3D 반도체 패키징 시장 : 세계 산업 규모, 점유율, 동향, 기회, 예측 - 기술별, 재료별, 업계별, 지역별, 경쟁별(2020-2030년)
3D Semiconductor Packaging Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Technology, By Material, By Industry Vertical, By Region, By Competition, 2020-2030F
상품코드:1881468
리서치사:TechSci Research
발행일:2025년 11월
페이지 정보:영문 180 Pages
라이선스 & 가격 (부가세 별도)
ㅁ Add-on 가능: 고객의 요청에 따라 일정한 범위 내에서 Customization이 가능합니다. 자세한 사항은 문의해 주시기 바랍니다.
한글목차
세계의 3D 반도체 패키징 시장은 2024년에 128억 8,000만 달러로 평가되었으며, 2030년까지 CAGR 19.22%로 성장하여 369억 8,000만 달러에 달할 것으로 예측됩니다.
3D 반도체 패키징은 단일 패키지 내에 여러 개의 집적회로를 수직으로 적층하는 기술이며, 층간 통신을 직접 수행하기 위해 실리콘 관통전극(TSV)을 활용하는 것이 일반적입니다. 이 방법을 통해 기존 패키징에 비해 소자의 설치 면적을 줄이고, 집적 밀도를 높이며, 전기적 성능과 전력 효율을 향상시킬 수 있습니다.
시장 개요
예측 기간
2026-2030년
시장 규모 : 2024년
128억 8,000만 달러
시장 규모 : 2030년
369억 8,000만 달러
CAGR : 2025-2030년
19.22%
가장 빠르게 성장하는 부문
3D 패키지 온 패키지
최대 시장
아시아태평양
주요 시장 촉진요인
인공지능(AI)과 머신러닝의 보급은 세계 3D 반도체 패키지 시장에서 가장 중요한 촉진제입니다. 이러한 첨단 컴퓨팅 패러다임은 기존의 2D 패키징으로는 제공하기 어려운 전례 없는 수준의 처리 능력, 메모리 대역폭 및 낮은 지연을 필요로 합니다.
주요 시장 과제
세계 3D 반도체 패키징 시장의 성장은 막대한 제조 비용과 기술적 복잡성으로 인해 큰 장벽에 직면해 있습니다. 여러 개의 집적회로를 수직으로 적층하는 기술은 설치 면적 감소와 통합성 향상 등의 이점을 제공하는 반면, 고도의 제조 공정과 특수한 장비가 필요합니다.
주요 시장 동향
세계 3D 반도체 패키징 시장은 반도체 설계의 모듈화 접근 방식인 칩렛 아키텍처의 확산으로 인해 큰 영향을 받고 있습니다. 이 패러다임은 모놀리식 시스템온칩 설계에서 여러 개의 전용 칩렛을 하나의 패키지에 통합하는 방향으로 전환되고 있습니다.
목차
제1장 개요
제2장 조사 방법
제3장 주요 요약
제4장 고객의 소리
제5장 세계의 3D 반도체 패키징 시장 전망
시장 규모 및 예측
금액별
시장 점유율과 예측
기술별(3D 실리콘 관통 전극, 3D 패키지 온 패키지, 3D 팬 아웃 기반, 3D 와이어 본딩)
The Global 3D Semiconductor Packaging Market, valued at USD 12.88 Billion in 2024, is projected to experience a CAGR of 19.22% to reach USD 36.98 Billion by 2030. 3D semiconductor packaging vertically stacks multiple integrated circuits within a single package, often utilizing through-silicon vias for direct inter-layer communication. This method reduces device footprint, enhances integration density, and improves electrical performance and power efficiency over traditional packaging.
Market Overview
Forecast Period
2026-2030
Market Size 2024
USD 12.88 Billion
Market Size 2030
USD 36.98 Billion
CAGR 2025-2030
19.22%
Fastest Growing Segment
3D Package on Package
Largest Market
Asia Pacific
Key Market Drivers
The proliferation of artificial intelligence and machine learning stands as a paramount driver for the Global 3D Semiconductor Packaging Market. These advanced computational paradigms demand unprecedented levels of processing power, memory bandwidth, and reduced latency, which conventional 2D packaging struggles to provide. 3D packaging technologies, through their ability to vertically integrate logic and memory dies with shorter interconnects, directly address these requirements, enabling the creation of high-performance computing units vital for training and inference in AI systems.
