반도체 웨이퍼 세정 장비 시장 규모, 점유율, 성장 분석 : 장비 유형별, 웨이퍼 사이즈별, 기술별, 동작 모드별, 지역별 - 산업 예측(2025-2032년)
Semiconductor Wafer Cleaning Equipment Market Size, Share, Growth Analysis, By Equipment Type, By Wafer Size, By Technology, By Operation Mode, By Region - Industry Forecast 2025-2032
상품코드:1628941
리서치사:SkyQuest Technology Consulting Pvt. Ltd.
발행일:2025년 01월
페이지 정보:영문 221 Pages
라이선스 & 가격 (부가세 별도)
한글목차
세계의 반도체 웨이퍼 세정 장비 시장 규모는 2023년에 101억 달러에 달하며, 예측 기간(2025-2032년)의 CAGR은 10.4%로, 2024년 111억 5,000만 달러에서 2032년에는 246억 1,000만 달러로 성장할 전망입니다.
세계의 반도체 웨이퍼 세정 장비 시장은 전자, 자동차 및 기타 부문의 반도체 수요 증가로 인해 지속적인 성장이 예상됩니다. 습식 세정, 건식 세정, 플라즈마 세정 등 첨단 세정 기술이 널리 채택되고 있으며, 기술 발전과 생산 속도 증가로 인해 시장의 호조세가 지속될 것으로 예상됩니다. 그러나 높은 초기 투자 비용, 엄격한 규제 프레임워크, 빠르게 진화하는 반도체 기술에 대응하기 위한 지속적인 기술 혁신의 필요성 등이 걸림돌로 작용하고 있습니다. 또한 COVID-19는 공급망과 제조 공정에 혼란을 가져와 시장 성장에 일시적인 영향을 미치고 있습니다. 이러한 문제들이 해결된다면, 이 분야는 향후 수년간 성장 잠재력을 발휘할 수 있을 것으로 보입니다.
목차
서론
조사의 목적
조사 범위
정의
조사 방법
정보 조달
2차 데이터와 1차 데이터 방법
시장 규모 예측
시장의 전제조건과 제한
개요
세계 시장 전망
공급과 수요의 동향 분석
부문별 기회 분석
시장 역학과 전망
시장 개요
시장 규모
시장 역학
촉진요인과 기회
억제요인과 과제
Porter의 산업 분석
주요 시장 인사이트
주요 성공 요인
경쟁의 정도
주요 투자 기회
시장 에코시스템
시장의 매력 지수(2024년)
PESTEL 분석
거시경제 지표
밸류체인 분석
가격 분석
사례 연구
기술의 진보
규제 상황
스타트업 분석
특허 분석
무역 분석
반도체 웨이퍼 세정 장비 시장 규모 : 장비 유형별
시장 개요
싱글 웨이퍼 스프레이 시스템
싱글 웨이퍼 극저온 시스템
배치 침지 세정 시스템
배치식 스프레이 세정 시스템
스크러버
반도체 웨이퍼 세정 장비 시장 규모 : 웨이퍼 사이즈별
시장 개요
150밀리미터
200밀리미터
300밀리미터
450밀리미터
반도체 웨이퍼 세정 장비 시장 규모 : 기술별
시장 개요
습식 화학 세정
에칭 세정
프런트 사이드 업 클리닝
반도체 웨이퍼 세정 장비 시장 규모 : 동작 모드별
시장 개요
자동
반자동
매뉴얼
반도체 웨이퍼 세정 장비 시장 규모 : 용도별
시장 개요
MEMS(MEMS)
CIS(CMOS 이미지 센서)
메모리
RF 디바이스
LED
인터포저
로직
반도체 웨이퍼 세정 장비 시장 규모
북미
미국
캐나다
유럽
독일
스페인
프랑스
영국
이탈리아
기타 유럽 지역
아시아태평양
중국
인도
일본
한국
기타 아시아태평양
라틴아메리카
브라질
기타 라틴아메리카 지역
중동 및 아프리카
GCC 국가
남아프리카공화국
기타 중동 및 아프리카
경쟁 정보
상위 5사의 비교
주요 기업의 시장 포지셔닝(2024년)
주요 시장 기업이 채택한 전략
시장의 최근 동향
기업의 시장 점유율 분석(2024년)
주요 기업의 기업 개요
회사 개요
제품 포트폴리오 분석
부문별 점유율 분석
매출의 전년대비 비교(2022-2024)
주요 기업 개요
Tokyo Electron Limited(Japan)
Lam Research Corporation(US)
SCREEN Holdings Co., Ltd.(Japan)
KLA Corporation(US)
Hitachi High-Tech Corporation(Japan)
Semes Co., Ltd.(South Korea)
Shibaura Mechatronics Corporation(Japan)
Entegris, Inc.(US)
Modutek Corporation(US)
PVA TePla AG(Germany)
Veeco Instruments Inc.(US)
Ultratech, Inc.(US)
Axus Technology(US)
Meyer Burger Technology AG(Switzerland)
Rudolph Technologies, Inc.(US)
EV Group(Austria)
Mattson Technology, Inc.(US)
Akrion Systems LLC(US)
SUSS MicroTec SE(Germany)
결론과 권장사항
KSA
영문 목차
영문목차
Global Semiconductor Wafer Cleaning Equipment Market size was valued at USD 10.1 billion in 2023 and is poised to grow from USD 11.15 billion in 2024 to USD 24.61 billion by 2032, growing at a CAGR of 10.4% during the forecast period (2025-2032).
