¼¼°èÀÇ SiC ÆÄ¿ö µð¹ÙÀ̽º ½ÃÀå
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¼¼°èÀÇ SiC ÆÄ¿ö µð¹ÙÀ̽º ½ÃÀåÀº 2030³â±îÁö 49¾ï ´Þ·¯¿¡ µµ´Þ

2024³â¿¡ 18¾ï ´Þ·¯·Î ÃßÁ¤µÇ´Â ¼¼°èÀÇ SiC ÆÄ¿ö µð¹ÙÀ̽º ½ÃÀåÀº ºÐ¼® ±â°£ÀÎ 2024-2030³â¿¡ CAGR 18.4%·Î ¼ºÀåÇϸç, 2030³â¿¡´Â 49¾ï ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù. ÀÌ ¸®Æ÷Æ®¿¡¼­ ºÐ¼®ÇÑ ºÎ¹®ÀÇ ÇϳªÀÎ SiC ´ÙÀÌ¿Àµå´Â CAGR 16.3%¸¦ ±â·ÏÇϸç, ºÐ¼® ±â°£ Á¾·á±îÁö 18¾ï ´Þ·¯¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù. SiC ÆÄ¿ö ¸ðµâ ºÎ¹®ÀÇ ¼ºÀå·üÀº ºÐ¼® ±â°£¿¡ CAGR 20.6%·Î ÃßÁ¤µË´Ï´Ù.

¹Ì±¹ ½ÃÀåÀº 4¾ï 8,910¸¸ ´Þ·¯, Áß±¹Àº CAGR 23.8%·Î ¼ºÀå ¿¹Ãø

¹Ì±¹ÀÇ SiC ÆÄ¿ö µð¹ÙÀ̽º ½ÃÀåÀº 2024³â¿¡ 4¾ï 8,910¸¸ ´Þ·¯·Î ÃßÁ¤µË´Ï´Ù. ¼¼°è 2À§ÀÇ °æÁ¦´ë±¹ÀÎ Áß±¹Àº 2030³â±îÁö 11¾ï ´Þ·¯ÀÇ ½ÃÀå ±Ô¸ð¿¡ ´ÞÇÒ °ÍÀ¸·Î ¿¹ÃøµÇ¸ç, ºÐ¼® ±â°£ÀÎ 2024-2030³âÀÇ CAGRÀº 23.8%ÀÔ´Ï´Ù. ±âŸ ÁÖ¸ñÇÒ ¸¸ÇÑ Áö¿ªº° ½ÃÀåÀ¸·Î´Â ÀϺ»°ú ij³ª´Ù°¡ ÀÖÀ¸¸ç, ºÐ¼® ±â°£ Áß CAGRÀº °¢°¢ 13.9%¿Í 16.4%·Î ¿¹ÃøµË´Ï´Ù. À¯·´¿¡¼­´Â µ¶ÀÏÀÌ CAGR ¾à 14.6%·Î ¼ºÀåÇÒ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù.

¼¼°èÀÇ "SiC ÆÄ¿ö µð¹ÙÀ̽º" ½ÃÀå - ÁÖ¿ä µ¿Çâ°ú ÃËÁø¿äÀÎ Á¤¸®

SiC ÆÄ¿ö µð¹ÙÀ̽º°¡ °íÈ¿À² Àü·Â º¯È¯¿¡ Çõ¸íÀ» ÀÏÀ¸Å°´Â ÀÌÀ¯´Â ¹«¾ùÀΰ¡?

