세계의 SOI(Silicon on Insulator) 및 기타 기판 시장 : 기판 유형별(반절연 SiC 기판, 전도성 SiC 기판), 웨이퍼 크기별(100mm, 150mm, 200mm), 용도별(파워 디바이스, RF 디바이스), 지역별 - 예측(-2029년)
SiC-On-Insulator and Other Substrates Market by Substrate Type (Semi-insulating SiC Substrates, Conductive SiC Substrates), Wafer Size (100mm, 150mm and 200mm), Application (Power Devices, RF Devices) and Region - Global Forecast to 2029
상품코드:1415814
리서치사:MarketsandMarkets
발행일:2024년 01월
페이지 정보:영문 135 Pages
라이선스 & 가격 (부가세 별도)
ㅁ Add-on 가능: 고객의 요청에 따라 일정한 범위 내에서 Customization이 가능합니다. 자세한 사항은 문의해 주시기 바랍니다.
한글목차
조사 범위
조사 대상년도
2020년-2029년
기준년도
2023년
예측 기간
2024년-2029년
검토 단위
금액(100만 달러)
부문별
기판 유형별, 웨이퍼 사이즈별, 용도별, 지역별
대상 지역
북미, 유럽, 아시아태평양 및 기타 지역
SOI(Silicon on Insulator) 및 기타 기판 시장 규모는 2024년 9,900만 달러에서 2029년 1억 4,900만 달러에 달할 것으로 예상되며, 2024년부터 2029년까지 연평균 8.5%의 연평균 복합 성장률(CAGR)을 나타낼 것으로 예상됩니다.
시장 성장을 가속하는 주요 요인으로는 5G 기술에서 SiC 기판의 보급 증가, 전기 자동차의 SiC 기판 채택 가속화 등이 있습니다. 또한, SOI 기판의 바이오 의료 장비에 대한 도입이 증가하고 있으며, 이는 시장 진출기업들에게 성장 기회를 제공할 것으로 예상됩니다.
파워 디바이스는 예측 기간 동안 SOI(Silicon on Insulator) 및 기타 기판 시장에서 가장 큰 시장 점유율을 차지할 것으로 예상됩니다.
SiC의 우수한 열전도율은 Si보다 3배 이상 높으며, 동일한 온도 상승에서 더 작은 다이를 사용할 수 있습니다. 따라서 전력 디바이스에 SiC 온 인슐레이터 기판이 점점 더 많이 채택되는 이유는 더 높은 전력 밀도, 가혹한 환경에 대한 내성, 전력 손실 감소, 효율성 향상 및 우수한 열전도율 때문입니다. 그 결과, SiC-on-Insulator는 파워 디바이스 용도에 매우 선호되고 있으며, 파워 디바이스가 가장 큰 시장 점유율을 차지할 것으로 예상됩니다.
이 보고서는 세계 SOI(Silicon on Insulator) 및 기타 기판 시장을 조사했으며, 기판 유형별/웨이퍼 크기별/용도별/지역별 동향과 시장 진출기업 프로파일 등을 정리한 보고서입니다.
목차
제1장 서론
제2장 조사 방법
제3장 주요 요약
제4장 프리미엄 인사이트
제5장 시장 개요
서론
시장 역학
공급망 분석
생태계/시장 맵
고객의 비즈니스에 영향을 미치는 동향/혼란
기술 분석
특허 분석
Porter의 Five Forces 분석
기준과 규제 상황
2024년-2025년 주요 컨퍼런스 및 이벤트
제6장 SOI(Silicon on Insulator) 및 기타 기판 재료
서론
SI
SIO2
기타
제7장 SOI(Silicon on Insulator) 및 기타 기판 시장, 웨이퍼 사이즈별
서론
100mm
150mm
200mm
제8장 SOI(Silicon on Insulator) 및 기타 기판 시장, 기판 유형별
서론
반절연성 SIC 기판
전도성 SIC 기판
제9장 SOI(Silicon on Insulator) 및 기타 기판 시장, 용도별
서론
파워 디바이스
RF 디바이스
기타
제10장 SOI(Silicon on Insulator) 및 기타 기판 시장, 지역별
서론
북미
유럽
아시아태평양
기타 지역
제11장 경쟁 구도
서론
주요 기업이 채택한 전략, 2019년-2023년
시장 점유율 분석, 2023년
기업 평가 매트릭스, 2023년
경쟁 시나리오와 동향
제12장 기업 개요
서론
주요 시장 진출기업
WOLFSPEED, INC.
