동박적층판(CCL) 시장 규모, 점유율, 성장 분석 : 용도별, 소재 유형별, 제조 공정별, 구리 코팅별, 지역별 - 산업 예측(2025-2032년)
Copper Clad Laminate Market Size, Share, and Growth Analysis, By Application (High-Speed Digital Circuit Boards, Power Circuit Boards), By Material Type (Fr-4, Cem-1), By Manufacturing Process, By Copper Coating, By Region - Industry Forecast 2025-2032
동박적층판(CCL) 세계 시장 규모는 2023년에 175억 달러, 2024년 187억 1,000만 달러에서 2032년에는 319억 달러로 성장하고, 예측 기간(2025-2032년) CAGR은 6.9%를 보일 전망입니다.
동박적층판(CCL) 시장은 주로 전자 및 통신 분야 수요 증가로 인해 강력한 성장세를 보이고 있습니다. 이러한 성장을 가속하는 주요 요인으로는 인쇄 회로 기판(PCB) 제조 및 반도체 생산의 발전이 있습니다. 아시아태평양은 통신 시스템, 자동차용 일렉트로닉스, 헬스케어 기술, 국방 용도의 거점이라는 전략적 포지셔닝으로 인해 2024년 가장 높은 성장률을 보이며 시장을 주도할 것으로 예측됩니다. 특히 소비자 전자제품, 자동차 기술 혁신, 5G 인프라, IoT 디바이스의 보급으로 세계 전자제품 환경이 진화함에 따라 고성능 내구성 라미네이트에 대한 수요가 급증하고 있습니다. 또한, 전기자동차 및 첨단운전자보조시스템(ADAS)로의 전환이 진행되고 있는 자동차 업계에서는 신뢰성이 높은 내열 라미네이트에 대한 요구가 더욱 높아지고 있습니다.
목차
서론
조사 방법
- 정보 조달
- 2차와 1차 데이터 방법
- 시장 규모 예측
- 시장 전제조건과 제한
주요 요약
- 세계 시장 전망
- 공급과 수요 동향 분석
- 부문별 기회 분석
시장 역학과 전망
- 시장 개요
- 시장 규모
- 시장 역학
- Porter의 Five Forces 분석
주요 시장 인사이트
- 중요 성공 요인
- 경쟁 정도
- 주요 투자 기회
- 시장 생태계
- 시장의 매력 지수(2024년)
- PESTEL 분석
- 거시경제 지표
- 밸류체인 분석
- 가격 분석
동박적층판(CCL) 시장 규모 : 용도별
- 시장 개요
- 고속 디지털 회로 기판
- 전력 회로 기판
- 자동차용 회로 기판
- 가전제품 회로 기판
- 의료용 회로 기판
- 산업용 회로 기판
동박적층판(CCL) 시장 규모 : 소재 유형별
- 시장 개요
- Fr-4
- Cem-1
- Cem-3
- Fr-2
- Fr-5
- 폴리이미드
- 백금철
동박적층판(CCL) 시장 규모 : 제조 공정별
- 시장 개요
- 라미네이트 수지 프레스
- 고압 라미네이트 프레스
- 양면 테이프 라미네이트
- 콜드 라미네이션프레스
- 고주파 라미네이션프레스
동박적층판(CCL) 시장 규모 : 구리 코팅별
- 시장 개요
- Electrolytic Copper
- Rolled Copper
- Sputtered Copper
- Clad Copper
- Etched Copper
동박적층판(CCL) 시장 규모
- 북미
- 유럽
- 아시아태평양
- 라틴아메리카
- 중동 및 아프리카
- GCC 국가
- 남아프리카
- 기타 중동 및 아프리카
경쟁 정보
- 주요 5개사 비교
- 주요 기업의 시장 포지셔닝(2024년)
- 주요 시장 기업이 채택한 전략
- 최근 시장 동향
- 기업의 시장 점유율 분석(2024년)
- 주요 기업 개요
- 기업 상세
- 제품 포트폴리오 분석
- 기업 부문별 점유율 분석
- 매출 전년대비 비교(2022-2024년)
주요 기업 개요
- Kingboard Laminates Holdings Ltd.(China)
- Shengyi Technology Co., Ltd.(China)
- Nan Ya Plastics Corporation(Taiwan)
- Panasonic Holdings Corporation(Japan)
- Taiwan Union Technology Corporation(Taiwan)
- Hitachi Chemical Co., Ltd.(Japan)
- Isola Group(USA)
- Doosan Corporation Electro-Materials(South Korea)
- Mitsubishi Gas Chemical Company, Inc.(Japan)
- Rogers Corporation(USA)
- Elite Material Co. Ltd.(EMC)(Taiwan)
- ITEQ Corporation(Taiwan)
- Resonac Corporation(Japan)
- AGC Inc.(Japan)
- Ventec International Group(China/UK)
- Chang Chun Group(Taiwan)
- Nanya New Material Technology Co., Ltd.(China)
- Goldenmax International Group Ltd.(China)
- Wazam New Materials(China)
- Sumitomo Bakelite Co., Ltd.(Japan)
결론과 제안
LSH
Global Copper Clad Laminate Market size was valued at USD 17.5 billion in 2023 and is poised to grow from USD 18.71 billion in 2024 to USD 31.9 billion by 2032, growing at a CAGR of 6.9% during the forecast period (2025-2032).
