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세계의 반도체 전기도금 시스템(도금 장비) 시장(2024년)
Global Semiconductor Electroplating Systems (Plating Equipment) Market Research Report 2024
상품코드 : 1496849
리서치사 : QYResearch
발행일 : 2024년 06월
페이지 정보 : 영문
 라이선스 & 가격 (부가세 별도)
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한글목차

세계 반도체 전기도금 시스템(도금 장비) 시장 규모는 2023년 5억 5,900만 달러에 달했습니다.

이 시장은 2024-2030년 예측 기간 동안 6.02%의 CAGR로 성장하여 2030년에는 8억 5,400만 달러에 달할 것으로 예상됩니다.

북미 반도체 전기도금 시스템(도금 장비) 시장 규모는 2023년 6,300만 달러에 달했습니다. 이 시장은 2024-2030년 예측 기간 동안 4.54%의 CAGR로 성장하여 2030년에는 9,000만 달러에 달할 것으로 예상됩니다.

아시아태평양의 반도체 전기도금 시스템(도금 장비) 시장 규모는 2023년 4억 6,500만 달러에 달했습니다. 이 시장은 2024년부터 2030년까지 예측 기간 동안 6.33%의 CAGR로 성장하여 2030년에는 7억 2,400만 달러에 달할 것으로 예상됩니다.

반도체 전기도금 시스템(도금 장비)의 세계 주요 업체로는 Lam Research, Applied Materials, ACM Research, ASMPT, TKC, Besi, ClassOne Technology, TANAKA Precious Metals, RENA Technologies 등이 있으며, 2023년 세계 상위 3개 업체가 매출의 약 54%를 차지했습니다.

이 보고서는 세계 반도체 전기도금 시스템(도금 장비) 시장에 대해 조사했으며, 시장 개요와 함께 유형별, 용도별, 지역별 동향, 시장 진입 기업 개요 등을 전해드립니다.

목차

제1장 반도체 전기도금 시스템(도금 장비) 시장 개요

제2장 제조업체에 의한 시장 경쟁

제3장 반도체 전기도금 시스템(도금 장비) 생산, 지역별

제4장 반도체 전기도금 시스템(도금 장비) 소비량, 지역별

제5장 유형별 부문

제6장 용도별 부문

제7장 주요 기업 개요

제8장 산업 체인과 판매 채널 분석

제9장 반도체 전기도금 시스템(도금 장비) 시장 역학

제10장 조사 결과와 결론

제11장 조사 방법과 정보 출처

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영문 목차

영문목차

The global Semiconductor Electroplating Systems (Plating Equipment) market was valued at US$ 559 million in 2023 and is anticipated to reach US$ 854 million by 2030, witnessing a CAGR of 6.02% during the forecast period 2024-2030.

North American market for Semiconductor Electroplating Systems (Plating Equipment) is estimated to increase from $ 63 million in 2023 to reach $ 90 million by 2030, at a CAGR of 4.54 % during the forecast period of 2024 through 2030.

Asia-Pacific market for Semiconductor Electroplating Systems (Plating Equipment) is estimated to increase from $ 465 million in 2023 to reach $ 724 million by 2030, at a CAGR of 6.33% during the forecast period of 2024 through 2030.

The major global manufacturers of Semiconductor Electroplating Systems (Plating Equipment) include Lam Research, Applied Materials, ACM Research, ASMPT, TKC, Besi, ClassOne Technology, TANAKA Precious Metals, and RENA Technologies, etc. In 2023, the world's top three vendors accounted for approximately 54% of the revenue.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Semiconductor Electroplating Systems (Plating Equipment), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Electroplating Systems (Plating Equipment).

The Semiconductor Electroplating Systems (Plating Equipment) market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Semiconductor Electroplating Systems (Plating Equipment) market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Semiconductor Electroplating Systems (Plating Equipment) manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

By Company

by Type

by Application

Production by Region

Consumption by Region

Chapter Outline:

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.

Chapter 2: Detailed analysis of Semiconductor Electroplating Systems (Plating Equipment) manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Production/output, value of Semiconductor Electroplating Systems (Plating Equipment) by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.

Chapter 4: Consumption of Semiconductor Electroplating Systems (Plating Equipment) in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.

Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 10: The main points and conclusions of the report.

Table of Contents

1 Semiconductor Electroplating Systems (Plating Equipment) Market Overview

2 Market Competition by Manufacturers

3 Semiconductor Electroplating Systems (Plating Equipment) Production by Region

4 Semiconductor Electroplating Systems (Plating Equipment) Consumption by Region

5 Segment by Type

6 Segment by Application

7 Key Companies Profiled

8 Industry Chain and Sales Channels Analysis

9 Semiconductor Electroplating Systems (Plating Equipment) Market Dynamics

10 Research Findings and Conclusion

11 Methodology and Data Source

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