast
8.3.6 Russia
8.3.6.1 Market Trends
8.3.6.2 Market Forecast
8.3.7 Others
8.3.7.1 Market Trends
8.3.7.2 Market Forecast
8.4 Latin America
8.4.1 Brazil
8.4.1.1 Market Trends
8.4.1.2 Market Forecast
8.4.2 Mexico
8.4.2.1 Market Trends
8.4.2.2 Market Forecast
8.4.3 Others
8.4.3.1 Market Trends
8.4.3.2 Market Forecast
8.5 Middle East and Africa
8.5.1 Market Trends
8.5.2 Market Breakup by Country
8.5.3 Market Forecast
9 Drivers, Restraints, and Opportunities
9.1 Overview
9.2 Drivers
9.3 Restraints
9.4 Opportunities
10 Value Chain Analysis
11 Porters Five Forces Analysis
11.1 Overview
11.2 Bargaining Power of Buyers
11.3 Bargaining Power of Suppliers
11.4 Degree of Competition
11.5 Threat of New Entrants
11.6 Threat of Substitutes
12 Price Analysis
13 Competitive Landscape
13.1 Market Structure
13.2 Key Players
13.3 Profiles of Key Players
13.3.1 Advanced Micro-Fabrication Equipment Inc. China