Key Market Challenges
The growth of the Global 3D Semiconductor Packaging Market faces a significant impediment due to the considerable manufacturing costs and technical complexities involved. Vertically stacking multiple integrated circuits, while offering benefits like reduced footprint and enhanced integration, demands advanced fabrication processes and specialized equipment. The intricacies of integrating diverse materials and components, alongside the critical need to effectively manage thermal dissipation within these densely configured packages, necessitate substantial research, development, and capital investment.
Key Market Trends
The global 3D semiconductor packaging market is significantly influenced by the widespread adoption of chiplet architectures, which represent a modular approach to semiconductor design. This paradigm shifts from monolithic system-on-chip designs to integrating multiple specialized chiplets into a single package. Such an approach enhances design flexibility, improves manufacturing yields by allowing smaller, optimized dies, and enables the integration of diverse functionalities onto a single platform. Three-dimensional packaging is essential for effectively connecting these disparate chiplets with high bandwidth and low latency, maximizing performance within a compact footprint.
Key Market Players
Taiwan Semiconductor Manufacturing Company Ltd
ASE Technology Holding Co. Ltd
Samsung Electronics Co., Ltd.
United Microelectronics Corporation
Amkor Technology, Inc.
Powertech Technology Inc.
Siliconware Precision Industries Ltd.
Qualcomm Incorporated
Micron Technology, Inc.
STMicroelectronics International N.V.
Report Scope:
In this report, the Global 3D Semiconductor Packaging Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:
3D Semiconductor Packaging Market, By Technology:
3D Through silicon via
3D Package on Package
3D Fan Out Based
3D Wire Bonded
3D Semiconductor Packaging Market, By Material:
Organic Substrate
Bonding Wire
Leadframe
Encapsulation Resin
Ceramic Package
Die Attach Material
3D Semiconductor Packaging Market, By Industry Vertical:
Electronics
Industrial
Automotive & Transport
Healthcare
IT & Telecommunication
Aerospace & Defense
3D Semiconductor Packaging Market, By Region:
North America
United States
Canada
Mexico
Europe
France
United Kingdom
Italy
Germany
Spain
Asia Pacific
China
India
Japan
Australia
South Korea
South America
Brazil
Argentina
Colombia
Middle East & Africa
South Africa
Saudi Arabia
UAE
Competitive Landscape
Company Profiles: Detailed analysis of the major companies presents in the Global 3D Semiconductor Packaging Market.
Available Customizations:
Global 3D Semiconductor Packaging Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:
Company Information
Detailed analysis and profiling of additional market players (up to five).
Table of Contents
1. Product Overview
1.1. Market Definition
1.2. Scope of the Market
1.2.1. Markets Covered
1.2.2. Years Considered for Study
1.2.3. Key Market Segmentations
2. Research Methodology
2.1. Objective of the Study
2.2. Baseline Methodology
2.3. Key Industry Partners
2.4. Major Association and Secondary Sources
2.5. Forecasting Methodology
2.6. Data Triangulation & Validation
2.7. Assumptions and Limitations
3. Executive Summary
3.1. Overview of the Market
3.2. Overview of Key Market Segmentations
