동박적층판(CCL) 시장 - 세계 산업 규모, 점유율, 동향, 기회, 예측 : 용도별, 재료 유형별, 제조 공정별, 지역별, 경쟁별(2020-2030년)
Copper Clad Laminates Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented, By Application, By Material Type, By Manufacturing Process, By Region, By Competition, 2020-2030F
동박적층판(CCL) 세계 시장은 2024년에 159억 7,000만 달러로 평가되었으며, 2030년에는 217억 1,000만 달러에 달하고, CAGR 5.09%로 성장할 것으로 예측됩니다.
동박적층판(CCL)은 인쇄회로기판(PCB) 제조의 기본 재료로, 유리섬유, 종이, 복합 에폭시 등의 절연 코어의 한쪽 또는 양면에 구리 호일을 코팅한 제품입니다. 이러한 라미네이트는 다양한 전자 애플리케이션의 회로 경로에 필수적인 전도성, 구조적 지지력 및 열 안정성을 제공합니다. 전자제품이 고성능 및 소형화 설계를 위해 계속 발전함에 따라 CCL의 관련성 및 채택은 소비자 기기, 통신, 차량용 전자제품 등으로 크게 확대되고 있습니다.
| 시장 개요 |
| 예측 기간 |
2026-2030년 |
| 시장 규모 : 2024년 |
159억 7,000만 달러 |
| 시장 규모 : 2030년 |
217억 1,000만 달러 |
| CAGR : 2025-2030년 |
5.09% |
| 급성장 부문 |
파워 회로 기판 |
| 최대 시장 |
북미 |
시장 촉진요인
민생 전자기기 및 소형화 기기 수요 증가
주요 시장 과제
원자재 가격 변동과 공급망 혼란
주요 시장 동향
고밀도 상호연결(HDI) 기술 및 전자기기 소형화로 인한 수요 급증
목차
제1장 개요
제2장 조사 방법
제3장 주요 요약
제4장 고객의 소리
제5장 세계의 동박적층판(CCL) 시장 전망
- 시장 규모 및 예측
- 시장 점유율과 예측
- 용도별(고속 디지털 회로 기판, 전원 회로 기판, 차량내 회로 기판, 가전제품 회로 기판, 의료용 회로 기판, 산업용 회로 기판)
- 재료 유형별(FR-4, CEM-1, CEM-3, FR-2, FR-5, 폴리이미드, PTFE)
- 제조 공정별(수지 라미네이트 프레스, 고압 라미네이트 프레스, 양면 테이프 라미네이트, 콜드 라미네이트 프레스, 고주파 라미네이트 프레스)
- 지역별
- 기업별(2024)
- 시장 맵
제6장 북미의 동박적층판(CCL) 시장 전망
- 시장 규모 및 예측
- 시장 점유율과 예측
- 북미 : 국가별 분석
제7장 유럽의 동박적층판(CCL) 시장 전망
- 시장 규모 및 예측
- 시장 점유율과 예측
- 유럽 : 국가별 분석
제8장 아시아태평양의 동박적층판(CCL) 시장 전망
- 시장 규모 및 예측
- 시장 점유율과 예측
- 아시아태평양 : 국가별 분석
제9장 남미의 동박적층판(CCL) 시장 전망
- 시장 규모 및 예측
- 시장 점유율과 예측
- 남미 : 국가별 분석
제10장 중동 및 아프리카의 동박적층판(CCL) 시장 전망
- 시장 규모 및 예측
- 시장 점유율과 예측
- 중동 및 아프리카 : 국가별 분석
- 남아프리카공화국
- 사우디아라비아
- 아랍에미리트
- 쿠웨이트
- 튀르키예
제11장 시장 역학
제12장 시장 동향과 발전
제13장 기업 개요
- Kingboard Laminates Holdings Ltd.
- Nan Ya Plastics Corporation
- Panasonic Corporation
- ITEQ Corporation
- Shengyi Technology Co., Ltd.(SYTECH)
- Isola Group
- Doosan Corporation Electro-Materials
- Nippon Mektron, Ltd.