The global semiconductor wafer cleaning equipment market is poised for continued growth, fueled by increasing semiconductor demand across electronics, automotive, and other sectors. With technological advancements and rising production rates, the market's positive trajectory is expected to persist as advanced cleaning techniques, including wet cleaning, dry cleaning, and plasma cleaning, become more widely adopted. However, challenges such as high initial investment costs, stringent regulatory frameworks, and the ongoing need for innovation to align with rapidly evolving semiconductor technologies present hurdles. Additionally, the COVID-19 pandemic has created disruptions in supply chains and manufacturing processes, temporarily affecting market growth. As these challenges are addressed, the sector is likely to capitalize on its growth potential in the coming years.
Top-down and bottom-up approaches were used to estimate and validate the size of the Global Semiconductor Wafer Cleaning Equipment market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.
Global Semiconductor Wafer Cleaning Equipment Market Segmental Analysis
Global Semiconductor Wafer Cleaning Equipment Market is segmented by Equipment Type, Wafer Size, Technology, Operation Mode, Application and region. Based on Equipment Type, the market is segmented into Single Wafer Spray System, Single Wafer Cryogenic System, Batch Immersion Cleaning System, Batch Spray Cleaning System and Scrubber. Based on Wafer Size, the market is segmented into 150 mm, 200 mm, 300 mm and 450 mm. Based on Technology, the market is segmented into Wet Chemistry-Based Cleaning, Etch Cleaning and Front Side Up Cleaning. Based on Operation Mode, the market is segmented into Automatic, Semi-Automatic and Manual. Based on Application, the market is segmented into MEMS (Micro-Electro-Mechanical Systems), CIS (CMOS Image Sensors), Memory, RF Device, LED, Interposer and Logic. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.
Driver of the Global Semiconductor Wafer Cleaning Equipment Market
The Global Semiconductor Wafer Cleaning Equipment market is significantly influenced by the increasing adoption of advanced packaging technologies. Innovations like 3D IC integration, wafer-level packaging, and fan-out wafer-level packaging (FOWLP) create a heightened demand for specialized cleaning equipment tailored to these processes. These state-of-the-art packaging techniques necessitate meticulous cleaning of wafer surfaces and interfaces to guarantee optimal adhesion, bonding, and reliability of stacked dies and interconnect structures. Consequently, wafer-cleaning equipment must effectively address the distinctive challenges posed by these advanced packaging methodologies, ultimately driving growth and development within the semiconductor wafer cleaning equipment market.