½Ç¸®ÄÜ Ä«¹ÙÀ̵å(SiC) ÆÄ¿ö µð¹ÙÀ̽º´Â ±âÁ¸ÀÇ ½Ç¸®ÄÜ ±â¹Ý ¹ÝµµÃ¼¸¦ ´É°¡ÇÏ´Â ¶Ù¾î³­ È¿À², ¿­ ¼º´É ¹× ½ºÀ§Äª ¼Óµµ¸¦ Á¦°øÇÔÀ¸·Î½á Àü ¼¼°è ÆÄ¿ö ÀÏ·ºÆ®·Î´Ð½º¿¡ Áö°¢º¯µ¿À» ÀÏÀ¸Å°°í ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ±¤´ë¿ª °¸ µð¹ÙÀ̽º´Â °íÀü¾ÐÀ» Áö¿øÇÏ°í °í¿Â¿¡¼­ ÀÛµ¿Çϵµ·Ï ¼³°èµÇ¾î Àü±âÀÚµ¿Â÷(EV), Àç»ý¿¡³ÊÁö ½Ã½ºÅÛ, »ê¾÷¿ë µå¶óÀ̺ê, Ç×°ø¿ìÁÖ, ½º¸¶Æ® ±×¸®µå ÀÎÇÁ¶ó µî °íÀü·Â ¿ëµµ¿¡ ÀûÇÕÇÕ´Ï´Ù. ´õ ³ôÀº Àý¿¬ ÆÄ±« Àü±âÀå, ´õ ³ÐÀº ¹êµå °¸, ´õ ³ôÀº ¿­ÀüµµÀ² µî SiCÀÇ ±âº» Ư¼ºÀº ´õ ÀÛ°í, ´õ ºü¸£°í, ´õ ¿¡³ÊÁö È¿À²ÀûÀÎ ½Ã½ºÅÛÀ» ¼³°èÇÒ ¼ö ÀÖ°Ô ÇØÁÝ´Ï´Ù. ¿¹¸¦ µé¾î EV¿¡¼­´Â SiC ±â¹Ý MOSFET ¹× ¼îƮŰ ´ÙÀÌ¿Àµå°¡ Æ®·¢¼Ç ÀιöÅÍ ¹× Â÷·®¿ë ÃæÀü±â¿¡ »ç¿ëµÇ¾î ÁÖÇà°Å¸®¸¦ Å©°Ô Çâ»ó½Ã۰í ÃæÀü ½Ã°£À» ´ÜÃàÇϰí ÀÖ½À´Ï´Ù. ž籤 ÀιöÅÍ¿¡¼­´Â Àü·Â ¼Õ½ÇÀ» ÁÙÀÌ°í °íÁÖÆÄ µ¿ÀÛÀ» °¡´ÉÇÏ°Ô ÇÏ¿© ¼öµ¿ ºÎǰÀÇ Å©±â¸¦ ÃÖ¼ÒÈ­ÇÒ ¼ö ÀÖ½À´Ï´Ù. ±âÁ¸ ½Ç¸®ÄÜ IGBT ¹× ´ÙÀÌ¿Àµå¿¡ ºñÇØ SiC ¼ÒÀÚ´Â Àüµµ ¼Õ½Ç ¹× ½ºÀ§Äª ¼Õ½ÇÀÌ °¨¼ÒÇϰí Àü·Â ¹Ðµµ°¡ ³ôÀ¸¸ç ÀÛµ¿ ¼ö¸íÀÌ ±é´Ï´Ù. ÀÌ·¯ÇÑ Æ¯¼ºÀº ´Ü¼øÈ÷ ½Ã½ºÅÛ ¼º´ÉÀ» Çâ»ó½Ãų »Ó¸¸ ¾Æ´Ï¶ó Â÷¼¼´ë Àü¿ø °ü¸® ½Ã½ºÅÛ¿¡¼­ ±â¼úÀûÀ¸·Î³ª »ó¾÷ÀûÀ¸·Î ½ÇÇö °¡´ÉÇÑ °ÍÀ» Á¤ÀÇÇÕ´Ï´Ù.

Àç·á ¹× Á¦Á¶ÀÇ ¹ßÀüÀº ¾î¶»°Ô SiC ÀåºñÀÇ Ã¤ÅÃÀ» °¡¼ÓÈ­Çϰí Àִ°¡?

