This report covers the market landscape and supply-chain for Precursors used in semiconductor device fabrication. It includes information about key suppliers, issues/trends in the material supply chain, estimates on supplier market share, and forecast for the material segments.
SAMPLE VIEW
Table of Contents
1 Executive Summary
1.1 PRECURSORS BUSINESS - MARKET OVERVIEW
1.2 PRECURSORS MARKET TRENDS IMPACTING 2024 OUTLOOK
1.3 5-YEAR UNIT SHIPMENT FORECAST BY SEGMENT: DIELECTRIC PRECURSORS
1.4 PRECURSOR TRENDS
1.5 PRECURSOR TECHNOLOGY TRENDS
1.6 COMPETITIVE LANDSCAPE DIELECTRIC PRECURSORS
1.7 ANALYST ASSESSMENT OF DIELECTRIC PRECURSORS
2 Scope, Purpose, and Methodology
2.1 SCOPE
2.2 METHODOLOGY
2.3 OVERVIEW OF OTHER TECHCET CMR(TM) OFFERINGS
3 Semiconductor Industry Market Status & Outlook
3.1 WORLDWIDE ECONOMY AND OUTLOOK
3.1.1 SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY
3.2.2.2 INCREASE IN SEMICONDUCTOR CONTENT FOR AUTOS
3.2.3 SMARTPHONE OUTLOOK
3.2.4 PC OUTLOOK
3.2.5 SERVERS / IT MARKET
3.3 SEMICONDUCTOR FABRICATION GROWTH - EXPANSION
3.3.1 IN THE MIDST OF HUGE INVESTMENT IN CHIP EXPANSIONS
3.3.2 NEW FABS IN THE US
3.3.3 WW FAB EXPANSION DRIVING GROWTH
3.3.4 EQUIPMENT SPENDING TRENDS
3.3.5 ADVANCED LOGIC TECHNOLOGY ROADMAPS
3.3.5.1 DRAM TECHNOLOGY ROADMAPS
3.3.5.2 3D NAND TECHNOLOGY ROADMAPS
3.3.6 FAB INVESTMENT ASSESSMENT
3.4 POLICY & TRADE TRENDS AND IMPACT
3.5 SEMICONDUCTOR MATERIALS OVERVIEW
3.5.1 TECHCET WAFER STARTS FORECAST THROUGH 2028
3.5.2 TECHCET MATERIALS MARKET FORECAST THROUGH 2028
4 Material Market Trends
4.1 CVD, ALD METAL - HIGH-K AND ADVANCED DIELECTRIC PRECURSORS MARKET TRENDS
4.1.1 2023 PRECURSOR MARKET LEADING INTO 2024
4.1.2 PRECURSOR MARKET OUTLOOK
4.1.3 DIELECTRIC PRECURSORS 5-YEAR UNIT SHIPMENT FORECAST BY SEGMENT
4.1.4 DIELECTRIC PRODUCTION OF TOP SUPPLIERS
4.1.5 DIELECTRIC PRODUCTION BY REGION
4.1.6 ALD/CVD MATERIAL PRODUCTION CAPACITY EXPANSIONS
4.1.7 INVESTMENT ANNOUNCEMENTS OVERVIEW
4.2 PRICING TRENDS
4.3 TECHNOLOGY TRENDS/TECHNICAL DRIVERS - OUTLINE
4.3.1 PRECURSOR GENERAL TECHNOLOGY OVERVIEW - TECHNOLOGY TRENDS
4.3.2 CUSTOMER DRIVEN TECHNOLOGIES
4.3.3 NAND ROADMAPS AND CHALLENGES - 3D NAND LEVELS W/ STACKS/TIERS
4.3.4 3D NAND PROCESS ADVANCES REQUIRED
4.3.5 MICRON UNVEILS BREAKTHROUGH NVDRAM: A DUAL-LAYER 32GBIT NON-VOLATILEFERROELECTRIC MEMORY WITH NEAR-DRAM PERFORMANCE
4.3.6 ADVANCED LOGIC ROADMAPS AND CHALLENGES - LOGIC TRANSISTOR EST. ROADMAP
4.3.7 ADVANCED LOGIC (FOUNDRY) NODE HVM ESTIMATE
4.3.7.1 THE SEMICONDUCTOR SHOWDOWN: SAMSUNG AND TSMC'S GAA FETS VS. INTEL'S RIBBONFET
4.3.8 ADV LOGIC FUTURE TECHNOLOGY CHALLENGES
4.3.9 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY
4.3.9.1 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY - DSA
4.3.9.2 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY: CENTURA SCULPTA BY APPLIED MATERIALS: SHAPING THE FUTURE OF SEMICONDUCTOR MANUFACTURING
4.3.9.3 ADVANCING TECHNOLOGIES IMPLICATION TO PHOTOLITHOGRAPHY: LINE EDGE ROUGHNESS REDUCTION THRU DEPOSITION