세계의 첨단 패키징 시장은 2024년에 385억 달러에 이르렀으며, 2025년부터 2034년에 걸쳐 11.5%의 연평균 복합 성장률(CAGR)을 나타내 견조한 성장이 전망되고 있습니다.
이 성장의 원동력이 되고 있는 것은 전자 부품의 소형화가 진행되고 있는 것과, 복수의 산업에서 인공지능이 널리 채용되고 있는 것입니다. 열 성능, 전반적인 신뢰성을 최적화하고, 전자 디바이스가 보다 높은 효율과 내구성으로 동작하는 것을 가능하게 하고 있습니다.
기술의 진보는 반도체 산업을 재형성하고 첨단 패키징 기법의 혁신을 촉진하고 있습니다. 자율기술에 대한 투자 증가는 디바이스의 장수명화, 방열, 에너지 효율 개선에 중요한 역할을 하는 첨단 반도체 패키징 수요를 더욱 촉진하고 있습니다.
| 시장 범위 | |
|---|---|
| 시작 연도 | 2024년 |
| 예측 연도 | 2025-2034년 |
| 시작 금액 | 385억 달러 |
| 예측 금액 | 1,114억 달러 |
| CAGR | 11.5% |
시장은 패키징 유형별로 플립칩, 팬인 웨이퍼 레벨 패키징, 임베디드 다이, 팬아웃, 2.5D/3D 기술로 구분됩니다. 기판에 직접 연결하기 때문에 신호 경로의 길이와 저항이 효과적으로 최소화됩니다.
용도별로 보면 첨단 패키징 시장은 가전, 자동차, 산업, 헬스케어, 항공우주 및 방위, 기타 산업에 이르고 있습니다. 자동차 분야는 2024년에 11.1% 시장 점유율을 차지했습니다. AI에 의한 컴퓨팅의 진보는 자동차 기술에 혁명을 가져오고, 실시간 의사결정을 가능하게 하고, 센서의 통합을 강화하고, 차량 성능을 향상시키고 있습니다.
미국의 첨단 패키징 시장은 2024년에 102억 달러에 달했고, 반도체와 첨단 패키징 기술에 있어서의 미국의 리더십을 강화하는 것을 목적으로 한 정부의 강력한 이니셔티브가 그 원동력이 되고 있습니다. 주요 반도체 제조업체와 연구 기관의 존재가 기술 진보를 가속해, 반도체 기술 혁신의 세계의 허브로서의 지위를 확고한 것으로 하고 있습니다.
The Global Advanced Packaging Market reached USD 38.5 billion in 2024 and is expected to grow at a robust CAGR of 11.5% from 2025 to 2034. This growth is fueled by the increasing miniaturization of electronic components and the widespread adoption of artificial intelligence across multiple industries. As the demand for compact, high-performance devices accelerates, advanced packaging solutions are becoming indispensable for enhancing functionality and efficiency. Semiconductor manufacturers are leveraging cutting-edge packaging technologies to optimize power management, thermal performance, and overall reliability, enabling electronic devices to operate with greater efficiency and durability. The growing emphasis on next-generation semiconductor solutions has positioned advanced packaging as a cornerstone of technological evolution across sectors such as consumer electronics, automotive, healthcare, aerospace, and industrial applications.
Technological advancements are reshaping the semiconductor industry, driving innovations in advanced packaging methodologies. The increasing integration of AI-driven applications and high-performance computing is prompting semiconductor manufacturers to develop highly efficient packaging solutions that support rapid data processing and enhanced connectivity. Rising investments in 5G, Internet of Things (IoT), and autonomous technologies are further propelling the demand for advanced semiconductor packaging, which plays a crucial role in improving device longevity, heat dissipation, and energy efficiency. As industries prioritize performance optimization, the need for customized, application-specific packaging solutions continues to grow, reinforcing the industry's upward trajectory.
| Market Scope | |
|---|---|
| Start Year | 2024 |
| Forecast Year | 2025-2034 |
| Start Value | $38.5 billion |
| Forecast Value | $111.4 billion |
| CAGR | 11.5% |
The market is segmented by packaging type into flip-chip, fan-in wafer-level packaging, embedded-die, fan-out, and 2.5D/3D technologies. Flip-chip-based advanced packaging dominated the segment, accounting for USD 24 billion in 2023, due to its ability to provide high-density interconnections. This technique involves flipping the chip and connecting it directly to the substrate using solder bumps, effectively minimizing signal path length and resistance. Flip-chip packaging is extensively utilized in mobile devices and high-performance electronic components that require enhanced signal integrity, reduced power consumption, and improved performance. The continuous adoption of advanced semiconductor packaging solutions across various applications is accelerating growth in this segment.
By application, the advanced packaging market spans consumer electronics, automotive, industrial, healthcare, aerospace & defense, and other industries. The automotive segment accounted for an 11.1% market share in 2024, as the integration of advanced packaging solutions plays a crucial role in optimizing power efficiency and signal transmission in electronic control units. AI-driven computing advancements are revolutionizing automotive technologies, enabling real-time decision-making, enhancing sensor integration, and improving vehicle performance. With increasing demand for electric and autonomous vehicles, advanced packaging solutions are becoming essential for ensuring reliable electronic control systems and superior vehicle efficiency.
The US advanced packaging market reached USD 10.2 billion in 2024, driven by strong government initiatives aimed at reinforcing the nation's leadership in semiconductor and advanced packaging technologies. The emphasis on domestic manufacturing and supply chain resilience is fueling market expansion with increased investments in next-generation packaging solutions. The presence of key semiconductor manufacturers and research institutions is accelerating technological advancements, solidifying the country's status as a global hub for semiconductor innovation. Government-backed incentives and strategic collaborations are further strengthening the industry, ensuring long-term growth and competitiveness in the global semiconductor market.