SiC ¿þÀÌÆÛ ±â¼ú, µð¹ÙÀ̽º ¾ÆÅ°ÅØÃ³ ¹× Á¦Á¶ °øÁ¤ÀÇ ±Þ¼ÓÇÑ ¹ßÀüÀº SiC ÆÄ¿ö µð¹ÙÀ̽ºÀÇ ºñ¿ë Àý°¨°ú ¼º´É Çâ»ó¿¡ ¸Å¿ì Áß¿äÇÑ ¿ªÇÒÀ» Çϰí ÀÖÀ¸¸ç, SiC ¿þÀÌÆÛ°¡ 4ÀÎÄ¡¿¡¼­ 6ÀÎÄ¡·Î, ±×¸®°í ÇöÀç 8ÀÎÄ¡·Î À̵¿ÇÔ¿¡ µû¶ó Á¦Á¶ ¼öÀ²°ú ±Ô¸ðÀÇ °æÁ¦°¡ Å©°Ô °³¼±µÇ¾î SiC µð¹ÙÀ̽º´Â ½Ç¸®ÄÜ µð¹ÙÀ̽º¿¡ ºñÇØ ºñ¿ë °æÀï·ÂÀÌ ³ô¾ÆÁ³½À´Ï´Ù. °æÁ¦¼ºÀÌ Å©°Ô °³¼±µÇ¾î SiC µð¹ÙÀ̽º´Â ½Ç¸®ÄÜ µð¹ÙÀ̽º¿¡ ºñÇØ ºñ¿ë °æÀï·ÂÀÌ ³ô¾ÆÁ³½À´Ï´Ù. Æ®·»Ä¡ MOSFET ±¸Á¶, JFET, °ÔÀÌÆ® µå¶óÀ̹ö ³»Àå ÇÏÀ̺긮µå ¸ðµâ µîÀÇ ±â¼ú Çõ½ÅÀº ¿Â ÀúÇ×À» ÃÖ¼ÒÈ­Çϸ鼭 Àü·ù ó¸®, Àü¾Ð Â÷´Ü, ¿­ ¼º´ÉÀ» Çâ»ó½ÃÄ×½À´Ï´Ù. ¿þÀÌÆÛÀÇ ¹ÚÇüÈ­, ÷´Ü ¿¡ÇÇÅÃ¼È ¼ºÀå ±â¼ú, °áÇÔ ¹Ðµµ °¨¼Ò¸¦ ÅëÇØ µð¹ÙÀ̽ºÀÇ ½Å·Ú¼ºÀ» Çâ»ó½ÃÄÑ 3.3kV ÀÌ»óÀÇ °íÀü¾Ð SiC ¸ðµâÀ» °³¹ßÇÒ ¼ö ÀÖ°Ô µÇ¾ú½À´Ï´Ù. ¶ÇÇÑ ¼Ò°áÀº ¾ç¸é ³Ã°¢, ±âÆÇ ¾ø´Â ¸ðµâ°ú °°Àº »õ·Î¿î Æ÷Àå ±â¼úÀº ´õ ³ªÀº ¿­ °ü¸®¿Í °íÁýÀûÈ­¸¦ °¡´ÉÇÏ°Ô Çϰí ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ¹ßÀüÀº Á¤±³ÇÑ ½Ã¹Ä·¹ÀÌ¼Ç Åø°ú AI Áö¿ø ¼³°è ¿öÅ©Ç÷οì·Î º¸¿ÏµÇ¾î ½ÃÀå Ãâ½Ã ½Ã°£À» ´ÜÃàÇÏ°í ±â´É ¿¹Ãø °¡´É¼ºÀ» Çâ»ó½Ã۰í ÀÖ½À´Ï´Ù. ¶ÇÇÑ SiC ÆÄ¿îµå¸®, Àåºñ Á¦Á¶¾÷ü ¹× ÀÚµ¿Â÷ OEM °£ÀÇ Çù¾÷Àº »ê¾÷ °ËÁõÀ» °¡¼ÓÈ­ÇÏ°í ¼¼°è °ø±Þ¸Á Áغñ¸¦ °¡¼ÓÈ­Çϰí ÀÖ½À´Ï´Ù. Àç·á ¼øµµ, °¡°ø Á¤È®µµ ¹× È®À强ÀÌ Çâ»óµÊ¿¡ µû¶ó SiC´Â °í¼º´É ÆÄ¿ö ÀÏ·ºÆ®·Î´Ð½ºÀÇ Æ´»õ ½ÃÀå¿¡¼­ ÁÖ·ù·Î ºü¸£°Ô À̵¿Çϰí ÀÖ½À´Ï´Ù.

SiC ÆÄ¿ö µð¹ÙÀ̽º°¡ ¾÷°è¿¡ °¡Àå Å« ¿µÇâÀ» ¹ÌÄ¡´Â °÷Àº ¾îµðÀΰ¡?

