한글목차

세계의 SiC 웨이퍼 가공 시장 규모는 2025년 10억 9,076만 달러로 평가되었고, 2026년부터 2032년에 걸쳐 CAGR 14.43%로 성장하고, 2032년까지 29억 8,644만 달러에 달할 것으로 예측되고 있습니다.

SiC 웨이퍼 가공 분야의 주요 세계 기업으로는 디스코, 어플라이드 머티리얼스, 에바라 제작소, 도쿄 정밀, 엔기스, 레바섬, 오카모토 정기, 스피드팜, G& N, 코마츠 NTC 등을 들 수 있습니다.

본 보고서는 세계의 SiC 웨이퍼 가공 시장에 대한 종합적인 개요를 제공하고, 정량 및 정성적 분석을 통해 독자 여러분이 성장 전략의 책정, 경쟁 구도의 평가, 현재 시장에서의 자사의 위치 지정 분석 및 SiC 웨이퍼 가공에 관한 정보에 근거한 비즈니스 판단을 실시할 수 있도록 지원합니다. SiC 웨이퍼 가공 시장 규모, 추정치 및 예측치는 수익(백만 달러) 기준으로 제공되며, 2025년을 기준연도로 하며, 2021년부터 2032년까지의 과거 및 예측 데이터를 포함합니다.

본 보고서에서는 세계의 SiC 웨이퍼 가공 시장을 종합적으로 부문화하고 있습니다. 지역별 시장 규모, 공정 단계별, 용도별, 웨이퍼 지름별 및 기업별 시장 규모도 제공됩니다. 보다 깊은 통찰력을 얻기 위해 경쟁 구도, 주요 경쟁사, 각각 시장 순위를 프로파일링하고 기술 동향과 신제품 개발에 대해서도 논의했습니다.

이 보고서는 SiC 웨이퍼 가공 제조업체, 신규 진출기업 및 업계 밸류체인 전체 기업에 대해 시장 전체 및 하위 부문별 수익, 판매 수량, 평균 가격에 대한 정보를 기업별, 프로세스 단계별, 용도별, 지역별로 제공합니다.

시장 세분화

기업별

• DISCO
• DISCO
• Applied Materials
• Ebara
• Tokyo Seimitsu
• Engis
• Revasum
• Okamoto
• SpeedFam
• G&N;
• Komatsu NTC
• Takatori
• SCREEN
• KLA
• Onto Innovation
• Bruker
• Freiberg Instruments
• Pureon
• Entegris
• Fujimi
• DuPont
• Beijing TSD Semiconductor

공정 단계별 부문

• 슬라이싱 장비
• 청소 및 검사 장비
• 랩핑/연삭 장비
• 연마 장비
• CMP 소모품

웨이퍼 지름별 구분

• 150mm
• 200mm
• 100mm 및 기타

연마 모드별 부문

• 편면 연마
• 양면 연마

용도별 부문

• 전력 소자
• 광전자
• 무선 통신
• 기타

지역별 부문

• 북미
  • 미국
  • 캐나다
• 아시아태평양
  • 중국
  • 일본
  • 한국
  • 대만
• 유럽
  • 독일
  • 프랑스
  • 이탈리아
  • 스웨덴

영문목차

The global SiC Wafer Processing market size is projected to reach US$ 2,986.44 million by 2032, from US$ 1,090.76 million in 2025, at a CAGR of 14.43% during 2026-2032.

Major global companies of SiC Wafer Processing include DISCO, Applied Materials, Ebara, Tokyo Seimitsu, Engis, Revasum, Okamoto, SpeedFam, G&N, Komatsu NTC, etc.

This report delivers a comprehensive overview of the global SiC Wafer Processing market, with both quantitative and qualitative analyses, to help readers develop growth strategies, assess the competitive landscape, evaluate their position in the current market, and make informed business decisions regarding SiC Wafer Processing. The SiC Wafer Processing market size, estimates, and forecasts are provided in terms of revenue (US$ millions), with 2025 as the base year and historical and forecast data for 2021-2032.