- Ventec International Group
- Rogers Corporation
제14장 전략적 제안
제15장 조사 회사 소개 및 면책사항
ksm
The Global Copper Clad Laminates Market was valued at USD 15.97 billion in 2024 and is projected to reach USD 21.71 billion by 2030, growing at a CAGR of 5.09%. Copper Clad Laminates (CCLs) serve as foundational materials in the manufacturing of printed circuit boards (PCBs), comprising an insulating core-such as glass fiber, paper, or composite epoxy-coated with copper foil on one or both sides. These laminates provide essential electrical conductivity, structural support, and thermal stability for circuit pathways in a wide array of electronic applications. As electronics continue to evolve with demand for higher performance and compact designs, the relevance and adoption of CCLs have significantly expanded across consumer devices, telecommunications, automotive electronics, and more.
| Market Overview |
|---|
| Forecast Period | 2026-2030 |
| Market Size 2024 | USD 15.97 Billion |
| Market Size 2030 | USD 21.71 Billion |
| CAGR 2025-2030 | 5.09% |
| Fastest Growing Segment | Power Circuit Boards |
| Largest Market | North America |
Key Market Drivers
Rising Demand for Consumer Electronics and Miniaturized Devices
The rapid growth of the global consumer electronics sector is significantly propelling the copper clad laminates (CCL) market, with widespread usage in devices such as smartphones, tablets, wearables, laptops, smart home appliances, and gaming consoles. As consumer preferences shift toward faster, slimmer, and multifunctional devices, manufacturers are driven to deliver compact and high-performance products. Copper clad laminates, being a crucial component in printed circuit boards (PCBs), play a pivotal role in achieving these objectives by offering robust electrical conductivity, insulation, and structural integrity needed in compact device architecture.
Key Market Challenges
Volatility in Raw Material Prices and Supply Chain Disruptions
The Copper Clad Laminates (CCL) market faces notable challenges due to fluctuating raw material prices, particularly for copper and epoxy resins, which directly influence production expenses and profitability. Copper's price volatility stems from factors such as global supply-demand imbalances, geopolitical instability, mining limitations, and currency shifts. This unpredictability places cost pressures on manufacturers who may struggle to maintain margins or be forced to pass costs to customers, potentially affecting demand. Additionally, resin and glass fabric costs are impacted by crude oil price movements, adding to the financial uncertainty. The situation is compounded by global supply chain vulnerabilities triggered by events like the COVID-19 pandemic, geopolitical conflicts, and maritime disruptions in regions like the Red Sea and Suez Canal. These issues have led to longer delivery timelines, rising freight costs, and sporadic raw material availability, particularly affecting manufacturers in the Asia Pacific. As a result, securing stable long-term material contracts has become increasingly difficult, making pricing and production planning highly unpredictable.
Key Market Trends
Surge in Demand Driven by High-Density Interconnect (HDI) Technology and Miniaturization in Electronics
The transition toward compact, high-efficiency, and multi-layer printed circuit boards (PCBs) is accelerating demand for copper clad laminates as High-Density Interconnect (HDI) technology becomes standard in modern electronics. With the rise of space-saving consumer products such as smartphones, tablets, and wearables, PCBs must accommodate dense circuitry while ensuring thermal and signal performance. To meet these specifications, CCL manufacturers are developing advanced laminates featuring ultra-thin prepregs, high Tg materials, low-loss substrates, and premium copper foil types like RTF and HTE. These innovations offer superior dielectric characteristics, dimensional reliability, and enhanced adhesion-critical for supporting microvias, blind/buried vias, and fine-line routing. Moreover, the growth of 5G infrastructure, electric vehicle electronics, IoT solutions, and ADAS technologies is fueling further adoption of HDI and multilayer board designs, boosting the overall CCL market.
Key Market Players
- Kingboard Laminates Holdings Ltd.
- Nan Ya Plastics Corporation
- Panasonic Corporation
- ITEQ Corporation
- Shengyi Technology Co., Ltd. (SYTECH)
- Isola Group
- Doosan Corporation Electro-Materials
- Nippon Mektron, Ltd.