SiC ÆÄ¿ö µð¹ÙÀ̽º´Â Àü·Â È¿À², ¼ÒÇüÈ­, ¿­Àû °ß°í¼ºÀÌ ¹Ì¼Ç Å©¸®Æ¼ÄÃÇÑ »ê¾÷ Àü¹Ý¿¡ ±í¼÷ÀÌ Ä§ÅõÇϰí ÀÖ½À´Ï´Ù. Àü±âÀÚµ¿Â÷(EV) ºÐ¾ß´Â SiC µð¹ÙÀ̽ºÀÇ °¡Àå Å©°í ºü¸£°Ô ¼ºÀåÇÏ´Â ¼Òºñó·Î, ¸ÞÀÎ Æ®·¢¼Ç ÀιöÅÍ, DC-DC ÄÁ¹öÅÍ, Â÷·®¿ë ÃæÀü±â¿¡ »ç¿ëµÇ°í ÀÖ½À´Ï´Ù. Å×½½¶ó, BYD, Çö´ë, Æø½º¹Ù°Õ µî ÁÖ¿ä ÀÚµ¿Â÷ Á¦Á¶¾÷üµéÀº SiC ¸ðµâÀ» ÅëÇÕÇÏ¿© ÁÖÇà°Å¸® ¿¬Àå, ÃæÀü ¼Óµµ Çâ»ó, ¿­È¿À² Çâ»óÀ» ½ÇÇöÇϰí ÀÖ½À´Ï´Ù. Àç»ý¿¡³ÊÁö ºÐ¾ß, ƯÈ÷ ž籤 ¹× dz·Â¹ßÀü ºÐ¾ß¿¡¼­ SiC ±â¹Ý ÀιöÅÍ´Â Àü·Â º¯È¯ È¿À²À» °³¼±ÇÏ°í ÆûÆÑÅ͸¦ ¼ÒÇüÈ­ÇÏ¿© ¼³Ä¡ ¹× Á¤ºñ¸¦ ¿ëÀÌÇÏ°Ô ÇÕ´Ï´Ù. ¸ðÅÍ µå¶óÀ̺ê, ·Îº¿ °øÇÐ, ¹«Á¤Àü Àü¿ø °ø±Þ Àåºñ(UPS)¿Í °°Àº »ê¾÷ ¿ëµµ´Â ½ºÀ§Äª µ¿ÀÛÀ» °³¼±ÇÏ°í ¿­¾ÇÇÑ Á¶°Ç¿¡¼­ ³»±¸¼ºÀ» Çâ»ó½Ã۱â À§ÇØ SiC¸¦ Ȱ¿ëÇϰí ÀÖ½À´Ï´Ù. Ç×°ø¿ìÁÖ ¹× ¹æÀ§ ºÐ¾ß¿¡¼­´Â ³»¹æ»ç¼±¼º°ú ½Å·Ú¼ºÀÌ Áß¿äÇÑ ÀΰøÀ§¼º, ·¹ÀÌ´õ ½Ã½ºÅÛ, Àü·Â ¼­ºê½Ã½ºÅÛ¿¡ SiC ºÎǰÀÌ Ã¤Åõǰí ÀÖ½À´Ï´Ù. ½º¸¶Æ® ±×¸®µå ½Ã½ºÅÛ°ú °í¾ÐÁ÷·ù¼ÛÀü(HVDC)Àº SiC ±â¹Ý ÄÁ¹öÅÍ¿Í Â÷´Ü±â°¡ Á¦°øÇÏ´Â °í¼Ó ½ºÀ§Äª°ú Àü·Â ¹ÐµµÀÇ ÀÌÁ¡À» ´©¸®°í ÀÖ½À´Ï´Ù. µ¥ÀÌÅͼ¾ÅÍ¿¡¼­µµ SiC´Â ¹èÀü Àåºñ(PDU) ¹× ¼­¹ö Àü¿ø °ø±Þ ÀåºñÀÇ ¿¡³ÊÁö È¿À²À» °³¼±ÇÏ°í ³Ã°¢ÀÇ Çʿ伺À» ÁÙÀ̱â À§ÇØ ¿¬±¸µÇ°í ÀÖ½À´Ï´Ù. ÀÌ·¯ÇÑ ´Ù¾çÇÑ ¿ëµµ´Â Àüü Àü±âÈ­ ¹ë·ùüÀο¡¼­ SiCÀÇ Çõ½Å °¡´É¼ºÀ» ÀÔÁõÇϰí ÀÖ½À´Ï´Ù.