The report segments the global SiC Wafer Processing market comprehensively. Regional market sizes By Process Stage, by Application, By Wafer Diameter, and by player are also provided. For deeper insight, the report profiles the competitive landscape, key competitors, and their respective market rankings, and discusses technological trends and new product developments.

This report will assist SiC Wafer Processing manufacturers, new entrants, and companies across the industry value chain with information on revenues, sales volume, and average prices for the overall market and its sub-segments, by company, By Process Stage, by Application, and by region.

Market Segmentation

By Company

• DISCO
• DISCO
• Applied Materials
• Ebara
• Tokyo Seimitsu
• Engis
• Revasum
• Okamoto
• SpeedFam
• G&N
• Komatsu NTC
• Takatori
• SCREEN
• KLA
• Onto Innovation
• Bruker
• Freiberg Instruments
• Pureon
• Entegris
• Fujimi
• DuPont
• Beijing TSD Semiconductor

Segment By Process Stage

• Slicing Equipment
• Cleaning & Inspection Equipment
• Lapping / Grinding Equipment
• Polishing Equipment
• CMP Consumables

Segment By Wafer Diameter

• 150 mm
• 200 mm
• 100 mm and Other

Segment By Polishing Mode

• Single Side Polishing
• Double Side Polishing

Segment by Application

• Power Devices
• Optoelectronics
• Wireless Communications
• Other

Segment by Region

• North America
  • U.S.
  • Canada
• Asia-Pacific
  • China
  • Japan
  • South Korea
  • Taiwan
• Europe
  • Germany
  • France
  • Italy
  • Sweden

Chapter Outline

Chapter 1: Defines the scope of the report and presents an executive summary of market segments (By Process Stage, by Application, By Wafer Diameter, etc.), including the size of each segment and its future growth potential. It offers a high-level view of the current market and its likely evolution in the short, medium, and long term.

Chapter 2: Summarizes global and regional market size and outlines market dynamics and recent developments, including key drivers, restraints, challenges and risks for industry participants, and relevant policy analysis.

Chapter 3: Provides a detailed view of the competitive landscape for SiC Wafer Processing companies, covering revenue share, development plans, and mergers and acquisitions.

Chapter 4: Analyzes segments By Process Stage, detailing the size and growth potential of each segment to help readers identify blue-ocean opportunities.

Chapter 5: Analyzes segments by Application, detailing the size and growth potential of each downstream segment to help readers identify blue-ocean opportunities.

Chapter 6-8: Regional deep dives (North America, Europe, Asia Pacific) broken down by country. Each chapter quantifies market size and growth potential by region and key countries, and outlines market development, outlook, addressable space, and capacity.

Chapter 9: Profiles key players, presenting essential information on leading companies, including product/ service offerings, revenue, gross margin, product introductions/portfolios, recent developments, etc.

Chapter 10: Key findings and conclusions of the report.

Table of Contents

1 Report Overview

• 1.1 Study Scope
• 1.2 Market Analysis By Process Stage
  • 1.2.1 Global SiC Wafer Processing Market Size Growth Rate By Process Stage: 2021 vs 2025 vs 2032
  • 1.2.2 Slicing
  • 1.2.3 Lapping / Grinding
  • 1.2.4 Polishing Equipment
  • 1.2.5 Cleaning & Inspection
  • 1.2.6 CMP Consumables
  • 1.2.7 Other
• 1.3 Market By Wafer Diameter
  • 1.3.1 Global SiC Wafer Processing Market Size Growth Rate By Wafer Diameter: 2021 vs 2025 vs 2032
  • 1.3.2 150 mm(6-inch)
  • 1.3.3 200 mm(8-inch)
  • 1.3.4 100 mm(4-inch)
• 1.4 Market By Polishing Mode
  • 1.4.1 Global SiC Wafer Polishing Equipment Market Size Growth Rate By Polishing Mode: 2021 vs 2025 vs 2032
  • 1.4.2 Single Side Polishing
  • 1.4.3 Double Side Polishing
• 1.5 Market by Application
  • 1.5.1 Global SiC Wafer Processing Market Growth by Application: 2021 vs 2025 vs 2032
  • 1.5.2 Power Devices
  • 1.5.3 Optoelectronics
  • 1.5.4 Wireless Communications
  • 1.5.5 Other
• 1.6 Assumptions and Limitations
• 1.7 Study Objectives
• 1.8 Years Considered

