한글목차

전자기기나 시스템의 소형화, 고속화, 고출력화에 수반해, 효과적인 열인터페이스 재료는 산업 전체에서 점점 중요해지고 있습니다. 전기자동차 파워 일렉트로닉스 및 재생 가능 에너지 인버터에서 고급 반도체 및 데이터센터 서버에 이르기까지 열 인터페이스를 효율적으로 관리하는 것은 최적의 성능, 장치 신뢰성 및 시스템의 긴 수명화에 필수적입니다. 기업은 열전도성, 비용 효율성, 환경 지속가능성의 균형을 유지하면서 증가하는 열저항 문제를 해결하는 최첨단 열 인터페이스 솔루션을 채택해야 합니다. 이에 반해 재료과학자와 제조업체는 새로운 상변화 처방, 탄소나노튜브와 그래핀을 포함한 차세대 복합재료, 열전도성 세라믹, 액체금속 인터페이스 등 첨단 열인터페이스 재료의 개발에 임하고 있습니다. 이러한 혁신은 적합성, 신뢰성, 적용 용이성 등 중요한 특성을 유지하면서 열전도성의 한계를 넓히는 것을 목표로 합니다. 초점은 더 높은 열유속에 대응하고, 열저항을 감소시키고, 장기간의 작동 사이클 동안 성능을 유지할 수 있는 TIM의 개발입니다.

파워 일렉트로닉스의 광대역 갭 반도체로의 전환, 컴퓨팅 용도에서 프로세서의 고밀도화, 전기자동차 채택의 확대 등 여러 가지 중요한 동향으로 인해 강화된 열 인터페이스 재료에 대한 수요가 증가하고 있습니다. 이러한 용도는 엄격한 환경 조건에서 안정적인 성능을 발휘하면서 높은 작동 온도를 관리할 수 있는 TIM이 필요합니다. 장치가 계속 진화하는 동안 열인터페이스 재료는 차세대 전자 및 전력 시스템을 실현하는데 점점 더 중요한 역할을 수행하고 있습니다.

열인터페이스 재료 시장은 전자, 자동차, 의료기기, 산업 분야 등 다양한 부문에서 수요가 증가함에 따라 강력한 성장을 보이고 있습니다. 기존의 재료가 계속 시장을 독점하고 있으며, 열 그리스와 갭 필러가 현재의 용도의 약 45-50%를 차지하고 있습니다. 그러나 상변화 컴파운드, 그래핀 강화제품, 새로운 복합재료를 포함한 첨단 재료는 특히 고성능 용도에서 큰 시장 점유율을 얻고 있습니다. 액체 금속 부문은 규모가 작지만 열 성능이 중요한 고급 응용 분야에서 급성장을 보여줍니다.

이 보고서는 세계의 열 인터페이스 머티리얼(TIM) 시장에 대해 조사 분석하고, 2025-2035년 시장 동향, 기술 개발, 성장 기회에 대한 상세한 고찰을 제공합니다.

목차

제1장 서론

• 열 관리 - 액티브 및 패시브
• 열인터페이스 재료(TIM)이란
• TIM의 비교 특성
• 열 패드와 그리스의 차이
• TIM의 장단점 : 유형별
• 퍼포먼스
• 가격
• TIM의 신기술
• TIM공급망
• 원재료 분석 및 가격 설정
• 환경규제와 지속가능성

제2장 재료

• 첨단 다기능 TIM
• TIM 필러
• 열전도 그리스, 페이스트
• 열 갭 패드
• 열 갭 필러
• 포팅 컴파운드/봉지재
• 접착 테이프
• 상변화물질
• 금속 베이스 TIM
• 탄소 기반 TIM
• 메타물질
• 자가 복구형 열 인터페이스 머티리얼
• TIM 디스펜싱

제3장 열인터페이스 재료(TIM) 시장

• 소비자 일렉트로닉스
• 전기자동차(EV)
• 데이터센터
• ADAS 센서
• EMI 실드
• 5G
• 항공우주 및 방위
• 공업용 전자 기기
• 신재생에너지
• 의료용 전자 기기

제4장 기업 프로파일(기업 11사의 프로파일)

제5장 조사 방법

제6장 참고문헌

영문목차

Effective thermal interface materials are becoming increasingly critical across industries as electronic devices and systems grow smaller, faster, and more power-dense. From electric vehicle power electronics and renewable energy inverters to advanced semiconductors and data center servers, managing thermal interfaces efficiently is essential for optimal performance, device reliability, and system longevity. Companies are facing rising pressure to adopt cutting-edge thermal interface solutions that address growing thermal resistance challenges while balancing thermal conductivity, cost-effectiveness, and environmental sustainability. In response, materials scientists and manufacturers are developing advanced thermal interface materials - including novel phase-change formulations, next-generation composite materials incorporating carbon nanotubes and graphene, thermally conductive ceramics, and liquid metal interfaces. These innovations aim to push the boundaries of thermal conductivity while maintaining critical properties like conformability, reliability, and ease of application. The focus is on developing TIMs that can handle higher heat fluxes, reduce thermal resistance, and maintain performance over extended operating cycles.

