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세계의 반도체용 레이저 그루빙 장비 시장 : 분석 및 예측(2020-2031년)
Global Laser Grooving Equipment for Semiconductor Market Report, History and Forecast 2020-2031
상품코드 : 1715281
리서치사 : QYResearch
발행일 : 2025년 04월
페이지 정보 : 영문
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한글목차

전 세계 반도체용 레이저 그루빙 장비 시장 규모는 2024년에 4억 6,835만 달러이며 2031년에는 8억 9,886만 달러에 달할 것으로 예상되며, 2025-2031년 예측 기간 동안 9.24%의 CAGR로 성장할 것으로 예상됩니다.

북미 시장 규모는 2024년 9,006만 달러로 2031년까지 1억 5,015만 달러에 달할 것으로 예상되며, 2024-2031년 예측 기간 동안 8.71%의 CAGR을 기록할 것으로 예상됩니다.

아시아태평양의 시장 규모는 2024년에 3억 2,808만 달러로 2031년까지 5억 7,638만 달러에 달할 것으로 예상되며, 2024년부터 2031년까지 예측 기간 동안 9.47%의 CAGR을 기록할 것으로 예상됩니다.

유럽의 시장 규모는 2024년에 3,414만 달러로 2031년까지 5,815만 달러에 달할 것으로 예상되며, 2024년부터 2031년까지 예측 기간 동안 8.96%의 CAGR을 기록할 것으로 예상됩니다.

세계의 반도체용 레이저 그루빙 장비 시장에 대해 조사 분석했으며, 각 지역별 시장 규모와 예측, 경쟁 상황, 주요 기업 프로파일, 기술 동향, 신제품 개발 등의 정보를 전해드립니다.

목차

제1장 반도체 시장 개요

제2장 반도체 시장 경쟁

제3장 반도체용 레이저 그루빙 장비 현황과 전망 : 지역별

제4장 반도체용 레이저 그루빙 장비 : 용도별

제5장 북미의 반도체용 레이저 그루빙 장비 : 국가별

제6장 유럽의 반도체용 레이저 그루빙 장비 : 국가별

제7장 아시아태평양의 반도체용 레이저 그루빙 장비 : 지역별

제8장 라틴아메리카의 반도체용 레이저 그루빙 장비 : 국가별

제9장 기업 개요

제10장 업스트림, 기회, 과제, 리스크, 영향요인 분석

제11장 마케팅 전략 분석, 판매업체

제12장 조사 결과와 결론

제13장 부록

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영문 목차

영문목차

The global market for Laser Grooving Equipment for Semiconductor was valued at US$ 468.35 million in the year 2024 and is projected to reach a revised size of US$ 809.86 million by 2031, growing at a CAGR of 9.24% during the forecast period 2025-2031.

North American market for Laser Grooving Equipment for Semiconductor was valued at $ 90.06 million in 2024 and will reach $ 150.15 million by 2031, at a CAGR of 8.71% during the forecast period of 2024 through 2031.

Asia-Pacific market for Laser Grooving Equipment for Semiconductor was valued at $ 328.08 million in 2024 and will reach $ 576.38 million by 2031, at a CAGR of 9.47% during the forecast period of 2024 through 2031.

Europe market for Laser Grooving Equipment for Semiconductor was valued at $ 34.14 million in 2024 and will reach $ 58.15 million by 2031, at a CAGR of 8.96% during the forecast period of 2024 through 2031.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Laser Grooving Equipment for Semiconductor, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Laser Grooving Equipment for Semiconductor.

The Laser Grooving Equipment for Semiconductor market size, estimations, and forecasts are provided in terms of sales volume (Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Laser Grooving Equipment for Semiconductor market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global Laser Grooving Equipment for Semiconductor market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.

Market Segmentation

This report covers the Laser Grooving Equipment for Semiconductor segments by manufacturers, by Type, by Application, by region and country, and provides market size (value, volume and average price) and CAGR for the history and forecast period (2020-2024, 2025-2031), considering 2024 as the base year. It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrices for this market.

By Company

Segment by Type

Segment by Application

By Region

Chapter Outline

Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, Latin America.

Chapter Two: Detailed analysis of Laser Grooving Equipment for Semiconductor manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.

Chapter Three: Sales, revenue of Laser Grooving Equipment for Semiconductor in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.

Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, Latin America.

Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, Latin America, Middle East & Africa, sales and revenue by country.

Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, etc.

Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry.

Chapter Twelve: Analysis of sales channel, distributors and customers.

Chapter Thirteen: Research Findings and Conclusion.

Table of Contents

1 Laser Grooving Equipment for Semiconductor Market Overview

2 Laser Grooving Equipment for Semiconductor Market Competition by Company

3 Laser Grooving Equipment for Semiconductor Status and Outlook by Region

4 Laser Grooving Equipment for Semiconductor by Application

5 North America Laser Grooving Equipment for Semiconductor by Country

6 Europe Laser Grooving Equipment for Semiconductor by Country

7 Asia-Pacific Laser Grooving Equipment for Semiconductor by Region

8 Latin America Laser Grooving Equipment for Semiconductor by Country

9 Company Profiles

10 Upstream, Opportunities, Challenges, Risks and Influences Factors Analysis

11 Marketing Strategy Analysis, Distributors

12 Research Findings and Conclusion

13 Appendix

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