세계의 3차원 집적회로(3D IC) 시장 : 규모, 점유율, 성장 및 산업 분석, 유형별, 용도별, 지역별 인사이트 및 예측(2024-2032년)
3D IC Market Size, Share, Growth and Global Industry Analysis By Type & Application, Regional Insights and Forecast, 2024-2032
상품코드:1891516
리서치사:Fortune Business Insights Pvt. Ltd.
발행일:2025년 12월
페이지 정보:영문 160 Pages
라이선스 & 가격 (부가세 별도)
한글목차
3차원 집적회로(3D IC) 시장의 성장 요인
세계의 3차원 집적회로(3D IC) 시장은 반도체 패키징 기술의 빠른 진보와 고성능 에너지 효율적 전자 시스템에 대한 수요 증가를 배경으로 강력한 확대를 보이고 있습니다. 2024년 세계의 3차원 집적회로(3D IC) 시장 규모는 171억 3,000만 달러로 평가되었습니다. 다수의 최종 이용 산업에서의 수직 적층 집적회로 아키텍처의 채택 확대를 반영하여 시장은 2025년에 194억 6,000만 달러로 성장하고, 2032년까지 482억 7,000만 달러로 크게 확대될 것으로 예측됩니다.
3D IC 기술은 다수의 반도체 다이를 수직으로 적층하여, 기존의 2차원 IC에 비해 성능 향상, 전력 소비 절감, 공간 효율 향상을 실현합니다. 전통적인 미세화 접근법이 물리적 및 경제적 한계에 도달하면서 아키텍처의 중요성은 점점 더 높아지고 있습니다. 본 시장은 3D 메모리, 프로세서, 센서, LED, 마이크로 일렉트로닉스 시스템 등 폭넓은 컴포넌트 외에 실리콘 관통 전극(TSV), 3D 팬아웃 패키징, 3D 웨이퍼 레벨 칩 스케일 패키징(WLCSP), 모놀리식 3D IC 등의 기반 기술을 포함하고 있습니다.
2024년 북미는 세계의 3차원 집적회로(3D IC) 시장을 주도하여 전체 시장 점유율의 38%를 차지했습니다. 이 지역의 이점은 인텔, NVIDIA, AMD, 마이크론 테크놀로지 등 주요 반도체 기업의 강력한 존재감과 R&D에 대한 많은 투자를 통해 뒷받침됩니다. 데이터센터, 인공지능 워크로드, 클라우드 컴퓨팅, 고급 소비자용 전자기기의 높은 수요가 북미의 시장 포지션을 지속적으로 강화하고 있습니다.
COVID-19의 유행은 세계 공급망과 제조업무를 혼란시켜 선진적인 반도체 부품의 생산 및 개발에 지연을 초래했습니다. 그러나 유행은 세계의 디지털 전환을 가속화하는 결과를 낳았습니다. 재택 근무와 클라우드 서비스를 지원하는 노트북, 서버, 네트워크 장비 및 데이터센터 인프라에 대한 수요 증가는 초기 과제를 상쇄하고 3차원 집적회로(3D IC) 시장의 장기적인 전망을 강화했습니다.
생성형 AI가 3차원 집적회로(3D IC) 시장에 미치는 영향
생성형 인공지능(AI)의 빠른 대두는 3차원 집적회로(3D IC) 시장의 주요 성장 추진력이 되고 있습니다. 고급 AI 모델은 뛰어난 연산 능력, 높은 메모리 대역폭 및 에너지 절감 처리 아키텍처를 요구합니다. 3D IC는 로직과 메모리의 밀접한 통합을 가능하게 하고 대기 시간과 전력 소모를 줄여 이러한 요구 사항을 충족합니다. 엔비디아, AMD, 인텔 등 주요 칩 제조업체는 AI 워크로드를 지원하기 위해 프로세서에 첨단 3D IC 기술 통합을 가속화하고 있으며, 2025년부터 2032년까지 시장 도입이 촉진될 전망입니다.