The copper clad laminate (CCL) market is witnessing robust growth, primarily fueled by rising demand from the electronics and telecommunications sectors. Key factors driving this expansion include advancements in printed circuit board (PCB) fabrication and semiconductor production. The Asia Pacific region is expected to lead the market, exhibiting the highest growth rate in 2024 due to its strategic position as a hub for communication systems, automotive electronics, healthcare technology, and defense applications. As the global electronics landscape evolves, particularly with the proliferation of consumer electronics, automotive innovations, 5G infrastructure, and IoT devices, the demand for high-performance, durable laminates continues to surge. Additionally, the automotive industry's transition toward electric vehicles and advanced driver-assistance systems further intensifies the need for reliable heat-resistant laminates.
Top-down and bottom-up approaches were used to estimate and validate the size of the Global Copper Clad Laminate market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.
Global Copper Clad Laminate Market Segments Analysis
Global Copper Clad Laminate Market is segmented by Application, Material Type, Manufacturing Process, Copper Coating and region. Based on Application, the market is segmented into High-Speed Digital Circuit Boards, Power Circuit Boards, Automotive Circuit Boards, Consumer Electronics Circuit Boards, Medical Circuit Boards and Industrial Circuit Boards. Based on Material Type, the market is segmented into Fr-4, Cem-1, Cem-3, Fr-2, Fr-5, Polyimide and PtFe. Based on Manufacturing Process, the market is segmented into Laminating Resin Press, High-Pressure Laminating Press, Double-Sided Tape Lamination, Cold Lamination Press and High-Frequency Lamination Press. Based on Copper Coating, the market is segmented into Electrolytic Copper, Rolled Copper, Sputtered Copper, Clad Copper and Etched Copper. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.
Driver of the Global Copper Clad Laminate Market
The global Copper Clad Laminate (CCL) market is primarily driven by the increasing demand for electronic devices such as smartphones, laptops, electric vehicles (EVs), and various industrial equipment. CCLs play a crucial role in the manufacturing of printed circuit boards (PCBs), which are vital components in these electronic products. The anticipated rollout of 5G infrastructure in 2024 and the rising production of EVs have further fueled the growth of the CCL market. For example, major companies like Apple and Samsung have heightened their procurement of high-frequency CCLs to support new device launches, prompting suppliers such as Kingboard Laminates and Nan Ya Plastics to expand their production capabilities.
Restraints in the Global Copper Clad Laminate Market
The global copper clad laminate market is facing notable constraints primarily linked to the availability and cost of essential raw materials like copper foil, epoxy resin, and fiberglass cloth. In 2024, significant fluctuations in global copper prices became a key challenge, largely due to political turbulence in major copper-producing countries such as Chile and Peru, which hindered mining operations and tightened the worldwide supply of copper. This disruption has led to increased prices, further compounded by a rising demand in sectors like renewable energy and electric vehicles, creating fierce competition for copper resources in the market.
Market Trends of the Global Copper Clad Laminate Market
The Global Copper Clad Laminate (CCL) market is witnessing a significant trend towards the adoption of halogen-free and eco-friendly materials, driven by heightened environmental awareness and stringent regulations. In 2024, leading electronics brands globally are insisting on halogen-free and low-VOC CCLs, influencing manufacturers to innovate sustainable solutions. Notably, companies like Elite Material Co. (EMC) are expanding their product portfolios to include eco-conscious laminate options, appealing to clients focused on meeting ESG objectives and adhering to global sustainability benchmarks. This shift reflects a broader commitment to responsible sourcing and environmental stewardship in the electronics supply chain, shaping the CCL market's future landscape.
