반도체 패키징 시장 예측 : 산업 규모, 점유율, 동향, 기회, 패키징 플랫폼별, 유형별, 기술별, 최종 사용자 산업별, 지역별, 경쟁 구도별(2021-2031년)

Semiconductor Packaging Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Packaging Platform, By Type, By Technology, By End-user Industry, By Region & Competition, 2021-2031F

US $ 4,500 ￦ 6,724,000

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한글목차

세계 반도체 패키징 시장은 2025년 312억 4,000만 달러, 2031년까지 469억 6,000만 달러에 달하고, CAGR 7.03%로 성장할 것으로 예측됩니다.

반도체 패키징은 집적 회로를 캡슐화하고 물리적 보호, 방열 및 인쇄 회로 기판에 전기적 연결성을 제공하는 것을 의미합니다. 시장 성장의 근본적인 요인은 고성능 컴퓨팅 및 인공지능에 대한 수요의 급증과 전기자동차의 반도체 탑재량 증가에 있습니다.

시장 개요
예측 기간	2027-2031년
시장 규모 : 2025년	312억 4,000만 달러
시장 규모 : 2031년	469억 6,000만 달러
CAGR : 2026-2031년	7.03%
가장 빠르게 성장하는 부문	전통적인 포장
가장 큰 시장	아시아태평양

주요 시장 성장 촉진요인

인공지능(AI)과 고성능 컴퓨팅의 급속한 보급은 대역폭과 전력 효율을 극대화하는 아키텍처를 필요로 하기 때문에 세계 반도체 패키징 시장을 근본적으로 변화시키고 있습니다. AI 알고리즘은 로직 유닛과 메모리 유닛 간의 고속 데이터 마이그레이션을 필요로하므로 업계는 2입니다.

주요 시장 과제

첨단 패키징 프로세스에 따른 비용과 기술적 복잡성 증가는 세계 반도체 패키징 시장의 확대에 심각한 장벽이 되고 있습니다. 물리적 스케일링 한계를 해결하기 위해 업계가 이기종 통합으로 전환하는 동안 초고밀도 상호 연결의 필요성은 전문적인 인프라에 엄청난 설비 투자가 필요합니다.

주요 시장 동향

고성능 컴퓨팅을 위한 유리 코어 기판의 상용화는 기존의 유기 인터포저의 안정성 한계를 해결하는 중요한 재료 진화로 부상하고 있습니다. 제조업체가 칩렛 아키텍처의 적극적인 스케일링을 진행하는 동안 유리는 우수한 평탄성과 치수 안정성을 제공합니다. 이를 통해 차세대 AI 프로세서에 필요한 초미세 인터커넥트 피치를 실현하여 대형 폼 팩터 패키지의 휨 문제를 줄일 수 있습니다.

목차

제1장 개요

제2장 조사 방법

제3장 주요 요약

제4장 고객의 목소리

제5장 세계 반도체 패키징 시장 전망

• 시장 규모 및 예측
  • 금액별
• 시장 점유율 및 예측
  • 패키징 플랫폼별(첨단 패키징, 기존 패키징)
  • 유형별(플립칩, 매립 다이, 팬인 WLP, FOWLP(Fan-Out WLP))
  • 기술별(그리드 어레이, 소형 외형 패키지, 플랫 노리드 패키지, 듀얼 플랫 노리드(DFN), 쿼드 플랫 노리드(QFN), 듀얼 인라인 패키지, 플라스틱 듀얼 인라인 패키지(PDIP), 세라믹 듀얼 인라인 패키지(CDIP) 등)
  • 최종 사용자 산업별(소비자 전자기기, 항공우주 및 방위, 의료기기, 통신 및 텔레콤, 자동차, 에너지 및 조명)
  • 지역별
  • 기업별(2025)
• 시장 맵

제6장 북미의 반도체 패키징 시장 전망

• 시장 규모 및 예측
• 시장 점유율 및 예측
• 북미 : 국가별 분석
  • 미국
  • 캐나다
  • 멕시코

제7장 유럽 반도체 패키징 시장 전망

• 시장 규모 및 예측
• 시장 점유율 및 예측
• 유럽 : 국가별 분석
  • 독일
  • 프랑스
  • 영국
  • 이탈리아
  • 스페인

제8장 아시아태평양의 반도체 패키징 시장 전망

• 시장 규모 및 예측
• 시장 점유율 및 예측
• 아시아태평양 : 국가별 분석
  • 중국
  • 인도
  • 일본
  • 한국
  • 호주

제9장 중동 및 아프리카 반도체 패키징 시장 전망

• 시장 규모 및 예측
• 시장 점유율 및 예측
• 중동 및 아프리카 : 국가별 분석
  • 사우디아라비아
  • 아랍에미리트(UAE)
  • 남아프리카