3.3. Overview of Key Market Players
3.4. Overview of Key Regions/Countries
3.5. Overview of Market Drivers, Challenges, Trends
4. Voice of Customer
5. Global 3D Semiconductor Packaging Market Outlook
5.1. Market Size & Forecast
5.1.1. By Value
5.2. Market Share & Forecast
5.2.1. By Technology (3D Through silicon via, 3D Package on Package, 3D Fan Out Based, 3D Wire Bonded)
5.2.2. By Material (Organic Substrate, Bonding Wire, Leadframe, Encapsulation Resin, Ceramic Package, Die Attach Material)
5.2.3. By Industry Vertical (Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication, Aerospace & Defense)
5.2.4. By Region
5.2.5. By Company (2024)
5.3. Market Map
6. North America 3D Semiconductor Packaging Market Outlook
6.1. Market Size & Forecast
6.1.1. By Value
6.2. Market Share & Forecast
6.2.1. By Technology
6.2.2. By Material
6.2.3. By Industry Vertical
6.2.4. By Country
6.3. North America: Country Analysis
6.3.1. United States 3D Semiconductor Packaging Market Outlook
6.3.1.1. Market Size & Forecast
6.3.1.1.1. By Value
6.3.1.2. Market Share & Forecast
6.3.1.2.1. By Technology
6.3.1.2.2. By Material
6.3.1.2.3. By Industry Vertical
6.3.2. Canada 3D Semiconductor Packaging Market Outlook
6.3.2.1. Market Size & Forecast
6.3.2.1.1. By Value
6.3.2.2. Market Share & Forecast
6.3.2.2.1. By Technology
6.3.2.2.2. By Material
6.3.2.2.3. By Industry Vertical
6.3.3. Mexico 3D Semiconductor Packaging Market Outlook
6.3.3.1. Market Size & Forecast
6.3.3.1.1. By Value
6.3.3.2. Market Share & Forecast
6.3.3.2.1. By Technology
6.3.3.2.2. By Material
6.3.3.2.3. By Industry Vertical
7. Europe 3D Semiconductor Packaging Market Outlook
7.1. Market Size & Forecast
7.1.1. By Value
7.2. Market Share & Forecast
7.2.1. By Technology
7.2.2. By Material
7.2.3. By Industry Vertical
7.2.4. By Country
7.3. Europe: Country Analysis
7.3.1. Germany 3D Semiconductor Packaging Market Outlook
7.3.1.1. Market Size & Forecast
7.3.1.1.1. By Value
7.3.1.2. Market Share & Forecast
7.3.1.2.1. By Technology
7.3.1.2.2. By Material
7.3.1.2.3. By Industry Vertical
7.3.2. France 3D Semiconductor Packaging Market Outlook
7.3.2.1. Market Size & Forecast
7.3.2.1.1. By Value
7.3.2.2. Market Share & Forecast
7.3.2.2.1. By Technology
7.3.2.2.2. By Material
7.3.2.2.3. By Industry Vertical
7.3.3. United Kingdom 3D Semiconductor Packaging Market Outlook
7.3.3.1. Market Size & Forecast
7.3.3.1.1. By Value
7.3.3.2. Market Share & Forecast
7.3.3.2.1. By Technology
7.3.3.2.2. By Material
7.3.3.2.3. By Industry Vertical
7.3.4. Italy 3D Semiconductor Packaging Market Outlook
7.3.4.1. Market Size & Forecast
7.3.4.1.1. By Value
7.3.4.2. Market Share & Forecast
7.3.4.2.1. By Technology
7.3.4.2.2. By Material
7.3.4.2.3. By Industry Vertical
7.3.5. Spain 3D Semiconductor Packaging Market Outlook
7.3.5.1. Market Size & Forecast
7.3.5.1.1. By Value
7.3.5.2. Market Share & Forecast
7.3.5.2.1. By Technology
7.3.5.2.2. By Material
7.3.5.2.3. By Industry Vertical
8. Asia Pacific 3D Semiconductor Packaging Market Outlook
8.1. Market Size & Forecast
8.1.1. By Value
8.2. Market Share & Forecast
8.2.1. By Technology
8.2.2. By Material
8.2.3. By Industry Vertical
8.2.4. By Country
8.3. Asia Pacific: Country Analysis
8.3.1. China 3D Semiconductor Packaging Market Outlook
8.3.1.1. Market Size & Forecast
8.3.1.1.1. By Value
8.3.1.2. Market Share & Forecast