시장 동향과 성장 요인
시장을 형성하는 주요 동향 중 하나는 고성능 컴퓨팅(HPC) 분야에서의 3D IC의 채택입니다. TSV(실리콘 관통 전극), 인터포저 기반 아키텍처, 첨단 웨이퍼 레벨 패키징 등의 기술은 데이터 전송 속도를 높이고 시스템 효율을 향상시킵니다. 이러한 혁신 기술은 AI 가속기, GPU, 차세대 프로세서에서 널리 활용됩니다.
소비자용 전자기기 분야는 스마트폰, 태블릿, 웨어러블 디바이스, 게임기 등 컴팩트하고 고성능인 디바이스에 대한 수요에 견인되어 최대 최종 사용자 부문을 유지하고 있습니다. 이와 더불어 자동차 분야는 자율주행, ADAS 및 자동차 연결 시스템을 위한 첨단 전자기기의 통합 추진으로 고성장 부문으로 부상하고 있습니다.
지역별 전망
2024년에도 북미가 시장을 선도한 한편 아시아태평양은 2032년까지 가장 빠른 성장이 예상됩니다. 중국, 한국, 일본, 대만은 강력한 반도체 제조 능력 외에도 TSMC, 삼성 등 기업의 대규모 투자가 지역 확대를 견인하고 있습니다. 유럽은 자동차 전자 및 산업 자동화 분야의 혁신에 힘입어 높은 점유율을 차지하고 있습니다. 한편 중동 및 아프리카에서는 스마트 인프라와 디지털 전환의 대처가 성장의 원동력이 되고 있습니다.
목차
제1장 서론
제2장 주요 요약
제3장 시장 역학
매크로 및 마이크로 경제 지표
성장 촉진요인, 억제요인, 기회 및 동향
생성형 AI의 영향
제4장 경쟁 구도
주요 기업의 사업 채용 전략
주요 기업의 통합 SWOT 분석
세계의 3D IC 내 주요 기업(상위 3-5개사)의 시장 점유율 및 순위(2023년)
제5장 세계의 3차원 집적회로(3D IC) 시장 규모 추정 및 예측(부문별(2019-2032년))
주요 조사 결과
기술별
실리콘 관통 전극(TSV)
3D 팬아웃 패키징
3D 웨이퍼 레벨 칩 스케일 패키징(WLCSP)
모놀리식 3D 집적회로
기타(유리 관통 전극(TGV) 등)
컴포넌트별
3D 메모리
LED
센서
프로세서
기타(마이크로 일렉트로닉스 시스템 등)
용도별
로직 및 메모리 집적
이미징 및 광전자
MEMS 및 센서
LED 패키징
기타(전원 관리 등)
최종 사용자별
소비자용 전자기기
IT 및 통신
자동차
의료
항공우주 및 방위
산업
기타(에너지 및 유틸리티 등)
지역별
북미
남미
유럽
중동 및 아프리카
아시아태평양
제6장 북미의 3차원 집적회로(3D IC) 시장 규모 추정 및 예측(부문별(2019-2032년))
국가별
미국
캐나다
멕시코
제7장 남미의 3차원 집적회로(3D IC) 시장 규모 추정 및 예측(부문별(2019-2032년))
국가별
브라질
아르헨티나
기타 남미 국가
제8장 유럽의 3차원 집적회로(3D IC) 시장 규모 추정 및 예측(부문별(2019-2032년))
국가별
영국
독일
프랑스
이탈리아
스페인
러시아
베네룩스
북유럽 국가
기타 유럽
제9장 중동 및 아프리카의 3차원 집적회로(3D IC) 시장 규모 추정 및 예측(부문별(2019-2032년))
국가별
튀르키예
이스라엘
GCC
북아프리카
남아프리카
기타 중동 및 아프리카
제10장 아시아태평양의 3차원 집적회로(3D IC) 시장 규모 추정 및 예측(부문별(2019-2032년))
국가별
중국
인도
일본
한국
ASEAN
오세아니아
기타 아시아태평양
제11장 주요 10개 기업의 기업 프로파일
Samsung
Taiwan Semiconductor Manufacturing(TSMC)
Advanced Micro Devices, Inc.