Restraints in the Global Semiconductor Wafer Cleaning Equipment Market
The Global Semiconductor Wafer Cleaning Equipment market faces notable constraints, primarily due to the substantial costs associated with installation and upkeep. Advanced wafer cleaning systems, designed to meet the rigorous cleanliness standards essential in contemporary semiconductor manufacturing, necessitate a hefty capital investment. These elevated initial expenses can deter semiconductor manufacturers from adopting such technologies, particularly affecting small and medium-sized enterprises that often operate within limited financial parameters. Consequently, the financial burden imposed by the acquisition, installation, and ongoing maintenance of these essential cleaning systems can hinder their ability to compete effectively in an increasingly demanding market landscape.
Market Trends of the Global Semiconductor Wafer Cleaning Equipment Market
The Global Semiconductor Wafer Cleaning Equipment market is experiencing a robust growth trajectory, fueled by the accelerated miniaturization of semiconductor devices. As consumer preferences shift towards compact, powerful electronics, the demand for impeccable wafer cleanliness intensifies. Miniaturization leads to decreased feature sizes and heightened device densities, where even minute contaminants can significantly affect performance and yield. Consequently, the reliance on advanced wafer-cleaning solutions is paramount for preserving the integrity and functionality of these high-density devices. This rising necessity among manufacturers to enhance production efficiency and product reliability signals a promising outlook for the semiconductor wafer cleaning equipment sector.
Table of Contents
Introduction
Objectives of the Study
Scope of the Report
Definitions
Research Methodology
Information Procurement
Secondary & Primary Data Methods
Market Size Estimation
Market Assumptions & Limitations
Executive Summary
Global Market Outlook
Supply & Demand Trend Analysis
Segmental Opportunity Analysis
Market Dynamics & Outlook
Market Overview
Market Size
Market Dynamics
Drivers & Opportunities
Restraints & Challenges
Porters Analysis
Competitive rivalry
Threat of substitute
Bargaining power of buyers
Threat of new entrants
Bargaining power of suppliers
Key Market Insights
Key Success Factors
Degree of Competition
Top Investment Pockets
Market Ecosystem
Market Attractiveness Index, 2024
PESTEL Analysis
Macro-Economic Indicators
Value Chain Analysis
Pricing Analysis
Case Studies
Technology Advancement
Regulatory Landscape
Startup Analysis
Patent Analysis
Trade Analysis
Global Semiconductor Wafer Cleaning Equipment Market Size by Equipment Type & CAGR (2025-2032)
Market Overview
Single Wafer Spray System
Single Wafer Cryogenic System
Batch Immersion Cleaning System
Batch Spray Cleaning System
Scrubber
Global Semiconductor Wafer Cleaning Equipment Market Size by Wafer Size & CAGR (2025-2032)
Market Overview
150 mm
200 mm
300 mm
450 mm
Global Semiconductor Wafer Cleaning Equipment Market Size by Technology & CAGR (2025-2032)
Market Overview
Wet Chemistry-Based Cleaning
Etch Cleaning
Front Side Up Cleaning
Global Semiconductor Wafer Cleaning Equipment Market Size by Operation Mode & CAGR (2025-2032)
Market Overview
Automatic
Semi-Automatic
Manual
Global Semiconductor Wafer Cleaning Equipment Market Size by Application & CAGR (2025-2032)
Market Overview
MEMS (Micro-Electro-Mechanical Systems)
CIS (CMOS Image Sensors)
Memory
RF Device
LED
Interposer
Logic
Global Semiconductor Wafer Cleaning Equipment Market Size & CAGR (2025-2032)
North America (Equipment Type, Wafer Size, Technology, Operation Mode, Application)
US
Canada
Europe (Equipment Type, Wafer Size, Technology, Operation Mode, Application)
Germany
Spain
France
UK
Italy
Rest of Europe
Asia Pacific (Equipment Type, Wafer Size, Technology, Operation Mode, Application)
China
India
Japan
South Korea
Rest of Asia-Pacific
Latin America (Equipment Type, Wafer Size, Technology, Operation Mode, Application)
Brazil
Rest of Latin America
Middle East & Africa (Equipment Type, Wafer Size, Technology, Operation Mode, Application)