SICC CO., LTD.
SOITEC
COHERENT CORP.
GLOBALWAFERS
XIAMEN POWERWAY ADVANCED MATERIAL CO., LTD.
CERAMICFORUM CO., LTD.
HOMRAY MATERIAL TECHNOLOGY
SHANGHAI ZHONGYINGRONG INNOVATIVE MATERIAL TECHNOLOGY CO., LTD
PRECISION MICRO-OPTICS INC.
SICRYSTAL GMBH
SYNLIGHT
TANKEBLUE CO,. LTD.
제13장 부록
LSH
영문 목차
영문목차
Report Description
Scope of the Report
Years Considered for the Study
2020-2029
Base Year
2023
Forecast Period
2024-2029
Units Considered
Value (USD Million)
Segments
By Substrate Type, Wafer Size, Application and Region
Regions covered
North America, Europe, APAC, RoW
The SiC-on-insulator and other substrates market is projected to reach USD 149 million by 2029 from USD 99 million in 2024, at a CAGR of 8.5% from 2024 to 2029. The major factors driving the market growth of the SiC-on-insulator and other substrates include the increasing deployment of SiC substrates in 5G technology and the accelerating adoption of SiC substrates in electric vehicles. Moreover, the growing implementation of SiC-on-insulator substrates in biomedical devices is expected to provide several growth opportunities for market players in the SiC-on-insulator and other substrates market.
Power devices are expected to account for the largest market share in the SiC-on-insulator and other substrates market during the forecast period.
The superior thermal conductivity of SiC, is more than three times better than Si, which allows the use of a small die for the same temperature rise. Therefore, the growing implementation of SiC-on-Insulator substrates in power devices is attributed to gaining higher power density, tolerance for harsh environments, reduced power losses, enhanced efficiency, and superior thermal conductivity. As a result, SiC-on-insulator is highly preferred for power device applications due to which power devices are expected to account for the largest market share in the SiC-on-insulator and other substrates.
Conductive SiC substrates are expected to account for the largest market size in the SiC-on-insulator and other substrates market during the forecast period.
In comparison to traditional silicon devices, power devices based on conductive SiC substrates offer several advantages such as faster switching speeds, higher voltages, lower parasitic resistances, compact sizes, and reduced cooling requirements. The capability of these devices to withstand high temperatures positions them as robust solutions for applications where traditional silicon counterparts may face limitations. Therefore, conductive SiC substrates are expected to account for the largest market size in the SiC-on-insulator and other substrates market.
Asia Pacific is expected to account for the highest CAGR during the forecast period.
The growing number of developments related to SiC-on-insulator and other substrates, surging demand for electric vehicles, the growing number of initiatives and schemes, the presence of key players and the availability of cost-efficiency resources fuel the market growth of SiC-on-insulator and other substrates. Therefore, the market growth of SiC-on-insulator and other substrates in Asia Pacific is expected to account for the highest CAGR during the forecast period.
The break-up of profile of primary participants in the SiC-on-insulator and other substrates market-
By Company Type: Tier 1 - 30%, Tier 2 - 50%, Tier 3 - 20%
By Designation Type: C Level - 25%, Director Level - 35%, Others - 40%
By Region Type: North America - 30%, Europe - 25%, Asia Pacific - 35%, Rest of the World (RoW) - 10%
The major players of the SiC-on-insulator and other substrates market are Wolfspeed, Inc. (US), SICC Co., Ltd. (China), SOITEC (France), Coherent Corp. (US), GlobalWafers Co., Ltd. (Taiwan)
Research Coverage
The report segments the SiC-on-insulator and other substrates market and forecasts its size based on substrate type, application, and region. The report also provides a comprehensive review of drivers, restraints, opportunities, and challenges influencing market growth. The report also covers qualitative aspects in addition to the quantitative aspects of the market.