2 Global Growth Trends

• 2.1 Global SiC Wafer Processing Market Perspective (2021-2032)
• 2.2 Global SiC Wafer Processing Growth Trends by Region
  • 2.2.1 Global SiC Wafer Processing Market Size by Region: 2021 vs 2025 vs 2032
  • 2.2.2 SiC Wafer Processing Historic Market Size by Region (2021-2026)
  • 2.2.3 SiC Wafer Processing Forecasted Market Size by Region (2027-2032)
• 2.3 SiC Wafer Processing Market Dynamics
  • 2.3.1 SiC Wafer Processing Industry Trends
  • 2.3.2 SiC Wafer Processing Market Drivers
  • 2.3.3 SiC Wafer Processing Market Challenges
  • 2.3.4 SiC Wafer Processing Market Restraints

3 Competition Landscape by Key Players

• 3.1 Global Top SiC Wafer Processing Players by Revenue
  • 3.1.1 Global Top SiC Wafer Processing Players by Revenue (2021-2026)
  • 3.1.2 Global SiC Wafer Processing Revenue Market Share by Players (2021-2026)
• 3.2 Global Top SiC Wafer Processing Players Market Share by Company Tier (Tier 1, Tier 2, Tier 3)
• 3.3 Global Key Players Ranking by SiC Wafer Processing Revenue
• 3.4 Global SiC Wafer Processing Market Concentration Ratio
  • 3.4.1 Global SiC Wafer Processing Market Concentration Ratio (CR5 and HHI)
  • 3.4.2 Global Top 10 and Top 5 Companies by SiC Wafer Processing Revenue in 2025
• 3.5 Global Key Players of SiC Wafer Processing Head Offices and Areas Served
• 3.6 Global Key Players of SiC Wafer Processing, Products and Applications
• 3.7 Mergers and Acquisitions, Expansion Plans

4 SiC Wafer Processing Breakdown Data By Process Stage

• 4.1 Global SiC Wafer Processing Historic Market Size By Process Stage (2021-2026)
• 4.2 Global SiC Wafer Processing Forecasted Market Size By Process Stage (2027-2032)

5 SiC Wafer Processing Breakdown Data by Application

• 5.1 Global SiC Wafer Processing Historic Market Size by Application (2021-2026)
• 5.2 Global SiC Wafer Processing Forecasted Market Size by Application (2027-2032)

6 North America

• 6.1 North America SiC Wafer Processing Market Size (2021-2032)
• 6.2 North America SiC Wafer Processing Market Growth Rate by Country: 2021 vs 2025 vs 2032
• 6.3 North America SiC Wafer Processing Market Size by Country (2021-2026)
• 6.4 North America SiC Wafer Processing Market Size by Country (2027-2032)
• 6.5 United States
• 6.6 Canada

7 Europe

• 7.1 Europe SiC Wafer Processing Market Size (2021-2032)
• 7.2 Europe SiC Wafer Processing Market Growth Rate by Country: 2021 vs 2025 vs 2032
• 7.3 Europe SiC Wafer Processing Market Size by Country (2021-2026)
• 7.4 Europe SiC Wafer Processing Market Size by Country (2027-2032)
• 7.5 Germany
• 7.6 France
• 7.7 Italy
• 7.8 Sweden