Broadcom Inc.
Micron Technology, Inc.
NVIDIA Corporation
Xilinx, Inc.
Amkor Technology, Inc.
ASE Technology Holding Co., Ltd.
Toshiba Corporation
CSM
영문 목차
영문목차
Growth Factors of 3D Integrated Circuit (3D IC) Market
The global 3D Integrated Circuit (3D IC) market is witnessing strong expansion, driven by rapid advancements in semiconductor packaging technologies and rising demand for high-performance, energy-efficient electronic systems. In 2024, the global 3D IC market size was valued at USD 17.13 billion. The market is projected to grow to USD 19.46 billion in 2025 and further expand significantly to USD 48.27 billion by 2032, reflecting the growing adoption of vertically stacked integrated circuit architectures across multiple end-use industries.
3D IC technology enables the vertical stacking of multiple semiconductor dies, improving performance, reducing power consumption, and enhancing space efficiency compared to conventional two-dimensional ICs. This architecture is increasingly critical as traditional scaling approaches reach physical and economic limitations. The market encompasses a wide range of components, including 3D memory, processors, sensors, LEDs, and microelectronics systems, along with enabling technologies such as Through-Silicon Via (TSV), 3D Fan-Out Packaging, 3D Wafer-Scale-Level Chip-Scale Packaging (WLCSP), and Monolithic 3D ICs.
In 2024, North America dominated the global 3D IC market, accounting for 38% of the total market share. The region's leadership is supported by the strong presence of major semiconductor companies such as Intel, NVIDIA, AMD, and Micron Technology, along with substantial investments in research and development. High demand from data centers, artificial intelligence workloads, cloud computing, and advanced consumer electronics continues to reinforce North America's market position.
The COVID-19 pandemic initially disrupted global supply chains and manufacturing operations, causing delays in production and development of advanced semiconductor components. However, the pandemic also accelerated digital transformation worldwide. Increased demand for laptops, servers, networking equipment, and data center infrastructure to support remote work and cloud services helped offset early challenges and strengthened the long-term outlook for the 3D IC market.
Impact of Generative AI on the 3D IC Market
The rapid rise of generative artificial intelligence (AI) has become a major catalyst for 3D IC market growth. Advanced AI models require massive computational power, high memory bandwidth, and energy-efficient processing architectures. 3D ICs address these requirements by enabling closer integration of logic and memory, reducing latency and power consumption. Leading chipmakers such as NVIDIA, AMD, and Intel are increasingly integrating advanced 3D IC technologies into their processors to support AI workloads, accelerating market adoption between 2025 and 2032.
Market Trends and Growth Drivers
One of the key trends shaping the market is the adoption of 3D ICs in high-performance computing (HPC). Technologies such as TSV, interposer-based architectures, and advanced wafer-level packaging allow faster data transfer and improved system efficiency. These innovations are widely used in AI accelerators, GPUs, and next-generation processors.
The consumer electronics sector remains the largest end-user segment, driven by demand for compact, high-performance devices such as smartphones, tablets, wearables, and gaming consoles. In parallel, the automotive sector is emerging as a high-growth segment, supported by increasing integration of advanced electronics for autonomous driving, ADAS, and in-vehicle connectivity systems.
Regional Outlook
While North America maintained market leadership in 2024, the Asia Pacific region is expected to experience the fastest growth through 2032. Strong semiconductor manufacturing capabilities in China, South Korea, Japan, and Taiwan, along with heavy investments by companies such as TSMC and Samsung, are driving regional expansion. Europe also holds a significant share, supported by innovation in automotive electronics and industrial automation, while growth in the Middle East & Africa is driven by smart infrastructure and digital transformation initiatives.