The demand for enhanced thermal interface materials is being driven by several key trends: the transition to wide bandgap semiconductors in power electronics, increasing processor densities in computing applications, and the growing adoption of electric vehicles. These applications require TIMs capable of managing higher operating temperatures while providing consistent performance under challenging environmental conditions. As devices continue to evolve, thermal interface materials play an increasingly vital role in enabling next-generation electronics and power systems.

The thermal interface materials (TIM) market demonstrates robust growth driven by increasing demands across multiple sectors including electronics, automotive, medical devices, and industrial applications. Traditional materials continue to dominate the market, with thermal greases and gap fillers representing approximately 45-50% of current applications. However, advanced materials including phase change compounds, graphene-enhanced products, and novel composites are gaining significant market share, particularly in high-performance applications. The liquid metal segment, while smaller, shows rapid growth in premium applications where thermal performance is critical.

"The Global Thermal Interface Materials Market 2025-2035" analyzes the global thermal interface materials (TIMs) industry, providing detailed insights into market trends, technological developments, and growth opportunities from 2025 to 2035. The report examines the crucial role of thermal interface materials in managing heat dissipation across various industries, including consumer electronics, electric vehicles, data centers, aerospace & defense, and emerging technology sectors. The study provides in-depth analysis of various TIM types, including thermal greases, gap fillers, phase change materials, metal-based TIMs, and emerging technologies such as graphene-enhanced compounds and carbon nanotubes. A detailed examination of material properties, performance characteristics, and application-specific requirements offers valuable insights for industry stakeholders.

Report contents include:

• Key market segments covered include consumer electronics, where increasing device miniaturization drives demand for advanced thermal management solutions; electric vehicles, where battery thermal management and power electronics create new opportunities; and data centers, where growing computing demands necessitate improved cooling solutions.
• Emerging applications in 5G infrastructure, ADAS sensors, and medical electronics.
• Carbon-based TIMs, metamaterials, and self-healing compounds.
• Supply chain analysis
• Price analysis of both raw materials and finished products.
• Market forecasts for all major segments, with detailed breakdowns by material type, application, and geographic region. The analysis includes market size projections, growth rates, and emerging opportunities across different end-use sectors.
• Detailed profiles of 111 companies active in the thermal interface materials market, from established global manufacturers to innovative technology startups. Each profile includes company overview, product portfolio, technological capabilities, and strategic developments. Companies profiled include 3M, ADA Technologies, AI Technology Inc., Aismalibar S.A., Alpha Assembly, AOK Technologies, AOS Thermal Compounds LLC, Arkema, Arieca Inc., ATP Adhesive Systems AG, Aztrong Inc., Bando Chemical Industries Ltd., BestGraphene, BNNano, BNNT LLC, Boyd Corporation, BYK, Cambridge Nanotherm, Carbice Corp., Carbon Waters, Carbodeon Ltd. Oy, CondAlign AS, Denka Company Limited, Detakta Isolier- und Messtechnik GmbH & Co. KG, Dexerials Corporation, Deyang Carbonene Technology, Dow Corning, Dupont (Laird Performance Materials), Dymax Corporation, Dynex Semiconductor (CRRC), ELANTAS Europe GmbH, Elkem Silcones, Enerdyne Thermal Solutions Inc., Epoxies Etc., First Graphene Ltd, Fujipoly, Fujitsu Laboratories, GCS Thermal, GLPOLY, Global Graphene Group, Goodfellow Corporation, Graphmatech AB, GuangDong KingBali New Material Co. Ltd., HALA Contec GmbH & Co. KG, Hamamatsu Carbonics Corporation, H.B. Fuller Company, Henkel AG & Co. KGAA, Hitek Electronic Materials, Honeywell, Hongfucheng New Materials, Huber Martinswerk, HyMet Thermal Interfaces SIA, Indium Corporation, Inkron, KB Element, Kerafol Keramische Folien GmbH & Co. KG, Kitagawa, KULR Technology Group Inc., Kyocera, Leader Tech Inc., LiSAT, LiquidCool Solutions, Liquid Wire Inc., MacDermid Alpha, MG Chemicals Ltd, Minoru Co. Ltd., Mithras Technology AG, Molecular Rebar Design LLC, Momentive Performance Materials, Morion NanoTech, Nanoramic Laboratories, Nano Tim, NeoGraf Solutions LLC, Nitronix, Nolato Silikonteknik, NovoLinc and more.
• Technical specifications and performance metrics for various TIM types, enabling comparison of different solutions for specific applications.