8 Asia-Pacific

• 8.1 Asia-Pacific SiC Wafer Processing Market Size (2021-2032)
• 8.2 Asia-Pacific SiC Wafer Processing Market Growth Rate by Region: 2021 vs 2025 vs 2032
• 8.3 Asia-Pacific SiC Wafer Processing Market Size by Region (2021-2026)
• 8.4 Asia-Pacific SiC Wafer Processing Market Size by Region (2027-2032)
• 8.5 China
• 8.6 Japan
• 8.7 South Korea
• 8.8 Taiwan

9 Key Players Profiles

• 9.1 DISCO
  • 9.1.1 DISCO Company Details
  • 9.1.2 DISCO Business Overview
  • 9.1.3 DISCO SiC Wafer Processing Introduction
  • 9.1.4 DISCO Revenue in SiC Wafer Processing Business (2021-2026)
  • 9.1.5 DISCO Recent Development
• 9.2 Applied Materials
  • 9.2.1 Applied Materials Company Details
  • 9.2.2 Applied Materials Business Overview
  • 9.2.3 Applied Materials SiC Wafer Processing Introduction
  • 9.2.4 Applied Materials Revenue in SiC Wafer Processing Business (2021-2026)
• 9.3 Ebara
  • 9.3.1 Ebara Company Details
  • 9.3.2 Ebara Business Overview
  • 9.3.3 Ebara SiC Wafer Processing Introduction
  • 9.3.4 Ebara Revenue in SiC Wafer Processing Business (2021-2026)
  • 9.3.5 Ebara Recent Development
• 9.4 Tokyo Seimitsu
  • 9.4.1 Tokyo Seimitsu Company Details
  • 9.4.2 Tokyo Seimitsu Business Overview
  • 9.4.3 Tokyo Seimitsu SiC Wafer Processing Introduction
  • 9.4.4 Tokyo Seimitsu Revenue in SiC Wafer Processing Business (2021-2026)
  • 9.4.5 Tokyo Seimitsu Recent Development
• 9.5 Engis
  • 9.5.1 Engis Company Details
  • 9.5.2 Engis Business Overview
  • 9.5.3 Engis SiC Wafer Processing Introduction
  • 9.5.4 Engis Revenue in SiC Wafer Processing Business (2021-2026)
• 9.6 Revasum
  • 9.6.1 Revasum Company Details
  • 9.6.2 Revasum Business Overview
  • 9.6.3 Revasum SiC Wafer Processing Introduction
  • 9.6.4 Revasum Revenue in SiC Wafer Processing Business (2021-2026)
• 9.7 Okamoto
  • 9.7.1 Okamoto Company Details
  • 9.7.2 Okamoto Business Overview
  • 9.7.3 Okamoto SiC Wafer Processing Introduction
  • 9.7.4 Okamoto Revenue in SiC Wafer Processing Business (2021-2026)
• 9.8 SpeedFam
  • 9.8.1 SpeedFam Company Details
  • 9.8.2 SpeedFam Business Overview
  • 9.8.3 SpeedFam SiC Wafer Processing Introduction
  • 9.8.4 SpeedFam Revenue in SiC Wafer Processing Business (2021-2026)
• 9.9 G&N
  • 9.9.1 G&N Company Details
  • 9.9.2 G&N Business Overview
  • 9.9.3 G&N SiC Wafer Processing Introduction
  • 9.9.4 G&N Revenue in SiC Wafer Processing Business (2021-2026)
• 9.10 Komatsu NTC
  • 9.10.1 Komatsu NTC Company Details
  • 9.10.2 Komatsu NTC Business Overview
  • 9.10.3 Komatsu NTC SiC Wafer Processing Introduction
  • 9.10.4 Komatsu NTC Revenue in SiC Wafer Processing Business (2021-2026)
• 9.11 Takatori
  • 9.11.1 Takatori Company Details
  • 9.11.2 Takatori Business Overview