SiC ÆÄ¿ö µð¹ÙÀ̽º ½ÃÀåÀÇ ¼ºÀåÀº Àü±âÈ­ Ãß¼¼, ¼º´É ¿ä±¸, °ø±Þ¸Á ¼º¼÷µµ¸¦ ¹Ý¿µÇÏ´Â ¸î °¡Áö ¿äÀο¡ ÀÇÇØ ÁÖµµµÇ°í ÀÖ½À´Ï´Ù.

SiC ÆÄ¿ö µð¹ÙÀ̽º ½ÃÀåÀ» ¹ßÀü½ÃŰ´Â °¡Àå °­·ÂÇÑ ¿äÀÎÀº Àü ¼¼°è Àü±âÈ­(ƯÈ÷ ¿î¼Û ¹× Àç»ý¿¡³ÊÁö)·ÎÀÇ ÀüȯÀÔ´Ï´Ù. Àü±âÀÚµ¿Â÷ÀÇ ±ÞÁõÀ¸·Î °íÈ¿À² ÀιöÅÍ ¹× ±Þ¼Ó ÃæÀü ¼Ö·ç¼Ç¿¡ ´ëÇÑ ¼ö¿ä°¡ Å©°Ô Áõ°¡Çϰí ÀÖÀ¸¸ç, SiC´Â ±âÁ¸ ½Ç¸®ÄÜ ºÎǰº¸´Ù ¿ì¼öÇÕ´Ï´Ù. ƯÈ÷ Áß±¹, À¯·´, ¹Ì±¹¿¡¼­´Â Ŭ¸° ¸ðºô¸®Æ¼¿Í ź¼Ò Á߸³ ¸ñÇ¥¸¦ ÃßÁøÇÏ´Â Á¤ºÎ Áöħ°ú Àμ¾Æ¼ºê°¡ ÀÌ·¯ÇÑ Ã¤ÅÃÀ» °­È­Çϰí ÀÖ½À´Ï´Ù. ž籤¹ßÀü¼Ò, dz·Â Åͺó, ±×¸®µå ½ºÅ丮Áö¿¡¼­ °íÀü¾Ð, ¼ÒÇü, °í½Å·Ú¼º Àü·Â ½Ã½ºÅÛ¿¡ ´ëÇÑ ¼ö¿ä°¡ Áõ°¡ÇÔ¿¡ µû¶ó SiCÀÇ º¸±ÞÀÌ °¡¼ÓÈ­µÇ°í ÀÖ½À´Ï´Ù. °ø±Þ Ãø¸é¿¡¼­´Â Wolfspeed, ST¸¶ÀÌÅ©·ÎÀÏ·ºÆ®·Î´Ð½º, ·Î¿È, ÀÎÇǴϾð, ¿Â¼¼¹ÌÄÁ´öÅÍ¿Í °°Àº ±â¾÷ÀÇ ÁÖÁ¶ ´É·Â È®´ë·Î ÀÎÇØ Àç·áÀÇ °¡¿ë¼º°ú ºñ¿ë È¿À²¼ºÀÌ Çâ»óµÇ°í ÀÖ½À´Ï´Ù. ¶ÇÇÑ SiC ±â¹Ý R&D ¹× ¼öÁ÷ ÅëÇÕ Àü·«¿¡ ´ëÇÑ ÅõÀÚ Áõ°¡·Î ¿þÀÌÆÛ Ç°Áú, µð¹ÙÀ̽º Àϰü¼º ¹× Àå±â °ø±Þ ¾ÈÁ¤¼ºÀÌ Çâ»óµÇ°í ÀÖ½À´Ï´Ù. µ¥ÀÌÅͼ¾ÅÍ, Ç×°ø¿ìÁÖ ½Ã½ºÅÛ, »ê¾÷¿ë ¸ðÅÍÀÇ ¿­ ¹× Àü·Â ¹Ðµµ ¿ä±¸´Â ƯÈ÷ ±âÁ¸ ½Ç¸®ÄÜÀÌ ¼º´ÉÀÇ ÇѰ迡 µµ´ÞÇÑ »óȲ¿¡¼­ SiCÀÇ °ü·Ã¼ºÀ» ´õ¿í ³ôÀ̰í ÀÖ½À´Ï´Ù. ÇÑÆí, ½Ã¹Ä·¹ÀÌ¼Ç ¼ÒÇÁÆ®¿þ¾î, ±¸µ¿ ȸ·Î, ±³À° ¸®¼Ò½º¸¦ Æ÷ÇÔÇÑ ¼³°è »ýŰèÀÇ ¼º¼÷Àº OEM ¹× ¼³°èÀÚÀÇ Ã¤Åà À庮À» ³·Ãß°í ÀÖ½À´Ï´Ù. Àüµ¿È­ ¸ñÇ¥, ¼º´É ÀÓ°èÄ¡, ¹ý±ÔÀÇ ÃßÁø·Â, Á¦Á¶ Áغñ µî ÀÌ·¯ÇÑ Ãß¼¼µéÀÌ °áÇÕµÇ¾î ¼¼°è SiC Àü·Â ¼ÒÀÚ ½ÃÀåÀº Ȱ±âÂù °í¼ºÀå ±Ëµµ¸¦ Çü¼ºÇϰí ÀÖ½À´Ï´Ù.