TABLE OF CONTENTS

1. INTRODUCTION

• 1.1. Thermal management-active and passive
• 1.2. What are thermal interface materials (TIMs)?
  • 1.2.1. Types
  • 1.2.2. Thermal conductivity
• 1.3. Comparative properties of TIMs
• 1.4. Differences between thermal pads and grease
• 1.5. Advantages and disadvantages of TIMs, by type
• 1.6. Performance
• 1.7. Prices
• 1.8. Emerging Technologies in TIMs
• 1.9. Supply Chain for TIMs
• 1.10. Raw Material Analysis and Pricing
• 1.11. Environmental Regulations and Sustainability

2. MATERIALS

• 2.1. Advanced and Multi-Functional TIMs
• 2.2. TIM fillers
  • 2.2.1. Trends
  • 2.2.2. Pros and Cons
  • 2.2.3. Thermal Conductivity
  • 2.2.4. Spherical Alumina
  • 2.2.5. Alumina Fillers
  • 2.2.6. Boron nitride (BN)
  • 2.2.7. Filler and polymer TIMs
  • 2.2.8. Filler Sizes
• 2.3. Thermal greases and pastes
  • 2.3.1. Overview and properties
  • 2.3.2. SWOT analysis
• 2.4. Thermal gap pads
  • 2.4.1. Overview and properties
  • 2.4.2. SWOT analysis
• 2.5. Thermal gap fillers
  • 2.5.1. Overview and properties
  • 2.5.2. SWOT analysis
• 2.6. Potting compounds/encapsulants
  • 2.6.1. Overview and properties
  • 2.6.2. SWOT analysis
• 2.7. Adhesive Tapes
  • 2.7.1. Overview and properties
  • 2.7.2. SWOT analysis
• 2.8. Phase Change Materials
  • 2.8.1. Overview and properties
  • 2.8.2. Types
    • 2.8.2.1. Organic/biobased phase change materials
      • 2.8.2.1.1. Advantages and disadvantages
      • 2.8.2.1.2. Paraffin wax
      • 2.8.2.1.3. Non-Paraffins/Bio-based
    • 2.8.2.2. Inorganic phase change materials
      • 2.8.2.2.1. Salt hydrates
        • 2.8.2.2.1.1. Advantages and disadvantages
      • 2.8.2.2.2. Metal and metal alloy PCMs (High-temperature)
    • 2.8.2.3. Eutectic mixtures
    • 2.8.2.4. Encapsulation of PCMs
      • 2.8.2.4.1. Macroencapsulation
      • 2.8.2.4.2. Micro/nanoencapsulation
    • 2.8.2.5. Nanomaterial phase change materials
  • 2.8.3. Thermal energy storage (TES)
    • 2.8.3.1. Sensible heat storage
    • 2.8.3.2. Latent heat storage
  • 2.8.4. Application in TIMs
    • 2.8.4.1. Thermal pads
    • 2.8.4.2. Low Melting Alloys (LMAs)
  • 2.8.5. SWOT analysis
• 2.9. Metal-based TIMs
  • 2.9.1. Overview
  • 2.9.2. Solders and low melting temperature alloy TIMs
    • 2.9.2.1. Solder TIM1
    • 2.9.2.2. Sintering
  • 2.9.3. Liquid metals
  • 2.9.4. Solid liquid hybrid (SLH) metals
    • 2.9.4.1. Hybrid liquid metal pastes
    • 2.9.4.2. SLH created during chip assembly (m2TIMs)
    • 2.9.4.3. Die-attach materials
      • 2.9.4.3.1. Solder Alloys and Conductive Adhesives
      • 2.9.4.3.2. Silver-Sintered Paste
      • 2.9.4.3.3. Copper (Cu) sintered TIMs
        • 2.9.4.3.3.1. TIM1 - Sintered Copper
        • 2.9.4.3.3.2. Cu Sinter Materials
      • 2.9.4.3.4. Sintered Copper Die-Bonding Paste
      • 2.9.4.3.5. Graphene Enhanced Sintered Copper TIMs
  • 2.9.5. SWOT analysis
• 2.10. Carbon-based TIMs
  • 2.10.1. Carbon nanotube (CNT) TIM Fabrication
  • 2.10.2. Multi-walled nanotubes (MWCNT)