Competitive Landscape
The global 3D IC market is highly competitive, with key players including Samsung, TSMC, AMD, NVIDIA, Broadcom, Micron Technology, Qualcomm, ASE Technology, and Amkor Technology. Continuous product innovation, strategic collaborations, and advanced packaging developments remain central to strengthening market positioning during the 2024-2032 period.
Segmentation By Technology
Through-Silicon Via (TSV)
3D Fan-Out Packaging
3D Wafer-Scale-Level Chip-Scale Packaging (WLCSP)
Monolithic 3D ICs
Others (Through-Glass Via (TGV))
By Component
3D Memory
LEDs
Sensors
Processors
Others (Microelectronical Systems)
By Application
Logic and Memory Integration
Imaging and Optoelectronics
MEMS and Sensors
LED Packaging
Others (Power Management)
By End-user
Consumer Electronics
IT and Telecommunications
Automotive
Healthcare
Aerospace and Defense
Industrial
Others (Energy and Utilities)
By Region
North America (By Technology, By Component, By Application, By End-user, and By Country)
U.S. (End-user)
Canada (End-user)
Mexico (End-user)
South America (By Technology, By Component, By Application, By End-user, and By Country)
Brazil (End-user)
Argentina (End-user)
Rest of South America
Europe (By Technology, By Component, By Application, By End-user, and By Country)
U.K. (End-user)
Germany (End-user)
France (End-user)
Italy (End-user)
Spain (End-user)
Russia (End-user)
Benelux (End-user)
Nordics (End-user)
Rest of Europe
Middle East and Africa (By Technology, By Component, By Application, By End-user, and By Country)
Turkey (End-user)
Israel (End-user)
GCC (End-user)
North Africa (End-user)
South Africa (End-user)
Rest of Middle East and Africa
Asia Pacific (By Technology, By Component, By Application, By End-user, and By Country)
China (End-user)
India (End-user)
Japan (End-user)
South Korea (End-user)
ASEAN (End-user)
Oceania (End-user)
Rest of Asia Pacific
Table of Content
1. Introduction
1.1. Definition, By Segment
1.2. Research Methodology/Approach
1.3. Data Sources
2. Executive Summary
3. Market Dynamics
3.1. Macro and Micro Economic Indicators
3.2. Drivers, Restraints, Opportunities and Trends
3.3. Impact of Generative AI
4. Competition Landscape
4.1. Business Strategies Adopted by Key Players
4.2. Consolidated SWOT Analysis of Key Players
4.3. Global 3D IC Key Players (Top 3 - 5) Market Share/Ranking, 2023
5. Global 3D IC Market Size Estimates and Forecasts, By Segments, 2019-2032
5.1. Key Findings
5.2. By Technology (USD)
5.2.1. Through-Silicon Via (TSV)
5.2.2. 3D Fan-Out Packaging
5.2.3. 3D Wafer-Scale-Level Chip-Scale Packaging (WLCSP)
5.2.4. Monolithic 3D ICs
5.2.5. Others (Through-Glass Via (TGV), etc.)
5.3. By Component (USD)
5.3.1. 3D Memory
5.3.2. LEDs
5.3.3. Sensors
5.3.4. Processors
5.3.5. Others (Microelectronical Systems, etc.)
5.4. By Application (USD)
5.4.1. Logic and Memory Integration
5.4.2. Imaging and Optoelectronics
5.4.3. MEMS and Sensors
5.4.4. LED Packaging
5.4.5. Others (Power Management, etc.)
5.5. By End-user (USD)
5.5.1. Consumer Electronics
5.5.2. IT and Telecommunications
5.5.3. Automotive
5.5.4. Healthcare
5.5.5. Aerospace and Defense
5.5.6. Industrial
5.5.7. Others (Energy and Utilities, etc.)
5.6. By Region (USD)
5.6.1. North America
5.6.2. South America
5.6.3. Europe
5.6.4. Middle East and Africa
5.6.5. Asia Pacific
6. North America 3D IC Market Size Estimates and Forecasts, By Segments, 2019-2032
6.1. Key Findings
6.2. By Technology (USD)
6.2.1. Through-Silicon Via (TSV)
6.2.2. 3D Fan-Out Packaging
6.2.3. 3D Wafer-Scale-Level Chip-Scale Packaging (WLCSP)