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Global Industry Analysts´Â º»»çÀÇ ±¹°¡, Á¦Á¶°ÅÁ¡, ¼öÃâÀÔ(¿ÏÁ¦Ç° ¹× OEM)À» ±â¹ÝÀ¸·Î ±â¾÷ÀÇ °æÀï·Â º¯È­¸¦ ¿¹ÃøÇß½À´Ï´Ù. ÀÌ·¯ÇÑ º¹ÀâÇÏ°í ´Ù¸éÀûÀÎ ½ÃÀå ¿ªÇÐÀº ÀÎÀ§ÀûÀÎ ¼öÀÔ¿ø°¡ Áõ°¡, ¼öÀͼº °¨¼Ò, °ø±Þ¸Á ÀçÆí µî ¹Ì½ÃÀû ¹× °Å½ÃÀû ½ÃÀå ¿ªÇÐ Áß¿¡¼­µµ ƯÈ÷ °æÀï»çµé¿¡°Ô ¿µÇâÀ» ¹ÌÄ¥ °ÍÀ¸·Î ¿¹ÃøµË´Ï´Ù.

Global Industry Analysts´Â ¼¼°è ÁÖ¿ä ¼ö¼® ÀÌÄÚ³ë¹Ì½ºÆ®(1,4,949¸í), ½ÌÅ©ÅÊÅ©(62°³ ±â°ü), ¹«¿ª ¹× »ê¾÷ ´Üü(171°³ ±â°ü)ÀÇ Àü¹®°¡µéÀÇ ÀǰßÀ» ¸é¹ÐÈ÷ °ËÅäÇÏ¿© »ýŰ迡 ¹ÌÄ¡´Â ¿µÇâÀ» Æò°¡ÇÏ°í »õ·Î¿î ½ÃÀå Çö½Ç¿¡ ´ëÀÀÇϰí ÀÖ½À´Ï´Ù. ¸ðµç ÁÖ¿ä ±¹°¡ÀÇ Àü¹®°¡¿Í °æÁ¦ÇÐÀÚµéÀÌ °ü¼¼¿Í ±×°ÍÀÌ ÀÚ±¹¿¡ ¹ÌÄ¡´Â ¿µÇâ¿¡ ´ëÇÑ ÀǰßÀ» ÃßÀû Á¶»çÇß½À´Ï´Ù.

Global Industry Analysts´Â ÀÌ·¯ÇÑ È¥¶õÀÌ ÇâÈÄ 2-3°³¿ù ³»¿¡ ¸¶¹«¸®µÇ°í »õ·Î¿î ¼¼°è Áú¼­°¡ º¸´Ù ¸íÈ®ÇÏ°Ô È®¸³µÉ °ÍÀ¸·Î ¿¹»óÇϰí ÀÖÀ¸¸ç, Global Industry Analysts´Â ÀÌ·¯ÇÑ »óȲÀ» ½Ç½Ã°£À¸·Î ÃßÀûÇϰí ÀÖ½À´Ï´Ù.