Table of Contents
Introduction
- Objectives of the Study
- Scope of the Report
- Definitions
Research Methodology
- Information Procurement
- Secondary & Primary Data Methods
- Market Size Estimation
- Market Assumptions & Limitations
Executive Summary
- Global Market Outlook
- Supply & Demand Trend Analysis
- Segmental Opportunity Analysis
Market Dynamics & Outlook
- Market Overview
- Market Size
- Market Dynamics
- Drivers & Opportunities
- Restraints & Challenges
- Porters Analysis
- Competitive rivalry
- Threat of substitute
- Bargaining power of buyers
- Threat of new entrants
- Bargaining power of suppliers
Key Market Insights
- Key Success Factors
- Degree of Competition
- Top Investment Pockets
- Market Ecosystem
- Market Attractiveness Index, 2024
- PESTEL Analysis
- Macro-Economic Indicators
- Value Chain Analysis
- Pricing Analysis
Global Copper Clad Laminate Market Size by Application & CAGR (2025-2032)
- Market Overview
- High-Speed Digital Circuit Boards
- Power Circuit Boards
- Automotive Circuit Boards
- Consumer Electronics Circuit Boards
- Medical Circuit Boards
- Industrial Circuit Boards
Global Copper Clad Laminate Market Size by Material Type & CAGR (2025-2032)
- Market Overview
- Fr-4
- Cem-1
- Cem-3
- Fr-2
- Fr-5
- Polyimide
- PtFe
Global Copper Clad Laminate Market Size by Manufacturing Process & CAGR (2025-2032)
- Market Overview
- Laminating Resin Press
- High-Pressure Laminating Press
- Double-Sided Tape Lamination
- Cold Lamination Press
- High-Frequency Lamination Press
Global Copper Clad Laminate Market Size by Copper Coating & CAGR (2025-2032)
- Market Overview
- Electrolytic Copper
- Rolled Copper
- Sputtered Copper
- Clad Copper
- Etched Copper
Global Copper Clad Laminate Market Size & CAGR (2025-2032)
- North America (Application, Material Type, Manufacturing Process, Copper Coating)
- Europe (Application, Material Type, Manufacturing Process, Copper Coating)
- Germany
- Spain
- France
- UK
- Italy
- Rest of Europe
- Asia Pacific (Application, Material Type, Manufacturing Process, Copper Coating)
- China
- India
- Japan
- South Korea
- Rest of Asia-Pacific
- Latin America (Application, Material Type, Manufacturing Process, Copper Coating)
- Brazil
- Rest of Latin America
- Middle East & Africa (Application, Material Type, Manufacturing Process, Copper Coating)
- GCC Countries
- South Africa
- Rest of Middle East & Africa
Competitive Intelligence
- Top 5 Player Comparison
- Market Positioning of Key Players, 2024
- Strategies Adopted by Key Market Players
- Recent Developments in the Market
- Company Market Share Analysis, 2024
- Company Profiles of All Key Players
- Company Details
- Product Portfolio Analysis
- Company's Segmental Share Analysis
- Revenue Y-O-Y Comparison (2022-2024)
Key Company Profiles
- Kingboard Laminates Holdings Ltd. (China)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Shengyi Technology Co., Ltd. (China)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Nan Ya Plastics Corporation (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Panasonic Holdings Corporation (Japan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Taiwan Union Technology Corporation (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Hitachi Chemical Co., Ltd. (Japan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Isola Group (USA)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Doosan Corporation Electro-Materials (South Korea)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Mitsubishi Gas Chemical Company, Inc. (Japan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Rogers Corporation (USA)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Elite Material Co. Ltd. (EMC) (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- ITEQ Corporation (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Resonac Corporation (Japan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- AGC Inc. (Japan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Ventec International Group (China/UK)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Chang Chun Group (Taiwan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Nanya New Material Technology Co., Ltd. (China)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Goldenmax International Group Ltd. (China)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Wazam New Materials (China)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
- Sumitomo Bakelite Co., Ltd. (Japan)
- Company Overview
- Business Segment Overview
- Financial Updates
- Key Developments
Conclusion & Recommendations