6.2.4. Monolithic 3D ICs
6.2.5. Others (Through-Glass Via (TGV), etc.)
6.3. By Component (USD)
6.3.1. 3D Memory
6.3.2. LEDs
6.3.3. Sensors
6.3.4. Processors
6.3.5. Others (Microelectronical Systems, etc.)
6.4. By Application (USD)
6.4.1. Logic and Memory Integration
6.4.2. Imaging and Optoelectronics
6.4.3. MEMS and Sensors
6.4.4. LED Packaging
6.4.5. Others (Power Management, etc.)
6.5. By End-user (USD)
6.5.1. Consumer Electronics
6.5.2. IT and Telecommunications
6.5.3. Automotive
6.5.4. Healthcare
6.5.5. Aerospace and Defense
6.5.6. Industrial
6.5.7. Others (Energy and Utilities, etc.)
6.6. By Country (USD)
6.6.1. United States
6.6.1.1. End-user
6.6.2. Canada
6.6.2.1. End-user
6.6.3. Mexico
6.6.3.1. End-user
7. South America 3D IC Market Size Estimates and Forecasts, By Segments, 2019-2032
7.1. Key Findings
7.2. By Technology (USD)
7.2.1. Through-Silicon Via (TSV)
7.2.2. 3D Fan-Out Packaging
7.2.3. 3D Wafer-Scale-Level Chip-Scale Packaging (WLCSP)
7.2.4. Monolithic 3D ICs
7.2.5. Others (Through-Glass Via (TGV), etc.)
7.3. By Component (USD)
7.3.1. 3D Memory
7.3.2. LEDs
7.3.3. Sensors
7.3.4. Processors
7.3.5. Others (Microelectronical Systems, etc.)
7.4. By Application (USD)
7.4.1. Logic and Memory Integration
7.4.2. Imaging and Optoelectronics
7.4.3. MEMS and Sensors
7.4.4. LED Packaging
7.4.5. Others (Power Management, etc.)
7.5. By End-user (USD)
7.5.1. Consumer Electronics
7.5.2. IT and Telecommunications
7.5.3. Automotive
7.5.4. Healthcare
7.5.5. Aerospace and Defense
7.5.6. Industrial
7.5.7. Others (Energy and Utilities, etc.)
7.6. By Country (USD)
7.6.1. Brazil
7.6.1.1. End-user
7.6.2. Argentina
7.6.2.1. End-user
7.6.3. Rest of South America
8. Europe 3D IC Market Size Estimates and Forecasts, By Segments, 2019-2032
8.1. Key Findings
8.2. By Technology (USD)
8.2.1. Through-Silicon Via (TSV)
8.2.2. 3D Fan-Out Packaging
8.2.3. 3D Wafer-Scale-Level Chip-Scale Packaging (WLCSP)