    • 2.10.2.1. Properties
    • 2.10.2.2. Application as thermal interface materials
  • 2.10.3. Single-walled carbon nanotubes (SWCNTs)
    • 2.10.3.1. Properties
    • 2.10.3.2. Application as thermal interface materials
  • 2.10.4. Vertically aligned CNTs (VACNTs)
    • 2.10.4.1. Properties
    • 2.10.4.2. Applications
    • 2.10.4.3. Application as thermal interface materials
  • 2.10.5. BN nanotubes (BNNT) and nanosheets (BNNS)
    • 2.10.5.1. Properties
    • 2.10.5.2. Application as thermal interface materials
  • 2.10.6. Graphene
    • 2.10.6.1. Properties
    • 2.10.6.2. Application as thermal interface materials
      • 2.10.6.2.1. Graphene fillers
      • 2.10.6.2.2. Graphene foam
      • 2.10.6.2.3. Graphene aerogel
      • 2.10.6.2.4. Graphene Heat Spreaders
      • 2.10.6.2.5. Graphene in Thermal Interface Pads
  • 2.10.7. Nanodiamonds
    • 2.10.7.1. Properties
    • 2.10.7.2. Application as thermal interface materials
  • 2.10.8. Graphite
    • 2.10.8.1. Properties
    • 2.10.8.2. Natural graphite
      • 2.10.8.2.1. Classification
      • 2.10.8.2.2. Processing
      • 2.10.8.2.3. Flake
        • 2.10.8.2.3.1. Grades
        • 2.10.8.2.3.2. Applications
    • 2.10.8.3. Synthetic graphite
      • 2.10.8.3.1. Classification
        • 2.10.8.3.1.1. Primary synthetic graphite
        • 2.10.8.3.1.2. Secondary synthetic graphite
        • 2.10.8.3.1.3. Processing
    • 2.10.8.4. Applications as thermal interface materials
      • 2.10.8.4.1. Graphite Sheets
      • 2.10.8.4.2. Vertical graphite
      • 2.10.8.4.3. Graphite pastes
  • 2.10.9. Hexagonal Boron Nitride
    • 2.10.9.1. Properties
    • 2.10.9.2. Application as thermal interface materials
  • 2.10.10. SWOT analysis
• 2.11. Metamaterials
  • 2.11.1. Types and properties
    • 2.11.1.1. Electromagnetic metamaterials
      • 2.11.1.1.1. Double negative (DNG) metamaterials
      • 2.11.1.1.2. Single negative metamaterials
      • 2.11.1.1.3. Electromagnetic bandgap metamaterials (EBG)
      • 2.11.1.1.4. Bi-isotropic and bianisotropic metamaterials
      • 2.11.1.1.5. Chiral metamaterials
      • 2.11.1.1.6. Electromagnetic "Invisibility" cloak
    • 2.11.1.2. Terahertz metamaterials
    • 2.11.1.3. Photonic metamaterials
    • 2.11.1.4. Tunable metamaterials
    • 2.11.1.5. Frequency selective surface (FSS) based metamaterials
    • 2.11.1.6. Nonlinear metamaterials
    • 2.11.1.7. Acoustic metamaterials
  • 2.11.2. Application as thermal interface materials
• 2.12. Self-healing thermal interface materials
  • 2.12.1. Extrinsic self-healing
  • 2.12.2. Capsule-based
  • 2.12.3. Vascular self-healing
  • 2.12.4. Intrinsic self-healing
  • 2.12.5. Healing volume
  • 2.12.6. Types of self-healing materials, polymers and coatings
  • 2.12.7. Applications in thermal interface materials
• 2.13. TIM Dispensing
  • 2.13.1. Low-volume Dispensing Methods
  • 2.13.2. High-volume Dispensing Methods
  • 2.13.3. Meter, Mix, Dispense (MMD) Systems
  • 2.13.4. TIM Dispensing Equipment Suppliers