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Global SiC Power Device Market to Reach US$4.9 Billion by 2030

The global market for SiC Power Device estimated at US$1.8 Billion in the year 2024, is expected to reach US$4.9 Billion by 2030, growing at a CAGR of 18.4% over the analysis period 2024-2030. SiC Diode, one of the segments analyzed in the report, is expected to record a 16.3% CAGR and reach US$1.8 Billion by the end of the analysis period. Growth in the SiC Power Module segment is estimated at 20.6% CAGR over the analysis period.

The U.S. Market is Estimated at US$489.1 Million While China is Forecast to Grow at 23.8% CAGR

The SiC Power Device market in the U.S. is estimated at US$489.1 Million in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$1.1 Billion by the year 2030 trailing a CAGR of 23.8% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 13.9% and 16.4% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 14.6% CAGR.

Global "SiC Power Device" Market - Key Trends & Drivers Summarized

Why Are SiC Power Devices Revolutionizing High-Efficiency Power Conversion?

Silicon carbide (SiC) power devices have emerged as a disruptive force in the global power electronics landscape, offering superior efficiency, thermal performance, and switching speed over traditional silicon-based semiconductors. These wide-bandgap devices are designed to handle higher voltages and operate at elevated temperatures, making them ideal for high-power applications such as electric vehicles (EVs), renewable energy systems, industrial drives, aerospace, and smart grid infrastructure. The fundamental properties of SiC-including a higher breakdown electric field, wider bandgap, and greater thermal conductivity-enable the design of smaller, faster, and more energy-efficient systems. In EVs, for instance, SiC-based MOSFETs and Schottky diodes are used in traction inverters and onboard chargers to significantly improve driving range and reduce charging time. In solar inverters, they reduce power losses and allow higher-frequency operation, minimizing the size of passive components. Compared to traditional silicon IGBTs and diodes, SiC devices offer reduced conduction and switching losses, greater power density, and longer operational lifespans. These attributes are not just improving system performance-they’re redefining what’s technologically and commercially viable in next-generation power management systems.

How Are Material And Fabrication Advances Accelerating SiC Device Adoption?

Rapid advancements in SiC wafer technology, device architecture, and manufacturing processes are playing a pivotal role in driving down costs and improving the performance of SiC power devices. The transition from 4-inch to 6-inch and now 8-inch SiC wafers has significantly improved fabrication yield and economies of scale, making SiC devices more cost-competitive with their silicon counterparts. Innovations such as trench MOSFET structures, JFETs, and hybrid modules with integrated gate drivers are enhancing current handling, voltage blocking, and thermal performance while minimizing on-resistance. Wafer thinning, advanced epitaxial growth techniques, and defect density reduction have improved device reliability and enabled the development of high-voltage SiC modules up to 3.3 kV and beyond. Moreover, new packaging technologies-such as sintered silver, double-sided cooling, and substrate-less modules-are enabling better thermal management and higher integration densities. These advances are complemented by sophisticated simulation tools and AI-assisted design workflows that shorten time-to-market and improve functional predictability. Additionally, collaborations between SiC foundries, equipment manufacturers, and automotive OEMs are fast-tracking industrial validation and accelerating global supply chain readiness. As material purity, processing precision, and scalability improve, SiC is rapidly transitioning from niche to mainstream in high-performance power electronics.

Where Are SiC Power Devices Making The Biggest Industry Impact?

SiC power devices are making deep inroads across industries where power efficiency, compactness, and thermal robustness are mission-critical. The electric vehicle (EV) sector is the largest and fastest-growing consumer of SiC devices, using them in main traction inverters, DC-DC converters, and onboard chargers. Major automotive manufacturers-including Tesla, BYD, Hyundai, and Volkswagen-are integrating SiC modules to achieve longer driving ranges, faster charging, and better thermal efficiency. In the renewable energy sector, particularly solar and wind power, SiC-based inverters improve power conversion efficiency and reduce form factors, making installation and maintenance easier. Industrial applications-such as motor drives, robotics, and uninterruptible power supplies (UPS)-leverage SiC for improved switching behavior and durability in harsh conditions. Aerospace and defense sectors deploy SiC components in satellites, radar systems, and power subsystems where radiation tolerance and reliability are critical. Smart grid systems and high-voltage DC (HVDC) transmission benefit from the high-speed switching and power density offered by SiC-based converters and breakers. Data centers, too, are exploring SiC to improve energy efficiency and reduce cooling needs in power distribution units (PDUs) and server power supplies. These varied applications underscore SiC’s transformative potential across the electrification value chain.