- Ventec International Group
- Rogers Corporation
Report Scope:
In this report, the Global Copper Clad Laminates Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:
Copper Clad Laminates Market, By Application:
- High-Speed Digital Circuit Boards
- Power Circuit Boards
- Automotive Circuit Boards
- Consumer Electronics Circuit Boards
- Medical Circuit Boards
- Industrial Circuit Boards
Copper Clad Laminates Market, By Material Type:
- FR-4
- CEM-1
- CEM-3
- FR-2
- FR-5
- Polyimide
- PTFE
Copper Clad Laminates Market, By Manufacturing Process:
- Laminating Resin Press
- High-Pressure Laminating Press
- Double-Sided Tape Lamination
- Cold Lamination Press
- High-Frequency Lamination Press
Copper Clad Laminates Market, By Region:
- North America
- United States
- Canada
- Mexico
- Europe
- France
- United Kingdom
- Italy
- Germany
- Spain
- Asia-Pacific
- China
- India
- Japan
- Australia
- South Korea
- South America
- Brazil
- Argentina
- Colombia
- Middle East & Africa
- South Africa
- Saudi Arabia
- UAE
- Kuwait
- Turkey
Competitive Landscape
Company Profiles: Detailed analysis of the major companies presents in the Global Copper Clad Laminates Market.
Available Customizations:
Global Copper Clad Laminates Market report with the given Market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:
Company Information
- Detailed analysis and profiling of additional Market players (up to five).
Table of Contents
1. Product Overview
- 1.1. Market Definition
- 1.2. Scope of the Market
- 1.2.1. Markets Covered
- 1.2.2. Years Considered for Study
- 1.3. Key Market Segmentations
2. Research Methodology
- 2.1. Objective of the Study
- 2.2. Baseline Methodology
- 2.3. Formulation of the Scope
- 2.4. Assumptions and Limitations
- 2.5. Sources of Research
- 2.5.1. Secondary Research
- 2.5.2. Primary Research
- 2.6. Approach for the Market Study
- 2.6.1. The Bottom-Up Approach
- 2.6.2. The Top-Down Approach
- 2.7. Methodology Followed for Calculation of Market Size & Market Shares
- 2.8. Forecasting Methodology
- 2.8.1. Data Triangulation & Validation
3. Executive Summary
- 3.1. Overview of the Market
- 3.2. Overview of Key Market Segmentations
- 3.3. Overview of Key Market Players
- 3.4. Overview of Key Regions/Countries
- 3.5. Overview of Market Drivers, Challenges, and Trends
4. Voice of Customer
5. Global Copper Clad Laminates Market Outlook
- 5.1. Market Size & Forecast
- 5.2. Market Share & Forecast
- 5.2.1. By Application (High-Speed Digital Circuit Boards, Power Circuit Boards, Automotive Circuit Boards, Consumer Electronics Circuit Boards, Medical Circuit Boards, Industrial Circuit Boards)
- 5.2.2. By Material Type (FR-4, CEM-1, CEM-3, FR-2, FR-5, Polyimide, PTFE)
- 5.2.3. By Manufacturing Process (Laminating Resin Press, High-Pressure Laminating Press, Double-Sided Tape Lamination, Cold Lamination Press, High-Frequency Lamination Press)
- 5.2.4. By Region
- 5.3. By Company (2024)
- 5.4. Market Map
6. North America Copper Clad Laminates Market Outlook
- 6.1. Market Size & Forecast
- 6.2. Market Share & Forecast
- 6.2.1. By Application
- 6.2.2. By Material Type
- 6.2.3. By Manufacturing Process
- 6.2.4. By Country
- 6.3. North America: Country Analysis