8.2.4. Monolithic 3D ICs
8.2.5. Others (Through-Glass Via (TGV), etc.)
8.3. By Component (USD)
8.3.1. 3D Memory
8.3.2. LEDs
8.3.3. Sensors
8.3.4. Processors
8.3.5. Others (Microelectronical Systems, etc.)
8.4. By Application (USD)
8.4.1. Logic and Memory Integration
8.4.2. Imaging and Optoelectronics
8.4.3. MEMS and Sensors
8.4.4. LED Packaging
8.4.5. Others (Power Management, etc.)
8.5. By End-user (USD)
8.5.1. Consumer Electronics
8.5.2. IT and Telecommunications
8.5.3. Automotive
8.5.4. Healthcare
8.5.5. Aerospace and Defense
8.5.6. Industrial
8.5.7. Others (Energy and Utilities, etc.)
8.6. By Country (USD)
8.6.1. United Kingdom
8.6.1.1. End-user
8.6.2. Germany
8.6.2.1. End-user
8.6.3. France
8.6.3.1. End-user
8.6.4. Italy
8.6.4.1. End-user
8.6.5. Spain
8.6.5.1. End-user
8.6.6. Russia
8.6.6.1. End-user
8.6.7. Benelux
8.6.7.1. End-user
8.6.8. Nordics
8.6.8.1. End-user
8.6.9. Rest of Europe
9. Middle East and Africa 3D IC Market Size Estimates and Forecasts, By Segments, 2019-2032
9.1. Key Findings
9.2. By Technology (USD)
9.2.1. Through-Silicon Via (TSV)
9.2.2. 3D Fan-Out Packaging
9.2.3. 3D Wafer-Scale-Level Chip-Scale Packaging (WLCSP)
9.2.4. Monolithic 3D ICs
9.2.5. Others (Through-Glass Via (TGV), etc.)
9.3. By Component (USD)
9.3.1. 3D Memory
9.3.2. LEDs
9.3.3. Sensors
9.3.4. Processors
9.3.5. Others (Microelectronical Systems, etc.)
9.4. By Application (USD)
9.4.1. Logic and Memory Integration
9.4.2. Imaging and Optoelectronics
9.4.3. MEMS and Sensors
9.4.4. LED Packaging
9.4.5. Others (Power Management, etc.)
9.5. By End-user (USD)
9.5.1. Consumer Electronics
9.5.2. IT and Telecommunications
9.5.3. Automotive
9.5.4. Healthcare
9.5.5. Aerospace and Defense
9.5.6. Industrial
9.5.7. Others (Energy and Utilities, etc.)
9.6. By Country (USD)
9.6.1. Turkey
9.6.1.1. End-user
9.6.2. Israel
9.6.2.1. End-user
9.6.3. GCC
9.6.3.1. End-user
9.6.4. North Africa
9.6.4.1. End-user
9.6.5. South Africa
9.6.5.1. End-user
9.6.6. Rest of Middle East and Africa
10. Asia Pacific 3D IC Market Size Estimates and Forecasts, By Segments, 2019-2032
10.1. Key Findings
10.2. By Technology (USD)
10.2.1. Through-Silicon Via (TSV)
10.2.2. 3D Fan-Out Packaging
10.2.3. 3D Wafer-Scale-Level Chip-Scale Packaging (WLCSP)