Reasons to buy the report:
The report will help the market leaders/new entrants in this market with information on the closest approximate revenues for the overall SiC-on-insulator and other substrates market and related segments. This report will help stakeholders understand the competitive landscape and gain more insights to strengthen their position in the market and plan suitable go-to-market strategies. The report also helps stakeholders understand the pulse of the market and provides them with information on key market drivers, restraints, opportunities, and challenges.
The report provides insights on the following pointers:
Analysis of key drivers (Increasing deployment of SiC substrates in 5G technology and accelerating adoption of SiC substrates in electric vehicles), restraints (High costs of SiC substrates), opportunities (Growing implementation of SiC-on-insulator substrates in biomedical devices and growing attention towards SiC-on-insulator substrates in photonics industry), and challenges (Process complexities related to SiC-on-insulator and other substrates) influencing the growth of the SiC-on-insulator and other substrates market.
Product Development/Innovation: Detailed insights on upcoming technologies, research & development activities, and new product launches in the SiC-on-insulator and other substrates market.
Market Development: Comprehensive information about lucrative markets - the report analyses the SiC-on-insulator and other substrates market across varied regions.
Market Diversification: Exhaustive information about new products, untapped geographies, recent developments, and investments in the SiC-on-insulator and other substrates market
Competitive Assessment: In-depth assessment of market shares, growth strategies and product offerings of leading players like Wolfspeed, Inc. (US), SICC Co., Ltd. (China), SOITEC (France), Coherent Corp. (US), GlobalWafers Co. Ltd. (Taiwan).
TABLE OF CONTENTS
1 INTRODUCTION
1.1 STUDY OBJECTIVES
1.2 MARKET DEFINITION
1.3 STUDY SCOPE
1.3.1 MARKETS COVERED
FIGURE 1 SIC-ON-INSULATOR AND OTHER SUBSTRATES MARKET SEGMENTATION
1.3.2 REGIONAL SCOPE
1.3.3 INCLUSIONS AND EXCLUSIONS
1.3.3.1 By company
1.3.3.2 By substrate type
1.3.3.3 By application
1.3.3.4 By region
1.3.4 YEARS CONSIDERED
1.3.5 CURRENCY CONSIDERED
1.4 LIMITATIONS
1.5 STAKEHOLDERS
1.6 IMPACT OF RECESSION
2 RESEARCH METHODOLOGY
2.1 RESEARCH DATA
FIGURE 2 SIC-ON-INSULATOR AND OTHER SUBSTRATES MARKET: RESEARCH DESIGN
2.1.1 SECONDARY RESEARCH
2.1.1.1 List of major secondary sources
2.1.1.2 Key data from secondary sources
2.1.2 PRIMARY RESEARCH
2.1.2.1 Primary interviews with experts
2.1.2.2 List of primary interview participants
2.1.2.3 Breakdown of primaries
2.1.2.4 Key data from primary sources
2.1.2.5 Key industry insights
2.1.3 SECONDARY AND PRIMARY RESEARCH
2.2 MARKET SIZE ESTIMATION METHODOLOGY
2.2.1 BOTTOM-UP APPROACH
2.2.1.1 Approach to derive market size using bottom-up analysis (demand side)
FIGURE 3 SIC-ON-INSULATOR AND OTHER SUBSTRATES MARKET: BOTTOM-UP APPROACH
2.2.2 TOP-DOWN APPROACH
2.2.2.1 Approach to derive market size using top-down analysis (supply side)
FIGURE 4 SIC-ON-INSULATOR AND OTHER SUBSTRATES MARKET: TOP-DOWN APPROACH
*Details on Business Overview, Products Offered, Recent Developments, MnM View, Right to win, Strategic choices made, Weaknesses and competitive threats might not be captured in case of unlisted companies.