- 6.3.1. United States Copper Clad Laminates Market Outlook
- 6.3.1.1. Market Size & Forecast
- 6.3.1.2. Market Share & Forecast
- 6.3.1.2.1. By Application
- 6.3.1.2.2. By Material Type
- 6.3.1.2.3. By Manufacturing Process
- 6.3.2. Canada Copper Clad Laminates Market Outlook
- 6.3.2.1. Market Size & Forecast
- 6.3.2.2. Market Share & Forecast
- 6.3.2.2.1. By Application
- 6.3.2.2.2. By Material Type
- 6.3.2.2.3. By Manufacturing Process
- 6.3.3. Mexico Copper Clad Laminates Market Outlook
- 6.3.3.1. Market Size & Forecast
- 6.3.3.2. Market Share & Forecast
- 6.3.3.2.1. By Application
- 6.3.3.2.2. By Material Type
- 6.3.3.2.3. By Manufacturing Process
7. Europe Copper Clad Laminates Market Outlook
- 7.1. Market Size & Forecast
- 7.2. Market Share & Forecast
- 7.2.1. By Application
- 7.2.2. By Material Type
- 7.2.3. By Manufacturing Process
- 7.2.4. By Country
- 7.3. Europe: Country Analysis
- 7.3.1. Germany Copper Clad Laminates Market Outlook
- 7.3.1.1. Market Size & Forecast
- 7.3.1.2. Market Share & Forecast
- 7.3.1.2.1. By Application
- 7.3.1.2.2. By Material Type
- 7.3.1.2.3. By Manufacturing Process
- 7.3.2. United Kingdom Copper Clad Laminates Market Outlook
- 7.3.2.1. Market Size & Forecast
- 7.3.2.2. Market Share & Forecast
- 7.3.2.2.1. By Application
- 7.3.2.2.2. By Material Type
- 7.3.2.2.3. By Manufacturing Process
- 7.3.3. Italy Copper Clad Laminates Market Outlook
- 7.3.3.1. Market Size & Forecast
- 7.3.3.2. Market Share & Forecast
- 7.3.3.2.1. By Application
- 7.3.3.2.2. By Material Type
- 7.3.3.2.3. By Manufacturing Process
- 7.3.4. France Copper Clad Laminates Market Outlook
- 7.3.4.1. Market Size & Forecast
- 7.3.4.2. Market Share & Forecast
- 7.3.4.2.1. By Application
- 7.3.4.2.2. By Material Type
- 7.3.4.2.3. By Manufacturing Process
- 7.3.5. Spain Copper Clad Laminates Market Outlook
- 7.3.5.1. Market Size & Forecast
- 7.3.5.2. Market Share & Forecast
- 7.3.5.2.1. By Application
- 7.3.5.2.2. By Material Type
- 7.3.5.2.3. By Manufacturing Process
8. Asia-Pacific Copper Clad Laminates Market Outlook
- 8.1. Market Size & Forecast
- 8.2. Market Share & Forecast
- 8.2.1. By Application
- 8.2.2. By Material Type
- 8.2.3. By Manufacturing Process
- 8.2.4. By Country
- 8.3. Asia-Pacific: Country Analysis
- 8.3.1. China Copper Clad Laminates Market Outlook
- 8.3.1.1. Market Size & Forecast
- 8.3.1.2. Market Share & Forecast
- 8.3.1.2.1. By Application
- 8.3.1.2.2. By Material Type
- 8.3.1.2.3. By Manufacturing Process
- 8.3.2. India Copper Clad Laminates Market Outlook
- 8.3.2.1. Market Size & Forecast
- 8.3.2.2. Market Share & Forecast
- 8.3.2.2.1. By Application
- 8.3.2.2.2. By Material Type
- 8.3.2.2.3. By Manufacturing Process
- 8.3.3. Japan Copper Clad Laminates Market Outlook
- 8.3.3.1. Market Size & Forecast
- 8.3.3.2. Market Share & Forecast
- 8.3.3.2.1. By Application
- 8.3.3.2.2. By Material Type
- 8.3.3.2.3. By Manufacturing Process
- 8.3.4. South Korea Copper Clad Laminates Market Outlook
- 8.3.4.1. Market Size & Forecast
- 8.3.4.2. Market Share & Forecast
- 8.3.4.2.1. By Application
- 8.3.4.2.2. By Material Type
- 8.3.4.2.3. By Manufacturing Process
- 8.3.5. Australia Copper Clad Laminates Market Outlook
- 8.3.5.1. Market Size & Forecast