제10장 남미의 반도체 패키징 시장 전망

• 시장 규모 및 예측
• 시장 점유율 및 예측
• 남미 : 국가별 분석
  • 브라질
  • 콜롬비아
  • 아르헨티나

제11장 시장 역학

• 성장 촉진요인
• 과제

제12장 시장 동향과 발전

• 합병 및 인수
• 제품 출시
• 최근 동향

제13장 세계 반도체 패키징 시장 : SWOT 분석

제14장 Porter's Five Forces 분석

• 업계 내 경쟁
• 신규 진입의 가능성
• 공급자의 힘
• 고객의 힘
• 대체품의 위협

제15장 경쟁 구도

• ASE Technology Holding Co., Ltd.
• Amkor Technology, Inc.
• Taiwan Semiconductor Manufacturing Company
• Intel Corporation
• Samsung Electronics Co., Ltd.
• Jiangsu Changjiang Electronics Technology Co., Ltd.
• Powertech Technology Inc.
• ChipMOS Technologies Inc.
• Siliconware Precision Industries Co., Ltd.
• Texas Instruments Incorporated

제16장 전략적 제안

제17장 기업 소개와 면책사항

SHW

영문 목차

영문목차

The Global Semiconductor Packaging Market will grow from USD 31.24 Billion in 2025 to USD 46.96 Billion by 2031 at a 7.03% CAGR. Semiconductor packaging entails the encasement of integrated circuits to provide physical protection, heat dissipation, and electrical connectivity to printed circuit boards. The market growth is fundamentally driven by the surging demand for high-performance computing and artificial intelligence, coupled with the increasing semiconductor content in electric vehicles.

Market Overview
Forecast Period	2027-2031
Market Size 2025	USD 31.24 Billion
Market Size 2031	USD 46.96 Billion
CAGR 2026-2031	7.03%
Fastest Growing Segment	Traditional Packaging
Largest Market	Asia Pacific

Key Market Drivers

The surging adoption of artificial intelligence and high-performance computing is fundamentally reshaping the Global Semiconductor Packaging Market by necessitating architectures that maximize bandwidth and power efficiency. As AI algorithms require rapid data movement between logic and memory units, the industry is pivoting toward 2.5D and 3D packaging solutions to bridge the gap that traditional interconnects cannot sustain. This computational intensity drives foundries to aggressively scale their backend capabilities to accommodate complex integration schemes like Chip-on-Wafer-on-Substrate.

Key Market Challenges

The escalating cost and technical complexity associated with advanced packaging processes constitute a severe impediment to the expansion of the Global Semiconductor Packaging Market. As the industry moves toward heterogeneous integration to address physical scaling limits, the requirement for ultra-precise interconnects necessitates substantial capital expenditure on specialized infrastructure. This financial burden creates a high barrier to entry that disproportionately affects smaller market participants who lack the liquidity to upgrade their facilities.

Key Market Trends

The Commercialization of Glass Core Substrates for High-Performance Computing is emerging as a critical material evolution to address the stability limitations of traditional organic interposers. As manufacturers aggressively scale chiplet architectures, glass provides superior flatness and dimensional stability, which enables the ultra-fine interconnect pitches required for next-generation AI processors and mitigates warpage issues in large-form-factor packages. This transition is rapidly moving from research to active industrial deployment as companies build dedicated infrastructure to support this technology.

Key Market Players

• ASE Technology Holding Co., Ltd.
• Amkor Technology, Inc.
• Taiwan Semiconductor Manufacturing Company
• Intel Corporation
• Samsung Electronics Co., Ltd.
• Jiangsu Changjiang Electronics Technology Co., Ltd.
• Powertech Technology Inc.
• ChipMOS Technologies Inc.
• Siliconware Precision Industries Co., Ltd.
• Texas Instruments Incorporated

Report Scope:

In this report, the Global Semiconductor Packaging Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Semiconductor Packaging Market, By Packaging Platform:

• Advanced Packaging
• Traditional Packaging

Semiconductor Packaging Market, By Type:

• Flip Chip
• Embedded DIE
• Fan-in WLP
• Fan-out WLP

Semiconductor Packaging Market, By Technology:

• Grid Array
• Small Outline Package
• Flat no-leads packages
• Dual-flat no-leads (DFN)
• Quad-flat no-leads (QFN)
• Dual In-Line Package
• Plastic Dual Inline Package (PDIP)
• Ceramic Dual Inline Package (CDIP)
• Others

Semiconductor Packaging Market, By End-user Industry:

• Consumer Electronics
• Aerospace & Defense
• Medical Devices
• Communications & Telecom
• Automotive
• and Energy & Lighting

Semiconductor Packaging Market, By Region:

• North America
• United States
• Canada
• Mexico
• Europe
• France
• United Kingdom
• Italy
• Germany
• Spain
• Asia Pacific
• China
• India
• Japan
• Australia
• South Korea
• South America
• Brazil
• Argentina
• Colombia
• Middle East & Africa
• South Africa
• Saudi Arabia
• UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Semiconductor Packaging Market.