10.2.4. Monolithic 3D ICs
10.2.5. Others (Through-Glass Via (TGV), etc.)
10.3. By Component (USD)
10.3.1. 3D Memory
10.3.2. LEDs
10.3.3. Sensors
10.3.4. Processors
10.3.5. Others (Microelectronical Systems, etc.)
10.4. By Application (USD)
10.4.1. Logic and Memory Integration
10.4.2. Imaging and Optoelectronics
10.4.3. MEMS and Sensors
10.4.4. LED Packaging
10.4.5. Others (Power Management, etc.)
10.5. By End-user (USD)
10.5.1. Consumer Electronics
10.5.2. IT and Telecommunications
10.5.3. Automotive
10.5.4. Healthcare
10.5.5. Aerospace and Defense
10.5.6. Industrial
10.5.7. Others (Energy and Utilities, etc.)
10.6. By Country (USD)
10.6.1. China
10.6.1.1. End-user
10.6.2. India
10.6.2.1. End-user
10.6.3. Japan
10.6.3.1. End-user
10.6.4. South Korea
10.6.4.1. End-user
10.6.5. ASEAN
10.6.5.1. End-user
10.6.6. Oceania
10.6.6.1. End-user
10.6.7. Rest of Asia Pacific
11. Company Profiles for Top 10 Players (Based on data availability in public domain and/or on paid databases)
11.1. Samsung
11.1.1. Overview
11.1.1.1. Key Management
11.1.1.2. Headquarters
11.1.1.3. Offerings/Business Segments
11.1.2. Key Details (Key details are consolidated data and not product/service specific)
11.1.2.1. Employee Size
11.1.2.2. Past and Current Revenue
11.1.2.3. Geographical Share
11.1.2.4. Business Segment Share
11.1.2.5. Recent Developments
11.2. Taiwan Semiconductor Manufacturing (TSMC)
11.2.1. Overview
11.2.1.1. Key Management
11.2.1.2. Headquarters
11.2.1.3. Offerings/Business Segments
11.2.2. Key Details (Key details are consolidated data and not product/service specific)
11.2.2.1. Employee Size
11.2.2.2. Past and Current Revenue
11.2.2.3. Geographical Share
11.2.2.4. Business Segment Share
11.2.2.5. Recent Developments
11.3. Advanced Micro Devices, Inc.
11.3.1. Overview
11.3.1.1. Key Management
11.3.1.2. Headquarters
11.3.1.3. Offerings/Business Segments
11.3.2. Key Details (Key details are consolidated data and not product/service specific)
11.3.2.1. Employee Size
11.3.2.2. Past and Current Revenue
11.3.2.3. Geographical Share
11.3.2.4. Business Segment Share
11.3.2.5. Recent Developments
11.4. Broadcom Inc.
11.4.1. Overview
11.4.1.1. Key Management
11.4.1.2. Headquarters
11.4.1.3. Offerings/Business Segments
11.4.2. Key Details (Key details are consolidated data and not product/service specific)
11.4.2.1. Employee Size
11.4.2.2. Past and Current Revenue
11.4.2.3. Geographical Share
11.4.2.4. Business Segment Share
11.4.2.5. Recent Developments
11.5. Micron Technology, Inc.
11.5.1. Overview
11.5.1.1. Key Management
11.5.1.2. Headquarters
11.5.1.3. Offerings/Business Segments
11.5.2. Key Details (Key details are consolidated data and not product/service specific)
11.5.2.1. Employee Size
11.5.2.2. Past and Current Revenue
11.5.2.3. Geographical Share
11.5.2.4. Business Segment Share
11.5.2.5. Recent Developments
11.6. NVIDIA Corporation
11.6.1. Overview
11.6.1.1. Key Management
11.6.1.2. Headquarters
11.6.1.3. Offerings/Business Segments
11.6.2. Key Details (Key details are consolidated data and not product/service specific)
11.6.2.1. Employee Size
11.6.2.2. Past and Current Revenue
11.6.2.3. Geographical Share
11.6.2.4. Business Segment Share
11.6.2.5. Recent Developments
11.7. Xilinx, Inc.
11.7.1. Overview
11.7.1.1. Key Management
11.7.1.2. Headquarters
11.7.1.3. Offerings/Business Segments
11.7.2. Key Details (Key details are consolidated data and not product/service specific)
11.7.2.1. Employee Size
11.7.2.2. Past and Current Revenue
11.7.2.3. Geographical Share
11.7.2.4. Business Segment Share
11.7.2.5. Recent Developments
11.8. Amkor Technology, Inc.
11.8.1. Overview
11.8.1.1. Key Management
11.8.1.2. Headquarters
11.8.1.3. Offerings/Business Segments
11.8.2. Key Details (Key details are consolidated data and not product/service specific)
11.8.2.1. Employee Size
11.8.2.2. Past and Current Revenue
11.8.2.3. Geographical Share
11.8.2.4. Business Segment Share
11.8.2.5. Recent Developments
11.9. ASE Technology Holding Co., Ltd.
11.9.1. Overview
11.9.1.1. Key Management
11.9.1.2. Headquarters
11.9.1.3. Offerings/Business Segments
11.9.2. Key Details (Key details are consolidated data and not product/service specific)
11.9.2.1. Employee Size
11.9.2.2. Past and Current Revenue
11.9.2.3. Geographical Share
11.9.2.4. Business Segment Share
11.9.2.5. Recent Developments
11.10. Toshiba Corporation
11.10.1. Overview
11.10.1.1. Key Management
11.10.1.2. Headquarters
11.10.1.3. Offerings/Business Segments
11.10.2. Key Details (Key details are consolidated data and not product/service specific)