- 8.3.5.2. Market Share & Forecast
- 8.3.5.2.1. By Application
- 8.3.5.2.2. By Material Type
- 8.3.5.2.3. By Manufacturing Process
9. South America Copper Clad Laminates Market Outlook
- 9.1. Market Size & Forecast
- 9.2. Market Share & Forecast
- 9.2.1. By Application
- 9.2.2. By Material Type
- 9.2.3. By Manufacturing Process
- 9.2.4. By Country
- 9.3. South America: Country Analysis
- 9.3.1. Brazil Copper Clad Laminates Market Outlook
- 9.3.1.1. Market Size & Forecast
- 9.3.1.2. Market Share & Forecast
- 9.3.1.2.1. By Application
- 9.3.1.2.2. By Material Type
- 9.3.1.2.3. By Manufacturing Process
- 9.3.2. Argentina Copper Clad Laminates Market Outlook
- 9.3.2.1. Market Size & Forecast
- 9.3.2.2. Market Share & Forecast
- 9.3.2.2.1. By Application
- 9.3.2.2.2. By Material Type
- 9.3.2.2.3. By Manufacturing Process
- 9.3.3. Colombia Copper Clad Laminates Market Outlook
- 9.3.3.1. Market Size & Forecast
- 9.3.3.2. Market Share & Forecast
- 9.3.3.2.1. By Application
- 9.3.3.2.2. By Material Type
- 9.3.3.2.3. By Manufacturing Process
10. Middle East and Africa Copper Clad Laminates Market Outlook
- 10.1. Market Size & Forecast
- 10.2. Market Share & Forecast
- 10.2.1. By Application
- 10.2.2. By Material Type
- 10.2.3. By Manufacturing Process
- 10.2.4. By Country
- 10.3. Middle East and Africa: Country Analysis
- 10.3.1. South Africa Copper Clad Laminates Market Outlook
- 10.3.1.1. Market Size & Forecast
- 10.3.1.2. Market Share & Forecast
- 10.3.1.2.1. By Application
- 10.3.1.2.2. By Material Type
- 10.3.1.2.3. By Manufacturing Process
- 10.3.2. Saudi Arabia Copper Clad Laminates Market Outlook
- 10.3.2.1. Market Size & Forecast
- 10.3.2.2. Market Share & Forecast
- 10.3.2.2.1. By Application
- 10.3.2.2.2. By Material Type
- 10.3.2.2.3. By Manufacturing Process
- 10.3.3. UAE Copper Clad Laminates Market Outlook
- 10.3.3.1. Market Size & Forecast
- 10.3.3.2. Market Share & Forecast
- 10.3.3.2.1. By Application
- 10.3.3.2.2. By Material Type
- 10.3.3.2.3. By Manufacturing Process
- 10.3.4. Kuwait Copper Clad Laminates Market Outlook
- 10.3.4.1. Market Size & Forecast
- 10.3.4.2. Market Share & Forecast
- 10.3.4.2.1. By Application
- 10.3.4.2.2. By Material Type
- 10.3.4.2.3. By Manufacturing Process
- 10.3.5. Turkey Copper Clad Laminates Market Outlook
- 10.3.5.1. Market Size & Forecast
- 10.3.5.2. Market Share & Forecast
- 10.3.5.2.1. By Application
- 10.3.5.2.2. By Material Type
- 10.3.5.2.3. By Manufacturing Process
11. Market Dynamics
- 11.1. Drivers
- 11.2. Challenges
12. Market Trends & Developments
- 12.1. Merger & Acquisition (If Any)
- 12.2. Product Launches (If Any)
- 12.3. Recent Developments
13. Company Profiles
- 13.1. Kingboard Laminates Holdings Ltd.
- 13.1.1. Business Overview
- 13.1.2. Key Revenue and Financials
- 13.1.3. Recent Developments
- 13.1.4. Key Personnel/Key Contact Person
- 13.1.5. Key Product/Services Offered
- 13.2. Nan Ya Plastics Corporation
- 13.3. Panasonic Corporation
- 13.4. ITEQ Corporation
- 13.5. Shengyi Technology Co., Ltd. (SYTECH)
- 13.6. Isola Group
- 13.7. Doosan Corporation Electro-Materials
- 13.8. Nippon Mektron, Ltd.
- 13.9. Ventec International Group
- 13.10. Rogers Corporation
14. Strategic Recommendations
15. About Us & Disclaimer