  • 9.11.3 Takatori SiC Wafer Processing Introduction
  • 9.11.4 Takatori Revenue in SiC Wafer Processing Business (2021-2026)
• 9.12 SCREEN
  • 9.12.1 SCREEN Company Details
  • 9.12.2 SCREEN Business Overview
  • 9.12.3 SCREEN SiC Wafer Processing Introduction
  • 9.12.4 SCREEN Revenue in SiC Wafer Processing Business (2021-2026)
• 9.13 KLA
  • 9.13.1 KLA Company Details
  • 9.13.2 KLA Business Overview
  • 9.13.3 KLA SiC Wafer Processing Introduction
  • 9.13.4 KLA Revenue in SiC Wafer Processing Business (2021-2026)
  • 9.13.5 KLA Recent Development
• 9.14 Onto Innovation
  • 9.14.1 Onto Innovation Company Details
  • 9.14.2 Onto Innovation Business Overview
  • 9.14.3 Onto Innovation SiC Wafer Processing Introduction
  • 9.14.4 Onto Innovation Revenue in SiC Wafer Processing Business (2021-2026)
• 9.15 Bruker
  • 9.15.1 Bruker Company Details
  • 9.15.2 Bruker Business Overview
  • 9.15.3 Bruker SiC Wafer Processing Introduction
  • 9.15.4 Bruker Revenue in SiC Wafer Processing Business (2021-2026)
• 9.16 Freiberg Instruments
  • 9.16.1 Freiberg Instruments Company Details
  • 9.16.2 Freiberg Instruments Business Overview
  • 9.16.3 Freiberg Instruments SiC Wafer Processing Introduction
  • 9.16.4 Freiberg Instruments Revenue in SiC Wafer Processing Business (2021-2026)
  • 9.16.5 Freiberg Instruments Recent Development
• 9.17 Pureon
  • 9.17.1 Pureon Company Details
  • 9.17.2 Pureon Business Overview
  • 9.17.3 Pureon SiC Wafer Processing Introduction
  • 9.17.4 Pureon Revenue in SiC Wafer Processing Business (2021-2026)
  • 9.17.5 Pureon Recent Development
• 9.18 Entegris
  • 9.18.1 Entegris Company Details
  • 9.18.2 Entegris Business Overview
  • 9.18.3 Entegris SiC Wafer Processing Introduction
  • 9.18.4 Entegris Revenue in SiC Wafer Processing Business (2021-2026)
  • 9.18.5 Entegris Recent Development
• 9.19 Fujimi
  • 9.19.1 Fujimi Company Details
  • 9.19.2 Fujimi Business Overview
  • 9.19.3 Fujimi SiC Wafer Processing Introduction
  • 9.19.4 Fujimi Revenue in SiC Wafer Processing Business (2021-2026)
• 9.20 DuPont
  • 9.20.1 DuPont Company Details
  • 9.20.2 DuPont Business Overview
  • 9.20.3 DuPont SiC Wafer Processing Introduction
  • 9.20.4 DuPont Revenue in SiC Wafer Processing Business (2021-2026)
  • 9.20.5 DuPont Recent Development
• 9.21 Beijing TSD Semiconductor
  • 9.21.1 Beijing TSD Semiconductor Company Details
  • 9.21.2 Beijing TSD Semiconductor Business Overview
  • 9.21.3 Beijing TSD Semiconductor SiC Wafer Processing Introduction
  • 9.21.4 Beijing TSD Semiconductor Revenue in SiC Wafer Processing Business (2021-2026)

10 Analyst's Viewpoints/Conclusions

11 Appendix

• 11.1 Research Methodology
  • 11.1.1 Methodology/Research Approach
  • 11.1.2 Data Source
• 11.2 Author Details
• 11.3 Disclaimer