The Growth In The SiC Power Device Market Is Driven By Several Factors That Reflect Electrification Trends, Performance Demands, And Supply Chain Maturity

The global shift toward electrification-especially in transportation and renewable energy-is the most powerful driver propelling the SiC power device market forward. The surging production of electric vehicles has significantly increased demand for high-efficiency inverters and fast-charging solutions, where SiC outperforms traditional silicon components. Government mandates and incentives promoting clean mobility and carbon-neutral targets are reinforcing this adoption, particularly in China, Europe, and the U.S. The growing need for high-voltage, compact, and reliable power systems in solar farms, wind turbines, and grid storage is also accelerating SiC deployment. On the supply side, the expansion of foundry capabilities, notably by companies like Wolfspeed, STMicroelectronics, Rohm, Infineon, and ON Semiconductor, is improving material availability and cost efficiency. Additionally, rising investments in SiC-based R&D and vertical integration strategies are enhancing wafer quality, device consistency, and long-term supply security. Thermal and power density demands from data centers, aerospace systems, and industrial motors further drive SiC’s relevance, especially as conventional silicon hits performance ceilings. Meanwhile, the maturation of design ecosystems-including simulation software, drive circuitry, and training resources-is lowering adoption barriers for OEMs and designers. Together, these trends-involving electrification goals, performance thresholds, regulatory tailwinds, and manufacturing readiness-are shaping a vibrant, high-growth trajectory for the global SiC power device market.

SCOPE OF STUDY:

The report analyzes the SiC Power Device market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Product Type (SiC Diode, SiC Power Module, SiC MOSFETs, SiC Gate Driver); Application (Inverter / Converter Application, Power Supply Application, Motor Drive Application, Photovoltaic / Energy Storage Systems Application, Flexible AC Transmission Systems Application, RF Devices & Cellular Base Stations Application, Other Applications); End-Use (Aerospace & Defense End-Use, Consumer Electronics End-Use, IT & Telecommunication End-Use, Automotive & Transportation End-Use, Other End-Uses)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.

Select Competitors (Total 32 Featured) -

TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by artificially increasing the COGS, reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

We are diligently following expert opinions of leading Chief Economists (14,949), Think Tanks (62), Trade & Industry bodies (171) worldwide, as they assess impact and address new market realities for their ecosystems. Experts and economists from every major country are tracked for their opinions on tariffs and how they will impact their countries.

We expect this chaos to play out over the next 2-3 months and a new world order is established with more clarity. We are tracking these developments on a real time basis.

As we release this report, U.S. Trade Representatives are pushing their counterparts in 183 countries for an early closure to bilateral tariff negotiations. Most of the major trading partners also have initiated trade agreements with other key trading nations, outside of those in the works with the United States. We are tracking such secondary fallouts as supply chains shift.

To our valued clients, we say, we have your back. We will present a simplified market reassessment by incorporating these changes!

APRIL 2025: NEGOTIATION PHASE

Our April release addresses the impact of tariffs on the overall global market and presents market adjustments by geography. Our trajectories are based on historic data and evolving market impacting factors.

JULY 2025 FINAL TARIFF RESET

Complimentary Update: Our clients will also receive a complimentary update in July after a final reset is announced between nations. The final updated version incorporates clearly defined Tariff Impact Analyses.

Reciprocal and Bilateral Trade & Tariff Impact Analyses:

USA <> CHINA <> MEXICO <> CANADA <> EU <> JAPAN <> INDIA <> 176 OTHER COUNTRIES.

Leading Economists - Our knowledge base tracks 14,949 economists including a select group of most influential Chief Economists of nations, think tanks, trade and industry bodies, big enterprises, and domain experts who are sharing views on the fallout of this unprecedented paradigm shift in the global econometric landscape. Most of our 16,491+ reports have incorporated this two-stage release schedule based on milestones.

COMPLIMENTARY PREVIEW

Contact your sales agent to request an online 300+ page complimentary preview of this research project. Our preview will present full stack sources, and validated domain expert data transcripts. Deep dive into our interactive data-driven online platform.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

III. MARKET ANALYSIS

IV. COMPETITION

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