Available Customizations:

Global Semiconductor Packaging Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

• Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

• 1.1. Market Definition
• 1.2. Scope of the Market
  • 1.2.1. Markets Covered
  • 1.2.2. Years Considered for Study
  • 1.2.3. Key Market Segmentations

2. Research Methodology

• 2.1. Objective of the Study
• 2.2. Baseline Methodology
• 2.3. Key Industry Partners
• 2.4. Major Association and Secondary Sources
• 2.5. Forecasting Methodology
• 2.6. Data Triangulation & Validation
• 2.7. Assumptions and Limitations

3. Executive Summary

• 3.1. Overview of the Market
• 3.2. Overview of Key Market Segmentations
• 3.3. Overview of Key Market Players
• 3.4. Overview of Key Regions/Countries
• 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global Semiconductor Packaging Market Outlook

• 5.1. Market Size & Forecast
  • 5.1.1. By Value
• 5.2. Market Share & Forecast
  • 5.2.1. By Packaging Platform (Advanced Packaging, Traditional Packaging)
  • 5.2.2. By Type (Flip Chip, Embedded DIE, Fan-in WLP, Fan-out WLP)
  • 5.2.3. By Technology (Grid Array, Small Outline Package, Flat no-leads packages, Dual-flat no-leads (DFN), Quad-flat no-leads (QFN), Dual In-Line Package, Plastic Dual Inline Package (PDIP), Ceramic Dual Inline Package (CDIP), Others)
  • 5.2.4. By End-user Industry (Consumer Electronics, Aerospace & Defense, Medical Devices, Communications & Telecom, Automotive, and Energy & Lighting)
  • 5.2.5. By Region
  • 5.2.6. By Company (2025)
• 5.3. Market Map

6. North America Semiconductor Packaging Market Outlook

• 6.1. Market Size & Forecast
  • 6.1.1. By Value
• 6.2. Market Share & Forecast
  • 6.2.1. By Packaging Platform
  • 6.2.2. By Type
  • 6.2.3. By Technology
  • 6.2.4. By End-user Industry
  • 6.2.5. By Country
• 6.3. North America: Country Analysis
  • 6.3.1. United States Semiconductor Packaging Market Outlook
    • 6.3.1.1. Market Size & Forecast
      • 6.3.1.1.1. By Value
    • 6.3.1.2. Market Share & Forecast
      • 6.3.1.2.1. By Packaging Platform
      • 6.3.1.2.2. By Type
      • 6.3.1.2.3. By Technology
      • 6.3.1.2.4. By End-user Industry
  • 6.3.2. Canada Semiconductor Packaging Market Outlook
    • 6.3.2.1. Market Size & Forecast
      • 6.3.2.1.1. By Value
    • 6.3.2.2. Market Share & Forecast
      • 6.3.2.2.1. By Packaging Platform
      • 6.3.2.2.2. By Type
      • 6.3.2.2.3. By Technology
      • 6.3.2.2.4. By End-user Industry
  • 6.3.3. Mexico Semiconductor Packaging Market Outlook
    • 6.3.3.1. Market Size & Forecast
      • 6.3.3.1.1. By Value
    • 6.3.3.2. Market Share & Forecast
      • 6.3.3.2.1. By Packaging Platform
      • 6.3.3.2.2. By Type
      • 6.3.3.2.3. By Technology
      • 6.3.3.2.4. By End-user Industry