8.3.1.2.1. By Technology
8.3.1.2.2. By Material
8.3.1.2.3. By Industry Vertical
8.3.2. India 3D Semiconductor Packaging Market Outlook
8.3.2.1. Market Size & Forecast
8.3.2.1.1. By Value
8.3.2.2. Market Share & Forecast
8.3.2.2.1. By Technology
8.3.2.2.2. By Material
8.3.2.2.3. By Industry Vertical
8.3.3. Japan 3D Semiconductor Packaging Market Outlook
8.3.3.1. Market Size & Forecast
8.3.3.1.1. By Value
8.3.3.2. Market Share & Forecast
8.3.3.2.1. By Technology
8.3.3.2.2. By Material
8.3.3.2.3. By Industry Vertical
8.3.4. South Korea 3D Semiconductor Packaging Market Outlook
8.3.4.1. Market Size & Forecast
8.3.4.1.1. By Value
8.3.4.2. Market Share & Forecast
8.3.4.2.1. By Technology
8.3.4.2.2. By Material
8.3.4.2.3. By Industry Vertical
8.3.5. Australia 3D Semiconductor Packaging Market Outlook
8.3.5.1. Market Size & Forecast
8.3.5.1.1. By Value
8.3.5.2. Market Share & Forecast
8.3.5.2.1. By Technology
8.3.5.2.2. By Material
8.3.5.2.3. By Industry Vertical
9. Middle East & Africa 3D Semiconductor Packaging Market Outlook
9.1. Market Size & Forecast
9.1.1. By Value
9.2. Market Share & Forecast
9.2.1. By Technology
9.2.2. By Material
9.2.3. By Industry Vertical
9.2.4. By Country
9.3. Middle East & Africa: Country Analysis
9.3.1. Saudi Arabia 3D Semiconductor Packaging Market Outlook
9.3.1.1. Market Size & Forecast
9.3.1.1.1. By Value
9.3.1.2. Market Share & Forecast
9.3.1.2.1. By Technology
9.3.1.2.2. By Material
9.3.1.2.3. By Industry Vertical
9.3.2. UAE 3D Semiconductor Packaging Market Outlook
9.3.2.1. Market Size & Forecast
9.3.2.1.1. By Value
9.3.2.2. Market Share & Forecast
9.3.2.2.1. By Technology
9.3.2.2.2. By Material
9.3.2.2.3. By Industry Vertical
9.3.3. South Africa 3D Semiconductor Packaging Market Outlook
9.3.3.1. Market Size & Forecast
9.3.3.1.1. By Value
9.3.3.2. Market Share & Forecast
9.3.3.2.1. By Technology
9.3.3.2.2. By Material
9.3.3.2.3. By Industry Vertical
10. South America 3D Semiconductor Packaging Market Outlook
10.1. Market Size & Forecast
10.1.1. By Value
10.2. Market Share & Forecast
10.2.1. By Technology
10.2.2. By Material
10.2.3. By Industry Vertical
10.2.4. By Country
10.3. South America: Country Analysis
10.3.1. Brazil 3D Semiconductor Packaging Market Outlook
10.3.1.1. Market Size & Forecast
10.3.1.1.1. By Value
10.3.1.2. Market Share & Forecast
10.3.1.2.1. By Technology
10.3.1.2.2. By Material
10.3.1.2.3. By Industry Vertical
10.3.2. Colombia 3D Semiconductor Packaging Market Outlook
10.3.2.1. Market Size & Forecast
10.3.2.1.1. By Value
10.3.2.2. Market Share & Forecast
10.3.2.2.1. By Technology
10.3.2.2.2. By Material
10.3.2.2.3. By Industry Vertical
10.3.3. Argentina 3D Semiconductor Packaging Market Outlook
10.3.3.1. Market Size & Forecast
10.3.3.1.1. By Value
10.3.3.2. Market Share & Forecast
10.3.3.2.1. By Technology
10.3.3.2.2. By Material
10.3.3.2.3. By Industry Vertical
11. Market Dynamics
11.1. Drivers
11.2. Challenges
12. Market Trends & Developments
12.1. Merger & Acquisition (If Any)
12.2. Product Launches (If Any)
12.3. Recent Developments
13. Global 3D Semiconductor Packaging Market: SWOT Analysis
14. Porter's Five Forces Analysis
14.1. Competition in the Industry
14.2. Potential of New Entrants
14.3. Power of Suppliers
14.4. Power of Customers
14.5. Threat of Substitute Products
15. Competitive Landscape
15.1. Taiwan Semiconductor Manufacturing Company Ltd