3. MARKETS FOR THERMAL INTERFACE MATERIALS (TIMs)

• 3.1. Consumer electronics
  • 3.1.1. Market overview
    • 3.1.1.1. Market drivers
    • 3.1.1.2. Applications
      • 3.1.1.2.1. Smartphones and tablets
      • 3.1.1.2.2. Wearable electronics
  • 3.1.2. Global market 2022-2035, by TIM type
• 3.2. Electric Vehicles (EV)
  • 3.2.1. Market overview
    • 3.2.1.1. Market drivers
    • 3.2.1.2. Applications
      • 3.2.1.2.1. Lithium-ion batteries
        • 3.2.1.2.1.1. Cell-to-pack designs
        • 3.2.1.2.1.2. Cell-to-chassis/body
      • 3.2.1.2.2. Power electronics
        • 3.2.1.2.2.1. Types
        • 3.2.1.2.2.2. Properties for EV power electronics
        • 3.2.1.2.2.3. TIM2 in SiC MOSFET
      • 3.2.1.2.3. Charging stations
  • 3.2.2. Global market 2022-2035, by TIM type
• 3.3. Data Centers
  • 3.3.1. Market overview
    • 3.3.1.1. Market drivers
    • 3.3.1.2. Applications
      • 3.3.1.2.1. Router, switches and line cards
        • 3.3.1.2.1.1. Transceivers
        • 3.3.1.2.1.2. Server Boards
        • 3.3.1.2.1.3. Switches and Routers
      • 3.3.1.2.2. Servers
      • 3.3.1.2.3. Power supply converters
  • 3.3.2. Global market 2022-2035, by TIM type
• 3.4. ADAS Sensors
  • 3.4.1. Market overview
    • 3.4.1.1. Market drivers
    • 3.4.1.2. Applications
      • 3.4.1.2.1. ADAS Cameras
        • 3.4.1.2.1.1. Commercial examples
      • 3.4.1.2.2. ADAS Radar
        • 3.4.1.2.2.1. Radar technology
        • 3.4.1.2.2.2. Radar boards
        • 3.4.1.2.2.3. Commercial examples
      • 3.4.1.2.3. ADAS LiDAR
        • 3.4.1.2.3.1. Role of TIMs
        • 3.4.1.2.3.2. Commercial examples
      • 3.4.1.2.4. Electronic control units (ECUs) and computers
        • 3.4.1.2.4.1. Commercial examples
      • 3.4.1.2.5. Die attach materials
      • 3.4.1.2.6. Commercial examples
  • 3.4.2. Global market 2022-2035, by TIM type
• 3.5. EMI shielding
  • 3.5.1. Market overview
    • 3.5.1.1. Market drivers
    • 3.5.1.2. Applications
      • 3.5.1.2.1. Dielectric Constant
      • 3.5.1.2.2. ADAS
        • 3.5.1.2.2.1. Radar
        • 3.5.1.2.2.2. 5G
      • 3.5.1.2.3. Commercial examples
• 3.6. 5G
  • 3.6.1. Market overview
    • 3.6.1.1. Market drivers
    • 3.6.1.2. Applications
      • 3.6.1.2.1. EMI shielding and EMI gaskets
      • 3.6.1.2.2. Antenna
      • 3.6.1.2.3. Base Band Unit (BBU)
      • 3.6.1.2.4. Liquid TIMs
      • 3.6.1.2.5. Power supplies
        • 3.6.1.2.5.1. Increased power consumption in 5G
  • 3.6.2. Market players
  • 3.6.3. Global market 2022-2035, by TIM type
• 3.7. Aerospace & Defense
  • 3.7.1. Market overview
    • 3.7.1.1. Market drivers
    • 3.7.1.2. Applications
      • 3.7.1.2.1. Satellite thermal management
      • 3.7.1.2.2. Avionics cooling
      • 3.7.1.2.3. Military electronics
    • 3.7.1.3. Global market 2022-2035, by TIM type
• 3.8. Industrial Electronics
  • 3.8.1. Market overview
    • 3.8.1.1. Market drivers
    • 3.8.1.2. Applications
      • 3.8.1.2.1. Industrial automation
      • 3.8.1.2.2. Power supplies
      • 3.8.1.2.3. Motor drives
      • 3.8.1.2.4. LED lighting
  • 3.8.2. Global market 2022-2035, by TIM type
• 3.9. Renewable Energy
  • 3.9.1. Market overview
    • 3.9.1.1. Market drivers
    • 3.9.1.2. Applications
      • 3.9.1.2.1. Solar inverters
      • 3.9.1.2.2. Wind power electronics
      • 3.9.1.2.3. Energy storage systems
  • 3.9.2. Global market 2022-2035, by TIM type
• 3.10. Medical Electronics
  • 3.10.1. Market overview
    • 3.10.1.1. Market drivers
    • 3.10.1.2. Applications
      • 3.10.1.2.1. Diagnostic equipment
      • 3.10.1.2.2. Medical imaging systems
      • 3.10.1.2.3. Patient monitoring devices
  • 3.10.2. Global market 2022-2035, by TIM type

4. COMPANY PROFILES (11 company profiles)

5. RESEARCH METHODOLOGY

6. REFERENCES