7. Europe Semiconductor Packaging Market Outlook

• 7.1. Market Size & Forecast
  • 7.1.1. By Value
• 7.2. Market Share & Forecast
  • 7.2.1. By Packaging Platform
  • 7.2.2. By Type
  • 7.2.3. By Technology
  • 7.2.4. By End-user Industry
  • 7.2.5. By Country
• 7.3. Europe: Country Analysis
  • 7.3.1. Germany Semiconductor Packaging Market Outlook
    • 7.3.1.1. Market Size & Forecast
      • 7.3.1.1.1. By Value
    • 7.3.1.2. Market Share & Forecast
      • 7.3.1.2.1. By Packaging Platform
      • 7.3.1.2.2. By Type
      • 7.3.1.2.3. By Technology
      • 7.3.1.2.4. By End-user Industry
  • 7.3.2. France Semiconductor Packaging Market Outlook
    • 7.3.2.1. Market Size & Forecast
      • 7.3.2.1.1. By Value
    • 7.3.2.2. Market Share & Forecast
      • 7.3.2.2.1. By Packaging Platform
      • 7.3.2.2.2. By Type
      • 7.3.2.2.3. By Technology
      • 7.3.2.2.4. By End-user Industry
  • 7.3.3. United Kingdom Semiconductor Packaging Market Outlook
    • 7.3.3.1. Market Size & Forecast
      • 7.3.3.1.1. By Value
    • 7.3.3.2. Market Share & Forecast
      • 7.3.3.2.1. By Packaging Platform
      • 7.3.3.2.2. By Type
      • 7.3.3.2.3. By Technology
      • 7.3.3.2.4. By End-user Industry
  • 7.3.4. Italy Semiconductor Packaging Market Outlook
    • 7.3.4.1. Market Size & Forecast
      • 7.3.4.1.1. By Value
    • 7.3.4.2. Market Share & Forecast
      • 7.3.4.2.1. By Packaging Platform
      • 7.3.4.2.2. By Type
      • 7.3.4.2.3. By Technology
      • 7.3.4.2.4. By End-user Industry
  • 7.3.5. Spain Semiconductor Packaging Market Outlook
    • 7.3.5.1. Market Size & Forecast
      • 7.3.5.1.1. By Value
    • 7.3.5.2. Market Share & Forecast
      • 7.3.5.2.1. By Packaging Platform
      • 7.3.5.2.2. By Type
      • 7.3.5.2.3. By Technology
      • 7.3.5.2.4. By End-user Industry

8. Asia Pacific Semiconductor Packaging Market Outlook

• 8.1. Market Size & Forecast
  • 8.1.1. By Value
• 8.2. Market Share & Forecast
  • 8.2.1. By Packaging Platform
  • 8.2.2. By Type
  • 8.2.3. By Technology
  • 8.2.4. By End-user Industry
  • 8.2.5. By Country
• 8.3. Asia Pacific: Country Analysis
  • 8.3.1. China Semiconductor Packaging Market Outlook
    • 8.3.1.1. Market Size & Forecast
      • 8.3.1.1.1. By Value
    • 8.3.1.2. Market Share & Forecast
      • 8.3.1.2.1. By Packaging Platform
      • 8.3.1.2.2. By Type
      • 8.3.1.2.3. By Technology
      • 8.3.1.2.4. By End-user Industry
  • 8.3.2. India Semiconductor Packaging Market Outlook
    • 8.3.2.1. Market Size & Forecast
      • 8.3.2.1.1. By Value
    • 8.3.2.2. Market Share & Forecast
      • 8.3.2.2.1. By Packaging Platform
      • 8.3.2.2.2. By Type
      • 8.3.2.2.3. By Technology
      • 8.3.2.2.4. By End-user Industry
  • 8.3.3. Japan Semiconductor Packaging Market Outlook
    • 8.3.3.1. Market Size & Forecast
      • 8.3.3.1.1. By Value
    • 8.3.3.2. Market Share & Forecast
      • 8.3.3.2.1. By Packaging Platform
      • 8.3.3.2.2. By Type
      • 8.3.3.2.3. By Technology
      • 8.3.3.2.4. By End-user Industry
  • 8.3.4. South Korea Semiconductor Packaging Market Outlook
    • 8.3.4.1. Market Size & Forecast
      • 8.3.4.1.1. By Value
    • 8.3.4.2. Market Share & Forecast
      • 8.3.4.2.1. By Packaging Platform
      • 8.3.4.2.2. By Type
      • 8.3.4.2.3. By Technology
      • 8.3.4.2.4. By End-user Industry
  • 8.3.5. Australia Semiconductor Packaging Market Outlook
    • 8.3.5.1. Market Size & Forecast
      • 8.3.5.1.1. By Value
    • 8.3.5.2. Market Share & Forecast
      • 8.3.5.2.1. By Packaging Platform
      • 8.3.5.2.2. By Type
      • 8.3.5.2.3. By Technology
      • 8.3.5.2.4. By End-user Industry

9. Middle East & Africa Semiconductor Packaging Market Outlook

• 9.1. Market Size & Forecast
  • 9.1.1. By Value
• 9.2. Market Share & Forecast
  • 9.2.1. By Packaging Platform
  • 9.2.2. By Type
  • 9.2.3. By Technology
  • 9.2.4. By End-user Industry
  • 9.2.5. By Country
• 9.3. Middle East & Africa: Country Analysis
  • 9.3.1. Saudi Arabia Semiconductor Packaging Market Outlook
    • 9.3.1.1. Market Size & Forecast
      • 9.3.1.1.1. By Value
    • 9.3.1.2. Market Share & Forecast
      • 9.3.1.2.1. By Packaging Platform
      • 9.3.1.2.2. By Type
      • 9.3.1.2.3. By Technology
      • 9.3.1.2.4. By End-user Industry
  • 9.3.2. UAE Semiconductor Packaging Market Outlook
    • 9.3.2.1. Market Size & Forecast
      • 9.3.2.1.1. By Value
    • 9.3.2.2. Market Share & Forecast
      • 9.3.2.2.1. By Packaging Platform
      • 9.3.2.2.2. By Type
      • 9.3.2.2.3. By Technology
      • 9.3.2.2.4. By End-user Industry
  • 9.3.3. South Africa Semiconductor Packaging Market Outlook
    • 9.3.3.1. Market Size & Forecast
      • 9.3.3.1.1. By Value
    • 9.3.3.2. Market Share & Forecast
      • 9.3.3.2.1. By Packaging Platform
      • 9.3.3.2.2. By Type
      • 9.3.3.2.3. By Technology
      • 9.3.3.2.4. By End-user Industry

10. South America Semiconductor Packaging Market Outlook

• 10.1. Market Size & Forecast
  • 10.1.1. By Value
• 10.2. Market Share & Forecast
  • 10.2.1. By Packaging Platform
  • 10.2.2. By Type
  • 10.2.3. By Technology
  • 10.2.4. By End-user Industry
  • 10.2.5. By Country
• 10.3. South America: Country Analysis
  • 10.3.1. Brazil Semiconductor Packaging Market Outlook
    • 10.3.1.1. Market Size & Forecast
      • 10.3.1.1.1. By Value
    • 10.3.1.2. Market Share & Forecast
      • 10.3.1.2.1. By Packaging Platform
      • 10.3.1.2.2. By Type
      • 10.3.1.2.3. By Technology
      • 10.3.1.2.4. By End-user Industry
  • 10.3.2. Colombia Semiconductor Packaging Market Outlook
    • 10.3.2.1. Market Size & Forecast
      • 10.3.2.1.1. By Value
    • 10.3.2.2. Market Share & Forecast
      • 10.3.2.2.1. By Packaging Platform
      • 10.3.2.2.2. By Type
      • 10.3.2.2.3. By Technology
      • 10.3.2.2.4. By End-user Industry
  • 10.3.3. Argentina Semiconductor Packaging Market Outlook
    • 10.3.3.1. Market Size & Forecast
      • 10.3.3.1.1. By Value
    • 10.3.3.2. Market Share & Forecast
      • 10.3.3.2.1. By Packaging Platform
      • 10.3.3.2.2. By Type
      • 10.3.3.2.3. By Technology
      • 10.3.3.2.4. By End-user Industry

11. Market Dynamics

• 11.1. Drivers
• 11.2. Challenges

12. Market Trends & Developments

• 12.1. Merger & Acquisition (If Any)
• 12.2. Product Launches (If Any)
• 12.3. Recent Developments

13. Global Semiconductor Packaging Market: SWOT Analysis

14. Porter's Five Forces Analysis

• 14.1. Competition in the Industry
• 14.2. Potential of New Entrants
• 14.3. Power of Suppliers
• 14.4. Power of Customers
• 14.5. Threat of Substitute Products

15. Competitive Landscape

• 15.1. ASE Technology Holding Co., Ltd.
  • 15.1.1. Business Overview
  • 15.1.2. Products & Services
  • 15.1.3. Recent Developments
  • 15.1.4. Key Personnel
  • 15.1.5. SWOT Analysis
• 15.2. Amkor Technology, Inc.
• 15.3. Taiwan Semiconductor Manufacturing Company
• 15.4. Intel Corporation
• 15.5. Samsung Electronics Co., Ltd.
• 15.6. Jiangsu Changjiang Electronics Technology Co., Ltd.
• 15.7. Powertech Technology Inc.
• 15.8. ChipMOS Technologies Inc.
• 15.9. Siliconware Precision Industries Co., Ltd.
• 15.10. Texas Instruments Incorporated

16. Strategic Recommendations

17. About Us & Disclaimer

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